CN105772896A - Patch positioning tool - Google Patents
Patch positioning tool Download PDFInfo
- Publication number
- CN105772896A CN105772896A CN201610234582.9A CN201610234582A CN105772896A CN 105772896 A CN105772896 A CN 105772896A CN 201610234582 A CN201610234582 A CN 201610234582A CN 105772896 A CN105772896 A CN 105772896A
- Authority
- CN
- China
- Prior art keywords
- posting
- positioning
- locating slot
- positioning tool
- paster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
The invention discloses a patch positioning tool which comprises a positioning frame and positioning edges, wherein a positioning through hole is formed in the positioning frame; the positioning edges are arranged in the positioning through hole and are connected with the positioning frame; and positioning grooves are formed in the positioning frame and are communicated with the positioning through hole. When the patch positioning tool is used for carrying out patching operation on a component, as the positioning grooves are formed in the positioning frame close to the positioning edges, tin balls generated in the reflow soldering process can flow into the positioning grooves without being extruded onto the surface of the component; and in addition, with existence of the positioning grooves, in the vacuumizing process accompanied with reflow soldering, solders cannot generate bubbles, and the condition that soldering tin is sputtered onto the surface of the component by rebounding of the positioning frame cannot occur either without adding a clear water procedure to remove the tin balls on the surface, so that the production procedure is reduced, the working efficiency is improved, and the cost is lowered.
Description
Technical field
The present invention relates to Electronic Packaging field, particularly relate to a kind of paster positioning tool.
Background technology
At present, solder reflow techniques is one of common mode of production in Electronic Packaging field, and normal reflux welding technology adopts solder pasting processes, by Solder-Paste Printing on circuit boards, then components and parts is pasted onto solder surfaces.Owing to the mobility of soldering paste is big, relevant components and parts easily occur drift to cause product rejection.The common measures taken preventing drift has two kinds, and a kind of is adopt suitable positioning tool, and another kind is to adopt less weld tabs technique of drifting about.
When adopting weld tabs technique, positioning tool is picked and placeed after on circuit boards, then weld tabs or the components and parts of preforming are placed in hole, location.Without positioning tool, owing to not having the viscosity of soldering paste, components and parts are susceptible to skew in moving process, easily produce scrap products after entering stove welding.
All producing a certain amount of tin sweat(ing) during except positioning action, soldering paste and weld tabs welding, tin sweat(ing) occurs to produce different consequences in different positions, for instance tin sweat(ing) when being positioned at component surface is removed it, then may result in short circuit time between two components and parts.
Visible, no matter soldering paste and weld tabs technique, all it be unable to do without the positioning tool of components and parts.One rational positioning tool should meet location simultaneously and reduce tin sweat(ing) harmful effect two effect.
Modal paster positioning tool, in the appointment position perforate of posting, bore size will be slightly larger than component size according to alignment tolerance, is mounted in posting by components and parts, and after welding, components and parts are fixed on appointment position, take off posting.In order to ensure positioning precision, posting size is general only bigger than component size, such as 0.1mm, its material is usually the material of Non-Dewetting, it is heated additionally, due to material and deforms, positioning tool material requires the material selecting thermal coefficient of expansion relatively low, such as the metal after Inorganic Non-metallic Materials or surface treatment.
In reflow process, solder is heated and expands and melt flowing, and when corresponding alignment tolerance cannot hold more solder completely, solder is just expressed into component surface and causes tin sweat(ing).
Additionally reflow soldering is typically accompanied by the process of evacuation, and bubbles burst in solder in vacuum, the scolding tin of generation is splashed to component surface through the bounce-back of posting.
For the problems referred to above, being usually employing increases water matting to remove surface tin sweat(ing).But be to increase operation and mean the increase of cost and the reduction of efficiency, and with this accidental injury to product.
Summary of the invention
It is an object of the invention to provide a kind of paster positioning tool, decrease the generation of tin sweat(ing), improve paster efficiency and paster yield rate, reduce production cost.
For solving above-mentioned technical problem, embodiments provide a kind of paster positioning tool, including posting and limit, location, described posting has positioning through hole, limit, described location is arranged in described positioning through hole, and be connected with described posting, described posting has locating slot, described locating slot communicates with described positioning through hole.
Wherein, described posting is inorganic ceramic posting.
Wherein, described posting is graphite posting, carborundum posting or aluminium nitride posting.
Wherein, described posting is almag posting.
Wherein, described posting is high-temperature resistance plastice posting.
Wherein, described posting is tetrafluoroethene posting or polyimides posting.
Wherein, each edge on limit, described location has at least one described locating slot.
Wherein, described locating slot is through locating slot or half through locating slot.
Wherein, described locating slot is band fillet locating slot.
Wherein, described posting and limit, described location are integral type structure.
The paster positioning tool that the embodiment of the present invention provides, compared with prior art, has the advantage that
The described paster positioning tool that the embodiment of the present invention provides, including posting and limit, location, described posting has positioning through hole, limit, described location is arranged in described positioning through hole, and be connected with described posting, having locating slot on described posting, described locating slot communicates with described positioning through hole.
