CN106112178A - A kind of wave soldering carrier - Google Patents
A kind of wave soldering carrier Download PDFInfo
- Publication number
- CN106112178A CN106112178A CN201610695615.XA CN201610695615A CN106112178A CN 106112178 A CN106112178 A CN 106112178A CN 201610695615 A CN201610695615 A CN 201610695615A CN 106112178 A CN106112178 A CN 106112178A
- Authority
- CN
- China
- Prior art keywords
- pressing plate
- plate
- base plate
- bracer
- wave soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of wave soldering carrier, including base plate, pressing plate it is provided with on base plate, a bracer it is provided with on base plate, pressing plate one end is hinged with a bracer, prop up bracer and limit pressing plate rotation centered by hinge axis in the range of predetermined angle, and when pressing plate rotates to open mode, pressing plate is fixed by a bracer；When pressing plate is provided with the spring probe of components and parts on corresponding circuits plate, pressing plate and base plate fastening towards base plate side, the components and parts on spring probe pressing circuit board, make components and parts lower surface closely cooperate with circuit board upper surface.The present invention, by arranging spring probe on pressing plate, can make components and parts and circuit board close contact reach zero and float high requirement；Pressing plate and wave soldering carrier realize integration by hinged, solve inconvenience during production flow, decrease the waste of turnover manpower；Employing hinge operation is convenient, fixes the open position of pressing plate simultaneously, beneficially the automatization of production procedure.
Description
Technical field
The present invention relates to wave soldering techniques field, particularly to a kind of wave soldering carrier.
Background technology
As it is shown in figure 1, be prior art one wave soldering carrier, base plate 1 is mainly used in carrying PCBA (Printed
Circuit Board Assembly, printed circuit board assembly), it has for the through hole of Wave crest Welding and for components and parts
The deep gouge of protection, and have alignment pin etc. to ensure that PCBA is placed on tram every time；Edge strip 2 is for preventing the liquid tin of high temperature from entering
Enter frock upper surface to contact with PCBA；Clinching 3 can be pressed on PCBA with turn buckle, for PCBA is fixed on base plate, and carries
Buoyancy and the impulsive force that PCBA born when overcoming welding is made for pressure；Pressing plate 4 primarily serve the purpose of utilize gravity or additional outside
Pressure is pressed downward against easily floating high components and parts, is produced floating height by the buoyancy effect of liquid tin during to prevent it from welding；Support bar 5 and limit
Bar 2 jointly acts on and ensures that the liquid tin of high temperature will not enter frock upper surface and contact with PCBA, simultaneously works as carrying whole crest
The effect of weldering carrier.Support bar 5 can overhang a part of edge to the two ends of base plate 1, and edge is tight with the track of Wave soldering apparatus
Close fit, moves with parallel track.Whole heating all completes with welding during frock orbital motion.
It will be seen from figure 1 that wave soldering carrier is just as a pallet, surrounding relies on edge strip 2 and support bar 5 composition to seal
Barricade, stops that high-temperature liquid state stannum injects from edge internal.Clinching 3 provides pressure for whole PCBA, makes PCBA be fixed on ripple
On the base plate 1 of peak weldering carrier, and when ensureing welding, PCBA will not float up.And the Main Function of pressing plate 4 is exactly on PCBA
The most floating one or more high components and parts provide pressure so that it is can overcome when contacting with liquid tin produced floating when welding
Power.
It can be seen that the process of Wave crest Welding is from the structure and working principle of wave soldering carrier: high-temperature liquid state stannum
Contact with the components and parts foot coating scaling powder and be attached to, on components and parts foot and PCBA pad, after cooling, to form the solder joint of solid-state
Process.But, owing to the proportion of stannum is relatively big, most components and parts there will be floating high phenomenon.Precision increasingly along with electronic product
Changing, floating high request when welding components and parts is more and more higher, and the even requirement of part components and parts cannot have any floating height, as having
The components and parts of orientation conduction receive capabilities and the components and parts etc. of height detection.The floating height mode of original pressing plate pressure, compression plate is processed
When the tolerance of flatness and components and parts make, body dimension tolerance etc. affect and cannot meet the floating of these type of high accuracy components and parts
High request.Additionally pressing plate and carrier split need individual operation, need manually to carry out location and put and have production efficiency during use
Certain impact.There is provided further, also need to increase extra pressure when the buoyancy that pressing plate gravity cannot overcome components and parts to be subject to
Device provides pressure for pressing plate, has unnecessary action and occurs, so efficiency will be had bigger impact.
