CN104270887A - Combined land structure and BAG circuit board - Google Patents
Combined land structure and BAG circuit board Download PDFInfo
- Publication number
- CN104270887A CN104270887A CN201410471027.9A CN201410471027A CN104270887A CN 104270887 A CN104270887 A CN 104270887A CN 201410471027 A CN201410471027 A CN 201410471027A CN 104270887 A CN104270887 A CN 104270887A
- Authority
- CN
- China
- Prior art keywords
- pad
- solder mask
- combined
- circuit board
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
Abstract
The invention discloses a combined land structure and a BAG circuit board. The combined land structure comprises a plurality of lands and a solder mask, wherein the multiple lands are arranged on a substrate of the circuit board, the solder mask is arranged on the surface of the lands and the surface of the substrate of the circuit board, and the solder mask is correspondingly provided with a plurality of openings which are exposed out of the lands and used for welding. The combined land structure is characterized in that the two ends of each land are arranged outside the boundary of the corresponding opening in the solder mask, and the boundaries of the middle and the two sides of each land are arranged inside the boundary of the corresponding opening in the solder mask. According to the combined land structure and the BAG circuit board, the two ends of each land are arranged outside the boundary of the corresponding opening in the solder mask, the boundaries of the middle and the two sides of each land are arranged inside the boundary of the corresponding opening in the solder mask, the length of the two ends of each land is larger than the width of the two sides of each land, and therefore enough attaching space among the lands, the substrate and the solder mask can be guaranteed, the requirements that the lands are firm and the solder mask does not deviate after welding are met, and enough wire arranging space is reserved among the lands.
Description
Technical field
The present invention relates to a kind of pad structure, in particular a kind of combined pad structure and BAG circuit board.
Background technology
SMT pad has two kinds, and a kind of is welding resistance definition pad (SMD and Solder Mask Defined Land) for Copper Foil definition pad (NSMD and Non-Solder Mask Defined Land, or Copper Defined Land) is a kind of.NSMD pad feature be solder mask opening border outside pad boundary, that is, solder mask does not cover pad, and its advantage is, pad diameter is little, and have sufficient wiring space between pad, shortcoming is, between pad and board substrate, contact area is little, thus poor adhesive force, insecure after welding.Another SMD pad design, this design solder mask opening border is in pad boundary, and it can depend on solder mask openings of sizes by bonding area, and the advantage of this kind of design is, pad diameter is large, contact area between pad and board substrate is large, because strong adhesion, comparatively firm after welding, its shortcoming is, gap between pad is little, and cabling space is not enough, easily causes lower road and contact pads and short circuit.In other words, pad structure of circuit board of the prior art cannot meet the wiring space of existing abundance between pad simultaneously, again can comparatively firmly performance requirement after welding, and namely same pad structure of circuit board is difficult to the advantage simultaneously possessing above-mentioned two kinds of pads.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of combined pad structure and BAG circuit board, this pad structure firmly simultaneously, can reserve again sufficient wiring space after guarantee welding between pad.
Technical scheme of the present invention is as follows:
A kind of combined pad structure, comprise the multiple pads be arranged on board substrate, and be arranged on the solder mask on described pad and board substrate surface, described solder mask correspondence is provided with multiple for exposing the opening that described pad carries out welding, wherein, described pad two ends are arranged on outside described solder mask opening border, and middle and border, both sides is arranged within described solder mask opening border.
Described combined pad structure, wherein, the spacing at described pad two ends is more than or equal to the distance between both sides.
Described combined pad structure, wherein, described pad is Long Circle metal pad.
Described combined pad structure, wherein, described pad is oval metal pad.
Described combined pad structure, wherein, described pad is polygon metal pad.
Described combined pad structure, wherein, described pad is rectangular metal pad.
Described combined pad structure, wherein, described pad is diamond-type metal pad.
Described combined pad structure, wherein, is provided with wiring area between the side boundaries of two adjacent described pads.
Described combined pad structure, wherein, described board substrate is the printed circuit board (PCB) BGA of ball grid array structure.
A kind of BAG circuit board, comprises board substrate, wherein, also comprises the arbitrary described combined pad structure of claim 1-9.
The combined pad structure of one provided by the present invention and BAG circuit board, owing to have employed pad two ends outside described solder mask opening border, on border, both sides, described pad centre position within suffered solder mask border, and pad two ends length is greater than the design of both sides width, can ensure there are enough attachment spaces between pad and base material, solder mask, after can meeting welding, pad firmly, solder mask do not offset, and can make again to leave enough wiring space between pad.
