CN202425269U - Cold plate of electronic component - Google Patents
Cold plate of electronic component Download PDFInfo
- Publication number
- CN202425269U CN202425269U CN2011204755924U CN201120475592U CN202425269U CN 202425269 U CN202425269 U CN 202425269U CN 2011204755924 U CN2011204755924 U CN 2011204755924U CN 201120475592 U CN201120475592 U CN 201120475592U CN 202425269 U CN202425269 U CN 202425269U
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- China
- Prior art keywords
- substrate
- liquid
- electronic component
- cold plate
- fluid passage
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a cold plate of an electronic component, which comprises a first substrate 2 and a second substrate 3. The cold plate of the electronic component is characterized in that the first substrate 2 is welded with the second substrate 3 by vacuum brazing, and a liquid passage 5 is arranged between the first substrate 2 and the second substrate 3. The two substrates are spliced by the technology of vacuum brazing, so that the substrates can be welded seamlessly, completely interference-free circulation among formed small liquid passages is achieved, flow speed of liquids is high, and radiating effect is better.
Description
Technical field
The utility model relates to cooling device, relates in particular to a kind of electronic devices and components cold drawing.
Background technology
Along with the development of electron trade, increasing industry is used electronic chip, and more and more electronic chips are used for same circuit board.In this process, electronic chip or other device in use all need heat radiation, and the occasion heat dissipation capacity that has and big common air-cooledly can't reach good effect at all.
This situation; Water-cooling, oil cooling heat radiation just are used for the heat radiation process of electronic devices and components; But common cooling electronic component cold drawing adopts common solder technology to be welded; The breach that this kind welding manner makes easy formation intersection convection current between the liquid passage aisle, making liquid overlong time in the inner passage influences radiating effect.
Summary of the invention
For addressing the above problem, the utility model provides a kind of radiating effect good electron components and parts cold drawing.
For achieving the above object, the technical scheme that the utility model adopts is: the electronic devices and components cold drawing, comprise first substrate 2, second substrate 3, and it is characterized in that: first substrate 2 and 3 vacuum brazings of second substrate form; First substrate 2 and 3 of second substrates are established fluid passage 5.
First preferred version of the utility model is: establish liquid-inlet 1 and liquid outlet 4 on described first substrate 2, said liquid-inlet 1 is communicated with fluid passage 5 with liquid outlet 4.
Second preferred version of the utility model is: described fluid passage 5 is serpentine, comprises a plurality of liquid passage aisles, does not have cross-channel between a plurality of liquid passage aisles.
The technical advantage of the utility model is: adopt two substrates of Vacuum Soldering Technology splicing, make that welding is seamless between substrate, complete noiseless circulation between the liquid passage aisle of formation.It is fast that flow of liquid is crossed speed, and radiating effect is better.
Below in conjunction with accompanying drawing and specific embodiment the utility model is further specified.
Description of drawings
Fig. 1 is a present embodiment left surface view.
Fig. 2 is the present embodiment front view.
Embodiment
With reference to figure 1, Fig. 2, the electronic devices and components cold drawing comprises first substrate 2, second substrate, 3 first substrates 2 and 3 vacuum brazings of second substrate and welds; First substrate 2 and 3 of second substrates are established fluid passage 5.Establish liquid-inlet 1 and liquid outlet 4 on first substrate 2, liquid-inlet 1 is communicated with fluid passage 5 with liquid outlet 4.Fluid passage 5 is serpentine, comprises a plurality of liquid passage aisles, does not have cross-channel between a plurality of liquid passage aisles.Liquid Ru Shui, oil flow into the liquid passage aisle that passes a plurality of S shapes through fluid passage 5 anterior shuntings from liquid-inlet 1, after conflux place, fluid passage 5 rear portion conflux, flow out from liquid outlet 4.
Though the utility model further specifies according to the foregoing description, the invention thought of the utility model is not limited only to this.Like liquid-inlet 1 and liquid outlet 4 position is set, also can establishes one of them on second substrate, can be considered the equivalent of the foregoing description.
Fluid passage 5 also can other crooked shapes, and substrate shape can be other shapes also, are not limited only to square in the accompanying drawing.Can change according to electronic devices and components.
Claims (3)
1. the electronic devices and components cold drawing comprises first substrate (2), second substrate (3), it is characterized in that: first substrate (2) forms with second substrate (3) vacuum brazing; Establish fluid passage (5) between first substrate (2) and second substrate (3).
2. electronic devices and components cold drawing according to claim 1 is characterized in that: establish liquid-inlet (1) and liquid outlet (4) on described first substrate (2), said liquid-inlet (1) is communicated with fluid passage (5) with liquid outlet (4).
3. electronic devices and components cold drawing according to claim 1 and 2 is characterized in that: described fluid passage (5) is serpentine, comprises a plurality of liquid passage aisles, does not have cross-channel between a plurality of liquid passage aisles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204755924U CN202425269U (en) | 2011-11-25 | 2011-11-25 | Cold plate of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204755924U CN202425269U (en) | 2011-11-25 | 2011-11-25 | Cold plate of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425269U true CN202425269U (en) | 2012-09-05 |
Family
ID=46749987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204755924U Expired - Fee Related CN202425269U (en) | 2011-11-25 | 2011-11-25 | Cold plate of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425269U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413670A (en) * | 2011-11-25 | 2012-04-11 | 无锡市豫达换热器有限公司 | Cold plate for electronic components |
| CN105744805A (en) * | 2016-04-15 | 2016-07-06 | 周哲明 | Multi-channel combined water-cooling plate |
-
2011
- 2011-11-25 CN CN2011204755924U patent/CN202425269U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413670A (en) * | 2011-11-25 | 2012-04-11 | 无锡市豫达换热器有限公司 | Cold plate for electronic components |
| CN105744805A (en) * | 2016-04-15 | 2016-07-06 | 周哲明 | Multi-channel combined water-cooling plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20141125 |
|
| EXPY | Termination of patent right or utility model |