Summary of the invention
The problems such as the floating height of components and parts existed in view of prior art wave soldering carrier and pressing plate operating needs are positioned manually, carry
Go out a kind of wave soldering carrier of the present invention, in order to overcome the problems referred to above or solve the problems referred to above at least in part.
To achieve these goals, the present invention is by the following technical solutions:
A kind of wave soldering carrier, including base plate, described base plate is provided with pressing plate, and described base plate is provided with a bracer,
Described pressing plate one end is hinged with described bracer, and described bracer limits described pressing plate and in the range of predetermined angle with hinge axis be
Central rotation, and when described pressing plate rotates to open mode, described pressing plate is fixed by described bracer；
Described pressing plate is provided with the spring probe of components and parts on corresponding circuits plate, described pressing plate and base plate towards base plate side
During fastening, the components and parts on described spring probe pressing circuit board, make described components and parts lower surface and described circuit board upper surface
Closely cooperate.
Alternatively, described bracer is provided with baffle plate, when described pressing plate rotates to open mode centered by hinge axis
Time, pressing plate described in described baffle, by spacing for described pressing plate at open position.
Alternatively, components and parts on corresponding circuits plate, described pressing plate is provided with one or more spring probe.
Alternatively, described pressing plate is provided with high temperature resistant Magnet away from the side of a bracer, and described base plate is also correspondingly arranged
When having high temperature resistant Magnet, described pressing plate and base plate to fasten, described high temperature resistant Magnet attracts each other and makes described pressing plate be pressed on base plate
On.
Alternatively, described base plate is provided with the magnetic receiver of high temperature resistant Magnet is installed.
Alternatively, described magnetic receiver being provided with guide finger, on described pressing plate, corresponding described guide finger is provided with U-shaped guiding
Hole.
Alternatively, described pressing plate is provided with step away from the side of a bracer, and described step makes described pressing plate and base plate button
During conjunction, there is therebetween the gap for opening.
Alternatively, described base plate is set side by side with pressing plate described in polylith.
Alternatively, hinged by damp hinge between described pressing plate and described bracer.
In sum, technical scheme, by arranging spring probe on pressing plate, utilizes stretching of spring probe
Contracting overcomes flatness tolerance and the components and parts making tolerance of pressing plate, components and parts and circuit board can be made to be in close contact and reach zero
Floating high requirement；Pressing plate and wave soldering carrier realize integration by hinged, solve inconvenience during production flow, decrease week
Turn the waste of manpower；Employing hinge operation is convenient, fixes the open position of pressing plate, beneficially production procedure simultaneously
Automatization.
Accompanying drawing explanation
Fig. 1 is the wave soldering carrier of prior art；
A kind of wave soldering carrier that Fig. 2 provides for one embodiment of the invention.
In figure: 1. base plate；1-1. props up bracer；1-2. is high temperature resistant Magnet；1-3. magnetic receiver；1-4. guide finger；1-5. baffle plate；
2. edge strip；3. clinching；4. pressing plate；4-1. spring probe；4-2. is high temperature resistant Magnet；4-3. step；4-4.U shape pilot hole；5.
Stay.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
A kind of wave soldering carrier that Fig. 2 provides for one embodiment of the invention.As in figure 2 it is shown, a kind of wave soldering carrier, bag
Including base plate 1, base plate 1 is provided with pressing plate 4, base plate 1 is provided with a bracer 1-1, pressing plate 4 one end is hinged with a bracer 1-1,
Bracer 1-1 limits pressing plate 4 and rotates centered by hinge axis in the range of predetermined angle, and rotates to open mode at pressing plate 4
Time, pressing plate 4 is fixed by a bracer 1-1；Pressing plate 4 is provided with components and parts on corresponding circuits plate towards base plate 1 side
When spring probe 4-1, pressing plate 4 and base plate 1 fasten, the components and parts on spring probe 4-1 pressing circuit board, make components and parts lower surface
Closely cooperate with circuit board upper surface.