Accompanying drawing explanation
Fig. 1 is the better structural representation executing example in a kind of combined pad structure of the present invention;
Fig. 2 is the structural representation of the second embodiment in a kind of combined pad structure of the present invention.
Embodiment
The invention provides a kind of combined pad structure and BAG circuit board, for making object of the present invention, technical scheme and effect clearly, clearly, referring to accompanying drawing examples, the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The combined pad structure of one provided by the invention, as shown in Figure 1, comprise the multiple pads 120 be arranged on BAG base material 110, and be attached to the solder mask 130 on BAG base material 110 and pad 120 surface, wherein, pad 120 is more than or equal to the pad of both sides width for two ends length, and border, described pad about 120 two ends 122 is within described solder mask 130 opening border 131, and border, described pad 120 two ends 121 is outside solder mask 130 opening border 131.That is, pad 120 two ends are arranged within solder mask 130 coverage, and mid portion comprises 122, border, both sides and is arranged on outside the coverage of solder mask 130.
Adopt such structure, the bond area with described BAG base material is increased at described pad 120 two ends, also increase the contact area of solder mask 130 and pad 120 simultaneously, thus increase its adhesive force, make this pad structure possess the characteristic of NSMD pad, after welding completes, pad 120 is enough firm.Further, because solder mask 130, BAG base material 110 both increase with the bond area of pad 120, also ensure that solder mask 130 can not offset relative to pad 120 between guarantee pad 120 and BAG base material 110 firmly simultaneously.And the spacing at pad 120 two ends is more than or equal to the distance between both sides, like this when ensureing that pad 120 integral solder area does not subtract, expand the space between pad 120, relative SMD pad has reserved larger wiring space, there will not be because wiring space is narrow, the problem of circuit and contact pads short circuit.
Further, described pad 120 is metal pad, described BAG base material 110 for solder pad space length be the printed circuit board (PCB) 0.4Pitch BGA of the ball grid array structure of 0.4mm.
Further, in present pre-ferred embodiments, as shown in Figure 1, described pad 120 is oval, and its major axis is 0.4mm, and minor axis is 0.17mm, and wherein solder mask opening is set to ellipse too, and its major axis is 0.32mm, and minor axis is 0.25mm.Certainly, pad 120 also can adopt Long Circle structure.
Further, in second embodiment of the invention, as shown in Figure 2, described pad 120 is rectangle.
Obviously, as long as the spacing that the shape of pad 120 meets its two ends is greater than both sides, for its shape, the present invention does not do concrete restriction.In above-described embodiment, it is exactly that therefore, its shape can have multiple change, can also be rhombus and other polygons in order to this point is described that pad 120 is designed to ellipse or Long Circle and rectangle.
Based on the description of above-described embodiment, the present invention also proposes a kind of BAG circuit board, comprises board substrate and is attached to the solder mask of substrate surface, also comprise the combined pad structure described in above-described embodiment.
The combined pad structure of one provided by the present invention and BAG circuit board, owing to have employed pad two ends outside described solder mask opening border, on border, both sides, described pad centre position within suffered solder mask border, and pad two ends length is greater than the design of both sides width, can ensure there are enough attachment spaces between pad and base material, solder mask, after can meeting welding, pad firmly, solder mask do not offset, and can make again to leave enough wiring space between pad.
Should be understood that; application of the present invention is not limited to above-mentioned citing; for those of ordinary skills; can be improved according to the above description or be converted; by horizontal, the longitudinally exchange of pad; corresponding cabling space also exchanges, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (10)
1. a combined pad structure, comprise the multiple pads be arranged on board substrate, and be arranged on the solder mask on described pad and board substrate surface, described solder mask correspondence is provided with multiple for exposing the opening that described pad carries out welding, it is characterized in that, described pad two ends are arranged on outside described solder mask opening border, and middle and border, both sides is arranged within described solder mask opening border.
2. combined pad structure according to claim 1, is characterized in that, the spacing at described pad two ends is more than or equal to the distance between both sides.
3. combined pad structure according to claim 1, is characterized in that, described pad is Long Circle metal pad.
4. combined pad structure according to claim 1, is characterized in that, described pad is oval metal pad.
5. combined pad structure according to claim 1, is characterized in that, described pad is polygon metal pad.
6. combined pad structure according to claim 5, is characterized in that, described pad is rectangular metal pad.
7. combined pad structure according to claim 5, is characterized in that, described pad is diamond-type metal pad.