When using described paster positioning tool that components and parts carry out paster operation, owing to described posting having locating slot in the position near limit, described location, the tin sweat(ing) produced in reflow process can flow in locating slot, component surface will not be expressed into, and due to the existence of locating slot, in the process of the adjoint evacuation of Reflow Soldering, solder is without producing bubble, scolding tin more will not be occurred through the bounce-back of posting to be splashed to the situation on surface of components and parts, it is no need for increasing clear water operation to remove the tin sweat(ing) on surface, decrease production process, improve work efficiency, improve yield rate, reduce cost.
In sum, the paster positioning tool that the embodiment of the present invention provides, by arranging locating slot on limit, location, decrease production process, improve work efficiency, improve yield rate, reduce cost.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
A kind of structural representation in the detailed description of the invention of the paster positioning tool that Fig. 1 provides for the embodiment of the present invention.
Detailed description of the invention
Just as described in the background section, in prior art, in reflow process, solder is heated and expands and melt flowing, and when corresponding alignment tolerance cannot hold more solder completely, solder is just expressed into component surface and causes tin sweat(ing).Additionally reflow soldering is typically accompanied by the process of evacuation, and bubbles burst in solder in vacuum, the scolding tin of generation is splashed to component surface through the bounce-back of posting.
For the problems referred to above, being usually employing increases water matting to remove surface tin sweat(ing).But be to increase operation and mean the increase of cost and the reduction of efficiency, and with this accidental injury to product.
Based on this, embodiments provide a kind of paster positioning tool, including posting and limit, location, described posting has positioning through hole, limit, described location is arranged in described positioning through hole, and be connected with described posting, described posting has locating slot, described locating slot communicates with described positioning through hole.
In sum, the paster positioning tool that the embodiment of the present invention provides, when components and parts are carried out paster operation, owing to described posting having locating slot in the position near limit, described location, the tin sweat(ing) produced in reflow process can flow in locating slot, component surface will not be expressed into, and due to the existence of locating slot, in the process of the adjoint evacuation of Reflow Soldering, solder is without producing bubble, scolding tin more will not be occurred through the bounce-back of posting to be splashed to the situation on surface of components and parts, it is no need for increasing clear water operation to remove the tin sweat(ing) on surface, decrease production process, improve work efficiency, improve yield rate, reduce cost.
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Elaborate detail in the following description so that fully understanding the present invention.But the present invention can be different from alternate manner described here implement with multiple, and those skilled in the art can do similar popularization when without prejudice to intension of the present invention.Therefore the present invention is not by the following public restriction being embodied as.
Refer to the structural representation in a kind of detailed description of the invention of the paster positioning tool that Fig. 1, Fig. 1 provide for the embodiment of the present invention.
In the concrete mode of one, described paster positioning tool, including posting 10 and limit 20, location, in described posting, 10 have positioning through hole, limit, described location 20 is arranged in described positioning through hole, and be connected with described posting 10, described posting 10 has locating slot 11, described locating slot 11 communicates with described positioning through hole.
When using described paster positioning tool that components and parts 30 carry out paster operation, owing to described posting 10 having locating slot 11 in the position near limit, described location 20, the tin sweat(ing) produced in reflow process can flow in locating slot 11, components and parts 30 surface will not be expressed into, and due to the existence of locating slot 11, in the process of the adjoint evacuation of Reflow Soldering, solder is without producing bubble, scolding tin more will not be occurred through the bounce-back of posting 10 to be splashed to the situation on surface of components and parts 30, it is no need for increasing clear water operation to remove the tin sweat(ing) on surface, decrease production process, improve work efficiency, improve yield rate, reduce cost.
Due to when welding, or make stannum band with high-temperature heating scolding tin, the temperature making described posting 10 and limit, described location 20 raises, and after temperature rising, described posting 10 and limit, described location 20 can carry out thermal expansion, gap shrinks between limit 20, location and components and parts 30 is even disappeared, it is also possible to components and parts 30 can cause extruding, damage components and parts 30.
Therefore, for making registration, described posting 10 and limit 20, location need to use the material that thermal coefficient of expansion is less to make, so that described posting 10 and limit, described location 20 are while realizing location, flow out enough spaces for expanding of solder and flowing.
Due to inorganic ceramic, aluminium alloy, high temperature plastics thermal coefficient of expansion little, heat resistance is good, therefore, described posting 10 is inorganic ceramic posting 10, inorganic ceramic posting 10 is generally graphite posting 10, carborundum posting 10 or aluminium nitride posting 10, in addition to this it is possible to use other inorganic ceramic to make described posting 10 and limit 20, location.
Additionally, described posting 10 can be almag posting 10, described posting 10 can also be high-temperature resistance plastice posting 10, is typically chosen tetrafluoroethene or polyimides posting 10 makes posting 10 in high-temperature resistance plastice.
It should be noted that in order to ensure the synchronicity of posting 10 and the thermal expansion on limit 20, location in the present invention, general posting 10 selects same material to make with limit 20, location.