Owing to spring probe 4-1 has scalability, it is possible to avoid prior art due to the flatness tolerance of pressing plate and
What component size tolerance caused presses problem not in place, provides continuous for components and parts, makes components and parts lower surface all the time
Closely cooperate with circuit board upper surface, meet zero and float high request, and the size of pressure can also be by regulation spring probe
Decrement is adjusted, and makes pressing plate equalize the pressure everywhere of circuit board, it is to avoid circuit board deforms；Additionally, by pressing plate 4 and crest
Weldering carrier is connected through the hinge and realizes integration, solves production flow inconvenience, the problem of waste of manpower, and the structure of flip-shell is also
It is more convenient to make to operate, and does not affect personnel's operation, coordinates the spacing fixation of a bracer 1-1, makes the open position of pressing plate 4
Uniquely, in process of production, it is possible to effectively dodge the mechanical arm capturing wave soldering carrier, it is to avoid collision, it is particularly suited for realizing
The automated production process of highly effective and safe.
As in figure 2 it is shown, in the present embodiment 1, a bracer 1-1 is provided with baffle plate 1-5, in pressing plate 4 with hinge axis is
When the heart rotates to open mode, baffle plate 1-5 stops pressing plate 4, by spacing for pressing plate 4 at open position.
Components and parts on corresponding circuits plate, pressing plate 4 is provided with one or more spring probe 4-1, particular number
According to the structural confirmation of components and parts, components and parts are the biggest, and the spring probe 4-1 quantity of setting is the most.
As in figure 2 it is shown, pressing plate 4 is provided with high temperature resistant Magnet 4-2 away from the side propping up bracer 1-1, on base plate 1, also correspondence sets
Being equipped with high temperature resistant Magnet 1-2, pressing plate 4 and base plate 1 when fastening, high temperature resistant Magnet 4-2 and 1-2 attracts each other and makes pressing plate 4 be pressed on
On base plate 1.Wherein, base plate 1 being provided with the magnetic receiver 1-3 installing high temperature resistant Magnet 1-2, high temperature resistant Magnet is preferably strong magnetic
Ferrum.Realized the convenient fastening of pressing plate 4 by magnetic effect, pressing plate 4 is fixed on above base plate 1, coordinate the pressure of spring probe 4-1
Close, it is possible to realize the pressing of circuit board is fixed, be therefore no longer necessary to the clinching of fixing circuit board, eliminate operation clinching and rotate
The action of pressing circuit board, makes job step be simplified, improves working performance.
Being provided with guide finger 1-4 on magnetic receiver 1-3, on pressing plate 4, corresponding guide finger 1-4 is provided with U-shaped pilot hole 4-4.When
When pressing plate 4 is fastened on base plate 1, guide finger 1-4 snaps in U-shaped pilot hole 4-4, accurately corrects closed position, it is ensured that button
Conjunction position is accurate.
Pressing plate 4 away from the side of bracer 1-1 be provided with step 4-3, step 4-3 make pressing plate 4 and base plate 1 fasten time, two
The gap for opening is there is, it is simple to picking and placeing of circuit board between person.
It is set side by side with many block pressur plates 4 on base plate 1, in embodiment as shown in Figure 2, base plate 1 is provided with arranged side by side 2 piece
Pressing plate 4.
Preferably, hinged by damp hinge between pressing plate 4 and a bracer 1-1, it is achieved the buffering to snap action, reduce
The impulsive force of use process.
It is an advantage of the current invention that:
1, tolerance and the components and parts supplied materials of the processing flatness of pressing plate is overcome completely by the scalability of spring probe
Making tolerance, components and parts lower surface and circuit board upper surface can be made to be in close contact and to reach zero and float high requirement；
2, achieving pressing plate integrated with wave soldering carrier, when solving production flow, the inconvenience of transport, decreases week
Turning the waste of manpower, the fixing spacing of a bracer makes pressing plate open position unique, does not affect human users, and can dodge crawl
The mechanical arm of wave soldering carrier, is particularly suited for realizing the automated production process of highly effective and safe；
3, use clam shell design and increase accurate guide frame, it is to avoid the unstability of personnel positioning, making pressing make
Industry is more efficient and convenient, improves working performance；
4, use high temperature resistant Magnet to coordinate the fastening realizing pressing plate and base plate, coordinate spring probe that circuit board is carried out simultaneously
Pressing, eliminates clinching and rotates the action of pressing circuit board, and job step is simplified, in hgher efficiency.
The above, the only detailed description of the invention of the present invention, under the above-mentioned teaching of the present invention, those skilled in the art
Other improvement or deformation can be carried out on the basis of above-described embodiment.It will be understood by those skilled in the art that above-mentioned tool
Body describes simply preferably explains the purpose of the present invention, and protection scope of the present invention should be as the criterion with scope of the claims.
Claims (9)
1. a wave soldering carrier, including base plate, described base plate is provided with pressing plate, it is characterised in that arrange on described base plate
Having a bracer, described pressing plate one end is hinged with described bracer, and described bracer limits described pressing plate in the range of predetermined angle
Rotate centered by hinge axis, and when described pressing plate rotates to open mode, described pressing plate is limited by described bracer
Position is fixing；
Described pressing plate is provided with the spring probe of components and parts on corresponding circuits plate, described pressing plate and base plate and fastens towards base plate side
Time, the components and parts on described spring probe pressing circuit board, make described components and parts lower surface tight with described circuit board upper surface
Coordinate.
2. wave soldering carrier as claimed in claim 1, it is characterised in that be provided with baffle plate on described bracer, when described pressure
When plate rotates to open mode centered by hinge axis, pressing plate described in described baffle, opening position by spacing for described pressing plate
Put.
3. wave soldering carrier as claimed in claim 1, it is characterised in that components and parts on corresponding circuits plate, described pressure
One or more spring probe it is provided with on plate.
4. wave soldering carrier as claimed in claim 1, it is characterised in that described pressing plate is provided with resistance to away from the side of a bracer
High temperature Magnet, when described base plate is also correspondingly arranged on high temperature resistant Magnet, described pressing plate and base plate fastening, described high temperature resistant Magnet
Attract each other and make described pressing plate be pressed on base plate.
5. wave soldering carrier as claimed in claim 4, it is characterised in that be provided with on described base plate and install high temperature resistant Magnet
Magnetic receiver.
6. wave soldering carrier as claimed in claim 5, it is characterised in that be provided with guide finger, described pressure on described magnetic receiver
On plate, corresponding described guide finger is provided with U-shaped pilot hole.
7. wave soldering carrier as claimed in claim 1, it is characterised in that described pressing plate is provided with platform away from the side of a bracer
, when described step makes described pressing plate and base plate fasten, there is therebetween the gap for opening in rank.
8. wave soldering carrier as claimed in claim 1, it is characterised in that be set side by side with on described base plate described in polylith and press
Plate.
9. wave soldering carrier as claimed in claim 1, it is characterised in that by damping between described pressing plate and described bracer
Hinge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610695615.XA CN106112178B (en) | 2016-08-19 | 2016-08-19 | A kind of wave soldering carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610695615.XA CN106112178B (en) | 2016-08-19 | 2016-08-19 | A kind of wave soldering carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106112178A true CN106112178A (en) | 2016-11-16 |
| CN106112178B CN106112178B (en) | 2019-05-24 |
Family
ID=57279066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610695615.XA Active CN106112178B (en) | 2016-08-19 | 2016-08-19 | A kind of wave soldering carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106112178B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107262869A (en) * | 2017-07-26 | 2017-10-20 | 湖北兆元科技有限公司 | Optical device wave soldering fixture and its welding method |
| CN107765313A (en) * | 2017-11-22 | 2018-03-06 | 苏州川鹏塑料有限公司 | Equipment for moulding product metal insert mistake proofing detection |
| CN108391385A (en) * | 2018-04-08 | 2018-08-10 | Oppo广东移动通信有限公司 | Jig for PCBA board reparation |
| CN108544165A (en) * | 2018-05-15 | 2018-09-18 | 苏州赛腾精密电子股份有限公司 | A kind of welding carrier press plate mechanism |
| CN108601239A (en) * | 2018-03-29 | 2018-09-28 | 广东欧珀移动通信有限公司 | Tool for stitching and compression method |
| CN108650805A (en) * | 2018-03-29 | 2018-10-12 | 广东欧珀移动通信有限公司 | Tool for stitching and compression method |
| CN110369885A (en) * | 2018-04-12 | 2019-10-25 | 湖北航鹏化学动力科技有限责任公司 | A kind of laser point welding tooling |
| CN110480117A (en) * | 2018-05-14 | 2019-11-22 | Oppo广东移动通信有限公司 | Tool for stitching and reflow soldering tool component for circuit board solder reflow |
| US20200180060A1 (en) * | 2016-11-08 | 2020-06-11 | Flex Ltd | Wave solder pallets for optimal solder flow and methods of manufacturing |
| CN113102868A (en) * | 2021-04-20 | 2021-07-13 | 中国直升机设计研究所 | Helicopter main nozzle lobe machining method |
| CN113664404A (en) * | 2021-08-23 | 2021-11-19 | 中国工程物理研究院化工材料研究所 | Multi-welding-point automatic pulse hot-pressing reflow soldering tool |
| CN113814506A (en) * | 2021-10-12 | 2021-12-21 | 北京无线电测量研究所 | Brazing device and brazing method for reducing overflow of solder |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200180060A1 (en) * | 2016-11-08 | 2020-06-11 | Flex Ltd | Wave solder pallets for optimal solder flow and methods of manufacturing |
| CN107262869B (en) * | 2017-07-26 | 2019-05-24 | 湖北兆元科技有限公司 | Optical device wave soldering fixture and its welding method |
| CN107262869A (en) * | 2017-07-26 | 2017-10-20 | 湖北兆元科技有限公司 | Optical device wave soldering fixture and its welding method |
| CN107765313A (en) * | 2017-11-22 | 2018-03-06 | 苏州川鹏塑料有限公司 | Equipment for moulding product metal insert mistake proofing detection |
| CN108601239A (en) * | 2018-03-29 | 2018-09-28 | 广东欧珀移动通信有限公司 | Tool for stitching and compression method |
| CN108650805A (en) * | 2018-03-29 | 2018-10-12 | 广东欧珀移动通信有限公司 | Tool for stitching and compression method |
| CN108391385A (en) * | 2018-04-08 | 2018-08-10 | Oppo广东移动通信有限公司 | Jig for PCBA board reparation |
| CN110369885B (en) * | 2018-04-12 | 2024-04-05 | 湖北航鹏化学动力科技有限责任公司 | Laser spot welding tool |
| CN110369885A (en) * | 2018-04-12 | 2019-10-25 | 湖北航鹏化学动力科技有限责任公司 | A kind of laser point welding tooling |
| CN110480117A (en) * | 2018-05-14 | 2019-11-22 | Oppo广东移动通信有限公司 | Tool for stitching and reflow soldering tool component for circuit board solder reflow |
| CN108544165B (en) * | 2018-05-15 | 2019-11-19 | 苏州赛腾精密电子股份有限公司 | A kind of welding carrier press plate mechanism |
| CN108544165A (en) * | 2018-05-15 | 2018-09-18 | 苏州赛腾精密电子股份有限公司 | A kind of welding carrier press plate mechanism |
| CN113102868A (en) * | 2021-04-20 | 2021-07-13 | 中国直升机设计研究所 | Helicopter main nozzle lobe machining method |
| CN113664404A (en) * | 2021-08-23 | 2021-11-19 | 中国工程物理研究院化工材料研究所 | Multi-welding-point automatic pulse hot-pressing reflow soldering tool |
| CN113664404B (en) * | 2021-08-23 | 2023-01-24 | 中国工程物理研究院化工材料研究所 | Multi-welding-point automatic pulse hot-pressing reflow soldering tool |
| CN113814506A (en) * | 2021-10-12 | 2021-12-21 | 北京无线电测量研究所 | Brazing device and brazing method for reducing overflow of solder |
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| CN106112178B (en) | 2019-05-24 |
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Address after: 261205 Workshop No. 1, 3 and 5 of Edelle Light Industrial Products Processing Base, Weifang Comprehensive Bonded Zone, Weifang City, Shandong Province, to the south of Yuqing East Street, Weifang Comprehensive Bonded Zone and to the east of Weifang Comprehensive Bonded Zone, Gaoxin Second Road Applicant after: Weifang Goertek Electronics Co., Ltd. Address before: 261031 No. 268 Dongfang Road, hi tech Industrial Development Zone, Shandong, Weifang Applicant before: Weifang Goertek Electronics Co., Ltd. |
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