CN113814506A - Brazing device and brazing method for reducing overflow of solder - Google Patents
Brazing device and brazing method for reducing overflow of solder Download PDFInfo
- Publication number
- CN113814506A CN113814506A CN202111187411.2A CN202111187411A CN113814506A CN 113814506 A CN113814506 A CN 113814506A CN 202111187411 A CN202111187411 A CN 202111187411A CN 113814506 A CN113814506 A CN 113814506A
- Authority
- CN
- China
- Prior art keywords
- magnet
- base
- pressing
- solder
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a brazing device and a brazing method for reducing overflow of a brazing material. A soldering apparatus for reducing solder overflow includes: the welding device comprises a base for loading a part to be welded and a box body, a pressure plate and at least one pressure pin for pressing the part to be welded, wherein the pressure plate is detachably arranged at the top end of the base, and the pressure pin is slidably arranged on the pressure plate. By designing the brazing device with the base, the pressing plate and the pressing pins, which is used for reducing the overflow of the solder, the brazing device is adaptive to the pressure of a part to be welded during welding, the phenomenon that the solder overflows too much due to large or uneven pressure after being melted is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
Description
Technical Field
The invention relates to the technical field of microwave hybrid integrated circuit generating equipment, in particular to a soldering device and a soldering method for reducing solder overflow.
Background
With the development of microwave modules towards miniaturization, light weight and high frequency band, the degree of module integration is higher and higher, and the component heat dissipation efficiency and high-reliability grounding of the modules become the focus of attention of module assembly. The low-temperature brazing is used as a high-reliability grounding mode between the module part and the box body, the welding effect is very important, the low void ratio of the module after welding is ensured, and the assembly influence on the subsequent micro-assembly link caused by the overflow of the welding flux is avoided as far as possible. Therefore, the quality of the adopted tool during low-temperature brazing becomes a corresponding mode for directly and effectively solving the low-temperature brazing problem. The brazing tool in the prior art cannot guarantee low void ratio, and the overflow of the solder is more.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art and provides a brazing device and a brazing method for reducing the overflow of a brazing material.
The technical scheme for solving the technical problems is as follows: a soldering apparatus that reduces solder overflow, comprising: the welding device comprises a base for loading a part to be welded and a box body, a pressure plate and at least one pressure pin for pressing the part to be welded, wherein the pressure plate is detachably arranged at the top end of the base, and the pressure pin is slidably arranged on the pressure plate.
The invention has the beneficial effects that: by designing the brazing device with the base, the pressing plate and the pressing pins, which is used for reducing the overflow of the solder, the brazing device is adaptive to the pressure of a part to be welded during welding, the phenomenon that the solder overflows too much due to large or uneven pressure after being melted is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
Furthermore, the contact surfaces of the base and the pressing plate are respectively provided with a first magnet, and the first magnet on the base and the first magnet on the pressing plate are arranged correspondingly.
The beneficial effect of adopting the further scheme is that: the pressing plate can be fixed on the contact end face of the base through the magnetic force of the first magnet, and the pressing pin is in close contact with the part to be welded.
Furthermore, hole sites for mounting the first magnets are respectively arranged on the contact surfaces of the base and the pressing plate.
The beneficial effect of adopting the further scheme is that: the hole position is used for installing a first magnet; the hole site mirror image and the equidistant range setting for the even atress of the contact surface of clamp plate and base makes the part atress of waiting to weld even, improves the stability and the reliability of base and clamp plate contact.
Wherein, the hole site on base and the clamp plate contact surface is mirror image respectively and equidistant range sets up, specifically, the hole site on two long limits on the base and two minor face tops is respectively about base axial symmetry, and a first magnet is placed to a hole site at every interval. The hole position of the pressing plate and the first magnet are the same.
Further, a second magnet is installed at one end of the pressing pin, and the pressing pin is slidably installed on the end face of the inner side of the pressing plate through the second magnet.
The beneficial effect of adopting the further scheme is that: the setting of second magnet for with tucking slidable mounting on the clamp plate, and the second magnet can drive tucking along with the removal and the synchronous motion of third magnet, the user of being convenient for adjusts the position of tucking.
Furthermore, a third magnet is mounted on the outer end face of the pressing plate, and the third magnet is arranged corresponding to the second magnet in position.
