CN102762030A - High-density PCB - Google Patents
High-density PCB Download PDFInfo
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- CN102762030A CN102762030A CN201210260490XA CN201210260490A CN102762030A CN 102762030 A CN102762030 A CN 102762030A CN 201210260490X A CN201210260490X A CN 201210260490XA CN 201210260490 A CN201210260490 A CN 201210260490A CN 102762030 A CN102762030 A CN 102762030A
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- pad
- pin
- water conservancy
- conservancy diversion
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Abstract
The invention discloses a structure and a manufacturing method of a high- density PCB, and further discloses a DIP (Double In-line Package) LED display adopting the high-density PCB. The manufacturing method of the high-density PCB comprises the following steps: adjacent bonding pads are respectively mounted at the center line position deviated from welding holes, at which diversion pads are arranged. By adopting the method provided by the invention, pins are not adhered when the high-density PCB is subject to wave soldering and solder impact during manufacturing. The high-density PCB is suitable for large-scale industrial production and application.
Description
Technical field
The present invention relates to a kind of LED display, particularly straight cutting LED lamp display screen.
Background technology
LED (light emitting diode light-emitting diode is called for short LED).It is that a kind of light on and off through the control semiconductor light-emitting-diode come character display.Be used for the display screen of various information such as display text, figure, image, animation, market, video, video signal.
LED (light emitting diode light-emitting diode is called for short LED) display screen is made up of the LED dot matrix; Through redness, blueness, the light on and off of green LED lamp come display text, picture, animation, video; Content can be changed at any time, and the each several part assembly all is the display device of modular construction.Usually form by display module, control system and power-supply system.
Adopt the display screen of straight cutting LED lamp, (R is red, and G is green to adopt RGB basically; With the blue look of B) three kinds of LED lamps or adopt RGBW (R is red, the green and blue look of B of G; W white) four kinds of LED lamps are formed, and single pixel needs the LED of a plurality of monochromes to show that jointly display screen is difficult for accomplishing high density.
Three-in-one straight cutting LED lamp has 4 pins, and pin densities is high, and the pad of printed panel is difficult to arrange that highdensity pad can produce the pin adhesion when crossing wave-soldering, and percent defective is high, and three-in-one straight cutting LED lamp is difficult on LED display, extensively adopt always.
Summary of the invention
Main purpose of the present invention is, the production and processing method of a kind of high density pcb board and this high density PCB is provided and adopts LED display module and the display screen of this high density PCB.
A kind of technical scheme of technical solution problem of the present invention, be provided with pad center and welding hole the center not point-blank, the center of adjacent pad lays respectively at the both sides of welding hole center line.
Be provided with pad away from the end at welding hole center greater than a end, to increase the area of pad near welding hole.
Above-mentioned pad comprises the pad of four pins of three-in-one straight cutting LED lamp; Said pad is pin one pad, pin two pads, pin three pads, pin four pads; Also comprise at least one water conservancy diversion pad; Said water conservancy diversion pad leans on pin one pad or pin four pads, or said water conservancy diversion pad directly links to each other with pin one pad or pin four pads and becomes a large bonding pad.
On the above-mentioned water conservancy diversion pad, arrange at least one water conservancy diversion welding hole, said water conservancy diversion welding hole inside is covered copper or is covered tin, and in welding, unnecessary welding fluid sucks the water conservancy diversion welding hole or is diverted to the water conservancy diversion pad.
A kind of technology implementation mode of technical solution problem; High density PCB pad comprises the water conservancy diversion pad, and the water conservancy diversion pad is positioned at pin pad next door, electronic component edge; Consistent with the impact direction of wave-soldering, this water conservancy diversion pad can be adjacent with edge pin pad or be combined into a large bonding pad.
Above-specified high density PCB comprises the hand designations silk-screen, the impact direction of welding fluid when above-mentioned silk-screen indication pcb board is crossed wave-soldering, and in the production process, PCB places according to the hand designations silk-screen, guarantees that the water conservancy diversion pad is positioned at the end of welding fluid impact direction.
A kind of high density PCB pad processing design method:
Place welding hole;
With the welding hole line is center line, and adjacent pad is placed on welding hole center line both sides, and the center of adjacent pad lays respectively at the both sides of welding hole center line.
Above-mentioned state pad away from an end of welding hole center line greater than a end near the welding hole center line.
Above-mentioned pad comprises the pad of four pins of three-in-one straight cutting LED lamp; Said pad is pin one pad, pin two pads, pin three pads, pin four pads; Also comprise at least one water conservancy diversion pad; Said water conservancy diversion pad leans on pin one pad or pin four pads, or said water conservancy diversion pad directly links to each other with pin one pad or pin four pads and becomes a large bonding pad.
A kind of high density PCB pad laying method is provided with the water conservancy diversion pad, and said water conservancy diversion pad is positioned at electronic component edge pin pad next door, and is adjacent with edge pin pad or be combined into a large bonding pad, on the above-mentioned water conservancy diversion pad, is provided with the water conservancy diversion welding hole.
Above-specified high density PCB is provided with the hand designations silk-screen, and said silk-screen indication pcb board is crossed the direction of wave-soldering.
Because of high density PCB of the present invention,, shunt and the impact and the unnecessary welding fluid that have received welding fluid through water conservancy diversion pad or pod apertures; Make highdensity pin adhesion in process of production; Through the both sides that adjacent pad departs from the welding hole center line respectively are set, the effective area that increases pad is guaranteed to increase the area of pad away from an end at welding hole center by the steadiness and raising area of dissipation of pad; Utilize the principle of pad shunting welding fluid; Reduce the welding fluid between pin and the pin, further reduce the adhesion rate of high density pin, significantly promoted the rate of finished products of high density pcb board through wave-soldering.
Description of drawings
Fig. 1 is the circuit board sketch map of existing straight cutting LED.
Fig. 2 is one of embodiment solder pad arrangements sketch map.
Fig. 3 is one of embodiment skew center of gravity solder pad arrangements sketch map.
Fig. 4 is that one of embodiment adopts the shunting pad and indicates the machine direction sketch map.
Fig. 5 is the embodiment sketch map that one of embodiment adopts the shunting pad.
Embodiment
Below through concrete embodiment and combine accompanying drawing to further detailed description of the present invention.
As shown in Figure 1, three-in-one straight cutting LED lamp 11 has 4 pins, under the LED display application scenarios; Arranged a large amount of components and parts on the pcb board 13, the density of the pin one 2 of device is very high, in the course of processing; When particularly adopting wave-soldering, scolding tin often sticks between the pin, causes the rate of finished products of production very low; Can not carry out production on a large scale, particularly outstanding in the production process of LED display.
Like Fig. 2, a kind of practical implementation technical scheme of technical solution problem of the present invention, be provided with pad center line 26 or 27 and the center 25 of welding hole not point-blank; The center of adjacent pad lays respectively at the both sides of welding hole center line, is positioned at the both sides of welding hole center line 25 like the center line 26 and the center line 27 of pad 22 and 24 of pad 21 and pad 23; Be provided with like this, the space between the pad increases, and makes the probability that connects tin between the pin reduce; The center line of pad departs from the center line of welding hole simultaneously; During welding, liquid scolding tin gathers an effect, forces welding fluid to depart from the welding hole center line; Further reduce even tin probability, the contact area that guarantees device pin pad and pcb board simultaneously is greater than adhering to.
Like Fig. 3, be provided with pad away from the end 32 at welding hole center 31 greater than a end 33, to increase the area of pad, the highdensity device of pin near welding hole; When arranging pad, the area of pad is generally very little, and the area of pad is little; The link strength of the device pin that is is little, through adding the area of large bonding pad one end pad, has strengthened pad link strength and area of dissipation; Simultaneously the center line of welding hole is departed from the center of pad more, welding fluid gather drip after, the probability of adhesion further reduces between the pin.
Like Fig. 4, be respectively the pad of four pins of three-in-one straight cutting LED lamp, also comprise at least one water conservancy diversion pad 41, said water conservancy diversion pad 41, directly linking to each other with LED lamp pin one pad or pin four pads becomes a large bonding pad, or near placement.Above-mentioned water conservancy diversion pad is arranged at least one water conservancy diversion welding hole 42, and said water conservancy diversion welding hole inside is covered copper or covered tin, and in welding, unnecessary welding fluid sucks water conservancy diversion welding hole 42 or is diverted to water conservancy diversion pad 41.
The water conservancy diversion pad is positioned at electronic component edge pin pad next door, and is consistent with the impact direction 43 of wave-soldering, and this water conservancy diversion pad can be adjacent with edge pin pad or be combined into a large bonding pad; The setting of water conservancy diversion pad made wave-soldering be, at the welding fluid inflow water conservancy diversion pad of impact direction; The water conservancy diversion pad provides the buffering of welding fluid, receives welding fluid simultaneously, prevents that welding fluid is after impulsive force weakens; Reflux the adhesion pin with impact direction.
Above-specified high density PCB comprises hand designations silk-screen 43, the impact direction of welding fluid when above-mentioned silk-screen indication pcb board is crossed wave-soldering; In the production process; PCB places according to the hand designations silk-screen, guarantees that the water conservancy diversion pad is positioned at the end of welding fluid impact direction, handled easily personal identification and placement pcb board.
Fig. 5 provides a specific embodiments that adopts the water conservancy diversion pad, outside the LED lamp pin, increases a water conservancy diversion pad, when crossing wave-soldering; The direction that welding fluid flows is BG+R, a shunting pad is arranged, when welding fluid is flowed by BG+R on pin R next door; Impulsive force is arranged, and after impulsive force disappeared, unnecessary welding fluid refluxed and can make+pin and the adhesion of R pin; After the shunting pad was set, unnecessary welding fluid absorbed streaming buffer by the shunting pad.
A kind of high density PCB pad processing design method:
Place welding hole;
With the welding hole line is center line, and adjacent pad is placed on welding hole center line both sides, and the center of adjacent pad lays respectively at the both sides of welding hole center line.
Above-mentioned state pad away from an end of welding hole center line greater than a end near the welding hole center line.
Above-mentioned pad comprises the pad of four pins of three-in-one straight cutting LED lamp; Said pad is pin one pad, pin two pads, pin three pads, pin four pads; Also comprise at least one water conservancy diversion pad; Said water conservancy diversion pad leans on pin one pad or pin four pads, or said water conservancy diversion pad directly links to each other with pin one pad or pin four pads and becomes a large bonding pad.
A kind of high density PCB pad laying method is provided with the water conservancy diversion pad, and said water conservancy diversion pad is positioned at electronic component edge pin pad next door, and is adjacent with edge pin pad or be combined into a large bonding pad, on the above-mentioned water conservancy diversion pad, is provided with the water conservancy diversion welding hole.
Above-specified high density PCB is provided with the hand designations silk-screen, and said silk-screen indication pcb board is crossed the direction of wave-soldering.
The foregoing description is not a limitation of the present invention, and those skilled in the art draw various execution modes through the present invention, the change in size of for example inventing, and the variation of arranging of external shape structure, led chip, material replacement etc. all belong to protection scope of the present invention.
Claims (10)
1. a high density PCB is characterized in that, the center of pad and the center of welding hole not point-blank, the center of adjacent pad lays respectively at the both sides of welding hole center line.
2. high density PCB as claimed in claim 1 is characterized in that, said pad away from the end at welding hole center greater than a end near welding hole.
3. PCB according to claim 1 or claim 2; It is characterized in that; Said pad comprises the pad of four pins of three-in-one straight cutting LED lamp, and said pad is pin one pad, pin two pads, pin three pads, pin four pads, also comprises at least one water conservancy diversion pad; Said water conservancy diversion pad leans on pin one pad or pin four pads, or said water conservancy diversion pad directly links to each other with pin one pad or pin four pads and becomes a large bonding pad.
4. a high density PCB is characterized in that, comprises the water conservancy diversion pad, and said water conservancy diversion pad is positioned at electronic component edge pin pad next door, and is adjacent with edge pin pad or be combined into a large bonding pad.
5. like the said high density PCB of claim 4, it is characterized in that, comprise the hand designations silk-screen, said silk-screen indication pcb board is crossed the direction of wave-soldering.
6. a high density PCB pad laying method is characterized in that, places welding hole;
With the welding hole line is center line, and adjacent pad is placed on the both sides of welding hole contact, and the center of adjacent pad lays respectively at the both sides of welding hole center line.
7. high density PCB pad laying method as claimed in claim 6 is characterized in that, said pad away from an end of welding hole center line greater than a end near the welding hole center line.
8. like claim 6 or 7 said methods; It is characterized in that; Said pad comprises the pad of four pins of three-in-one straight cutting LED lamp, and said pad is pin one pad, pin two pads, pin three pads, pin four pads, also comprises at least one water conservancy diversion pad; Said water conservancy diversion pad leans on pin one pad or pin four pads, or said water conservancy diversion pad directly links to each other with pin one pad or pin four pads and becomes a large bonding pad.
9. a high density PCB pad laying method is characterized in that, the water conservancy diversion pad is set, and said water conservancy diversion pad is positioned at electronic component edge pin pad next door, and is adjacent with edge pin pad or be combined into a large bonding pad.
10. like the said method of claim 9, it is characterized in that, comprise the hand designations silk-screen is set that said silk-screen indication pcb board is crossed the direction of wave-soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260490XA CN102762030A (en) | 2012-07-26 | 2012-07-26 | High-density PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260490XA CN102762030A (en) | 2012-07-26 | 2012-07-26 | High-density PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102762030A true CN102762030A (en) | 2012-10-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210260490XA Pending CN102762030A (en) | 2012-07-26 | 2012-07-26 | High-density PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102762030A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687283A (en) * | 2013-12-04 | 2014-03-26 | 乐视致新电子科技（天津）有限公司 | Printed circuit board capable of avoiding through hole short circuit and method thereof |
| CN103983809A (en) * | 2013-02-08 | 2014-08-13 | 辉达公司 | PCB and online testing structure thereof, and manufacturing method of online testing structure |
| CN104080277A (en) * | 2014-05-19 | 2014-10-01 | 深圳市共进电子股份有限公司 | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1538800A (en) * | 2003-04-17 | 2004-10-20 | 华为技术有限公司 | Method of sharing tin stealing bonding pad |
| CN2840593Y (en) * | 2005-10-18 | 2006-11-22 | 艾默生网络能源有限公司 | Anti solder bridging PCB board |
| JP2011151106A (en) * | 2010-01-20 | 2011-08-04 | Panasonic Corp | Printed wiring board |
-
2012
- 2012-07-26 CN CN201210260490XA patent/CN102762030A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1538800A (en) * | 2003-04-17 | 2004-10-20 | 华为技术有限公司 | Method of sharing tin stealing bonding pad |
| CN2840593Y (en) * | 2005-10-18 | 2006-11-22 | 艾默生网络能源有限公司 | Anti solder bridging PCB board |
| JP2011151106A (en) * | 2010-01-20 | 2011-08-04 | Panasonic Corp | Printed wiring board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103983809A (en) * | 2013-02-08 | 2014-08-13 | 辉达公司 | PCB and online testing structure thereof, and manufacturing method of online testing structure |
| CN103687283A (en) * | 2013-12-04 | 2014-03-26 | 乐视致新电子科技（天津）有限公司 | Printed circuit board capable of avoiding through hole short circuit and method thereof |
| CN104080277A (en) * | 2014-05-19 | 2014-10-01 | 深圳市共进电子股份有限公司 | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121031 |