CN201950327U - Wave soldering carrier - Google Patents

Wave soldering carrier Download PDF

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Publication number
CN201950327U
CN201950327U CN2011200620913U CN201120062091U CN201950327U CN 201950327 U CN201950327 U CN 201950327U CN 2011200620913 U CN2011200620913 U CN 2011200620913U CN 201120062091 U CN201120062091 U CN 201120062091U CN 201950327 U CN201950327 U CN 201950327U
Authority
CN
China
Prior art keywords
wave soldering
cover plate
soldering carrier
pcb
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200620913U
Other languages
Chinese (zh)
Inventor
赵铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU OUKANGNUO ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
SUZHOU OUKANGNUO ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU OUKANGNUO ELECTRONIC TECHNOLOGY Co Ltd filed Critical SUZHOU OUKANGNUO ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN2011200620913U priority Critical patent/CN201950327U/en
Application granted granted Critical
Publication of CN201950327U publication Critical patent/CN201950327U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a wave soldering carrier, which is used for containing a printed circuit board (PCB) when wave soldering is carried out on the PCB. The wave soldering carrier comprises a bottom plate and a tin blocking strip which is fixedly connected onto the periphery of the bottom plate and is vertical to the bottom plate; the bottom plate and the tin blocking strip are enclosed to form a cavity. The wave soldering carrier also comprises a cover plate. The cover plate is provided with a plurality of elastic pressing rods; the wave soldering carrier comprises a working condition. When the wave soldering carrier is in the working condition, the cover plate covers above the cavity, and a component which can float on the PCB is pressed by the pressing rods when the wave soldering is carried out. Due to the fact that the wave soldering carrier is provided with the cover plate and the pressing rods, the hidden danger brought by the reason that tin beads fall into the PCB in the wave soldering process can be prevented, and the component which is easy to float is pressed, so that poor soldering of the component is avoided happening.

Description

The wave soldering carrier
Technical field
The utility model relates to a kind of wave soldering carrier that is applied to the electronic circuit welding field.
Background technology
In the prior art, general when electronic circuit welds employed wave soldering carrier form by a base plate and the retaining tin bar that is arranged at the base plate periphery.When it used, the tin sweat(ing) that welding is produced might be fallen on the PCB, has hidden danger.And in the process of wave soldering, some element on the PCB can float when being subjected to the tin wave impact, thereby causes the element failure welding.
Summary of the invention
The purpose of this utility model provides a kind of element that prevents and floats and avoid tin sweat(ing) to fall into wave soldering carrier on the PCB.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of wave soldering carrier, be used for when PCB is carried out wave soldering, placing described PCB, described wave soldering carrier comprises base plate, be fixedly connected on described base plate periphery and with the perpendicular retaining tin bar of described base plate, described base plate and described retaining tin bar surround a cavity, described wave soldering carrier also comprises cover plate, described cover plate is provided with a plurality of rubber-like pressure bars
Described wave soldering carrier comprises duty, when described wave soldering carrier is in described duty, described cover plate covers above described cavity, and described pressure bar is pushed down the element that can float when the wave soldering on the described PCB.
Preferably, described cover plate is rotating is arranged on the described retaining tin bar of a side.
Further preferred, described cover plate is installed on the retaining tin bar of a described side by hinge.
Further preferred, two described hinges are installed on the described cover plate.
Preferably, described cover plate is provided with locking device, and when described wave soldering carrier was in described duty, described cover plate locked by described locking device mutually with described retaining tin bar.
Preferably, described base plate is a rectangle, is provided with four described retaining tin bars around the base plate of described rectangle.
Preferably, described base plate is made by exotic material.
Because the technique scheme utilization, the utility model compared with prior art has following advantage: 1, owing to the utlity model has cover plate, can prevent that in the process of wave soldering, tin sweat(ing) falls into the hidden danger of bringing on the PCB; 2, because the utility model is provided with pressure bar, the element that can will easily float in the process of wave soldering is pushed down, and has avoided the generation of element failure welding.
Description of drawings
Accompanying drawing 1 is the vertical view of wave soldering carrier of the present utility model.
Accompanying drawing 2 is the A-A view of wave soldering carrier of the present utility model.
Accompanying drawing 3 is the right view of wave soldering carrier of the present utility model.
In the above accompanying drawing: 1, base plate; 2, retaining tin bar; 3, cover plate; 4, cavity; 5, hinge; 6, locking device; 7, pressure bar.
The specific embodiment
Below in conjunction with embodiment shown in the drawings the utility model is further described.
Embodiment one: referring to accompanying drawing 1 to shown in the accompanying drawing 3.
A kind of wave soldering carrier is used for placing PCB when PCB is carried out wave soldering.
The wave soldering carrier comprise the rectangle of making by exotic material base plate, be fixedly connected on around the base plate and with perpendicular four retaining tin bars, the cover plate of base plate.Base plate surrounds a cavity with the retaining tin bar.Cover plate is by on the rotating retaining tin bar that is installed in a side of two hinges.Cover plate is provided with locking device, and locking device is positioned at a side relative with the side that hinge is installed.Also be provided with a plurality of rubber-like pressure bars on the cover plate.
The wave soldering carrier comprises duty, and when the wave soldering carrier was in running order, cover plate covered above cavity, and pressure bar is pushed down the element that can float when the wave soldering on the PCB.Cover plate locks by locking device mutually with the retaining tin bar.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection domain of the present utility model with this.All equivalences of doing according to the utility model spirit essence change or modify, and all should be encompassed within the protection domain of the present utility model.

