CN203596975U

CN203596975U - PCB with PIN connecting pin

Info

Publication number: CN203596975U
Application number: CN201320634640.9U
Authority: CN
Inventors: 刘峥耘; 欧阳小银
Original assignee: SHENZHEN HUICHEN ELECTRONICS CO Ltd
Current assignee: SHENZHEN HUICHEN ELECTRONICS CO Ltd
Priority date: 2013-10-15
Filing date: 2013-10-15
Publication date: 2014-05-14
Anticipated expiration: 2023-10-15

Abstract

The utility model discloses a PCB with a PIN connecting pin. The PCB comprises a PCB bare board, an electronic component, and the PIN connecting pin. The PIN connecting pin is provided with a PIN cap welded with the PCB bare board. Meshes are disposed on the PCB bare board, and distances from the PIN cap to the meshes are 0.2 mm to 0.8 mm. The PCB is provided with the PIN cap which is welded with the PCB bare board through the PIN connecting pin. The meshes are disposed on the PCB bare board, and distances from the PIN cap to the meshes are 0.2 mm to 0.8 mm. The meshes can release pressure generated when the PIN connecting pin is pressed into the PCB in time, so as not to influence installation of other electronic components, and installed electronic components do not have risks of stress damage, and product performance is good.

Description

A kind of pcb board with PIN connecting needle

Technical field

The utility model relates to pcb board, a kind of pcb board with PIN connecting needle relating in particular to.

Background technology

In PCB semi-finished product processing, having portioned product link is PIN connecting needle, need to be pressed in the upper PIN of PCB hole fixingly, then adds tin welding and fixes.Cause has pressure-acting while being pressed into PIN connecting needle, easily make PCB crush, or PCB when distortion the element (as resistance, patch-type LED) that causes having welded on it be subject to the external carbuncle rosin joint that gets loose, cause quality hidden danger, there is again the PIN of pressure compressing head width minimum to have 5mm, cause minimum spacing between other electronic devices and components of PIN connecting needle and pcb board can not be less than 4mm, implement operation bottleneck many.

Therefore, there is defect in prior art, needs to improve.

Utility model content

Technical problem to be solved in the utility model is: provide a kind of electronic devices and components without being subject to stress damage risk, the pcb board with PIN connecting needle of good product performance.

The technical solution of the utility model is as follows: a kind of pcb board with PIN connecting needle, comprise PCB bare board, electronic devices and components and PIN connecting needle, and described PIN connecting needle arranges the PIN pin cap with described PCB bare board welding; On described PCB bare board, and the 0.2mm-0.8 mm place of the described PIN pin cap of distance offers mesh.

Be applied to technique scheme, in described pcb board, on described PCB bare board, and 0.5 mm place of the described PIN pin cap of distance offers mesh.

Be applied to technique scheme, in described pcb board, described electronic devices and components are surface adhered with electronic component.

Adopt such scheme, the utility model arranges the PIN pin cap welding with PCB bare board by PIN connecting needle; And, on PCB bare board, and the 0.2mm-0.8 mm place of distance P IN pin cap offers mesh, the pressure that the mesh arranging produces can make PIN connecting needle be pressed into pcb board time discharges in time, thereby can not affect the installation of other electronic devices and components, make the electronic devices and components of installing without being subject to stress damage risk, good product performance.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model.

Embodiment

Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.

The present embodiment provides a kind of pcb board with PIN connecting needle, described pcb board is by PCB bare board, and the 0.2mm-0.8 mm place of the described PIN pin cap of distance offers mesh, mesh can make the pressure in the time being pressed into PIN connecting needle discharge in time, make to be arranged on electronic devices and components on PCB bare board without being subject to stress damage risk, good product performance.

Wherein, as shown in Figure 1, pcb board comprises PCB bare board 103, electronic devices and components and PIN connecting needle 101, and electronic devices and components and PIN connecting needle 101 are installed on PCB bare board 103, wherein, PIN hole can be set on PCB bare board, PIN connecting needle 101 is arranged in PIN hole, the corresponding PIN hole of each PIN connecting needle, and for example, can adopt surface-pasted mode that electronic devices and components are installed, thereby facilitate the operation of crossing reflow soldering process of pcb board.

And described PIN connecting needle 101 arranges the PIN pin cap 102 with described PCB bare board welding; Wherein, can be on PCB bare board 103, and the 0.2mm-0.8 mm place of the described PIN pin cap 102 of distance offers mesh 104.For example, can locate to offer mesh 104 at 0.2mm or 0.3mm or 0.4mm or 0.5mm or 0.6mm or 0.7mm or 0.8mm etc., preferably, offer mesh 104 at 0.5mm place, when making mesh 104 and PIN connecting needle 101 keep suitable distance, do not affect again the mounting distance of other electronic devices and components, and, corresponding each PIN connecting needle 101, can corresponding offer one or more mesh 104.

Or, can make the length of PIN pin cap be no more than 0.2mm, for example, PIN pin cap length is 0.2mm, or for 0.15mm etc., preferably, PIN pin cap length is 0.2mm, guarantees the height of tin cream fusing in Reflow Soldering, makes PIN connecting needle and pcb board welding firmly.

And, described pcb board can be made and obtain in the following way: first, on PCB bare board, make PIN hole, on the PCB bare board that does not weld any electronic devices and components, make PIN hole, then, PIN connecting needle correspondence is pressed in described PIN hole, each PIN connecting needle correspondence be pressed into one described in PIN hole, and, make the PIN pin cap exposing be no more than 0.2mm, for example, can make the PIN pin cap exposing is 0.2mm, or, for 0.15mm etc., preferably making the PIN pin cap exposing is 0.2mm, guarantee the height of tin cream fusing in Reflow Soldering, make PIN connecting needle and pcb board welding firm.

And, after PIN connecting needle correspondence is pressed in PIN hole, again on described PCB bare board, and the 0.2mm-0.8 mm place of the described PIN pin cap of distance offers mesh, for example, can locate to offer mesh at 0.2mm or 0.3mm or 0.4mm or 0.5mm or 0.6mm or 0.7mm or 0.8mm etc., preferably, offer mesh at 0.5mm place, when making mesh and PIN connecting needle keep suitable distance, do not affect again the mounting distance of other electronic devices and components, and, corresponding each PIN connecting needle, can corresponding offer one or more mesh.

And, offer after mesh, then on described PCB bare board, electronic devices and components are installed, form pcb board semi-finished product, for example, can adopt surface-pasted mode that electronic devices and components are installed, thereby facilitate the operation of crossing reflow soldering process of pcb board.Again then, half-finished pcb board is crossed to Reflow Soldering, tin cream is directly melted on described PIN pin cap, and described PIN pin cap and described PCB are welded together, form finished product pcb board.

So, by first PIN connecting needle being pressed in the PIN hole of pcb board before electronic devices and components are installed, and, discharging PIN connecting needle by the mesh of offering is pressed into after the pressure of pcb board, electronic devices and components are installed again, and Reflow Soldering forms finished product pcb board, so, the pressure that can make PIN connecting needle be pressed into discharges in time, can not affect the installation of other electronic devices and components, make the electronic devices and components of installing without being subject to stress damage risk, after being pressed into PIN connecting needle, electronic devices and components are installed again, between PIN connecting needle and electronic devices and components, the I of spacing reaches 1mm, greatly promote the installing space of electronic devices and components.

These are only preferred embodiment of the present utility model, be not limited to the utility model, all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims

1. with a pcb board for PIN connecting needle, comprise PCB bare board, electronic devices and components and PIN connecting needle, it is characterized in that:

Described PIN connecting needle arranges the PIN pin cap with described PCB bare board welding;

On described PCB bare board, and the 0.2mm-0.8 mm place of the described PIN pin cap of distance offers mesh.

2. pcb board according to claim 1, is characterized in that, on described PCB bare board, and 0.5 mm place of the described PIN pin cap of distance offers mesh.

3. pcb board according to claim 2, is characterized in that, described electronic devices and components are surface adhered with electronic component.