CN104080277A - Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board - Google Patents
Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board Download PDFInfo
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- CN104080277A CN104080277A CN201410211183.1A CN201410211183A CN104080277A CN 104080277 A CN104080277 A CN 104080277A CN 201410211183 A CN201410211183 A CN 201410211183A CN 104080277 A CN104080277 A CN 104080277A
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- soldering
- opening
- welding hole
- wave
- pad
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Abstract
The invention discloses a method for preventing soldering holes from being blocked in the wave soldering process. The method includes the following steps that a substrate is provided; holes are drilled in the substrate so as to form the soldering holes; a bonding pad enclosing each soldering hole is formed in the portion, around the soldering hole, of the substrate; an opening is formed in at least one bonding pad and covered with green oil; wave soldering is conducted towards the opening. The invention further relates to a printed circuit board. Because the opening of the bonding pad is covered with the green oil so that soldering tin cannot flow through in the wave soldering process, the soldering tin can only flow along the two sides of the opening and is not prone to flowing into the soldering holes, and thus it is guaranteed that the soldering holes without inserts cannot be blocked by the soldering tin easily in the wave soldering process.
Description
Technical field
The present invention relates to printed circuit field, particularly relate to a kind of method that welding hole stops up while preventing wave-soldering, also relate to a kind of printed circuit board (PCB).
Background technology
While often having part plug-in unit at wave-soldering on printed circuit board (PCB) (PCB), do not go up part, corresponding pad adopts normal design conventionally, has crossed after wave-soldering, and welding hole is just likely covered by tin.Main cause is there is no detin pad, will cause too much tin to pile up on pad, causes plug-hole.If upper device after this hole needs, just needs artificial detin, hole is opened, cause the loss of artificial and efficiency.
Summary of the invention
Based on this, be necessary to provide a kind of method that welding hole stops up while preventing wave-soldering.
The method that while preventing wave-soldering, welding hole stops up, comprises the following steps: to provide a substrate; On described substrate, boring is to form welding hole; On each welding hole substrate around, form the pad that surrounds welding hole; Pad upper shed described at least one, opening part is covered by green oil; In face of described opening, cross wave-soldering.
In an embodiment, described pad is circular before opening, after opening, from closed hoop, becomes non-closed hoop therein.
In an embodiment, described pad is the copper material for exposing except opening therein.
In an embodiment, the width of described opening is 0.5 millimeter therein.
In an embodiment, the direction of each pad upper shed is all identical therein.
Also be necessary to provide a kind of printed circuit board (PCB).
A printed circuit board (PCB), comprising: substrate, and described substrate forms welding hole through boring; Pad, is formed on each welding hole substrate around, surrounds described welding hole; At least one in described pad is provided with opening, and opening part is covered by green oil, and the opening direction of each welding hole is all identical.
In an embodiment, described pad is the copper material for exposing except opening therein.
In an embodiment, the width of described opening is 0.5 millimeter therein.
The above-mentioned method that welding hole stops up while preventing wave-soldering, thereby the opening part of pad covering green oil does not have scolding tin and flows through when crossing wave-soldering, therefore scolding tin only can be along two side flow of opening, therefore be difficult for flowing in welding hole, thereby guaranteed that not yet the welding hole of plug-in unit is difficult for being stopped up by scolding tin when crossing wave-soldering.
Accompanying drawing explanation
By the more specifically explanation of the preferred embodiments of the present invention shown in accompanying drawing, above-mentioned and other object of the present invention, that Characteristics and advantages will become will be more clear.In whole accompanying drawings, identical Reference numeral is indicated identical part, and deliberately by actual size equal proportion convergent-divergent, draws accompanying drawing, focuses on illustrating purport of the present invention.
Fig. 1 is the schematic diagram of the pad of the method that while preventing wave-soldering in an embodiment, welding hole stops up while crossing wave-soldering;
Fig. 2 is the flow chart of the method that while preventing wave-soldering in an embodiment, welding hole stops up.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing, provided first-selected embodiment of the present invention.But the present invention can realize in many different forms, be not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to disclosure of the present invention more thoroughly comprehensively.
It should be noted that, when element is called as " being fixed on " another element, can directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology of using are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present invention with scientific terminology.The term using in specification of the present invention herein, just in order to describe the object of specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Fig. 2 is the flow chart of the method that while preventing wave-soldering in an embodiment, welding hole stops up, and comprises the following steps:
S21, provides a substrate.
S22, on substrate, boring is to form welding hole.
S23 forms the pad that surrounds welding hole on each welding hole substrate around.
S24, in pad upper shed.
Refer to Fig. 1, on the pad 10 arranging around welding hole 11, open a gap, opening 12 is covered by green oil.Due to the obstruction of welding hole 11 mainly during wave-soldering not plug-in unit cause, so can consider when design just selectively to part pad 10 openings.
S25, crosses wave-soldering in face of opening.
The flow direction of scolding tin when the arrow in Fig. 1 represented wave-soldering, during due to mistake wave-soldering, crest welder is in face of opening 12 and PCB relative motion, thereby do not have scolding tin and flow through and opening 12 places cover green oil, therefore scolding tin only can be along two side flow of opening 12, therefore be difficult for flowing in welding hole 11, thereby guaranteed that not yet the welding hole 11 of plug-in unit is difficult for being stopped up by scolding tin when crossing wave-soldering.
Owing to crossing the effect that wave-soldering guarantee hole is not blocked in face of opening 12, therefore can wave-soldering direction more easily be configured by the opening 12 on a PCB is all arranged to same direction.
If it is narrow that the width of opening 12 arranges, be difficult to play the effect that changes the scolding tin flow direction; If arrange widely, can affect again the welding effect of pad 10.In an embodiment, the width of opening 12 is made as 0.5mm therein.
In the embodiment shown in fig. 1, pad 10 adopts common circular pad, at the close ring that opening 12 rear scripts are set, becomes non-closed hoop, and pad 10 is the copper material for exposing except opening.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (8)
1. the method that while preventing wave-soldering, welding hole stops up, comprises the following steps:
One substrate is provided;
On described substrate, boring is to form welding hole;
On each welding hole substrate around, form the pad that surrounds welding hole;
Pad upper shed described at least one, opening part is covered by green oil;
In face of described opening, cross wave-soldering.
2. the method that welding hole stops up while preventing wave-soldering according to claim 1, is characterized in that, described pad is circular before opening, after opening, from closed hoop, becomes non-closed hoop.
3. the method that welding hole stops up while preventing wave-soldering according to claim 1, is characterized in that, described pad is the copper material exposing except opening.
4. the method that welding hole stops up while preventing wave-soldering according to claim 1, is characterized in that, the width of described opening is 0.5 millimeter.
5. the method that welding hole stops up while preventing wave-soldering according to claim 1, is characterized in that, the direction of each pad upper shed is all identical.
6. a printed circuit board (PCB), is characterized in that, comprising:
Substrate, described substrate forms welding hole through boring;
Pad, is formed on each welding hole substrate around, surrounds described welding hole; At least one in described pad is provided with opening, and opening part is covered by green oil, and the opening direction of each welding hole is all identical.
7. printed circuit board (PCB) according to claim 6, is characterized in that, described pad is the copper material for exposing except opening.
8. printed circuit board (PCB) according to claim 6, is characterized in that, the width of described opening is 0.5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410211183.1A CN104080277A (en) | 2014-05-19 | 2014-05-19 | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410211183.1A CN104080277A (en) | 2014-05-19 | 2014-05-19 | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104080277A true CN104080277A (en) | 2014-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410211183.1A Pending CN104080277A (en) | 2014-05-19 | 2014-05-19 | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104080277A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102315A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | The Wave crest Welding method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN111200906A (en) * | 2020-02-09 | 2020-05-26 | 苏州浪潮智能科技有限公司 | PCB board |
| CN113056095A (en) * | 2021-02-22 | 2021-06-29 | 深圳市亚微科技有限公司 | FPC suitable for pin insertion |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851614A (en) * | 1987-05-22 | 1989-07-25 | Compaq Computer Corporation | Non-occluding mounting hole with solder pad for printed circuit boards |
| CN2629386Y (en) * | 2003-06-20 | 2004-07-28 | 顺德市顺达电脑厂有限公司 | Rear soldering pad |
| CN102026477A (en) * | 2009-09-17 | 2011-04-20 | 雅达电子国际有限公司 | Printed circuit board |
| CN102762030A (en) * | 2012-07-26 | 2012-10-31 | 秦玉成 | High-density PCB |
| CN103369813A (en) * | 2012-04-11 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Structure of printed circuit board |
-
2014
- 2014-05-19 CN CN201410211183.1A patent/CN104080277A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851614A (en) * | 1987-05-22 | 1989-07-25 | Compaq Computer Corporation | Non-occluding mounting hole with solder pad for printed circuit boards |
| CN2629386Y (en) * | 2003-06-20 | 2004-07-28 | 顺德市顺达电脑厂有限公司 | Rear soldering pad |
| CN102026477A (en) * | 2009-09-17 | 2011-04-20 | 雅达电子国际有限公司 | Printed circuit board |
| CN103369813A (en) * | 2012-04-11 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Structure of printed circuit board |
| CN102762030A (en) * | 2012-07-26 | 2012-10-31 | 秦玉成 | High-density PCB |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102315A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | The Wave crest Welding method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN111200906A (en) * | 2020-02-09 | 2020-05-26 | 苏州浪潮智能科技有限公司 | PCB board |
| CN113056095A (en) * | 2021-02-22 | 2021-06-29 | 深圳市亚微科技有限公司 | FPC suitable for pin insertion |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141001 |
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| RJ01 | Rejection of invention patent application after publication |