Claims (7)

1. wave soldering carrier, be used for when PCB is carried out wave soldering, placing described PCB, described wave soldering carrier comprises base plate, be fixedly connected on described base plate periphery and with the perpendicular retaining tin bar of described base plate, described base plate and described retaining tin bar surround a cavity, it is characterized in that: described wave soldering carrier also comprises cover plate, described cover plate is provided with a plurality of rubber-like pressure bars
Described wave soldering carrier comprises duty, when described wave soldering carrier is in described duty, described cover plate covers above described cavity, and described pressure bar is pushed down the element that can float when the wave soldering on the described PCB.
2. wave soldering carrier according to claim 1 is characterized in that: described cover plate is rotating to be arranged on the described retaining tin bar of a side.
3. wave soldering carrier according to claim 2 is characterized in that: described cover plate is installed on the retaining tin bar of a described side by hinge.
4. wave soldering carrier according to claim 3 is characterized in that: two described hinges are installed on the described cover plate.
5. wave soldering carrier according to claim 1, it is characterized in that: described cover plate is provided with locking device, when described wave soldering carrier was in described duty, described cover plate locked by described locking device mutually with described retaining tin bar.
6. wave soldering carrier according to claim 1 is characterized in that: described base plate is a rectangle, is provided with four described retaining tin bars around the base plate of described rectangle.
7. wave soldering carrier according to claim 1 is characterized in that: described base plate is made by exotic material.
CN2011200620913U 2011-03-11 2011-03-11 Wave soldering carrier Expired - Fee Related CN201950327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200620913U CN201950327U (en) 2011-03-11 2011-03-11 Wave soldering carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200620913U CN201950327U (en) 2011-03-11 2011-03-11 Wave soldering carrier

Publications (1)

Publication Number Publication Date
CN201950327U true CN201950327U (en) 2011-08-31

Family

ID=44494454

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200620913U Expired - Fee Related CN201950327U (en) 2011-03-11 2011-03-11 Wave soldering carrier

Country Status (1)

Country Link
CN (1) CN201950327U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052276A (en) * 2012-12-19 2013-04-17 昆山迈致治具科技有限公司 PCB (Printed Circuit Board) welding fixture
CN106112178A (en) * 2016-08-19 2016-11-16 潍坊歌尔电子有限公司 A kind of wave soldering carrier
CN108655530A (en) * 2018-04-23 2018-10-16 格力电器(武汉)有限公司 Tin soldering tool

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052276A (en) * 2012-12-19 2013-04-17 昆山迈致治具科技有限公司 PCB (Printed Circuit Board) welding fixture
CN106112178A (en) * 2016-08-19 2016-11-16 潍坊歌尔电子有限公司 A kind of wave soldering carrier
CN106112178B (en) * 2016-08-19 2019-05-24 潍坊歌尔电子有限公司 A kind of wave soldering carrier
CN108655530A (en) * 2018-04-23 2018-10-16 格力电器(武汉)有限公司 Tin soldering tool

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110831

Termination date: 20140311