CN2840593Y - Anti solder bridging PCB board - Google Patents
Anti solder bridging PCB board Download PDFInfo
- Publication number
- CN2840593Y CN2840593Y CN 200520066107 CN200520066107U CN2840593Y CN 2840593 Y CN2840593 Y CN 2840593Y CN 200520066107 CN200520066107 CN 200520066107 CN 200520066107 U CN200520066107 U CN 200520066107U CN 2840593 Y CN2840593 Y CN 2840593Y
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- pad
- pcb board
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Abstract
The utility model discloses an anti-solder bridging PCB board, particularly a welding technique in electronic installation. The utility model comprises at least two first pads a and second pads b which are arranged in an over weld direction and are embedded in the PCB board, and the geometric centers of the pads are not coincident with the geometric centers of corresponding contact pins. The pad is elliptical, the length range of a minor axis of the ellipse is 45 mil-70 mil, and the length range of a major axis is 50 mil-120 mil. The angle formed by the rectilinear direction of the major axis of the elliptical pad and the over weld direction is larger than or equal to 0 DEG and is smaller than 90 DEG. The utility model can reduce the possibility of solder bridging in the process of welding and can increase production first pass yield and production efficiency.
Description
[technical field]
The utility model relates to the solder technology in the circuit assembly, relates in particular to a kind of anti-tin pcb board that connects.
[background technology]
Be extensive use of contact pin connector in the circuit assembly industry, in the prior art, the contact pin connector of 2.0mm spacing is still immature in wave-soldering technology, and its reason is: the pad design on the pcb board has adopted the widely used circular pad design of industry.As shown in Figure 1, be placed on schematic diagram in the pad for 2.0mm spacing contact pin in the prior art.In the drawings, contact pin is 0.5mm * 0.5mm policy, and the centre distance of adjacent contact pin is 2mm; The circular pad diameter is 50mil; The geometric center of contact pin overlaps with the geometric center of circular pad, so just make the geometric center distance between adjacent pad also have only 2.0mm, because solder joint can be subjected to scolding tin wetting power and capillary influence when in the end being shaped, it is very serious to connect the tin problem in wave-soldering production, almost 100% company's tin when particularly contact pin connector is axially vertical with mistake wave-soldering direction (direction of horizontal arrow among Fig. 1), had a strong impact on production efficiency and welding reliability, contact pin connector axially is meant along the direction (being the vertical direction among Fig. 1) of the length of contact pin arrangement here.
In addition, in thin space surface mount pin welding procedure (as Reflow Soldering), when subsides pad design in pcb board surface is conventional symmetric shape, then because the nearly problem that connects tin easily that exists too of adjacent pad distance.
[summary of the invention]
The technical problems to be solved in the utility model provides a kind of anti-tin pcb board that connects, and has reduced to connect the possibility that tin takes place in welding process, has improved production first-pass yield and production efficiency.
The utility model is to realize by following technical scheme:
A kind of anti-company tin pcb board comprises that at least two are being arranged on the weldering direction excessively, and is embedded in first pad and second pad in the pcb board that the geometric center of described pad does not overlap with the geometric center of its corresponding contact pin.
Further improvement of the utility model is: described pad is for oval, and described oval-shaped minor axis length scope is 45mil---70mil, and its long axis length scope is 50mil---120mil.
Further improvement of the utility model is: the rectilinear direction at the major axis place of described oval pad and mistake weldering direction angulation are for spending less than 90 more than or equal to 0 degree.
Further improvement of the utility model is: the angle ranging from 45 degree.
Further improvement of the utility model is: described pad is a rectangle, and described rectangular bond length scope is 20mil---70mil, and its long edge lengths scope is 50mil---120mil.
Further improvement of the utility model is: the rectilinear direction at the place, long limit of described oblong pad and mistake weldering direction angulation are for spending less than 90 more than or equal to 0 degree.
Further improvement of the utility model is: the angle ranging from 45 degree.
Further improvement of the utility model is: comprise that also at least one is stolen the tin copper sheet, it was arranged on the weldering direction, and on the pcb board at the second pad 0.5mm---1.25mm place, the described width of stealing the tin copper sheet is more than or equal to 0.5mm.
Further improvement of the utility model is: the pcb board surface between described pad scribbles solder resist.
Further improvement of the utility model is: described solder resist is white ink for screen printing.
Owing to adopted above technical scheme, the geometric center of pad does not overlap with the geometric center of contact pin, pad design ovalisation or rectangle, make that the solder joint that forms no longer is conventional taper shape, but be the asymmetric cone of bottom surface with ellipse or rectangle, make solder joint estimate that the geometric center spacing that is shaped increases, and has reduced by two adjacent welds and has connected the tin possibility at last; In the utility model, along crossing the weldering direction, what the suitable distance place behind the pad on the pcb board added proper width steals the tin copper sheet, can the company's of removal tin, improved production first-pass yield and production efficiency.In addition, this eccentric pad technology can derive a kind of new requirement, promptly under the certain situation of distance, by designing eccentric pad, can dwindle the contact pin center distance.
[description of drawings]
Fig. 1 is that 2.0mm spacing contact pin is placed on the interior schematic diagram of pad in the prior art.
Fig. 2 is that 2.0mm spacing contact pin is placed on the schematic diagram () in the oval pad.
Fig. 3 has a schematic diagram () of stealing the pcb board of tin copper sheet.
Fig. 4 has a schematic diagram (two) of stealing the pcb board of tin copper sheet.
Fig. 5 has two schematic diagrames of stealing the pcb board of tin copper sheet.
Fig. 6 is that 2.0mm spacing contact pin is placed on the schematic diagram (two) in the utility model pad.
Fig. 7 is that 2.0mm spacing contact pin is placed on the schematic diagram (three) in the utility model pad.
[embodiment]
Below in conjunction with drawings and Examples the utility model is further set forth:
With the wave-soldering is example, and its welding process is:
During production contact pin put into the pad hole on the pcb board, then the monoblock pcb board is placed on the conveyer belt of Wave soldering apparatus, the pcb board that to insert element by conveyer belt is through the crest stove, make the pcb board bottom surface, expose the component pin of bottom surface and the scolding tin of fusion contacts, the scolding tin of fusion at this moment just is filled between pin and the PCB bottom surface pad and is filled in the pad hole, when conveyer belt continues when mobile, the solder joint that has at this moment welded just breaks away from the scolding tin of tin stove, has just formed solder joint after cooling off.Here, the conveyer belt direction of advancing was the wave-soldering direction.
For principle of the present utility model is described better, give an actual example, cross the direction of wave-soldering direction for the arrow indication that occurs among all figure, contact pin connector axially be vertical direction, this both direction is vertical mutually.
As shown in Figure 2, four pads are arranged among the figure, be divided into two rows, for convenience of description, four pads are designated as respectively: the first pad a, the second pad b, the 3rd pad c and the 4th pad d, wherein, these four pads all are oval, have four square contact pins to be inserted in respectively in these four pads, the geometric center of pad and contact pin all departs from mutually, does not promptly overlap.The long 50mil of minor axis of ellipse among the figure, the long 70mil of major axis, wherein, lmil=0.0245mm.Contact pin is 0.5mm * 0.5mm policy, the centre distance of adjacent contact pin is 2mm, consider that pad has certain width, the minimum distance of the first pad a and the second pad b is got 0.73mm, then the geometric center of the first pad a and second pad b distance is approximately: 0.73+70 * 0.0245=2.445mm, 2.0mm with respect to prior art, increased 0.445mm, thereby reduced the probability of the company's of generation tin between the first pad a and the second pad b, in like manner, the probability that produces tin between the 3rd pad c and the 4th pad d also can reduce.
Here, oval-shaped minor axis length scope can change in the scope of 45mil---70mil, and its long axis length also can change in the scope of 50mil---120mil, can reduce the probability of the company's of generation tin equally.
In order to make the effect of the company's of removal tin more obvious, can cross the wave-soldering direction on the edge, pcb board apart from the second pad b (perhaps the 4th pad d) 0.5mm---1.25mm place is provided with a tin copper sheet (promptly not having welding resistance to cover the copper sheet that can directly go up tin) steathily, the width that should steal the tin copper sheet is more than or equal to 0.5mm, specifically referring to Fig. 3.The direction of arrow was the wave-soldering direction among the figure.The action principle of stealing the tin copper sheet is: utilize the good characteristics of its scolding tin wetability, when the scolding tin of adhesion with wetability good steal the tin copper sheet and contact after, scolding tin can stolen wetting expansion on the tin copper sheet rapidly, thereby uses the scolding tin of adhesion to be broken, and has so just avoided connecting tin.
Equally, guaranteeing under the situation of geometric center distance greater than 2mm of pad, the rectilinear direction at the major axis place of oval pad with cross wave-soldering direction angulation can for greater than 0 degree less than 90 degree, also can realize the purpose of this utility model, as shown in Figure 4, the direction of arrow was the wave-soldering direction among the figure, and the rectilinear direction at the major axis place of oval pad is 45 degree with crossing wave-soldering direction angulation, in such cases, more obvious to minimizing even tin effect.Rectilinear direction with respect to the major axis place of oval pad is 0 degree with crossing wave-soldering direction angulation, angle is that the tin distance (as: distance of the geometric center of the geometric center of the contact pin of placing among the pad a and pad b) of dragging between the geometric center of contact pin point and back one solder joint of the last solder joints of scheme of 45 degree has increased, and the probability of tin is also just littler like this.
Simultaneously, steal the tin copper sheet and also can be two, promptly adopt segmented, be provided with like this and be beneficial to the outlet that is electrically connected.As shown in Figure 5, the direction of arrow was the wave-soldering direction among the figure, and the pcb board upper edge is crossed the wave-soldering direction and is disposed with first tin copper sheet, the second pad b, the first pad a steathily; In like manner, the pcb board upper edge is crossed the wave-soldering direction and is disposed with second tin copper sheet, the 4th pad d, the 3rd pad c steathily.First distance (perhaps second distance of stealing between tin copper sheet and the 4th pad d) of stealing between the tin copper sheet and the second pad b can change in the scope of 0.5mm---1.25mm, and two width of stealing the tin copper sheet are more than or equal to 0.5mm.
In order to increase the flexibility of production, stealing the tin copper sheet also can be placed near on the pcb board of pad a, be to be placed with two bulks on the pcb board to steal the tin copper sheet, specifically referring to Fig. 6, such direction of crossing wave-soldering both can be by the right side to left, also can be by left-to-right, represent with double-head arrow among the figure, if crossing the wave-soldering direction is from left to right, then the tin copper sheet of stealing on the left side plays the effect of tin steathily, and the tin copper sheet of stealing on the right does not play the effect of tin steathily; Otherwise, be from right to left if cross the wave-soldering direction, then the tin copper sheet of stealing on the right plays the effect of tin steathily, and the tin copper sheet of stealing on the left side does not play the effect of tin steathily.In addition, about steal between tin copper sheet and the corresponding pad distance and steathily the tin copper sheet width as previously mentioned.
In addition, be placed on crossing on the tin frame of pcb board with stealing the tin copper sheet, and the back of correspondence pad on pcb board, its action principle puts directly with stealing the tin copper sheet that the pad back is the same on pcb board, and this design is convenient to change on pad design on the pcb board or the PCB situation of tin copper sheet steathily can't be set.
In the utility model, except the pad design ovalisation, also can be other non-standard ellipses, as a circle is cut back outside translation respectively, again the sideline is linked up formed shape, can also be designed to rectangle, not overlap with the geometric center of contact pin as long as guarantee the geometric center of pad, the geometric center spacing of two pads is as far as possible away from (under the prerequisite that guarantees Joint Strength).As shown in Figure 7, the direction of arrow was the wave-soldering direction among the figure, and the rectilinear direction at place, rectangular long limit can certainly have certain included angle with the wave-soldering direction is parallel excessively, and promptly the formed angle of this both direction can be greater than 0 degree less than 90 degree; Rectangular bond length scope is 20mil---70mil, and its long edge lengths scope is 50mil---120mil.
In addition, can also scribble solder resist in the pcb board surface between pad, as: the ink for screen printing of white ink for screen printing or other colors; Perhaps welding resistance is removed, here said solder resist is removed, in fact just be meant when pcb board is made not at PCB surface-coated solder resist, directly the base material with pcb board comes out, have certain effect to reducing residual and companys of the preventing tin generation of tin sweat(ing), and be convenient to desk checking identification, also be to reduce a kind of supplementary form that connects tin.
When contact pin connector axially with cross the wave-soldering direction in the same way, then need not tin copper sheet steathily, can reach the 100% anti-tin that connects; This also is the effect that eccentric pad is stolen tin, eccentric pad is except having strengthened the geometric center distance (as: distance of the geometric center of pad solder joint that a forms and the geometric center of pad solder joint that b forms) of solder joint arranged side by side under this condition, drag tin distance (as: distance of the geometric center of the geometric center of the contact pin of placing among the pad a and pad c) between the contact pin point that has also increased simultaneously last solder joint and the geometric center of back one solder joint, so also just reduced the even probability of tin; Axially vertical when contact pin connector with mistake wave-soldering direction, carry out suitable pad and steal the design of tin copper sheet according to above principle, and to the suitable adjustment of wave-soldering technology (just more can reduce company's tin probability of similar thin space socket as single crest technology than dual waves technology), for example: whether use single crest or dual waves, and adjusting chain speed, crest height, conventional Wave soldering apparatus parameters such as tin furnace temperature also can be near 100% first-pass yield.
For the contact pin center distance is the situation (greater than 2mm or less than 2mm) of different distance, can become the pad design on the pcb board eccentric pad equally, reduces the effect that connects the tin probability to reach.In addition, adopt this eccentric pad technology, can also can dwindle the contact pin center distance by the eccentric pad of design.
In addition, the utility model also can be applied in surface mount process, and in Reflow Soldering, it is eccentric shape that pad design is pasted on the PCB surface, can reduce equally to connect the tin probability, increases Joint Strength.
Claims (10)
1, a kind of anti-tin pcb board that connects comprises that at least two are being arranged on the weldering direction excessively, and is embedded in first pad (a) and second pad (b) in the pcb board that it is characterized in that: the geometric center of described pad does not overlap with the geometric center of its corresponding contact pin.
2, a kind of anti-tin pcb board that connects according to claim 1, it is characterized in that: described pad is for oval, and described oval-shaped minor axis length scope is 45mil---70mil, and its long axis length scope is 50mil---120mil.
3, a kind of anti-tin pcb board that connects according to claim 2 is characterized in that: the rectilinear direction at the major axis place of described oval pad with cross weldering direction angulation for more than or equal to 0 degree less than 90 degree.
4, a kind of anti-tin pcb board that connects according to claim 3 is characterized in that: the angle ranging from 45 degree.
5, a kind of anti-tin pcb board that connects according to claim 1, it is characterized in that: described pad is a rectangle, and described rectangular bond length scope is 20mil---70mil, and its long edge lengths scope is 50mil---120mil.
6, a kind of anti-tin pcb board that connects according to claim 5 is characterized in that: the rectilinear direction at the place, long limit of described oblong pad with cross weldering direction angulation for spending less than 90 more than or equal to 0 degree.
7, a kind of anti-tin pcb board that connects according to claim 6 is characterized in that: the angle ranging from 45 degree.
8, according to the arbitrary described a kind of anti-tin pcb board that connects of claim 1 to 7, it is characterized in that: comprise that also at least one is stolen the tin copper sheet, it was arranged on the weldering direction, on the pcb board at first pad (a) or second pad (b) 0.5mm---1.25mm place, the described width of stealing the tin copper sheet is more than or equal to 0.5mm.
9, according to the arbitrary described a kind of anti-tin pcb board that connects of claim 1 to 7, it is characterized in that: the pcb board surface between described pad scribbles solder resist.