The beneficial effect of adopting the further scheme is that: the size of the magnetic force applied to the to-be-welded part by the pressing pin is adjusted by the third magnets with different specifications, and the stress size and uniformity of a solder sheet between the to-be-welded part and the box body in a molten state are adapted, so that the overflow of the solder is reduced. The pressure of the pressing pin can be adjusted through the specification of the third magnet, the pressing pin is adaptive to the pressure of a part to be welded during welding, excessive overflow of the solder due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
Furthermore, the base is provided with a limiting groove for loading the parts to be welded and the box body, the pressing plate and the base are respectively provided with a positioning pin hole, and the positioning pin hole in the pressing plate and the positioning pin hole in the base are correspondingly arranged.
The beneficial effect of adopting the further scheme is that: the spacing groove is used for blocking the box body all around, prevents that the box body from rocking in the base. The relative position of the fixed base and the pressure plate is convenient to fix due to the arrangement of the positioning pin holes, the relative position of the pressure pin and the part to be welded is prevented from changing, and the stability and the reliability of the brazing device are improved.
Further, the base and the clamp plate are of square structures, and bosses for supporting the clamp plate are arranged at diagonal positions of the top end of the base respectively.
The beneficial effect of adopting the further scheme is that: the base and the pressing plate are of square structures, so that the box body is convenient to mount and dismount and is convenient to adapt to the appearance of the box body; the setting of boss, the base of being convenient for supports the clamp plate, prevents that first magnet from receiving the clamp plate extrusion and damaging.
Further, the other end of the pressing needle is provided with a pressing head.
The beneficial effect of adopting the further scheme is that: the size of the pressing point of the pressing pin can be adjusted through the size of the pressing head.
In addition, the invention also provides a soldering method for reducing solder overflow, based on any one of the soldering devices for reducing solder overflow, the soldering method for reducing solder overflow comprises the following steps:
s1, placing a solder sheet at the position to be welded corresponding to the part to be welded on the box body;
s2, placing the parts to be welded on the solder sheet;
s3, placing the box body with the parts to be welded into the base;
s4, mounting the pressing pin on the end face of the inner side of the pressing plate through a second magnet;
s5, correspondingly mounting the third magnet and the second magnet on the outer end face of the pressure plate;
s6, adjusting the position of the press pin through a third magnet to enable the press pin to be abutted against the part to be welded;
s7, fixing the pressure plate and the base through the positioning pin holes;
and S8, placing the brazing device with the box body in a welding furnace cavity for welding.
The invention has the beneficial effects that: the brazing method for reducing the overflow of the solder is designed, the pressure applied to the parts to be welded during welding is adapted, the excessive overflow of the solder due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
Further, after step S5 and before step S6, comprising: when the movement of the third magnet is confirmed, the second magnet and the pressing pin move along with the third magnet.
The beneficial effect of adopting the further scheme is that: when the pressing plate is installed on the base, a user can move the pressing pin through the third magnet located on the outer side of the pressing plate.
Advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of a brazing apparatus according to an embodiment of the present invention.
Fig. 2 is a second schematic structural diagram of a brazing apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic view of a combination structure of a pressing pin and a pressing plate according to an embodiment of the present invention.
Fig. 4 is a second schematic view of a combination structure of the pressing pin and the pressing plate according to the embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a base according to an embodiment of the present invention.
Fig. 6 is a second schematic structural diagram of a base according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a pressure plate according to an embodiment of the present invention.
Fig. 8 is a second schematic structural diagram of a pressing plate according to an embodiment of the present invention.
Fig. 9 is a schematic structural view of a pressing pin according to an embodiment of the present invention.
Fig. 10 is a flow chart of a brazing method according to an embodiment of the present invention.
The reference numbers illustrate: 1-a base; 2-pressing a plate; 3-pressing the needle; 4-a first magnet; 5-a second magnet; 6-a third magnet; 7-a limiting groove; 8-positioning pin holes; 9-boss; 10-pressure head.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1 to 9, an embodiment of the present invention provides a soldering apparatus that reduces solder overflow, including: the welding device comprises a base 1 for loading a part to be welded and a box body, a pressure plate 2 and at least one pressure pin 3 for pressing the part to be welded, wherein the pressure plate 2 is detachably arranged at the top end of the base 1, and the pressure pin 3 is slidably arranged on the pressure plate 2.
The invention has the beneficial effects that: by designing the brazing device with the base, the pressing plate and the pressing pins, which is used for reducing the overflow of the solder, the brazing device is adaptive to the pressure of a part to be welded during welding, the phenomenon that the solder overflows too much due to large or uneven pressure after being melted is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
The first magnet, the second magnet and the third magnet are high-temperature resistant magnets. The brazing apparatus of the embodiments of the present invention may be, but is not limited to, the field of low temperature brazing. Low temperatures are temperatures below 450 degrees celsius. The indenter may be a high temperature resistant polytetrafluoroethylene indenter.
The third magnet is used for applying pressure and adjusting the position of the pressing pin. The locating pin hole is used for limiting when the pressing plate is installed. The pressing pin is used for pressing and contacting the parts to be welded. The pressing plate is used for installing the pressing pin, the second magnet and the third magnet. The pressure head is used for contacting parts to be welded, and is detachable and adjustable in size. The base is used for installing the box body and the pressing plate. The boss is used for buffering the contact of the pressure plate and the base. The second magnet is bonded with the pressing pin and is used for being adsorbed with a third magnet on the outer side of the bottom plate in an alignment mode.
The brazing device for reducing the overflow of the solder comprises a base, a pressing plate, a pressing pin and high-temperature resistant magnets, wherein the magnetic force exerted on a part to be welded by the pressing pin is adjusted by the high-temperature resistant magnets with different specifications, and the force bearing size and the uniformity of a solder sheet between the part to be welded and a box body in a molten state are adapted, so that the overflow of the solder is reduced. The base is square, a limiting groove for mounting a box body to be welded is formed in the lower end face of the base, the size of the limiting groove is 0.2mm smaller than that of a single side of the box body, the periphery of the box body is clamped, and the rest of the lower end face is provided with a cavity; four square bosses are arranged on the upper end surface of the base at the diagonal line, the plane size of each boss is consistent with the external dimension of the high-temperature resistant magnet, and the height size is 0.5 mm; the external dimension of the pressing plate is consistent with that of the base, and the thickness of the pressing plate is 2 mm; the sizes of the contact end surfaces of the base and the pressing plate are consistent, the contact end surfaces are 2mm larger than the overall size of the high-temperature resistant magnet, hole sites for mounting the high-temperature resistant magnet are arranged, the sizes of the hole sites are consistent with the sizes of the high-temperature resistant magnet, the hole sites are arranged on the contact end surfaces of the base and the pressing plate in a mirror image mode and are arranged at equal intervals (the overall size of one high-temperature resistant magnet is spaced), and the high-temperature resistant magnet is bonded and cured by adopting high-temperature resistant insulating glue inside the hole sites; the pressing plate can be fixed on the contact end surface of the base through the magnetic force of the high-temperature resistant magnet; two positioning pin holes with the same size are formed in diagonal positions on one side of the contact end face of the base and the pressing plate, the diameter of each positioning pin hole is 2mm, and the positioning pin holes are used for limiting when the pressing plate is installed on the base; the pressing needle has elasticity, the lower end face is a high-temperature resistant polytetrafluoroethylene pressing head with adjustable size, and the upper end face and the high-temperature resistant magnet are bonded and cured into a whole by adopting a high-temperature resistant insulating glue.
When the brazing device is used, the brazing sheet is firstly arranged at the position to be welded of the box body, then the part to be welded is arranged above the brazing sheet, then the box body is arranged in the limiting groove of the base, then the pressing pin and the high-temperature-resistant magnet are arranged above the pressing plate, the position of the pressing pin is adjusted by moving the high-temperature-resistant magnet to enable the pressing pin to be consistent with the position to be welded, and finally the pressing plate and the base are arranged together through the positioning pin hole. When the low-temperature brazing is carried out, the pressing plate is in close contact with the base through the magnetic force of the high-temperature resistant magnet, so that the pressing pin is in close contact with a part to be welded, the pressing point size of the pressing pin can be adjusted through the size of the high-temperature resistant polytetrafluoroethylene pressing head, the pressing pin pressure can be adjusted through the specification of the high-temperature resistant magnet, the pressure of the part to be welded during welding is adapted, excessive overflow of the solder due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the void ratio of the low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
A soldering apparatus for reducing solder overflow includes: the lower end face of the base is provided with a limiting groove for installing a box body to be welded, the pressing plate is provided with a positioning pin hole corresponding to the base, the magnetic force of the pressing plate through the high-temperature magnet is fixed on the contact end face of the base, and the position of the pressing pin, which is in contact with a part to be welded, can be adjusted through adjusting the position of the high-temperature magnet above the pressing plate. The base is square, a limiting groove for mounting a box body to be welded is formed in the lower end face of the base, the size of the limiting groove is 0.2mm smaller than that of a single side of the box body, the periphery of the box body is clamped, and the rest of the lower end face is provided with a cavity; four square bosses are arranged on the upper end surface of the base at the diagonal line, the plane size of each boss is consistent with the external dimension of the high-temperature resistant magnet, and the height size is 0.5 mm; the overall dimension of the pressing plate is consistent with that of the base, and the thickness of the pressing plate is 2 mm. The contact end face size of base and clamp plate is unanimous, all than high temperature resistant magnet's overall dimension 2mm big, all offers the hole site that is used for installing high temperature resistant magnet, and the hole site size is unanimous with high temperature resistant magnet's size, and the hole site is arranged on the contact end face of base and clamp plate according to the mirror image mode, equidistant range (the overall dimension of a high temperature resistant magnet at interval). And the high-temperature resistant magnet is bonded with the hole sites formed on the end surfaces of the base and the pressing plate by high-temperature resistant insulating glue and then cured. And two positioning pin holes with the same size are formed in diagonal positions on one side of the contact end surface of the base and the pressing plate, and the diameter of each positioning pin hole is 2mm and used for limiting when the pressing plate is installed on the base.
The pressing pin has elasticity (the elastic size range is 1mm-6mm), the lower end face is a pressing head with adjustable size, and the upper end face and the high-temperature resistant magnet are bonded and solidified into a whole by adopting high-temperature resistant insulating glue.
As shown in fig. 1 to 9, first magnets 4 are respectively mounted on contact surfaces of the base 1 and the pressure plate 2, and the first magnets 4 on the base 1 and the first magnets 4 on the pressure plate 2 are arranged in positions corresponding to each other.
The beneficial effect of adopting the further scheme is that: the pressing plate can be fixed on the contact end face of the base through the magnetic force of the first magnet, and the pressing pin is in close contact with the part to be welded.
As shown in fig. 1 to 9, further, holes for mounting the first magnets 4 are respectively disposed on the contact surfaces of the base 1 and the pressing plate 2, and the holes are arranged in a mirror image and at equal intervals.
The beneficial effect of adopting the further scheme is that: the hole position is used for installing a first magnet; the hole site mirror image and the equidistant range setting for the even atress of the contact surface of clamp plate and base makes the part atress of waiting to weld even, improves the stability and the reliability of base and clamp plate contact.
As shown in fig. 1 to 9, a second magnet 5 is mounted at one end of the presser pin 3, and the presser pin 3 is slidably mounted on the inner end surface of the pressure plate 2 through the second magnet 5.
The beneficial effect of adopting the further scheme is that: the setting of second magnet for with tucking slidable mounting on the clamp plate, and the second magnet can drive tucking along with the removal and the synchronous motion of third magnet, the user of being convenient for adjusts the position of tucking.
As shown in fig. 1 to 9, a third magnet 6 is attached to an outer end surface of the platen 2, and the third magnet 6 is provided in a position corresponding to the second magnet 5.
The beneficial effect of adopting the further scheme is that: the size of the magnetic force applied to the to-be-welded part by the pressing pin is adjusted by the third magnets with different specifications, and the stress size and uniformity of a solder sheet between the to-be-welded part and the box body in a molten state are adapted, so that the overflow of the solder is reduced. The pressure of the pressing pin can be adjusted through the specification of the third magnet, the pressing pin is adaptive to the pressure of a part to be welded during welding, excessive overflow of the solder due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
As shown in fig. 1 to 9, further, the base 1 is provided with a limiting groove 7 for loading a component to be welded and a box body, the pressing plate 2 and the base 1 are respectively provided with a positioning pin hole 8, and the positioning pin hole 8 on the pressing plate 2 and the positioning pin hole 8 on the base 1 are correspondingly arranged.
The beneficial effect of adopting the further scheme is that: the spacing groove is used for blocking the box body all around, prevents that the box body from rocking in the base. The relative position of the fixed base and the pressure plate is convenient to fix due to the arrangement of the positioning pin holes, the relative position of the pressure pin and the part to be welded is prevented from changing, and the stability and the reliability of the brazing device are improved.
As shown in fig. 1 to 9, the base 1 and the pressure plate 2 are both of a square structure, and bosses 9 for supporting the pressure plate 2 are respectively disposed at diagonal positions of the top end of the base 1.
The beneficial effect of adopting the further scheme is that: the base and the pressing plate are of square structures, so that the box body is convenient to mount and dismount and is convenient to adapt to the appearance of the box body; the setting of boss, the base of being convenient for supports the clamp plate, prevents that first magnet from receiving the clamp plate extrusion and damaging.
As shown in fig. 1 to 9, a pressing head 10 is further installed at the other end of the pressing pin 3.
The beneficial effect of adopting the further scheme is that: the size of the pressing point of the pressing pin can be adjusted through the size of the pressing head.
The utility model provides a reduce brazing device that solder spills over includes base, clamp plate, tucking and high temperature resistant magnet, and the spacing groove of the box body of treating welding is treated in the installation is seted up to the lower terminal surface of base, and the locating pin hole that corresponds with the base is seted up to the clamp plate, and the magnetic force of the high temperature resistant magnet of clamp plate accessible is fixed on the contact terminal surface of base, and the tucking accessible adjusts the tucking and treats the contact position of welded part in the high temperature resistant magnet position of clamp plate top.
Firstly, the solder sheet and the parts to be welded are sequentially placed in the box body and are installed in the base together, and the pressing plate and the base are installed in place in a limiting mode through the positioning pin holes. When the low-temperature brazing is carried out, the pressing plate is in close contact with the base through the magnetic force of the high-temperature resistant magnet, so that the pressing pin is in close contact with a part to be welded, the pressing point size of the pressing pin can be adjusted through the size of the high-temperature resistant polytetrafluoroethylene pressing head, the pressing pin pressure can be adjusted through the specification of the high-temperature resistant magnet, the pressure of the part to be welded during welding is adapted, excessive overflow of the solder due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the void ratio of the low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
The brazing device capable of reducing the overflow of the solder comprises a base, a pressing plate, a pressing pin and a high-temperature-resistant magnet, wherein a limiting groove for installing a box body to be welded is formed in the lower end face of the base, a positioning pin hole corresponding to the base is formed in the pressing plate, the pressing plate can be fixed on the contact end face of the base through the magnetic force of the high-temperature-resistant magnet, and the pressing pin can be adjusted through adjusting the position of the high-temperature-resistant magnet above the pressing plate to adjust the contact position of the pressing pin and a part to be welded. The base is square, a limiting groove for mounting a box body to be welded is formed in the lower end face of the base, the size of the limiting groove is 0.2mm smaller than that of a single side of the box body, the periphery of the box body is clamped, and the rest of the lower end face is provided with a cavity; four square bosses are arranged on the upper end surface of the base at the diagonal line, the plane size of each boss is consistent with the external dimension of the high-temperature resistant magnet, and the height size is 0.5 mm; the overall dimension of the pressing plate is consistent with that of the base, and the thickness of the pressing plate is 2 mm. The contact end face size of base and clamp plate is unanimous, all than high temperature resistant magnet's overall dimension 2mm big, all offers the hole site that is used for installing high temperature resistant magnet, and the hole site size is unanimous with high temperature resistant magnet's size, and the hole site is arranged on the contact end face of base and clamp plate according to the mirror image mode, equidistant range (the overall dimension of a high temperature resistant magnet at interval). The high-temperature resistant magnet is bonded with the hole sites arranged on the end surfaces of the base and the pressing plate by high-temperature resistant insulating glue and then cured. Two positioning pin holes with the same size are formed in diagonal positions on one side of the contact end face of the base and the pressing plate, and the diameter of each positioning pin hole is 2mm and used for limiting when the pressing plate is installed on the base. The pressing needle has elasticity (the elastic size range is 1mm-6mm), the lower end face is a high-temperature resistant polytetrafluoroethylene pressing head with adjustable size, and the upper end face and the high-temperature resistant magnet are bonded and cured into a whole by adopting a high-temperature resistant insulating glue.
The use method of the brazing device comprises the following steps: cleaning the position to be welded, corresponding to the part to be welded, of the box body by adopting a semi-dry absolute ethyl alcohol cotton ball;
firstly, placing a layer of pre-cut and cleaned solder sheet on a to-be-welded position of a box body corresponding to a to-be-welded part, then placing the to-be-welded part above the solder sheet, then placing the box body into a limiting groove on the lower end surface of a base, then installing a pressing pin on the inner side of a pressing plate, installing a high-temperature resistant magnet on the outer side of the pressing plate, adjusting the position of the pressing pin by moving the high-temperature resistant magnet to enable the pressing pin to be consistent with the pressable contact position of the to-be-welded part, and finally installing the pressing plate and the base together in a limiting way through a positioning pin hole;
placing the tool with the box body in a vacuum welding furnace cavity or on a heating table top for welding;
and after the welding is finished, the tool is moved out, the temperature of the tool is reduced to room temperature, the pressing plate is moved away from the base, and the box body is taken out.
Before the pressing plate is installed on the base, when the high-temperature-resistant magnet on the outer side of the pressing plate needs to be confirmed to move, the pressing pin on the inner side of the pressing plate moves along with the pressing pin, and then the position of the high-temperature-resistant magnet on the outer side of the pressing plate is adjusted to enable the polytetrafluoroethylene pressing head of the pressing pin to correspond to the position of a part to be welded, which can be in pressing contact with the part.
As shown in fig. 10, the present invention further provides a soldering method for reducing solder overflow, based on any one of the above soldering apparatuses for reducing solder overflow, the soldering method for reducing solder overflow includes:
s1, placing a solder sheet at the position to be welded corresponding to the part to be welded on the box body;
s2, placing the parts to be welded on the solder sheet;
s3, placing the box body with the parts to be welded into the base;
s4, mounting the pressing pin on the end face of the inner side of the pressing plate through a second magnet;
s5, correspondingly mounting the third magnet and the second magnet on the outer end face of the pressure plate;
s6, adjusting the position of the press pin through a third magnet to enable the press pin to be abutted against the part to be welded;
s7, fixing the pressure plate and the base through the positioning pin holes;
and S8, placing the brazing device with the box body in a welding furnace cavity for welding.
The invention has the beneficial effects that: the brazing method for reducing the overflow of the solder is designed, the pressure applied to the parts to be welded during welding is adapted, the excessive overflow of the solder due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the void ratio of low-temperature brazing is reduced, and the reliability of the low-temperature brazing is improved.
A method for soldering a box and a part to be soldered by using the soldering apparatus for reducing solder overflow, comprising the steps of:
cleaning the position to be welded, corresponding to the part to be welded, of the box body by adopting a semi-dry absolute ethyl alcohol cotton ball;
firstly, placing a layer of pre-cut and cleaned solder sheet on a to-be-welded position of a box body corresponding to a to-be-welded part, then placing the to-be-welded part above the solder sheet, then placing the box body into a limiting groove on the lower end surface of a base, then installing a pressing pin on the inner side of a pressing plate, installing a high-temperature resistant magnet on the outer side of the pressing plate, adjusting the position of the pressing pin by moving the high-temperature resistant magnet to enable the pressing pin to be consistent with the pressable contact position of the to-be-welded part, and finally installing the pressing plate and the base together in a limiting way through a positioning pin hole;
placing the tool with the box body in a vacuum welding furnace cavity or on a heating table top for welding;
and after the welding is finished, the tool is moved out, the temperature of the tool is reduced to room temperature, the pressing plate is moved away from the base, and the box body is taken out.
Before the pressing plate is installed on the base, when the high-temperature-resistant magnet on the outer side of the pressing plate needs to be confirmed to move, the pressing pin on the inner side of the pressing plate moves along with the pressing pin, and then the position of the high-temperature-resistant magnet on the outer side of the pressing plate is adjusted to enable the pressing head of the pressing pin to correspond to the position, capable of being pressed and contacted, of the part to be welded.
Further, after step S5 and before step S6, comprising: when the movement of the third magnet is confirmed, the second magnet and the pressing pin move along with the third magnet.
The beneficial effect of adopting the further scheme is that: when the pressing plate is installed on the base, a user can move the pressing pin through the third magnet located on the outer side of the pressing plate.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A soldering apparatus for reducing solder overflow, comprising: the welding device comprises a base (1) used for loading a part to be welded and a box body, a pressing plate (2) and at least one pressing pin (3) used for pressing the part to be welded, wherein the pressing plate (2) is detachably arranged at the top end of the base (1), and the pressing pin (3) is slidably arranged on the pressing plate (2).
2. The brazing device for reducing the overflow of the solder according to claim 1, wherein the contact surfaces of the base (1) and the pressure plate (2) are respectively provided with a first magnet (4), and the first magnet on the base (1) is arranged corresponding to the first magnet on the pressure plate (2).
3. The soldering apparatus for reducing solder overflow according to claim 2, wherein the contact surfaces of the base (1) and the pressure plate (2) are respectively provided with holes for mounting the first magnet (4).
4. A soldering apparatus with reduced solder overflow according to claim 1, wherein a second magnet (5) is mounted at one end of the pressing pin (3), and the pressing pin (3) is slidably mounted on the inner end surface of the pressing plate (2) via the second magnet (5).
5. A soldering apparatus with reduced solder overflow according to claim 4, characterized in that a third magnet (6) is mounted on the outer end face of the pressure plate (2), and the third magnet (6) is arranged corresponding to the second magnet (5).
6. The brazing device for reducing the overflow of the solder according to claim 1, wherein the base (1) is provided with a limiting groove (7) for loading a component to be welded and a box body, the pressure plate (2) and the base (1) are respectively provided with a positioning pin hole (8), and the positioning pin hole on the pressure plate (2) is arranged corresponding to the positioning pin hole on the base (1).
7. The brazing device for reducing the overflow of the solder is characterized in that the base (1) and the pressure plate (2) are of a square structure, and bosses (9) for supporting the pressure plate (2) are respectively arranged at the diagonal positions of the top end of the base (1).
8. A soldering apparatus with reduced solder overflow according to claim 1, characterized in that the other end of the pressing pin (3) is provided with a pressing head (10).
9. A soldering method for reducing solder overflow, based on the soldering apparatus for reducing solder overflow of any one of claims 1 to 8, the soldering method for reducing solder overflow comprising:
s1, placing a solder sheet at the position to be welded corresponding to the part to be welded on the box body;
s2, placing the parts to be welded on the solder sheet;
s3, placing the box body with the parts to be welded into the base;
s4, mounting the pressing pin on the end face of the inner side of the pressing plate through a second magnet;
s5, correspondingly mounting the third magnet and the second magnet on the outer end face of the pressure plate;
s6, adjusting the position of the press pin through a third magnet to enable the press pin to be abutted against the part to be welded;
s7, fixing the pressure plate and the base through the positioning pin holes;
and S8, placing the brazing device with the box body in a welding furnace cavity for welding.
10. The brazing method for reducing the overflow of the solder according to claim 9, comprising after the step S5 and before the step S6: when the movement of the third magnet is confirmed, the second magnet and the pressing pin move along with the third magnet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111187411.2A CN113814506B (en) | 2021-10-12 | 2021-10-12 | Soldering device and soldering method for reducing solder overflow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111187411.2A CN113814506B (en) | 2021-10-12 | 2021-10-12 | Soldering device and soldering method for reducing solder overflow |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113814506A true CN113814506A (en) | 2021-12-21 |
| CN113814506B CN113814506B (en) | 2023-06-27 |
Family
ID=78916472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111187411.2A Active CN113814506B (en) | 2021-10-12 | 2021-10-12 | Soldering device and soldering method for reducing solder overflow |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113814506B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114309854A (en) * | 2021-12-28 | 2022-04-12 | 中国科学院空天信息创新研究院 | Method and tool suitable for integrated brazing of multiple substrates of box body with two-sided open cavity |
| CN115213513A (en) * | 2022-07-14 | 2022-10-21 | 中国电子科技集团公司第二十九研究所 | Multi-chip vacuum eutectic welding device and method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2227964A1 (en) * | 1998-04-06 | 1999-10-06 | Micael Rider | Magnetic stand for the assembly and the unilateral soldering of ferromagnetic sheet panels |
| RU2010116091A (en) * | 2010-04-23 | 2011-10-27 | Общество с ограниченной ответственностью "Научно-Технический Центр Информационные Технологии" (RU) | METHOD OF ELECTRIC CONTACT SOLDERING OF TIPS OF RAIL CONNECTORS TO THE RAIL AND DEVICE FOR ITS IMPLEMENTATION |
| CN106112178A (en) * | 2016-08-19 | 2016-11-16 | 潍坊歌尔电子有限公司 | A kind of wave soldering carrier |
| CN108767389A (en) * | 2018-09-05 | 2018-11-06 | 北京无线电测量研究所 | A kind of E surface waves lead junction type ferrite isolator |
| CN109570756A (en) * | 2018-12-26 | 2019-04-05 | 江苏省宜兴电子器件总厂有限公司 | A kind of thin type solder sheet and metalwork pre-fix method |
| CN209716712U (en) * | 2018-11-27 | 2019-12-03 | 苏州福莱盈电子有限公司 | The jig of high rosin joint is floated for improving USB device |
| CN210306382U (en) * | 2019-07-15 | 2020-04-14 | 江南造船(集团)有限责任公司 | Welding strutting arrangement and welding frock that corresponds |
| CN111716035A (en) * | 2020-07-10 | 2020-09-29 | 无锡奥特维科技股份有限公司 | Welding bottom plate, welding conveying device, battery string production equipment and production method |
| CN111774795A (en) * | 2020-07-23 | 2020-10-16 | 无锡奥特维科技股份有限公司 | Pressing tool, stringer and welding strip laying method |
| CN112775517A (en) * | 2020-12-28 | 2021-05-11 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
-
2021
- 2021-10-12 CN CN202111187411.2A patent/CN113814506B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2227964A1 (en) * | 1998-04-06 | 1999-10-06 | Micael Rider | Magnetic stand for the assembly and the unilateral soldering of ferromagnetic sheet panels |
| RU2010116091A (en) * | 2010-04-23 | 2011-10-27 | Общество с ограниченной ответственностью "Научно-Технический Центр Информационные Технологии" (RU) | METHOD OF ELECTRIC CONTACT SOLDERING OF TIPS OF RAIL CONNECTORS TO THE RAIL AND DEVICE FOR ITS IMPLEMENTATION |
| CN106112178A (en) * | 2016-08-19 | 2016-11-16 | 潍坊歌尔电子有限公司 | A kind of wave soldering carrier |
| CN108767389A (en) * | 2018-09-05 | 2018-11-06 | 北京无线电测量研究所 | A kind of E surface waves lead junction type ferrite isolator |
| CN209716712U (en) * | 2018-11-27 | 2019-12-03 | 苏州福莱盈电子有限公司 | The jig of high rosin joint is floated for improving USB device |
| CN109570756A (en) * | 2018-12-26 | 2019-04-05 | 江苏省宜兴电子器件总厂有限公司 | A kind of thin type solder sheet and metalwork pre-fix method |
| CN210306382U (en) * | 2019-07-15 | 2020-04-14 | 江南造船(集团)有限责任公司 | Welding strutting arrangement and welding frock that corresponds |
| CN111716035A (en) * | 2020-07-10 | 2020-09-29 | 无锡奥特维科技股份有限公司 | Welding bottom plate, welding conveying device, battery string production equipment and production method |
| CN111774795A (en) * | 2020-07-23 | 2020-10-16 | 无锡奥特维科技股份有限公司 | Pressing tool, stringer and welding strip laying method |
| CN112775517A (en) * | 2020-12-28 | 2021-05-11 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114309854A (en) * | 2021-12-28 | 2022-04-12 | 中国科学院空天信息创新研究院 | Method and tool suitable for integrated brazing of multiple substrates of box body with two-sided open cavity |
| CN115213513A (en) * | 2022-07-14 | 2022-10-21 | 中国电子科技集团公司第二十九研究所 | Multi-chip vacuum eutectic welding device and method |
| CN115213513B (en) * | 2022-07-14 | 2023-09-26 | 中国电子科技集团公司第二十九研究所 | Multi-chip vacuum eutectic welding device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113814506B (en) | 2023-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113814506A (en) | Brazing device and brazing method for reducing overflow of solder | |
| TWI377103B (en) | Repair apparatus and repair method | |
| US20170135254A1 (en) | Shielding cover mounting and dismounting apparatus | |
| CN109256337B (en) | Eutectic welding device and method for millimeter-scale elements with circumferences | |
| JP3895703B2 (en) | Printed circuit board connection device | |
| US20030027371A1 (en) | Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body | |
| JP2013157377A (en) | Soldering method of semiconductor device and soldering jig | |
| JP5751258B2 (en) | Manufacturing method of semiconductor device | |
| JP2007329306A (en) | Thermocompression bonding apparatus | |
| JP4619209B2 (en) | Semiconductor element mounting method and semiconductor element mounting apparatus | |
| KR20010082623A (en) | Method of manufacturing a semiconductor integrated circuit device | |
| CN214684643U (en) | Electric iron device for manually welding PCB (printed circuit board) plug-in | |
| CN214046200U (en) | DIP tray convenient to installation is fixed | |
| JPH11345816A (en) | Method and apparatus for forming solder bumps | |
| US10940645B2 (en) | Vibration heat-pressing device | |
| JP2809207B2 (en) | Semiconductor device repair method and repair device | |
| CN116567918B (en) | Miniature circuit board capable of realizing high-density wiring and preparation method thereof | |
| CN221231778U (en) | ROSA hot-press welding device | |
| TWI772220B (en) | Hot-pressing components and hot-pressing equipment | |
| CN220312258U (en) | Tool assembly for welding tuning fork material level switch | |
| KR102560267B1 (en) | A PCB component mounting method with increased production efficiency | |
| CN113301732B (en) | Welding device and method for leadless ceramic packaging component | |
| CN112192115A (en) | Height-adjustable optical assembly and flexible PCB welding fixture and method | |
| CN114289814A (en) | Circuit board welding method and jig | |
| CN111370836A (en) | Cavity filter assembling method for welding cover plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |