CN106102315B - The Wave crest Welding method and printed circuit board of printed circuit board - Google Patents
The Wave crest Welding method and printed circuit board of printed circuit board Download PDFInfo
- Publication number
- CN106102315B CN106102315B CN201610724489.6A CN201610724489A CN106102315B CN 106102315 B CN106102315 B CN 106102315B CN 201610724489 A CN201610724489 A CN 201610724489A CN 106102315 B CN106102315 B CN 106102315B
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- 238000003466 welding Methods 0.000 title claims abstract description 134
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 68
- 230000000903 blocking effect Effects 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000009434 installation Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09463—Partial lands, i.e. lands or conductive rings not completely surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention is suitable for printed-board technology field, provides a kind of Wave crest Welding method of printed circuit board the following steps are included: providing a substrate, drills on substrate and form at least one welding hole；Formed be located on welding hole peripheral pad and；It is open to each pad, forms notch, the notch is penetrated through to the welding hole inner wall；The substrate is mobile towards Xi Mianbofeng, and welding hole and the notch are arranged along the substrate direction of advance.The Wave crest Welding method of the printed circuit board is located on the pad for welding hole peripheral by forming welding hole on the substrate and being formed, to prepare for wave-soldering electronic component to be welded；And the notch is set on pad, the welding hole and the notch are arranged along the substrate direction of advance, and when the welding hole passes through the tin surface wave peak, the scolding tin is flowed out along the notch, to avoid blocking the welding hole.
Description
Technical field
The invention belongs to a kind of Wave crest Welding method of printed-board technology field more particularly to printed circuit board with
And printed circuit board.
Background technique
Currently, in the production of printed circuit board, carrying out welding using wave-soldering and being widely used.
Wave-soldering is a kind of by pump function, and the liquid solder surface melted is made to form the solder wave of specific shape, when
The dress connection component of component has been inserted when passing through solder wave at a certain angle, has formed the technology of solder joint in pin-land.
Moreover, wave-soldering is heated using convective heat transfer principle butt welding zone.
It needs to complete using manual welding mode, example since the device on some printed circuit boards can not carry out wave-soldering
Such as, some winding displacements or cannot device resistant to high temperature etc..But all component holes after excessively complete wave-soldering on printed circuit board can quilt
Scolding tin is blocked, and the scolding tin on component hole is at this moment needed to sop up, and so that component hole is completely exposed that installation elements could be used for, is gone forward side by side
Row manual welding；Or first component hole is touched with high temperature paper before wave soldering, high temperature paper is torn again after excessively complete wave-soldering,
Then installation elements again.Regardless of which kind of method can all increase cost and lost labor using, and there is quality hidden danger.
Summary of the invention
The purpose of the present invention is to provide a kind of Wave crest Welding methods of printed circuit board, it is intended to solve in the prior art
Printed circuit board there is technical issues that when wave-soldering.
The invention is realized in this way a kind of Wave crest Welding method of printed circuit board, comprising the following steps:
One substrate is provided, drill on the substrate and forms at least one welding hole；
Form the pad for being located on the welding hole peripheral；
It is open to each pad, forms notch, the notch is penetrated through to the welding hole inner wall；
The substrate is mobile towards Xi Mianbofeng and carries out wave-soldering processing to the pad, and the welding hole is lacked with described
The arrangement of substrate direction of advance described in opening's edge.
Further, the width of the notch is more than or equal to the 1/2 of the welding hole internal diameter, and is less than or equal to
The 2/3 of the welding hole internal diameter.
Further, the notch is more than or equal to the pad along the weldering along the length of the substrate direction of advance
Connect the width of hole radial direction.
Further, along the substrate direction of advance, the opening direction of each notch is identical.
Further, in the step of forming notch, the guide groove communicated with the notch is formed in the pad outer rim.
The present invention also provides a kind of printed circuit boards, including being formed with the substrate of at least one welding hole and along each institute
State the pad that welding hole peripheral is formed；At least one pad is equipped with the notch of perforation to the welding hole inner wall, the weldering
Direction of advance of the hole with the corresponding notch along the substrate towards Xi Mianbofeng is connect to arrange.
Further, the width of the notch is more than or equal to the 1/2 of the welding hole internal diameter, and is less than or equal to
The 2/3 of the welding hole internal diameter.
Further, the notch is more than or equal to the pad along the weldering along the length of the substrate direction of advance
Connect the width of hole radial direction.
Further, along the substrate direction of advance, the opening direction of each notch is identical.
Further, the pad outer rim is equipped with the guide groove communicated with the notch.
The Wave crest Welding method for having the technical effect that the printed circuit board of the present invention compared with the existing technology passes through in institute
It states and forms welding hole on substrate and form the pad for being located on the welding hole peripheral, with the electricity to be welded for wave-soldering
Sub- component is prepared；And the notch is set on the pad, the welding hole and the notch advance along the substrate
Direction arrangement, when the welding hole passes through the tin surface wave peak, the scolding tin is flowed out along the notch, to avoid blocking institute
State welding hole.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to the embodiment of the present invention or the prior art
Attached drawing needed in description is briefly described, it should be apparent that, drawings described below is only of the invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the structural schematic diagram that printed circuit board provided in an embodiment of the present invention carries out wave-soldering；
Fig. 2 is the structure chart for forming welding hole in the embodiment of the present invention on substrate；
Fig. 3 is the structure chart that pad is formed on the substrate of Fig. 2；
Fig. 4 is the structure chart that notch is formed on the pad of Fig. 3；
Fig. 5 is the structure chart that printed circuit board provided in an embodiment of the present invention carries out wave-soldering；
Fig. 6 is the arrangement figure that multiple pads are arranged on printed circuit board provided in an embodiment of the present invention.
Description of symbols:
| 10 | Substrate | 40 | Notch |
| 20 | Welding hole | 50 | Xi Mianbofeng |
| 30 | Pad | 60 | Guide groove |
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.
Fig. 1 to Fig. 5 is please referred to, the Wave crest Welding method of printed circuit board provided in an embodiment of the present invention includes following step
It is rapid:
One substrate 10 is provided, drill on the substrate 10 and forms at least one welding hole 20；
Formed be located on 20 periphery of welding hole pad 30 and；
It is open to each pad 30, forms notch 40, the perforation of notch 40 to 20 inner wall of welding hole；
The substrate 10 is mobile towards Xi Mianbofeng and carries out wave-soldering processing to the pad 30, and the welding hole 20 with
The notch 40 is arranged along 10 direction of advance of substrate.
The Wave crest Welding method of printed circuit board provided in an embodiment of the present invention is welded by being formed on the substrate 10
It connects hole 20 and forms the pad 30 for being located on 20 periphery of welding hole, with the electronic component to be welded for wave-soldering
It prepares；And the notch 40 is set on the pad 30, the welding hole 20 and the notch 40 are before the substrate 10
It arranges into direction, when the welding hole 20 is by the tin surface wave peak 50, the scolding tin is flowed out along the notch 40, to keep away
Exempt to block the welding hole 20.
In this embodiment, the welding hole 20 is the through-hole through opposite two surfaces of the substrate 10.Passing through tin face
When wave crest 50,10 1 surface of substrate is towards tin surface wave peak 50, and another surface is away from tin surface wave peak 50 and described
Scolding tin in tin surface wave peak 50 climbs upwards through the welding hole 20 and is adhered on the pad 30, forms solder joint after cooling,
And extra scolding tin is flowed from the notch 40.
In this embodiment, the pad 30 is made of copper, and using other conductions and can also can be used for welding
Material is made, without being limited thereto.It should be noted that the hole wall of the welding hole 20 is without metalized, in order to avoid in wave crest
Occur scolding tin when weldering to be directly adhered in the hole wall, and causes plug-hole.
In this embodiment, the substrate 10 can be multilayer wiring board 10, and be equipped with resistance on its two opposite surface
Layer, i.e. green oil, the pad 30 are exposed to the solder mask.
In this embodiment, by the way that the notch 40 is arranged, so that the pad 30 becomes before opening for closed hoop
It is non-closed ring-type after opening, so that the scolding tin is flowed out along the notch 40 after tin surface wave peak 50 carries out wave-soldering,
The scolding tin is avoided to block the welding hole 20.Preferably, before the notch 40 is arranged, the pad 30 can be annulus
Shape, oval ring-type, square ring or other arbitrary shapes are formed by ring-type, without being limited thereto.
In this embodiment, 40 ground of notch is equipped with solder mask.
In this embodiment, the substrate 10 is mobile relative to tin surface wave peak 50 under the drive of conveying mechanism, with
Realize welding.The welding hole 20 and the notch 40 are moved along the direction of advance of the substrate 10, mobile in the substrate 10
In the process, the notch 40 is located at the rear at tin surface wave peak 50, and the scolding tin is from the inner wall of the welding hole 20 towards described
The outer rim of pad 30 flows, and the direction arrow B is flowed along Fig. 1, i.e., along the scolding tin of the notch 40 flowing and the substrate 10
Unanimously, the scolding tin is drawn into the notch 40 direction of advance A (direction arrow A as shown in figure 1) automatically, be can control balance, is led
Draw and melt tin, scolding tin is avoided to accumulate, scolding tin is avoided to block the welding hole 20.
Fig. 1 is please referred to, further, the width W of the notch 40 is more than or equal to the 1/ of the 20 internal diameter D of welding hole
2, and it is less than or equal to the 2/3 of the 20 internal diameter D of welding hole.By the way that the width W of the notch 40 is set smaller than or
Equal to the 2/3 of the 20 internal diameter D of welding hole, scolding tin can be effectively adhered on the pad 30, to guarantee in the pad
Good pad is formed on 30, prevents failure welding or rosin joint；By the way that the width W of the notch 40 is set greater than or
Person is equal to the 1/2 of the 20 internal diameter D of welding hole, reduces the blocking power that scolding tin is flowed along the notch 40, it is stifled to avoid the occurrence of scolding tin
Firmly the problem of welding hole 20.
Fig. 1 is please referred to, further, the notch 40 is greater than or waits along the length L1 of the 10 direction of advance A of substrate
In the pad 30 along the radial width L2 of the welding hole 20.It is to be appreciated that the notch 40 is completely through the pad
30, so that the pad 30 becomes non-close ring-type from closed circular, to guarantee that the scolding tin can be flowed along the notch 40
It is dynamic, and avoid the occurrence of the problem of blocking welding hole 20.The notch 40 is big along the length L1 of the 10 direction of advance A of substrate
When the pad 30 is along the 20 radial width L2 of welding hole, the scolding tin flows to described lack along 20 inner wall of welding hole
The side far from 20 inner wall of welding hole of mouth 40, avoids the scolding tin from being piled up at the welding hole 20, prevents blocking institute
State welding hole 20.
Fig. 1, Fig. 5 and Fig. 6 are please referred to, further, along the 10 direction of advance A of substrate, the opening of each notch 40
Direction is identical.When for having two or more described pads 30 to need to carry out wave-soldering, advance along the substrate 10
Direction A, the opening direction having the same of notch 40 on each pad 30 are that is, each described along the 10 direction of advance A of substrate
Notch 40 is respectively positioned on the rear of corresponding welding hole 20, so that the flow direction B of the scolding tin and the 10 direction of advance A base of substrate
This is consistent, and scolding tin is avoided to block the welding hole 20.
In this embodiment, the quantity of the pad 30 can be arranged according to 10 actual demand of substrate.
In this embodiment, each pad 30 can be arranged along same linear interval, as shown in fig. 6, can also be distributed
In on two or two or more straight lines, the arrangement mode of the pad 30 is without being limited thereto, can be arranged according to actual demand.
Fig. 1 and Fig. 5 are please referred to, further, in the step of forming notch 40, in 30 outer rim of pad formation and institute
State the guide groove 60 that notch 40 communicates.By forming the guide groove 60 in 30 outer rim of pad, and the guide groove 60 is lacked with described
Mouth 40 communicates, in this way, the scolding tin along the notch 40 flowing disperses from guide groove 60 described in trend, the scolding tin is avoided to be piled up in
At the welding hole 20, prevent from blocking the welding hole 20.
Preferably, the guide groove 60 extends along the opposite sides of the notch 40.In other embodiments, the guide groove 60
It can also extend along the unilateral side of the notch 40, it is without being limited thereto.
Printed circuit board provided in an embodiment of the present invention includes substrate 10 and the edge for being formed at least one welding hole 20
The pad 30 that each 20 periphery of the welding hole is formed；At least one pad 30 is equipped with perforation to 20 inner wall of welding hole
Notch 40, direction of advance of the welding hole 20 with the corresponding notch 40 along the substrate 10 towards tin surface wave peak 50 are arranged.
Fig. 1 to Fig. 5 is please referred to, the Wave crest Welding method of printed circuit board provided in an embodiment of the present invention passes through described
Form welding hole 20 on substrate 10 and formed and be located on the pad 30 of 20 periphery of welding hole, with for wave-soldering it is to be welded
The electronic component connect is prepared；And the notch 40 is set on the pad 30, the welding hole 20 and the notch 40
It arranges along 10 direction of advance of substrate, when the welding hole 20 is by the tin surface wave peak 50, the scolding tin is lacked along described
Mouth 40 flows out, to avoid blocking the welding hole 20.
In this embodiment, the welding hole 20 is the through-hole through opposite two surfaces of the substrate 10.Passing through tin face
When wave crest 50,10 1 surface of substrate is towards tin surface wave peak 50, and another surface is away from tin surface wave peak 50 and described
Scolding tin in tin surface wave peak 50 climbs upwards through the welding hole 20 and is adhered on the pad 30, forms solder joint after cooling,
And extra scolding tin is flowed from the notch 40.
In this embodiment, the pad 30 is made of copper, and using other conductions and can also can be used for welding
Material is made, without being limited thereto.It should be noted that the hole wall of the welding hole 20 is without metalized, in order to avoid in wave crest
Occur scolding tin when weldering to be directly adhered in the hole wall, and causes plug-hole.
In this embodiment, the substrate 10 can be multilayer wiring board 10, and be equipped with resistance on its two opposite surface
Layer, i.e. green oil, the pad 30 are exposed to the solder mask.
In this embodiment, by the way that the notch 40 is arranged, so that the pad 30 becomes before opening for closed hoop
It is non-closed ring-type after opening, so that the scolding tin is flowed out along the notch 40 after tin surface wave peak 50 carries out wave-soldering,
The scolding tin is avoided to block the welding hole 20.Preferably, before the notch 40 is arranged, the pad 30 can be annulus
Shape, oval ring-type, square ring or other arbitrary shapes are formed by ring-type, without being limited thereto.
In this embodiment, 40 ground of notch is equipped with solder mask.
In this embodiment, the substrate 10 is mobile relative to tin surface wave peak 50 under the drive of conveying mechanism, with
Realize welding.The welding hole 20 and the notch 40 are moved along the direction of advance of the substrate 10, mobile in the substrate 10
In the process, the notch 40 is located at the rear at tin surface wave peak 50, and the scolding tin is from the inner wall of the welding hole 20 towards described
The outer rim of pad 30 flows, and the direction arrow B is flowed along Fig. 1, i.e., along the scolding tin of the notch 40 flowing and the substrate 10
Unanimously, the scolding tin is drawn into the notch 40 direction of advance A (direction arrow A as shown in figure 1) automatically, be can control balance, is led
Draw and melt tin, scolding tin is avoided to accumulate, scolding tin is avoided to block the welding hole 20.
Fig. 1 is please referred to, further, the width W of the notch 40 is more than or equal to the 1/ of the 20 internal diameter D of welding hole
2, and it is less than or equal to the 2/3 of the 20 internal diameter D of welding hole.By the way that the width W of the notch 40 is set smaller than or
Equal to the 2/3 of the 20 internal diameter D of welding hole, scolding tin can be effectively adhered on the pad 30, to guarantee in the pad
Good pad is formed on 30, prevents failure welding or rosin joint；By the way that the width W of the notch 40 is set greater than or
Person is equal to the 1/2 of the 20 internal diameter D of welding hole, reduces the blocking power that scolding tin is flowed along the notch 40, it is stifled to avoid the occurrence of scolding tin
Firmly the problem of welding hole 20.
Fig. 1 is please referred to, further, the notch 40 is greater than or waits along the length L1 of the 10 direction of advance A of substrate
In the pad 30 along the radial width L2 of the welding hole 20.It is to be appreciated that the notch 40 is completely through the pad
30, so that the pad 30 becomes non-close ring-type from closed circular, to guarantee that the scolding tin can be flowed along the notch 40
It is dynamic, and avoid the occurrence of the problem of blocking welding hole 20.The notch 40 is big along the length L1 of the 10 direction of advance A of substrate
When the pad 30 is along the 20 radial width L2 of welding hole, the scolding tin flows to described lack along 20 inner wall of welding hole
The side far from 20 inner wall of welding hole of mouth 40, avoids the scolding tin from being piled up at the welding hole 20, prevents blocking institute
State welding hole 20.
Fig. 1, Fig. 5 and Fig. 6 are please referred to, further, along the 10 direction of advance A of substrate, the opening of each notch 40
Direction is identical.When for having two or more described pads 30 to need to carry out wave-soldering, advance along the substrate 10
Direction A, the opening direction having the same of notch 40 on each pad 30 are that is, each described along the 10 direction of advance A of substrate
Notch 40 is respectively positioned on the rear of corresponding welding hole 20, so that the flow direction B of the scolding tin and the 10 direction of advance A base of substrate
This is consistent, and scolding tin is avoided to block the welding hole 20.
In this embodiment, the quantity of the pad 30 can be arranged according to 10 actual demand of substrate.
In this embodiment, each pad 30 can be arranged along same linear interval, as shown in fig. 6, can also be distributed
In on two or two or more straight lines, the arrangement mode of the pad 30 is without being limited thereto, can be arranged according to actual demand.
Fig. 1 and Fig. 5 are please referred to, further, in the step of forming notch 40, is equipped with and institute in 30 outer rim of pad
State the guide groove 60 that notch 40 communicates.By forming the guide groove 60 in 30 outer rim of pad, and the guide groove 60 is lacked with described
Mouth 40 communicates, in this way, the scolding tin along the notch 40 flowing disperses from guide groove 60 described in trend, the scolding tin is avoided to be piled up in
At the welding hole 20, prevent from blocking the welding hole 20.
Preferably, the guide groove 60 extends along the opposite sides of the notch 40.In other embodiments, the guide groove 60
It can also extend along the unilateral side of the notch 40, it is without being limited thereto.
In the above embodiments, through wave-soldering handle printed circuit board carry out electronic component manual welding be,
It is used directly for manual welding, while the solder joint of manual welding can make manual welding because there are scolding tin on pad after wave-soldering
It is more easier, effectively reduces production cost, avoid manual operation, improves the quality and yield of printed circuit board.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of Wave crest Welding method of printed circuit board, which comprises the following steps:
One substrate is provided, drill on the substrate and forms at least one welding hole, the welding hole is through the substrate
The through-hole on opposite two surfaces；
Form the pad for being located on the welding hole peripheral；
It is open to each pad, forms notch, the notch is penetrated through to the welding hole inner wall；
The substrate is mobile towards Xi Mianbofeng and carries out wave-soldering processing, and the welding hole and the notch edge to the pad
The substrate direction of advance arrangement；
In the step of forming notch, the guide groove communicated with the notch is formed in the pad outer rim.
2. the Wave crest Welding method of printed circuit board as described in claim 1, which is characterized in that the width of the notch is big
In or equal to the welding hole internal diameter 1/2, and be less than or equal to the welding hole internal diameter 2/3.
3. the Wave crest Welding method of printed circuit board as described in claim 1, which is characterized in that the notch is along the base
The length of plate direction of advance is more than or equal to the pad along the width of the welding hole radial direction.
4. the Wave crest Welding method of printed circuit board as described in claim 1, which is characterized in that along the substrate advance side
To the opening direction of each notch is identical.
5. a kind of printed circuit board, including being formed with the substrate of at least one welding hole and being formed along each welding hole peripheral
Pad, the welding hole be through the substrate with respect to two surfaces through-hole；It is characterized in that, being set at least one pad
There is the notch of perforation to the welding hole inner wall, the welding hole and the corresponding notch are along the substrate towards Xi Mianbofeng's
Direction of advance arrangement；
The pad outer rim is equipped with the guide groove communicated with the notch.
6. printed circuit board as claimed in claim 5, which is characterized in that the width of the notch is more than or equal to the weldering
The 1/2 of hole internal diameter is connect, and is less than or equal to the 2/3 of the welding hole internal diameter.
7. printed circuit board as claimed in claim 5, which is characterized in that length of the notch along the substrate direction of advance
More than or equal to the pad along the width of the welding hole radial direction.
8. printed circuit board as claimed in claim 5, which is characterized in that along the substrate direction of advance, each notch
Opening direction is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610724489.6A CN106102315B (en) | 2016-08-25 | 2016-08-25 | The Wave crest Welding method and printed circuit board of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610724489.6A CN106102315B (en) | 2016-08-25 | 2016-08-25 | The Wave crest Welding method and printed circuit board of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102315A CN106102315A (en) | 2016-11-09 |
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| CN110662350A (en) * | 2018-06-29 | 2020-01-07 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN111432549A (en) * | 2019-01-09 | 2020-07-17 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN110677988A (en) * | 2019-10-14 | 2020-01-10 | 江苏优为视界科技有限公司 | Prevent circuit board in pad stifled hole |
| CN111200906B (en) * | 2020-02-09 | 2021-06-29 | 苏州浪潮智能科技有限公司 | PCB board |
| CN113056095A (en) * | 2021-02-22 | 2021-06-29 | 深圳市亚微科技有限公司 | FPC suitable for pin insertion |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2629386Y (en) * | 2003-06-20 | 2004-07-28 | 顺德市顺达电脑厂有限公司 | Rear soldering pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05226820A (en) * | 1992-02-18 | 1993-09-03 | Ibiden Co Ltd | Printed wiring board |
| JP2005129758A (en) * | 2003-10-24 | 2005-05-19 | Sanyo Product Co Ltd | Control board for game machine |
| CN201440753U (en) * | 2009-05-15 | 2010-04-21 | 台达电子工业股份有限公司 | Grounded C-shaped interlinked welding pad |
| CN202488880U (en) * | 2012-03-09 | 2012-10-10 | 常州海弘电子有限公司 | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering |
| CN103369813A (en) * | 2012-04-11 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Structure of printed circuit board |
| CN203827602U (en) * | 2014-05-09 | 2014-09-10 | 广东易事特电源股份有限公司 | Improved grounding pad |
| CN104080277A (en) * | 2014-05-19 | 2014-10-01 | 深圳市共进电子股份有限公司 | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board |
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| CN2629386Y (en) * | 2003-06-20 | 2004-07-28 | 顺德市顺达电脑厂有限公司 | Rear soldering pad |
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