10, a kind of anti-tin pcb board that connects according to claim 9, it is characterized in that: described solder resist is for there being the color ink for screen printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520066107 CN2840593Y (en) | 2005-10-18 | 2005-10-18 | Anti solder bridging PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520066107 CN2840593Y (en) | 2005-10-18 | 2005-10-18 | Anti solder bridging PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2840593Y true CN2840593Y (en) | 2006-11-22 |
Family
ID=37428563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520066107 Expired - Fee Related CN2840593Y (en) | 2005-10-18 | 2005-10-18 | Anti solder bridging PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2840593Y (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102404945A (en) * | 2011-12-01 | 2012-04-04 | 昆山明创电子科技有限公司 | Continuous tin prevention jig |
| CN102489820A (en) * | 2011-12-01 | 2012-06-13 | 昆山明创电子科技有限公司 | Jig free of continuous tin electrodeposit |
| CN102762030A (en) * | 2012-07-26 | 2012-10-31 | 秦玉成 | High-density PCB |
| CN104053310A (en) * | 2014-07-03 | 2014-09-17 | 浪潮(北京)电子信息产业有限公司 | PCB design method for preventing continuous tin electrodeposit of welding device |
| CN104105358A (en) * | 2013-04-07 | 2014-10-15 | 深圳市共进电子股份有限公司 | Method of preventing solder bridge in case of printed circuit board plug-in wave soldering |
| CN104270887A (en) * | 2014-09-17 | 2015-01-07 | 惠州Tcl移动通信有限公司 | Combined land structure and BAG circuit board |
| CN104394644A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化系统有限公司 | Four-pin 3528 LED lamp welding pad |
| CN104576423A (en) * | 2014-12-08 | 2015-04-29 | 南通富士通微电子股份有限公司 | Short-connection bonding and welding method and structure for adjacent welding pads |
| CN104853521A (en) * | 2015-05-27 | 2015-08-19 | 北京三重华星电子科技有限公司 | Short-circuit proof method for tin soldering |
| CN105430938A (en) * | 2015-11-19 | 2016-03-23 | 广东威创视讯科技股份有限公司 | PCB package library structure and packaging method |
| CN107613648A (en) * | 2017-09-04 | 2018-01-19 | 郑州云海信息技术有限公司 | A kind of method and system for solving 0402 type RCL inside parts and connecting tin |
-
2005
- 2005-10-18 CN CN 200520066107 patent/CN2840593Y/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102489820A (en) * | 2011-12-01 | 2012-06-13 | 昆山明创电子科技有限公司 | Jig free of continuous tin electrodeposit |
| CN102404945A (en) * | 2011-12-01 | 2012-04-04 | 昆山明创电子科技有限公司 | Continuous tin prevention jig |
| CN102762030A (en) * | 2012-07-26 | 2012-10-31 | 秦玉成 | High-density PCB |
| CN104105358B (en) * | 2013-04-07 | 2018-07-13 | 深圳市共进电子股份有限公司 | The method of continuous tin prevention when edge receptacle wave-soldering |
| CN104105358A (en) * | 2013-04-07 | 2014-10-15 | 深圳市共进电子股份有限公司 | Method of preventing solder bridge in case of printed circuit board plug-in wave soldering |
| CN104053310A (en) * | 2014-07-03 | 2014-09-17 | 浪潮(北京)电子信息产业有限公司 | PCB design method for preventing continuous tin electrodeposit of welding device |
| CN104270887A (en) * | 2014-09-17 | 2015-01-07 | 惠州Tcl移动通信有限公司 | Combined land structure and BAG circuit board |
| CN104394644A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化系统有限公司 | Four-pin 3528 LED lamp welding pad |
| CN104576423A (en) * | 2014-12-08 | 2015-04-29 | 南通富士通微电子股份有限公司 | Short-connection bonding and welding method and structure for adjacent welding pads |
| CN104853521A (en) * | 2015-05-27 | 2015-08-19 | 北京三重华星电子科技有限公司 | Short-circuit proof method for tin soldering |
| CN105430938A (en) * | 2015-11-19 | 2016-03-23 | 广东威创视讯科技股份有限公司 | PCB package library structure and packaging method |
| CN107613648A (en) * | 2017-09-04 | 2018-01-19 | 郑州云海信息技术有限公司 | A kind of method and system for solving 0402 type RCL inside parts and connecting tin |
| CN107613648B (en) * | 2017-09-04 | 2019-06-25 | 郑州云海信息技术有限公司 | A kind of method and system for solving 0402 type RCL inside parts and connecting tin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061122 Termination date: 20111018 |