CN203590593U - Printed circuit board capable of preventing through hole short circuit - Google Patents
Printed circuit board capable of preventing through hole short circuit Download PDFInfo
- Publication number
- CN203590593U CN203590593U CN201320797922.0U CN201320797922U CN203590593U CN 203590593 U CN203590593 U CN 203590593U CN 201320797922 U CN201320797922 U CN 201320797922U CN 203590593 U CN203590593 U CN 203590593U
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- circuit board
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Abstract
The utility model provides a printed circuit board capable of preventing through hole short circuit. The printed circuit board comprises through holes and drainage areas. A drainage area is at a position corresponding to at least one through hole. Through the drainage areas, when the printed circuit board passes through a crest soldering furnace, redundant soldering tin used by soldering flows toward the direction of the drainage areas, and the drainage areas can accommodate redundant soldering tin produced by soldering. According to the utility model, short circuit caused by overlap soldering between the through holes on the printed circuit board can be prevented; the soldering yield is improved; and the number of times of secondary rework is reduced.
Description
Technical field
The utility model relates to art of printed circuit boards, relates in particular to a kind of printed circuit board (PCB) that prevents through hole short circuit.
Background technology
Printed circuit board (PCB) (PCB) is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.On printed circuit board (PCB), common part comprises through hole and pad.Through hole is through whole wiring board, can be used for realizing intraconnection or as the mounting-positioning holes of element.Because through hole is easy to realize in technique, cost is lower, so most printed circuit board (PCB) is all used it.Element, by the through hole on printed circuit board (PCB), is weldingly fixed on printed circuit board (PCB) with scolding tin, thereby realizes the electrical connection of element in circuit.Through hole Copper Foil is around called pad.
Due to the raising of chip integration, cause the element on printed circuit board (PCB) more and more, thereby the number of openings on printed circuit board (PCB) also increase.On printed circuit board (PCB) of the same area, the number of openings of setting is more, and the density of through hole is also larger.
SMT(surface mounting technology, Surface Mounted Technology), be most popular a kind of technology and technique in current Electronic Assemblies industry.SMT main contents and basic technology inscape comprise: paste solder printing--> part mounts--> reflow soldering-->AOI(Automatic Optic Inspection, automated optical detection) and > divides plate in optical detection--> maintenance--.In SMT technique during first step paste solder printing, row's solder joint through hole to add tin amount wayward, easily leave unnecessary tin amount.When printed circuit board (PCB) passes through in wave-soldering furnace, the scolding tin on printed circuit board (PCB) can melt and slightly flow.Because the density of the through hole on printed circuit board (PCB) is large, the distance between adjacent through-holes is very short, and the unnecessary tin amount of leaving over can cause the joint welding between through hole, causes the short circuit of through hole, thereby need carry out secondary to printed circuit board (PCB), does over again to remove the joint welding between through hole.
Utility model content
In view of this, the utility model provides a kind of printed circuit board (PCB) that prevents through hole short circuit, and it can prevent the short circuit causing because of joint welding between through hole on printed circuit board (PCB), has improved the yield of welding, reduces the number of times that secondary is done over again.
The utility model provides a kind of printed circuit board (PCB) that prevents through hole short circuit, described printed circuit board (PCB) comprises through hole and drainage district, the correspondence position of at least one through hole has in the time of can making printed circuit board (PCB) pass through in wave-soldering furnace, the unnecessary scolding tin that order welding is used flows to its direction, and holds the drainage district of scolding tin unnecessary while welding.
Further, through hole described in the utility model is at least one row; Described drainage district is arranged on the outer end of the edge through hole of arbitrary exhausting hole.
Further, through hole described in the utility model is at least one row; Described drainage district is arranged on the outer end of the edge exhausting hole of at least one exhausting hole.
Further, drainage described in the utility model district is and exhausting hole Yi Pai drainage one to one district, described edge.
Further, drainage described in the utility model district is microscler drainage district.
Further, drainage described in the utility model district with described printed circuit board (PCB) in wave-soldering furnace to cross stove direction parallel.
Further, in the middle of drainage described in the utility model district and through hole, be one for reducing the disconnection district of the failure welding of solder joint.
