CN202889788U

CN202889788U - Structure for preventing element from pseudo soldering

Info

Publication number: CN202889788U
Application number: CN 201220541154
Authority: CN
Inventors: 刘建兵
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2012-10-22
Filing date: 2012-10-22
Publication date: 2013-04-17
Anticipated expiration: 2022-10-22

Abstract

The utility model discloses a structure for preventing an element from pseudo soldering. The structure comprises a PCB (Printed Circuit Board) for picking and placing the element; the PCB comprises a solder resisting layer, a copper foil layer, and a solder pad on the copper foil layer; a weld leg of the element is aligned to or higher than the lower end of an element body; a sunken gap is formed in a part, corresponding to the lower part of the element body, of the PCB; no solder resisting layer or copper foil layer is placed in the sunken gap; or no solder resisting layer is placed in the sunken gap, and the copper foil layer in the sunken gap is thinner than the surrounding copper foil layer. By adopting the structure for preventing the element from the pseudo soldering, the problem that pseudo soldering is easily caused in the element due to that the weld leg of the element is higher than the element body can be effectively solved.

Description

A kind of structure of avoiding the element rosin joint

Technical field

The utility model relates to hardware electronic, particularly relates to a kind of structure of avoiding the element rosin joint.

Background technology

The SMT(surface mounting technology that traditional handicraft is used) in the material, the leg of element is compared with component body, generally is concordant with the component body lower end or a little less than the component body lower end, as shown in Figure 1.Yet, as shown in Figures 2 and 3, for some special material element, the leg 2 of element is higher than component body 1 lower end, because the PCB(printed circuit board (PCB)) solder mask 3 and copper foil layer 4 certain thickness is arranged, component body 1 is mounted on the solder mask 3, and there is difference in height in the leg 2 of element with component body 1, when mounting, the leg 2 of element is slightly higher than the position of the pad 6 on the PCB, and tin cream can't wrap up leg well.Like this, leg 2 and the PCB pad 6 solder reflow postweldings of element are easy to form rosin joint, cause the SMT fraction defective high, and production efficiency is low.

The utility model content

Main purpose of the present utility model is exactly for above-mentioned this class particular components, and a kind of structure that can avoid dexterously the element rosin joint is provided, and solves the element leg easily causes the element rosin joint than this height problem.

For achieving the above object, the utility model is by the following technical solutions:

A kind of structure of avoiding the element rosin joint, comprise the PCB for mount components, described PCB comprises solder mask, copper foil layer and is located at pad on the copper foil layer, the leg of described element is concordant with the component body lower end or be higher than the component body lower end, position under the corresponding described component body of described PCB offers the sinking breach, in the described sinking breach without solder mask and copper foil layer, perhaps in the described sinking breach without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer thickness.

Preferably, described sinking breach is arranged to its degree that makes described element sinking so that the leg of described element is just fallen on the pad of element.

The technique effect that the utility model is useful:

By PCB is upper originally corresponding to the solder mask under the component body with copper foil layer is all or part of digs up, because element sinks, make this element leg draw close component pads, like this, can solve well the material problem of faulty soldering that the element leg brings than this height during welding.Adopt the utility model, when the SMT material mounted, rosin joint can not occur in this material, has improved production efficiency, had reduced fault generation and maintenance probability, had reduced cost.

Description of drawings

Fig. 1 is traditional element mounting structure schematic diagram, and the leg of this element is concordant with the component body lower end or a little less than the component body lower end;

Fig. 2 is the leg element schematic diagram higher than component body lower end;

Fig. 3 is traditional upper mounting structure schematic diagram of particular components PCB, and the leg of this element is higher than component body lower end;

Fig. 4 is the structural representation of avoiding the element rosin joint of one embodiment of the invention.

Embodiment

By reference to the accompanying drawings the utility model is further described in detail by the following examples.

See also Fig. 4, in some embodiments, avoid the structure of element rosin joint to comprise PCB for mount components, described PCB comprises base material 5, solder mask 3, copper foil layer 4 and is located at pad 6 on the copper foil layer 4, the leg 2 of described element is concordant with component body 1 lower end or be higher than component body 1 lower end, position under the corresponding described component body 1 of described PCB offers the sinking breach, and described sinking breach is interior without solder mask and copper foil layer.Described sinking breach also without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer 4 thickness, as long as make the leg 2 of described element effectively draw close pad 6 in element.Like this, tin cream can well leg 2 parcels, make it rosin joint not to occur.

Preferably, described sinking breach is arranged to its degree that makes described element sinking so that the leg 2 of described element is just fallen on the pad 6 of element.

Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that implementation of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims

1. structure of avoiding the element rosin joint, comprise the PCB for mount components, described PCB comprises solder mask, copper foil layer and is located at pad on the copper foil layer, the leg of described element is concordant with the component body lower end or be higher than the component body lower end, described structure is characterised in that, position under the corresponding described component body of described PCB offers the sinking breach, in the described sinking breach without solder mask and copper foil layer, perhaps in the described sinking breach without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer thickness.

2. the structure of avoiding the element rosin joint as claimed in claim 1 is characterized in that, described sinking breach is arranged to its degree that makes described element sinking so that the leg of described element is just fallen on the pad of element.