Owing to only arranging locating slot 11 on a limit on limit, described location 20, can only weld having locating slot 11 place so that the bonding area of components and parts 30 and circuit plate on the way is less, connects firm not.Therefore, for improving paster effect, each edge on limit, described location 20 has at least one described locating slot 11.Certainly, if as long as welding a small amount of extrusion can obtain predetermined welding effect, it is possible to the corresponding quantity reducing locating slot 11.
It should be noted that the present invention is not specifically limited to the size of described locating slot 11, quantity, shape and the position that arranges on described posting 10.
Described locating slot 11 can be through locating slot, it can also be half through locating slot, the present invention does not do at this and limits, and through locating slot 11 here refers to that the part on the limit 20, location between locating slot 11 and components and parts 30 is removed, rather than in the vertical direction becomes through hole.
For ensureing the structural strength of posting 10, avoid the area of locating slot 11 outputed too big, and reality is in paster welding process, scolding tin can not flow the position of all of locating slot 11, therefore, it is comparatively rounder and more smooth that the outside of described locating slot 11 can be arranged, and therefore, described locating slot 11 is traditionally arranged to be band fillet locating slot 11.
In the manufacturing process of actual paster positioning tool, make owing to posting 10 is usually the same material of employing with limit 20, location, for reducing the difficulty of processing technology, described posting 10 is tied for integral type with limit, described location 20, namely punch in posting 10, the several locating slot 11 of making near hole.It should be noted that the processing technology of described paster positioning tool is not limited by the present invention.
In sum, the paster positioning tool that the embodiment of the present invention provides, when components and parts are carried out paster operation, owing to described posting having locating slot in the position near limit, described location, the tin sweat(ing) produced in reflow process can flow in locating slot, component surface will not be expressed into, and due to the existence of locating slot, in the process of the adjoint evacuation of Reflow Soldering, solder is without producing bubble, scolding tin more will not be occurred through the bounce-back of posting to be splashed to the situation on surface of components and parts, it is no need for increasing clear water operation to remove the tin sweat(ing) on surface, decrease production process, improve work efficiency, improve yield rate, reduce cost.
Above paster positioning tool provided by the present invention is described in detail.Principles of the invention and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method and the core concept thereof of the present invention.It should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to the present invention carries out some improvement and modification, these improve and modify in the protection domain also falling into the claims in the present invention.
Claims (10)
1. a paster positioning tool, it is characterised in that include posting and limit, location, having positioning through hole in described posting, limit, described location is arranged in described positioning through hole, and is connected with described posting, having locating slot on described posting, described locating slot communicates with described positioning through hole.
2. paster positioning tool as claimed in claim 1, it is characterised in that described posting is inorganic ceramic posting.
3. paster positioning tool as claimed in claim 2, it is characterised in that described posting is graphite posting, carborundum posting or aluminium nitride posting.
4. paster positioning tool as claimed in claim 1, it is characterised in that described posting is almag posting.
5. paster positioning tool as claimed in claim 1, it is characterised in that described posting is high-temperature resistance plastice posting.
6. paster positioning tool as claimed in claim 5, it is characterised in that described posting is tetrafluoroethene posting or polyimides posting.
7. paster positioning tool as claimed in claim 1, it is characterised in that there is in each edge on limit, described location at least one described locating slot.
8. paster positioning tool as claimed in claim 7, it is characterised in that described locating slot is through locating slot or half through locating slot.
9. paster positioning tool as claimed in claim 8, it is characterised in that described locating slot is band fillet locating slot.
10. the paster positioning tool as described in claim 1-9 any one, it is characterised in that described posting and limit, described location are integral type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610234582.9A CN105772896A (en) | 2016-04-15 | 2016-04-15 | Patch positioning tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610234582.9A CN105772896A (en) | 2016-04-15 | 2016-04-15 | Patch positioning tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105772896A true CN105772896A (en) | 2016-07-20 |
Family
ID=56397684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610234582.9A Pending CN105772896A (en) | 2016-04-15 | 2016-04-15 | Patch positioning tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105772896A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783650A (en) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | For the fixing device of the automatic routing of semiconductor laser |
| CN110449682A (en) * | 2019-07-03 | 2019-11-15 | 苏州工业园区职业技术学院 | A kind of CPU heat dissipation copper foil patch reflow soldering tool |
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2016
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| CN2653842Y (en) * | 2002-10-02 | 2004-11-03 | 松下电器产业株式会社 | Printed board |
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| CN101979205A (en) * | 2010-12-01 | 2011-02-23 | 天津市中环电子计算机有限公司 | Circuit board wave-soldering fixture designed by using over-tight coupling board |
| CN102176811A (en) * | 2011-03-07 | 2011-09-07 | 苏州工业园区宏创科技有限公司 | Universal jig suitable for bearing double-sided main board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783650A (en) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | For the fixing device of the automatic routing of semiconductor laser |
| CN106783650B (en) * | 2016-12-14 | 2019-12-06 | 深圳清华大学研究院 | Fixing device for automatic routing of semiconductor laser |
| CN110449682A (en) * | 2019-07-03 | 2019-11-15 | 苏州工业园区职业技术学院 | A kind of CPU heat dissipation copper foil patch reflow soldering tool |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160720 |