8., according to the arbitrary described combined pad structure of claim 1-7, it is characterized in that, between the side boundaries of two adjacent described pads, be provided with wiring area.
9. combined pad structure according to claim 8, is characterized in that, described board substrate is the printed circuit board (PCB) BGA of ball grid array structure.
10. a BAG circuit board, comprises board substrate, it is characterized in that, also comprises the arbitrary described combined pad structure of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410471027.9A CN104270887A (en) | 2014-09-17 | 2014-09-17 | Combined land structure and BAG circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410471027.9A CN104270887A (en) | 2014-09-17 | 2014-09-17 | Combined land structure and BAG circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104270887A true CN104270887A (en) | 2015-01-07 |
Family
ID=52162348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410471027.9A Pending CN104270887A (en) | 2014-09-17 | 2014-09-17 | Combined land structure and BAG circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104270887A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246248A (en) * | 2015-10-30 | 2016-01-13 | 环维电子(上海)有限公司 | Circuit board |
| US20220192018A1 (en) * | 2020-12-15 | 2022-06-16 | Ibiden Co., Ltd. | Wiring substrate |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040020972A1 (en) * | 2002-07-30 | 2004-02-05 | Yoshiyuki Miyajima | Printed circuit board and soldering structure for electronic parts thereto |
| WO2005122655A2 (en) * | 2004-06-09 | 2005-12-22 | Koninklijke Philips Electronics N.V. | Pcb including a star shaped through-hole solder pad |
| CN2840593Y (en) * | 2005-10-18 | 2006-11-22 | 艾默生网络能源有限公司 | Anti solder bridging PCB board |
| CN201601891U (en) * | 2010-02-08 | 2010-10-06 | 华为终端有限公司 | Printed circuit board |
| CN201910971U (en) * | 2010-12-31 | 2011-07-27 | 惠州Tcl移动通信有限公司 | Bonding pad structure of circuit board |
| CN102256442A (en) * | 2011-06-17 | 2011-11-23 | 惠州Tcl移动通信有限公司 | Welding pad structure for ball grid array packaging chip and multilayer printed circuit board for mobile phone |
| CN202168275U (en) * | 2011-07-08 | 2012-03-14 | 惠州Tcl移动通信有限公司 | BGA pad structure designed to adopt non-SMD and SMD in combination |
| JP2012064797A (en) * | 2010-09-16 | 2012-03-29 | Hitachi Ltd | Printed wiring board and printed circuit board |
| CN202364474U (en) * | 2011-11-24 | 2012-08-01 | 惠州Tcl移动通信有限公司 | PCB structure for handset |
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
-
2014
- 2014-09-17 CN CN201410471027.9A patent/CN104270887A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040020972A1 (en) * | 2002-07-30 | 2004-02-05 | Yoshiyuki Miyajima | Printed circuit board and soldering structure for electronic parts thereto |
| WO2005122655A2 (en) * | 2004-06-09 | 2005-12-22 | Koninklijke Philips Electronics N.V. | Pcb including a star shaped through-hole solder pad |
| CN2840593Y (en) * | 2005-10-18 | 2006-11-22 | 艾默生网络能源有限公司 | Anti solder bridging PCB board |
| CN201601891U (en) * | 2010-02-08 | 2010-10-06 | 华为终端有限公司 | Printed circuit board |
| JP2012064797A (en) * | 2010-09-16 | 2012-03-29 | Hitachi Ltd | Printed wiring board and printed circuit board |
| CN201910971U (en) * | 2010-12-31 | 2011-07-27 | 惠州Tcl移动通信有限公司 | Bonding pad structure of circuit board |
| CN102256442A (en) * | 2011-06-17 | 2011-11-23 | 惠州Tcl移动通信有限公司 | Welding pad structure for ball grid array packaging chip and multilayer printed circuit board for mobile phone |
| CN202168275U (en) * | 2011-07-08 | 2012-03-14 | 惠州Tcl移动通信有限公司 | BGA pad structure designed to adopt non-SMD and SMD in combination |
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN202364474U (en) * | 2011-11-24 | 2012-08-01 | 惠州Tcl移动通信有限公司 | PCB structure for handset |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246248A (en) * | 2015-10-30 | 2016-01-13 | 环维电子(上海)有限公司 | Circuit board |
| CN105246248B (en) * | 2015-10-30 | 2018-04-27 | 环维电子(上海)有限公司 | Circuit board |
| US20220192018A1 (en) * | 2020-12-15 | 2022-06-16 | Ibiden Co., Ltd. | Wiring substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |