CN201426226Y - Electronic component integration board - Google Patents
Electronic component integration board Download PDFInfo
- Publication number
- CN201426226Y CN201426226Y CN2009200572166U CN200920057216U CN201426226Y CN 201426226 Y CN201426226 Y CN 201426226Y CN 2009200572166 U CN2009200572166 U CN 2009200572166U CN 200920057216 U CN200920057216 U CN 200920057216U CN 201426226 Y CN201426226 Y CN 201426226Y
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting plate
- heat conductive
- electronic devices
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An electronic component integration board is characterized in that the integration board is composed of a heat conductive board, a plurality of electronic components fixed on the heat conductive boardand a coil tube arranged under the heat conductive plate and tightly attached on the surface of the heat conductive plate, the lower both sides of the coil tube are welded on the heat conductive plate through heat conductive material. Compared with prior art, the electronic component integration board has the advantages of low manufacturing cost, easy machining and good heat dissipation effect.
Description
Technical field:
The utility model relates to a kind of electronic devices and components circuit board.
Background technology:
The existing electronic devices and components circuit board that need lower the temperature to the electronic devices and components in the work generally is by a middle thick copper coin that is processed with cooling water channel, and several electronic devices and components are fixed on the thick copper coin according to arranging in proper order.During work, in cooling water channel, feed cooling fluid,, prevent that electronic devices and components from high temperature damaging so that cool off, take away the heat that is produced when electronic devices and components are worked.The shortcoming of this kind electronic devices and components circuit board is the manufacturing cost height, and the processing difficulties of water channel is not easy to be provided with according to the actual needs the water channel of processing special trend in thick copper coin.
Summary of the invention:
Goal of the invention of the present utility model is to provide the electronic devices and components circuit board of a kind of low cost of manufacture, handling ease.
The coil pipe that abuts against the heat-conducting plate surface that the utility model is achieved in that by heat-conducting plate, be fixed on several electronic devices and components on the heat-conducting plate, be arranged on below the heat-conducting plate constitutes, and the both sides below the coil pipe are welded on heat-conducting plate by Heat Conduction Material.Heat Conduction Material is copper or tin.Because adopt the mode of welding coil pipe on heat-conducting plate that the heat that electronic devices and components sent in the work is drained, and the setting of coil pipe and special trend are easy to process, and, coil pipe is set on heat-conducting plate, cost is low.
Here, in order to improve radiating effect, the face that coil pipe is connected with heat-conducting plate is the plane, like this, just can guarantee effectively that coil pipe has enough areas to contact with heat-conducting plate, guarantees the effect of heat radiation.
Compared with the prior art the utility model has advantage low cost of manufacture, handling ease, good heat dissipation effect.
Description of drawings:
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a back of the present utility model view.
Embodiment:
Now in conjunction with the accompanying drawings and embodiments the utility model is described in further detail:
As shown in the figure, the utility model by copper heat-conducting plate 1, be fixed on several electronic devices and components 2 (as resistance) on the heat-conducting plate 1, the bronze pan tube that abuts against heat-conducting plate 1 surface 3 that is arranged on below the heat-conducting plate 1 constitutes, the face that coil pipe is connected with heat-conducting plate is that the plane is (with the following pressing of coil pipe, like this, the following plane that just forms of coil pipe).Both sides below the coil pipe 3 are fixed together with heat-conducting plate 1 by brazing or soldering 4.
Claims (3)
1, a kind of electronic devices and components circuit board, the coil pipe that abuts against the heat-conducting plate surface that it is characterized in that by heat-conducting plate, be fixed on several electronic devices and components on the heat-conducting plate, is arranged on below the heat-conducting plate constitutes, and the both sides below the coil pipe are welded on the heat-conducting plate by Heat Conduction Material.
2, electronic devices and components circuit board according to claim 1 is characterized in that the face that coil pipe is connected with heat-conducting plate is the plane.
3, electronic devices and components circuit board according to claim 1 and 2 is characterized in that Heat Conduction Material is copper or tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200572166U CN201426226Y (en) | 2009-05-19 | 2009-05-19 | Electronic component integration board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200572166U CN201426226Y (en) | 2009-05-19 | 2009-05-19 | Electronic component integration board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201426226Y true CN201426226Y (en) | 2010-03-17 |
Family
ID=42025683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200572166U Expired - Lifetime CN201426226Y (en) | 2009-05-19 | 2009-05-19 | Electronic component integration board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201426226Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994678A (en) * | 2015-07-02 | 2015-10-21 | 常州鼎润电子科技有限公司 | High-efficiency heat dissipation PCB |
| CN105161009A (en) * | 2015-07-16 | 2015-12-16 | 江苏嘉德光电科技有限公司 | Surface-mounted indoor single/double-color unit plate |
-
2009
- 2009-05-19 CN CN2009200572166U patent/CN201426226Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994678A (en) * | 2015-07-02 | 2015-10-21 | 常州鼎润电子科技有限公司 | High-efficiency heat dissipation PCB |
| CN105161009A (en) * | 2015-07-16 | 2015-12-16 | 江苏嘉德光电科技有限公司 | Surface-mounted indoor single/double-color unit plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101784160B (en) | Method for manufacturing press in type printed circuit board with high thermal conductivity | |
| US20090314471A1 (en) | Heat pipe type heat sink and method of manufacturing the same | |
| CN204668293U (en) | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment | |
| CN102655714A (en) | Manufacturing process of metal substrate high-conductivity metal base circuit board | |
| CN102123562B (en) | Method for manufacturing metal substrate by adopting reflow soldering | |
| CN103338613B (en) | There is the electronic equipment of asymmetric radiator structure | |
| CN201426226Y (en) | Electronic component integration board | |
| CN202282935U (en) | Water cooled plate | |
| CN203761733U (en) | Novel micro heat pipe heat dissipation module of airborne electronic device | |
| CN101325165A (en) | Method for joining radiator and power component with low heat | |
| CN209731686U (en) | A kind of circuit board | |
| CN109640581B (en) | Air-cooled cold plate with built-in heat pipe and processing method thereof | |
| CN204392737U (en) | Hand-held device radiator structure | |
| CN202907340U (en) | Inlaid circuit board | |
| CN201594949U (en) | PCB with embedded radiating structure | |
| CN201064074Y (en) | Heat pipe radiator | |
| CN203040009U (en) | High heat conducting circuit board | |
| CN203722987U (en) | Simple heat radiation structure of multiple power devices | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN209527039U (en) | It is a kind of using air-cooled heat pipe cold plate | |
| CN202425269U (en) | Cold plate of electronic component | |
| CN204305453U (en) | VFC plate | |
| CN101770563B (en) | Intelligent card heat dissipating device and manufacturing method thereof | |
| CN208848891U (en) | A kind of radiator of lateral diffusion metal oxide semiconductor (LDMOS) device | |
| CN100533047C (en) | Method for improving contact thermal resistance between large power heat pipe radiator and heating element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Foshan Jiechuang Technology Co., Ltd. Assignor: Ren Hang Contract record no.: 2011440000043 Denomination of utility model: Electronic component integration board Granted publication date: 20100317 License type: Exclusive License Record date: 20110128 |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100317 |
|
| CX01 | Expiry of patent term |