From above technical scheme, the correspondence position of at least one through hole of the utility model is provided with drainage district, and when drainage district can make printed circuit board (PCB) pass through in wave-soldering furnace, the unnecessary scolding tin that order welding is used flows to the direction in described drainage district, and described drainage district can hold scolding tin unnecessary while welding.Like this, although when the paste solder printing of SMT technique residual unnecessary scolding tin, when printed circuit board (PCB) in wave-soldering furnace by time, the scolding tin on printed circuit board (PCB) can melt, and unnecessary scolding tin flows and is stored in drainage district to the direction in drainage district.Like this, even if the density of the through hole on printed circuit board (PCB) is large, the distance between adjacent through-holes is very short, and the unnecessary tin amount of leaving over during welding can not cause the joint welding between through hole yet, but is stored in drainage district.Therefore the utility model can prevent the short circuit of through hole, thereby has improved the yield of welding, reduces the number of times that secondary is done over again.
Accompanying drawing explanation
Fig. 1 is the printed circuit board (PCB) schematic diagram of the utility model embodiment mono-;
Fig. 2 is the printed circuit board (PCB) schematic diagram of the utility model embodiment bis-;
Fig. 3 is the printed circuit board (PCB) schematic diagram of the utility model embodiment bis-.
Embodiment
The correspondence position of at least one through hole of the utility model has drainage district, and when drainage district can make printed circuit board (PCB) pass through in wave-soldering furnace, the unnecessary scolding tin that order welding is used flows to the direction in drainage district, and drainage district can hold scolding tin unnecessary while welding.Like this, although when the paste solder printing of SMT technique residual unnecessary scolding tin, when printed circuit board (PCB) in wave-soldering furnace by time, the scolding tin on printed circuit board (PCB) can melt, and unnecessary scolding tin flows and is stored in drainage district to the direction in drainage district.Like this, even if the density of the through hole on printed circuit board (PCB) is large, the distance between adjacent through-holes is very short, and the unnecessary tin amount of leaving over during welding can not cause the joint welding between through hole yet, but is stored in drainage district.Therefore the utility model can prevent the short circuit of through hole, thereby has improved the yield of welding, reduces the number of times that secondary is done over again.
Embodiment mono-
Referring to Fig. 1, the utility model provides a kind of printed circuit board (PCB) 1 that prevents through hole short circuit, and printed circuit board (PCB) comprises through hole 11He drainage district 12.Through hole 11, for realizing intraconnection or as the mounting-positioning holes of element.Element on printed circuit board (PCB), by the through hole on printed circuit board (PCB), is weldingly fixed on printed circuit board (PCB) with scolding tin, thereby realize interelement electrical equipment, connects.
When the utility model drainage district 12 can make printed circuit board (PCB) 1 pass through in wave-soldering furnace, the unnecessary scolding tin that order welding is used flows to the direction in drainage district 12, and drainage district 12 can hold scolding tin unnecessary while welding.Particularly, drainage district 12 can or have the inclined-plane at an angle of inclination for a groove, and the angle of inclination on inclined-plane is that 12 directions tilt from through hole 11Xiang drainage district.
Like this, when printed circuit board (PCB) 1 passes through in wave-soldering furnace, scolding tin unnecessary during welding can flow to and be kept in drainage district 12, even if the density of the through hole 11 on printed circuit board (PCB) 1 is large, distance between adjacent through-holes 11 is very short, and the unnecessary scolding tin of leaving over during welding can not cause the joint welding between through hole 11 yet.Therefore the utility model can prevent the short circuit of through hole 11, thereby has improved the yield of welding, reduces the number of times that secondary is done over again.
The utility model through hole 11 is at least one row.Drainage district 12 is arranged on the outer end of the edge through hole 111 of arbitrary exhausting hole 11.
Referring to Fig. 2, the difference of the present embodiment and embodiment mono-is only that drainage district 12 is arranged on the outer end of the edge exhausting hole 112 of at least one exhausting hole 11.
12Wei Yu edge, drainage district exhausting hole 112 districts of Yi Pai drainage one to one.
Further, drainage district 12 is microscler drainage district.
The path that flows to drainage district 12 due to scolding tin is linear, and microscler drainage district 12 is more convenient by unnecessary scolding tin Tuo Xiang drainage district 12, also facilitates drainage district 12 to hold unnecessary tin amount along scolding tin flow direction.
Further, drainage district 12 with printed circuit board (PCB) 1 in wave-soldering furnace to cross stove direction parallel.
The direction in drainage district 12 is with stove direction is parallel excessively, and crossing stove direction is exactly the direction by wave-soldering furnace, convenient by unnecessary scolding tin Tuo Xiang drainage district 12.
Further, referring to Fig. 3, in the middle of drainage district 12 and through hole 112, be one for reducing the disconnection district of the failure welding of row's solder joint, unnecessary scolding tin flows to drainage district 12 through disconnecting district.
In the middle of drainage district 12 and through hole 112, disconnects, during by unnecessary scolding tin Tuo Xiang drainage district 12, disconnecting district does not have scolding tin residual, and row's solder joint at through hole place is difficult for generation failure welding.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in the scope of the utility model protection.
Claims (7)
1. can prevent a printed circuit board (PCB) for through hole short circuit, it is characterized in that, described printed circuit board (PCB) comprises through hole and drainage district,
The correspondence position of at least one through hole has in the time of can making printed circuit board (PCB) pass through in wave-soldering furnace, and the unnecessary scolding tin that order welding is used flows to its direction, and holds the drainage district of scolding tin unnecessary while welding.
2. printed circuit board (PCB) according to claim 1, is characterized in that, described through hole is at least one row; Described drainage district is arranged on the outer end of the edge through hole of arbitrary exhausting hole.
3. printed circuit board (PCB) according to claim 1, is characterized in that, described through hole is at least one row; Described drainage district is arranged on the outer end of the edge exhausting hole of at least one exhausting hole.
4. printed circuit board (PCB) according to claim 3, is characterized in that, described drainage district is and exhausting hole Yi Pai drainage one to one district, described edge.
5. according to the printed circuit board (PCB) described in claim 2 or 4, it is characterized in that, described drainage district is microscler drainage district.
6. printed circuit board (PCB) according to claim 5, is characterized in that, described drainage district with described printed circuit board (PCB) in wave-soldering furnace to cross stove direction parallel.
7. printed circuit board (PCB) according to claim 5, is characterized in that, is one for reducing the disconnection district of the failure welding of row's solder joint in the middle of described drainage district and through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320797922.0U CN203590593U (en) | 2013-12-04 | 2013-12-04 | Printed circuit board capable of preventing through hole short circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320797922.0U CN203590593U (en) | 2013-12-04 | 2013-12-04 | Printed circuit board capable of preventing through hole short circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203590593U true CN203590593U (en) | 2014-05-07 |
Family
ID=50588427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320797922.0U Expired - Fee Related CN203590593U (en) | 2013-12-04 | 2013-12-04 | Printed circuit board capable of preventing through hole short circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203590593U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687283A (en) * | 2013-12-04 | 2014-03-26 | 乐视致新电子科技（天津）有限公司 | Printed circuit board capable of avoiding through hole short circuit and method thereof |
| CN114126200A (en) * | 2021-11-30 | 2022-03-01 | 格力电器（合肥）有限公司 | PCB pad opening structure, method and electric appliance |
-
2013
- 2013-12-04 CN CN201320797922.0U patent/CN203590593U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687283A (en) * | 2013-12-04 | 2014-03-26 | 乐视致新电子科技（天津）有限公司 | Printed circuit board capable of avoiding through hole short circuit and method thereof |
| CN114126200A (en) * | 2021-11-30 | 2022-03-01 | 格力电器（合肥）有限公司 | PCB pad opening structure, method and electric appliance |
| CN114126200B (en) * | 2021-11-30 | 2024-06-04 | 格力电器（合肥）有限公司 | PCB bonding pad open pore structure, method and electric appliance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20170721 Granted publication date: 20140507 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20200721 Granted publication date: 20140507 |
|
| PD01 | Discharge of preservation of patent | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140507 Termination date: 20171204 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |