CN115213513A - Multi-chip vacuum eutectic welding device and method - Google Patents
Multi-chip vacuum eutectic welding device and method Download PDFInfo
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- CN115213513A CN115213513A CN202210829123.0A CN202210829123A CN115213513A CN 115213513 A CN115213513 A CN 115213513A CN 202210829123 A CN202210829123 A CN 202210829123A CN 115213513 A CN115213513 A CN 115213513A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention discloses a multi-chip vacuum eutectic welding device and a method. The invention overcomes the tension generated by the melting of the welding flux in the welding process by utilizing the suction force generated by the high-temperature permanent magnet to the magnetic column, realizes the good welding of the chip and the component, simplifies and high-efficiency multi-chip vacuum eutectic operation, can realize the automatic arrangement of the component, the welding flux sheet and the bearing plate by optimizing the vacuum eutectic welding fixture and matching with automatic equipment such as an automatic chip mounter and the like, improves the vacuum eutectic efficiency, and solves the problems that the common welding fixture is easy to generate overvoltage or undervoltage and the repeated arrangement of heavy needles is complicated in operation.
Description
Technical Field
The invention relates to the technical field of microelectronic packaging, in particular to a multi-chip vacuum eutectic welding device and method.
Background
Vacuum co-crystals are typically in a low oxygen and low pressure environment. The low oxygen can effectively prevent the solder from being oxidized secondarily by heating, the gas is filled in the low pressure, the isolated hollow holes in the molten solder can be reduced to reduce the hollow holes, and the low pressure is also helpful for the oxide decomposition of the solder. The addition of formic acid atmosphere is also helpful for decomposition and reduction of the solder, increases the wettability and improves the eutectic quality. Therefore, the vacuum eutectic is widely applied to microelectronic packaging, particularly to the working procedures of high-power bare chip eutectic, device sealing cap and the like.
The invention of a multi-chip eutectic bonding pressure device (201610639280. X) by Libo et al, when the area is slightly large in use, the pressure plate is heated and deformed, which can cause over-pressure of part of the chip (device), crushing of the chip, and under-pressure of part of the chip (device), resulting in poor bonding.
The assembly method (201810059738.3) of the 'multi-chip eutectic graphite tool and assembly method' invented by Lijie solves the problems of overpressure and underpressure caused by heating of a pressure plate, but heavy needles need to be repeatedly released during each welding, and the operation is complicated.
How to realize simple and efficient multi-chip vacuum eutectic is a key for improving the production efficiency of high-power bare chips, and related reports are not available at present.
Disclosure of Invention
The invention mainly aims to provide a multi-chip vacuum eutectic welding device and a multi-chip vacuum eutectic welding method, and aims to solve the problems that an existing common welding clamp is easy to generate overvoltage or undervoltage, and the repeated application of heavy needles is complicated.
In order to achieve the above object, the present invention provides a multi-chip vacuum eutectic bonding apparatus, comprising:
a magnet substrate;
the bearing assembly is arranged on the magnet substrate and comprises a magnetic column baffle, a magnetic column limiter, a device limiter and a bearing plate limiter which are arranged in a laminated mode, a magnetic column is arranged between the magnetic column baffle and the magnetic column limiter, the bearing plate limiter is provided with a welding cavity, and a chip welding piece is placed in the welding cavity;
the magnet assembly comprises a magnet limiter, the magnet limiter is provided with a cavity, and a high-temperature magnet is arranged in the cavity;
the bearing plate pressing plate is arranged between the bearing assembly and the magnet assembly and covers the welding cavity;
and the bearing plate is arranged between the bearing assembly and the bearing plate pressing plate and corresponds to the welding cavity.
Optionally, the magnetic column baffle is arranged in a concave manner, and the magnetic column is arranged in the concave space.
Optionally, the magnetic pillar is made of a single material or an alloy of Fe, co and Ni.
Optionally, the magnetic column limiter is provided with a plurality of through holes.
Optionally, the position of the through hole on the magnetic column limiter, the position of the magnetic column in the magnetic column baffle, and the position of the welding cavity formed on the bearing plate limiter correspond to the position of the welding cavity formed on the bearing plate limiter.
Optionally, the magnetic column baffle, the magnetic column limiter, the device limiter and the bearing plate limiter are provided with a plurality of locking screw holes and are fixedly connected through locking screws.
Optionally, the loading board stopper is provided with an alignment pin, and the magnet stopper and the loading board pressing plate are provided with corresponding alignment pin holes.
In order to achieve the above object, the present invention further provides a multi-chip vacuum eutectic soldering method for the multi-chip vacuum eutectic soldering apparatus, the method comprising:
s1: placing the chip welding piece into a welding cavity formed in a bearing plate limiting stopper;
s2: fixedly installing a bearing plate pressing plate and a magnet assembly on a bearing assembly;
s3: the assembled and fixed device is moved out of the magnet substrate and is placed into a vacuum furnace for heating and welding;
s4: after welding, taking down the device and placing the device on a magnet substrate;
s5: taking down the bearing plate pressing plate and the magnet assembly, and taking out a welded part after welding;
s6: and repeating S1-S5, and carrying out welding operation of the next cycle.
Optionally, the solder assembly includes solder, a chip, a substrate, and a capacitor.
Optionally, the step S1 specifically includes:
s11: arranging a chip pressing plate in the welding cavity;
s12: the chip, the substrate and the capacitor are installed into a welding cavity with the surfaces facing downwards;
s13: loading solder into the solder cavity;
s14: the carrier plate is loaded into the weld cavity.
The embodiment of the invention provides a multi-chip vacuum eutectic welding device and a method. The invention overcomes the tension generated by the melting of the solder in the welding process by utilizing the suction force generated by the high-temperature permanent magnet to the magnetic column, and realizes the good welding of the chip and the component. The multi-chip vacuum eutectic operation is simple and efficient. Through the optimization of the vacuum eutectic welding fixture, automatic devices such as an automatic chip mounter and the like are matched, automatic placement of devices, solder pieces and bearing plates can be achieved, and vacuum eutectic efficiency is improved. The problem of ordinary welding jig easily appear excessive pressure or under-pressure is solved, repeated heavy needle complex operation that releases.
Drawings
FIG. 1 is a schematic view of a multi-chip vacuum eutectic bonding apparatus;
FIG. 2 is a schematic view of a portion of a multi-chip vacuum eutectic soldering apparatus.
Description of the reference numerals:
1 magnetic column baffle, 2 magnetic columns, 3 magnetic column limiters, 4 device limiters, 5 bearing plate limiters, 6 locking screws, 7 alignment pins, 8 magnet limiters, 9 high-temperature magnets, 10 magnetic plate/magnetic plate combination, 11 bearing plate pressing plate, 12 bearing plate, 13 solder, 14 chips, 15 substrates, 16 capacitors, 17 chip pressing plate, 18 combination and 19 magnets.
The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
At present, in the related technical field, the problem of overvoltage or undervoltage easily occurs in the existing common welding clamp, and the operation of repeatedly applying the heavy needle is complicated.
To solve this problem, various embodiments of the multi-chip vacuum eutectic soldering apparatus and method of the present invention are provided. The multi-chip vacuum eutectic welding device overcomes the tension generated by the melting of the welding flux in the welding process by utilizing the suction force generated by the high-temperature permanent magnet to the magnetic column, realizes the good welding of the chip and the component, simplifies and high-efficiency multi-chip vacuum eutectic operation, can realize the automatic arrangement of the component, the welding flux sheet and the bearing plate by optimizing the vacuum eutectic welding fixture and matching with automatic equipment such as an automatic chip mounter and the like, improves the vacuum eutectic efficiency, solves the problems that the common welding fixture is easy to generate overvoltage or undervoltage and the repeated application of heavy needles is complicated in operation.
The embodiment of the invention provides a multi-chip vacuum eutectic welding device which comprises a magnetic column baffle 1, a magnetic column 2, a magnetic column limiter 3, a device limiter 4, a bearing plate limiter 5, a locking screw 6, an alignment pin 7, a magnet limiter 8, a high-temperature magnet 9, a bearing plate pressing plate 11 and a magnet 19.
In a preferred embodiment, as shown in FIG. 1:
(1) The magnetic column baffle is concave and is concave in a square shape.
Preferably, the width of the edge of the magnetic column baffle is 1mm.
Preferably, the four corners and the center of the magnetic column baffle are distributed with 5 locking screws.
Preferably, the magnetic column baffle can resist the high temperature of more than 400 ℃, and can realize the penetration of a magnetic field and the rapid conduction of heat.
Preferably, the magnetic column baffle is made of nonmagnetic aluminum alloy.
Preferably, the thickness of the magnetic column baffle is 1mm.
Preferably, the magnetic pillar baffle is 43mm long or wide.
(2) The magnetic column material is kovar alloy, and the Curie temperature is 450 ℃.
Preferably, the magnetic column is composed of two cylinders with different diameters, the diameter of the magnetic column at the small-diameter end is 0.6mm, and the diameter of the flange at the large-diameter end is 1mm.
Preferably, the length of the magnetic pillar is 5mm.
(3) The magnetic column limiter is a porous plate or aluminum alloy.
Preferably, 5 locking screws are distributed at four corners and the center of the magnetic column limiter.
Preferably, the magnetic column limiter can resist the high temperature of more than 400 ℃ and can realize the penetration of a magnetic field and the rapid conduction of heat.
Preferably, the thickness of the magnetic pillar limiter is 2mm.
Preferably, the magnetic column limiter is 43mm long or wide.
(4) The device limiter is made of aluminum alloy.
Preferably, 5 locking screws are distributed at four corners and the center of the device limiter.
Preferably, the device stopper can resist high temperature of more than 400 ℃ and can realize penetration of a magnetic field and rapid heat conduction.
Preferably, the device stopper is 2mm thick.
Preferably, the device stop is 43mm long or wide.
Preferably, the device stopper is precisely machined by laser.
Preferably, the device stopper can be used for processing a pin aligning hole so as to improve the aligning precision.
(5) The plate limiter is an aluminum alloy.
Preferably, 5 locking screws are distributed at four corners and the center of the bearing plate limiter.
Preferably, the bearing plate limiter can resist high temperature of more than 400 ℃ and can realize penetration of a magnetic field and rapid heat conduction.
Preferably, the thickness of the bearing plate limiter is 1mm.
Preferably, the carrier plate stopper is 43mm long or wide.
Preferably, the bearing plate limiter is formed by mechanical precision machining.
(6) The locking screw is made of a metal nonmagnetic material.
(7) The alignment pin is made of steel and is chamfered to the end, so that alignment is easy.
(8) The magnet limiter is concave inwards, is concave inwards in a square shape, and can be internally provided with a clamping position to clamp the embedded magnet.
Preferably, after the magnet limiter is inwards concave, the side width is 1mm.
Preferably, two sides of the magnet limiter are provided with 2 pin alignment holes in number.
Preferably, the magnet stopper can resist high temperature of more than 400 ℃, and can realize penetration of a magnetic field and rapid heat conduction.
Preferably, the magnet limiter is an aluminum alloy.
Preferably, the magnet limiter is made of permanent magnetic material.
Preferably, the thickness of the magnet stopper is 5mm.
Preferably, the magnet stopper is 43mm long or wide.
Preferably, the magnet limiter can be two parts of an up-and-down symmetrical structure, and the middle part of the magnet limiter is hollow and used for placing a high-temperature magnet.
(9) The high-temperature magnet is a permanent magnet.
Preferably, the high temperature magnet is cylindrical in shape.
Preferably, the high temperature magnet is a samarium cobalt magnet.
Preferably, the curie temperature of the high-temperature magnet is 600 ℃.
Preferably, the magnetic field strength of the high-temperature magnet is 100Gs.
Preferably, the radial distribution range of the high-temperature magnet is 15mm.
(10) The bearing plate pressing plate can resist the high temperature of more than 400 ℃, and can realize the penetration of a magnetic field and the rapid conduction of heat.
Preferably, the bearing plate clamp plate both sides, processing pin counterpoint hole, quantity is 2.
Preferably, the carrier plate pressure plate is made of an aluminum alloy material.
Preferably, the thickness of the bearing plate pressing plate is 2mm.
(11) The magnet is a permanent magnet.
Preferably, the magnet is a square neodymium iron boron magnet with the shape of 10 mm thick and the length and the width of the magnet are 150mm.
Preferably, the magnet has a curie temperature of 450 ℃.
Preferably, the magnetic field strength of the magnet is 100Gs.
In this embodiment, a device for multi-chip vacuum eutectic soldering is provided, where the device uses the attraction force generated by a high-temperature permanent magnet to a magnetic pillar to overcome the tension generated by melting solder in the soldering process, so as to achieve good soldering of chips and components. That is, the component with a small area is pressed by one magnetic column, and the chip, the component and the substrate with a large area are pressed by a plurality of magnetic columns. The area of the chip, the component and the substrate determines the number of the magnetic columns, and the number of the magnetic columns determines the magnitude of the pressure. When the high-temperature magnet is fixed, the pressure of the components with small area is adjusted by changing the length of the magnetic columns, the pressure of the chips, the components and the substrates with large area is adjusted by increasing or decreasing the number of the magnetic columns, and the optimal pressure value is matched by the two modes, so that ideal pressure application and accurate welding are realized.
As shown in fig. 2, a partial schematic diagram of a multi-chip vacuum soldering apparatus is provided, and according to the principle, a specific implementation process of the multi-chip vacuum eutectic soldering method of the present application is as follows:
s1: the device is provided with a bearing plate, a chip, a substrate, a capacitor and a required welding flux which are required for stacking and welding.
S2: the magnetic column baffle 1, the magnetic column 2, the magnetic column limiter 3, the device limiter 4 and the bearing plate limiter 5 are combined by a locking screw 6 to form a combined body 18, and the alignment precision is required to be less than 0.5 mm during combination.
S3: the magnet retainer 8 is arranged in the high-temperature magnet 9 to be combined and clamped to form a magnetic plate/magnetic plate combination 10.
S4: the chip pressing plate 17 is arranged in the assembly 18, the hollow leakage surface is arranged upwards, and the reverse arrangement does not damage the circuits in the chip.
S5: the chip 14, substrate 15, capacitor 16 components are mounted face down in the assembly 18.
S6: the solder 13 is loaded into the assembly 18 in position.
S7: the carrier plate 12 is positioned into the assembly 18.
S8: the bearing plate pressing plate 11 is installed into the assembly 18 by pin alignment.
S9: the bearing plate pressing plate 11 and the assembly 18 are pressed tightly, and the 10 is installed into the assembly 18 in a pin alignment mode.
S10: the assembled device is removed from the magnet 19 and placed in a vacuum furnace for heat welding (after being turned 180 degrees up and down, the device is placed in the vacuum furnace for heat welding, and the pressure is the superposition of magnetic attraction and magnetic column gravity).
S11: after the welding is completed, the device is removed and placed on the magnet 19.
S12: and (3) sequentially taking out the magnetic plate/magnetic plate assembly 10 and the bearing plate pressing plate 11, finally taking out the welded bearing plate 12, and finishing the first welding.
S13: and repeating S5-S12, and carrying out the welding operation of the next cycle.
The invention provides a device and a welding method for multi-chip vacuum eutectic welding. The pressure is adjusted by changing the length of the magnetic columns or increasing or decreasing the number of the magnetic columns. The secondary oxidation of the solder is prevented by vacuumizing, and the oxide is decomposed under low vacuum degree and reduced by formic acid atmosphere. By the process means, the vacuum eutectic operation of multiple chips and devices is simplified, and the operation convenience is improved.
From the result of use, the eutectic voidage is low, and efficiency promotion is obvious. A new realization path is found for the high-power bare chip and multi-chip vacuum eutectic technology, and the technical progress of the full eutectic process is promoted. The vacuum eutectic operation can be automated by matching with the automatic die bonder, the die placing machine and the manipulator.
The above are only preferred embodiments of the invention, and not intended to limit the scope of the invention, and all equivalent structures or equivalent flow transformations that may be applied to the present specification and drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the invention.
Claims (10)
1. A multi-chip vacuum eutectic soldering device, comprising:
a magnet substrate;
the bearing assembly is arranged on the magnet substrate and comprises a magnetic column baffle, a magnetic column limiter, a device limiter and a bearing plate limiter which are arranged in a laminated manner, wherein a magnetic column is arranged between the magnetic column baffle and the magnetic column limiter, the bearing plate limiter is provided with a welding cavity, and a chip welding part is placed in the welding cavity;
the magnet assembly comprises a magnet limiter, the magnet limiter is provided with a cavity, and a high-temperature magnet is arranged in the cavity;
the bearing plate pressing plate is arranged between the bearing assembly and the magnet assembly and covers the welding cavity;
and the bearing plate is arranged between the bearing assembly and the bearing plate pressing plate and corresponds to the welding cavity.
2. The multi-chip vacuum eutectic soldering device of claim 1, wherein the magnetic stud baffles are concave, and the magnetic studs are disposed in the concave spaces.
3. The multi-chip vacuum eutectic soldering device of claim 1, wherein the material of the magnetic pillars is a single material or an alloy of Fe, co, ni.
4. The multi-chip vacuum eutectic soldering device of claim 1, wherein the stud retainer is provided with a plurality of through holes.
5. The multi-chip vacuum eutectic soldering apparatus of claim 4, wherein the through holes are disposed at positions on the stud retainers, the studs are disposed at positions on the stud stops, and the positions of the solder cavities formed on the carrier plate retainers correspond to the positions of the solder cavities formed on the carrier plate retainers.
6. The multi-chip vacuum eutectic soldering device according to claim 1, wherein the stud retainer, the device retainer and the carrier plate retainer are provided with a plurality of locking screw holes and are connected and fixed by locking screws.
7. The multi-chip vacuum eutectic bonding apparatus of claim 1, wherein the carrier plate limiter is provided with alignment pins, and the magnet limiter and the carrier plate pressure plate are provided with corresponding alignment pin holes.
8. A multi-chip vacuum eutectic soldering method, for use in the multi-chip vacuum eutectic soldering apparatus of any one of claims 1 to 7, the method comprising:
s1: the chip welding part is arranged in a welding cavity formed in a bearing plate limiter;
s2: fixedly mounting the bearing plate pressing plate and the magnet assembly on the bearing assembly;
s3: the assembled and fixed device is removed from the magnet substrate and placed into a vacuum furnace for heating welding;
s4: after welding, taking down the device and placing the device on a magnet substrate;
s5: taking down the bearing plate pressing plate and the magnet assembly, and taking out a welded part after welding;
s6: and repeating S1-S5, and carrying out the welding operation of the next cycle.
9. The multi-chip vacuum eutectic soldering method of claim 8, wherein the solder part comprises solder, a chip, a substrate and a capacitor.
10. The multi-chip vacuum eutectic soldering method according to claim 9, wherein the step S1 specifically comprises:
s11: arranging a chip pressure plate in the welding cavity;
s12: the chip, the substrate and the capacitor are installed into a welding cavity in a face-down mode;
s13: loading solder into the solder cavity;
s14: the carrier plate is loaded into the weld cavity.
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