JP5104259B2 - Metal base plate cooling device - Google Patents

Description

  The present invention relates to a solder reflow apparatus (system) used in a power semiconductor module manufacturing process, and more particularly to a metal base plate cooling apparatus used in a cooling process after heating in soldering a metal base plate and an insulating substrate.

  Currently, in the field of power control such as motor drive and power conversion, power semiconductor devices (chips) that handle large amounts of power, such as IGBTs, MOSFETs, and diodes, are built in one package. Semiconductor modules are widely used.

  There are various packages for this power semiconductor module depending on its application and purpose, but those that handle a relatively large output capacity are provided with a conductor layer (pattern) such as copper on both sides of the ceramic substrate. A power semiconductor element such as an IGBT or a diode bonded to the front surface (upper surface) via solder, copper or aluminum bonded to the rear surface (lower surface) of the insulating substrate via solder, and the like. A metal base plate is provided (see, for example, Patent Document 1), and a plurality of lead electrode terminals electrically connected to the power semiconductor element on the insulating substrate and the insulating substrate including the power semiconductor element are surrounded. A protective resin case and a resin case configured to be filled with silicon gel or epoxy resin are used.

  In the power semiconductor module having such a configuration, in the manufacturing process, it is necessary to join the insulating substrate and the metal base plate with solder, and the solder reflow method is generally used. In this solder reflow method, cream solder (solder paste), which is placed between an insulating substrate and a metal base plate, is heated to form a liquid phase and then cooled at a predetermined rate using a cooling device. (Heat removal) solidifies (solidifies) the solder, and the insulating substrate and the metal base plate are soldered together.

  On the other hand, the conventional cooling device includes a cooling block portion that contacts the back surface of the metal base plate opposite to the insulating substrate mounting surface in the metal base plate of the power semiconductor module and absorbs heat. The entire surface of the base plate or a single region formed by surrounding a plurality of insulating substrates is formed so as to have only one flat surface so as to be cooled. (For example, see Patent Document 2)

  By adopting such a configuration, there is no difference in the configuration of the cooling block portion regardless of whether the insulating substrate mounted on the metal base plate is a single case or a plurality of cases. The use of the cooling block was made possible.

Japanese Patent Laying-Open No. 2006-202884 (FIG. 1) Japanese Patent Laying-Open No. 2005-72369 (FIG. 1)

  In the power semiconductor module, a large amount of heat is generated and released by the mounted power semiconductor element during the operation, but it is generated by adopting the structure as described above, a so-called high heat conduction structure. By quickly radiating heat, destruction of power semiconductor elements and deterioration of characteristics are avoided. However, it is known that the metal base plate adopted in the structure generally warps with a certain curvature due to warpage and distortion due to the residual stress in the processing process and the bimetal effect at the joint surface with the insulating substrate. It has been.

  On the other hand, in the conventional cooling device, as described above, the cooling block portion of the cooling device has a single cooling block so as to cool the entire back surface of the metal base plate of the power semiconductor module or the entire surface of a single region formed by surrounding a plurality of insulating substrates. It was formed so as to be in contact with one region of the metal base as having only two flat surfaces. And it is inevitable that partial gaps (partial non-contact) occur between the metal base plate and the cooling block due to the warp and distortion of the metal base plate described above. Since it depends on the state of warping of the metal base plate in the semiconductor module, it is not constant and causes individual differences (variation).

  For this reason, in power semiconductor modules with a high thermal conductivity structure, due to the occurrence of partial gaps in the solid difference, clogging occurs and there is no gap, and heat dissipation proceeds quickly from the point where the cooling block and metal base plate are in contact. On the contrary, as the gap becomes larger, the temperature does not decrease and the temperature gradient during cooling sometimes increases remarkably. In addition, since it is difficult to predict the temperature gradient distribution, the solder crystal grains are non-uniform in size, and the solder element strength deteriorates due to the agglomeration of impurity elements at the last solidified location. There was a problem of destabilization and reduced product reliability due to poor soldering. Furthermore, the unstable cooling rate at the time of solidifying the solder causes voids in the joint surface solder, leading to a problem of product quality degradation.

  The above-mentioned problems become more prominent as the insulating substrate or the metal base plate becomes larger, and in recent years, from the viewpoint of environmental measures, so-called lead-free solder that does not contain lead in its components. Although the use is indispensable, it has become prominent even when using lead-free solder having a characteristic that the temperature difference between the solid phase and the liquidus is large.

  The present invention has been made in order to solve the above-described problems, and is an influence caused by unstable cooling at the time of solder solidification in solder bonding between an insulating substrate and a metal base plate of a power semiconductor module having a high heat conduction structure. It is an object of the present invention to provide a metal base plate cooling device for achieving stable reliability in a product (power semiconductor module) by avoiding the above and realizing ideal solidification of solder.

  The metal base plate cooling device according to the present invention is a metal base plate cooling device in a solder reflow device system used for soldering a metal base plate and a plurality of insulating substrates in a power semiconductor module, the metal base plate It has a cooling block mechanism part provided with a cooling projection part in contact with the rear surface of the metal base plate so as to correspond to each arrangement of the plurality of insulating substrates on the surface.

  The present invention has a cooling block mechanism portion provided with a cooling protrusion that contacts the back surface of the metal base plate so as to correspond to each arrangement of the plurality of insulating substrates on the surface of the metal base plate. Unexpected partial gaps between the metal base plate and the cooling block due to warpage and strain can be suppressed, so the cooling rate of the soldering solder is stable, the size of the solder crystal grains is made uniform and uniform. be able to.

Embodiment 1 FIG.
A cooling block mechanism used in the metal base plate cooling apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. Fig.1 (a) is a top view of a cooling block mechanism part, FIG.1 (b) is a side view of the mechanism part. FIG. 2 is a schematic diagram showing a partial configuration of a schematic configuration example of the entire metal base plate cooling apparatus including at least a cooling medium circulation mechanism in addition to the cooling block mechanism.

  In FIG. 1, the cooling blocks 10 a to 10 d are held at predetermined positions on the cooling block fixing frames 25 a and b, and the cooling block fixing frames 25 a and 25 b are fixed at predetermined positions on the cooling block support base 28. Configured. In addition, in order to clarify the positional relationship between the cooling block mechanism 30 and the power semiconductor module (a metal base plate and a plurality of insulating substrates on the metal base plate) when the power semiconductor module is cooled in the drawing, A plate 201 and a plurality of insulating substrates 202 are shown (two-dot chain line). Although solder is omitted, it has the same area as the insulating substrate and exists between the metal base plate and the insulating substrate.

  The positional relationship between the cooling block 10 with respect to the cooling block fixing frame 25 and the cooling block fixing frame 25 with respect to the cooling block support base 28 is movable, and is adjusted and fixed by the position adjusting mechanism 26. By doing so, when the power semiconductor module is set in the cooling block mechanism section 30, each of the cooling blocks 10 can be accurately and correspondingly arranged at the position where the insulating substrate is placed on the metal base plate of the module. It is like that. Then, the upper surface of the cooling projection 1 of each of the cooling blocks 10a to 10d and the back surface 201 of the metal base plate of the power semiconductor module are in contact with each other at the position where the insulating substrate 202 is mounted. This heat can be quickly released to the cooling block 10.

  The position adjusting mechanism 26 includes a slit (a horizontally long hole in the drawing) provided in the cooling block fixing frame 25 and a screw that passes through the slit and can be fixed to the cooling block support base 28. The position of the cooling block fixing frame 25 relative to the cooling block support 28 is adjusted by tightening (screwing) the screws at a desired position. Similarly, the cooling block 10 includes a slit (a vertically long hole in the drawing) and a screw that passes through the slit and can be fixed to the cooling block fixing frame 25. The position of the block 10 is adjusted.

  With respect to positioning, the respective centers of the plurality of insulating substrates 202 mounted on the metal base plate 201 and the centers of the cooling protrusions (pressing contact) portions 1 of the respective cooling blocks 10 are substantially matched. Most preferred.

  The metal base plate cooling device 100 shown in FIG. 2 supplies and circulates a cooling medium controlled to a desired temperature (for example, about 10 ° C.) to the cooling block 10 in the cooling block mechanism 30 of FIG. A cooling medium circulator (generally also referred to as a “chiller”) 90 having a function of causing the cooling medium to flow between the cooling blocks 10a to 10c and the cooling medium circulator 90. Has been.

  FIG. 3 is an enlarged cross-sectional view of the cooling block 10 in FIG. The cooling block 10 shown in FIG. 3 assembles the cooling projection 1, the cooling projection guide 2, the cooling block housing 3, the elastic spring 4, the cooling medium introduction path forming section 6, and the cooling medium discharge path forming section 7. It is comprised by.

  The cooling block housing 3 is provided with a protruding (ridge) portion at a position facing the part of the outer periphery of the upper portion, and is fixed to the cooling block fixing frame 25 by the position adjusting mechanism 26. The cooling block 10 is assembled by mounting the cooling protrusion 1, the cooling protrusion guide 2, the spring 4, the cooling medium introduction path forming section 6, and the cooling medium discharge path forming section 7 on the cooling block housing 3. Done.

  A cooling medium circulation path (passage) in the cooling block 10 is formed by combining the cooling medium introduction path forming section 6 and the cooling medium discharge path forming section 7. In this example, the cooling medium introduction path forming portion 6 has a cylindrical passage that guides the cooling medium introduced into the cooling block 10 to a position immediately below the cooling protrusion 1 and forms a predetermined gap on the outer periphery thereof. Thus, the cooling medium is discharged out of the cooling block 10 by providing the cooling medium discharge path forming portion 7 with a cylindrical passage that covers the cover. Hereinafter, a configuration including the cooling medium introduction path forming unit 6 and the cooling medium discharge path forming unit 7 is referred to as a cooling medium circulation path forming unit 9.

  Further, the cooling medium introduction path forming section 6 and the cooling medium discharge path forming section 7 have a coupling portion with a heat insulating hose 95, and the cooling medium cooling block 10 is connected via the heat insulating hose 95 to be coupled. Is introduced and discharged.

  The cooling protrusion 1 adopts a structure that always contacts the cooling medium circulation path forming part 9 (cooling medium discharge path forming part 7 side), and heat conducted from the outside, that is, the metal base plate 201 to the cooling protrusion 1 is adopted. The coolant is absorbed by the coolant in the coolant circulation path forming unit 9. Therefore, the material of the cooling protrusion 1 is made of copper (k = 403 W / mK) having a high thermal conductivity, or aluminum having a relatively high thermal conductivity (k = 403 W / mK) without solder adhesion from the viewpoint of maintenance work. 236W / mK) is suitable.

  Moreover, the cooling protrusion 1 is provided with a spring 4 as an elastic member between the cooling block housing 3 and is moved up and down by its expansion and contraction. As a result, when the metal base plate 201 of the power semiconductor module is set on the cooling block mechanism unit 30, the cooling protrusion 1 is pressed against the metal base plate 201. The elastic force of the spring 4 may be determined in relation to the weight of the power semiconductor module or the relationship with the power semiconductor module clamping mechanism (not shown). For example, when the contact is made only by the weight of the power semiconductor module, It is desirable that the metal base plate 201 has a strength that does not come into contact with the cooling protrusion guide portion 2 within the range of variations in its own weight. This is because the cooling protrusions on the metal base plate 200 are changed by changing the characteristics of the spring 4. This means that the pressing force of the part 1 can be adjusted.

The cooling projection guide portion 2 serves as a guide for the cooling projection portion 1 that moves up and down by the expansion and contraction of the spring 4, and prevents a lateral displacement and a tilt associated therewith, and restricts the projection amount. In the present embodiment, the upper surface shape of the cooling protrusion 1 and the cooling protrusion guide 2 is circular, the diameter of the cooling protrusion 1 is smaller than that of the insulating substrate, and the outer diameter of the cooling protrusion guide 2 is insulated. The size is almost the same as the short side of the substrate.
In addition, since it is possible to change the shape and material of the cooling protrusion part 1 and the cooling protrusion guide part 2, according to the various structures in the insulated substrate 201, etc., it may meet specifications required, such as strength and thermal conductivity. It is also easy to select and optimize the cooling conditions.

  The heat insulating hose 95 is coupled to the cooling medium introduction path forming section 6 and the cooling medium discharge path forming section 7 in the cooling block 10. The heat insulating hose 95 is combined with another cooling block 10 or the cooling medium circulator 90 to form a cooling medium circulation system. For example, an inner diameter of about 8 mm is appropriate for thermal load fluctuations and flow path pressure loss, and as a cooling medium, ethylene glycol or oil can be used in addition to water.

  With respect to the connection of the heat insulating hose 95, the cooling medium from the cooling medium circulator 90 may be connected so as to return to the cooling medium circulator 90 again through the plurality of cooling blocks 10a to 10d in order. The cooling medium circulator 90 and the cooling blocks 10a to 10d may be individually connected, or the cooling accuracy and effects may be enhanced by using relay parts.

  In addition, it can replace with the method of circulating a cooling medium with the heat insulation hose 95, and can also implement | achieve using a heat pipe.

  Next, the cooling operation will be described. The power semiconductor module 200 (the metal base plate 201 and the insulating substrate 202) heated in the solder reflow apparatus is positioned (alignment) provided on the cooling block support 28 or the cooling block fixing frame 25 of the cooling block mechanism 30. (Not shown), each cooling block is set (fixed) so that the position of the insulating substrate on the metal base plate coincides, and the metal base plate 201 is moved by its own weight or a clamping mechanism (not shown). The cooling projections 1 are held in contact with each other.

  In order to reduce the partial gap with the cooling block of the cooling device due to the warp generated in the metal base plate and to make the contact good, it is necessary to reduce the cooling area area consisting of one flat surface in the cooling block. This is effective from the viewpoint of suppressing the adverse effect caused by the warp of the metal base plate, and the warp of the metal base plate has the largest amount of curvature change directly below the insulating substrate, and it is preferable to contact the cooling block with this portion. A uniform cooling state can be realized.

  In particular, the contact portion of the cooling block that is pressed against the metal base plate for cooling, that is, the cooling protrusion, is preferably included in each insulating substrate region in order to minimize the adverse effect of warpage. I understood it. And the area which the cooling projection part contacts is about 1/2 or less of the insulating substrate area.

  FIG. 4 shows the relationship with the assumed contact range of the cooling block (cooling protrusion) with respect to an example of the arrangement and size of the insulating substrate mounted on the metal base plate. FIG. FIG. 4B is based on the prior art. In the present embodiment, since a relatively narrow region centering on the portion where the insulating substrate is disposed is the assumed contact range Aa to Ad, generation of a gap can be substantially avoided, and the contact location is made constant. The temperature of the solder portion is made more uniform than the temperature of the metal base plate. On the other hand, in the conventional technology, since a relatively wide area (area formed by surrounding a plurality of insulating substrates) is assumed as the contact range B, it is difficult to avoid or reduce the generation of a partial gap, In addition, since the position where the gap is generated is not always constant, the contact location and state are supposed to change.

  According to the configuration of the cooling block mechanism unit based on the present embodiment, since the cooling rate of the bonding solder is stabilized, the size of the solder crystal grains can be made uniform and uniform, and the product reliability guarantee period (Holding period) can be extended. In addition, the solder temperature distribution during solidification becomes uniform, and the generation of voids in the joining surface solder can be suppressed. Furthermore, stable product manufacturing is possible, productivity is improved, and throughput and yield can be improved.

  In addition, according to the present embodiment, since the independent cooling protrusion 1 is pressed along the warp and distortion of the metal base plate 201, the influence of the warp of the metal base plate 201 can be reduced, and the above-described effects can be achieved. Can increase.

  Furthermore, according to the present embodiment, since the independent cooling blocks 10a to 10d are movable, the metal base plate 201 of different sizes (the arrangement of the insulating substrate 202 changes) and the insulating substrate on the metal base plate 201 are used. Even if the positions of 202 are different, the alignment mechanism (not shown) is used as a reference, and the alignment of the cooling block under each insulating substrate can be handled as a simple rearrangement. Can reduce the workload of changeover during production and production, and can reduce costs.

  As described above, according to the present invention, as compared with the cooling due to the entire metal base plate contact, the contact area is reduced, so that the metal base plate itself is less susceptible to the deterioration of the adhesion (contact) property due to the residual warp and distortion of the metal base plate itself. Furthermore, the improved adhesion improves the temperature distribution (difference between max and min values) of the metal base plate as well as the insulating substrate mounting part during cooling, thus reducing thermal warpage of the metal base plate. Thus, the occurrence of a partial gap between the metal base plate and the cooling block (cooling protrusion) can be dramatically suppressed.

(Modification of Embodiment 1).
Subsequently, a modified example in the first embodiment will be described. FIG. 5 is an enlarged sectional view showing a modification of the cooling block 10 in FIG. In FIG. 5, the cooling block 20 includes a cooling protrusion (pressing contact) portion 11, a cooling protrusion guide portion 12, a cooling block housing 13, a metal bellows (elastic metal cylinder) 15 that is an elastic body, a cooling medium introduction path forming portion 16, The cooling medium discharge path forming part 17 is assembled. In the figure, the same reference numerals are used for the same components as those in the first embodiment.

  The cooling block housing 13 has a protruding portion at a position facing the part of the outer periphery of the upper portion, and is fixed to the cooling block fixing frame 25. In addition, the cooling block 20 is assembled such that the cooling protrusion 11, the cooling protrusion guide part 12, the metal bellows 15, the cooling medium introduction path forming part 16, and the cooling medium discharge path forming part 17 are mounted on the cooling block housing 13. Has been done.

  By combining the metal bellows 13, the cooling medium introduction path forming part 16 and the cooling medium discharge path forming part 17, a cooling medium circulation path in the cooling block 20 is formed. Hereinafter, a configuration including the metal bellows 15, the cooling medium introduction path forming unit 16, and the cooling medium discharge path forming unit 17 is referred to as a cooling medium circulation path forming unit 19. Further, the cooling medium introduction path forming section 16 and the cooling medium discharge path forming section 17 have a coupling portion with the heat insulating hose 95, and the cooling medium cooling block 20 is connected via the heat insulating hose 95 to be coupled. Is introduced and discharged.

  The cooling protrusion 11 adopts a structure in which the cooling protrusion 11 is always in contact with or fixed to the cooling medium circulation path forming part 19 (the metal bellows 15 side), and the cooling protrusion 11 heats the cooling medium in the cooling medium circulation path forming part 19. It is comprised so that it may be absorbed. Therefore, the material of the cooling protrusion 11 is suitably copper having a high thermal conductivity, aluminum having a relatively high thermal conductivity and no solder adhesion from the viewpoint of maintenance work. Moreover, as a material of the metal bellows 15 used in the present embodiment, SUS, Inconel (registered trademark), Hastelloy (registered trademark), and the like are conceivable, and among them, Inconel is most suitable because of corrosion resistance, material strength and high pressure resistance. .

  The cooling projection 11 is brought into contact with (adhered to) the tip of the metal bellows 15 having elasticity, and is moved up and down in the same manner as the spring 4 of the first embodiment by the expansion and contraction of the metal bellows 15. .

  Therefore, according to the present embodiment, the cooling protrusion 11 configured to contact (adhere) to the metal bellows 15 is capable of self-expanding and self-warping, so that the metal base plate 201 can be warped. This further increases the effect of warping of the metal base plate 201. The size of the metal bellows 13 in the present embodiment was about Φ20 to 30 mm in diameter, and the warpage of the metal base plate 201 was good.

Embodiment 2. FIG.
In the first embodiment, the cooling protrusion (pressing contact) portion is provided and pressed against the metal base plate using the elastic force of the spring or the metal bellows. However, the short side length is relatively small, for example. For a metal base plate on which an insulating substrate having a size of 25 mm or less is mounted, the spring or the metal bellows in the cooling block may be omitted.

  Fig.6 (a) is a top view of a cooling block mechanism part, FIG.6 (b) is a side view of the mechanism part. FIG. 7 is an enlarged cross-sectional view of the cooling block 40 in FIG. In FIG. 7, the cooling block 40 has a cooling projection 31 on the upper surface portion thereof, a cooling block housing 33 provided with a cooling medium discharge path formed so as to correspond to the cooling projection 31, and a cooling medium introduction It is configured by assembling the path forming part 36. Therefore, the assembly of the cooling block 40 is almost completed simply by mounting the cooling medium introduction path forming portion 36 to the cooling block housing 33, and the cooling block housing 33 and the cooling medium introduction path forming portion 36 are combined to cool the cooling block 40. A cooling medium circulation path in the block 40 is formed. Further, the cooling medium introduction path forming section 36 and the cooling block housing 33 have a coupling portion with the heat insulating hose 95, and the cooling medium is introduced into the cooling block 40 via the heat insulating hose 95 to be coupled. Emission is performed. In the figure, the same reference numerals are used for the same components as those in the first embodiment.

  According to the configuration of the cooling block mechanism unit 40 based on this embodiment, since the cooling rate of the joining solder is stabilized as in the first embodiment when the insulating substrate is relatively small, the solder The crystal grains can be made uniform in size, and the product reliability guarantee period (holding period) can be extended. In addition, the solder temperature distribution during solidification becomes uniform, and the generation of voids in the joining surface solder can be suppressed. Furthermore, stable product manufacturing is possible, productivity is improved, and throughput and yield can be improved.

  On the other hand, by omitting the configuration of the spring 4 or the metal bellows 15 in the first embodiment, it is possible to reduce the number of components, and the cooling medium discharge path forming portion is previously formed in the cooling block housing. By doing so, the main components can be greatly reduced (from 6 to 2), the apparatus can be realized at low cost, and the time and cost spent for maintenance can be reduced.

Embodiment 3 FIG.
In the first and second embodiments, the arrangement of a plurality of cooling blocks can be changed by preparing a plurality of cooling blocks divided as a cooling block mechanism section, in addition to the cooling block fixing frame 25 and the cooling block support base 28. However, the position of the cooling protrusion may be fixed in advance by integrating the cooling block.
In FIG. 8, the cooling block mechanism unit 70 is formed as one cooling block, and cooling protrusions 71 a to 71 d are formed on the upper surface corresponding to the positions of the plurality of insulating substrates 202 mounted on the metal base plate 201. Yes.

  Also in the present embodiment, as in the first embodiment, the partial gap with the cooling protrusion of the cooling block of the cooling device accompanying the warp generated in the metal base plate 201 is reduced, and the contact is improved. Is effective from the viewpoint of suppressing the adverse effect of the warp of the metal base plate to reduce the area of the cooling area consisting of one flat surface in the cooling projection of the cooling block, and the warp of the metal base plate is an insulating substrate The amount of change in curvature at the bottom is the largest, and it is preferable to bring the cooling block into contact with this portion, whereby a uniform cooling state can be realized.

And according to the structure of the cooling block mechanism part 70 based on such this Embodiment, since the cooling rate of joining solder is stabilized, the size of a solder crystal grain can be equalized (made uniform), and product reliability Sexual guarantee period (retention period) can be extended. In addition, the solder temperature distribution during solidification becomes uniform, and the generation of voids in the joining surface solder can be suppressed. Furthermore, stable product manufacturing is possible, productivity is improved, and throughput and yield can be improved.
Since the position of the cooling projection 71 is fixed, it is difficult to share between different power semiconductor modules such as the arrangement of the insulating substrate 202 as in the first or second embodiment, but the configuration is simple. Therefore, since the cooling block itself can be manufactured at low cost and has excellent durability, when the same power semiconductor module is produced and processed in excess of a certain quantity, an effect such as cost reduction can be obtained.

  In the first or second embodiment, one cooling projection is provided in one cooling block. However, a plurality of projections may be provided in one cooling block. This is particularly effective when the distance between the substrates is in a fixed relationship. Further, the shape of the cooling protrusion is not limited to a circle, but may be further optimized by adopting a rectangle or other shapes according to the shape of the insulating substrate.

  In the third embodiment, a metal bellows may be arranged at the tip of the cooling projection 71 of the cooling block or so as to replace the cooling projection 71, whereby not only the same effect can be obtained but also the metal A better contact state can be expected due to the elastic force of the bellows.

  In Embodiments 1 to 3, it goes without saying that the thermal contact with the metal base plate is further improved if a heat conductive soft pad is arranged at the tip of the cooling projection.

It is the top view (a) and side view (b) of the cooling block mechanism part which concern on Embodiment 1 of this invention. It is the schematic which shows the whole structure of a metal base plate cooling device. It is an expanded sectional view of the cooling block which concerns on Embodiment 1 of this invention. It is the top view which compared the contact assumption range of a metal base board and a cooling block (cooling protrusion part) in this invention (a) and prior art (b). It is an expanded sectional view of the cooling block which concerns on Embodiment 1 modification of this invention. It is the top view (a) and side view (b) of the cooling block mechanism part which concern on Embodiment 2 of this invention. It is an expanded sectional view of the cooling block which concerns on Embodiment 2 of this invention. It is the top view (a) and side view (b) of the cooling block mechanism part which concern on Embodiment 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling protrusion part 2 Cooling protrusion guide part 3 Cooling block housing | casing 4 Spring 6 Cooling medium introduction path formation part 7 Cooling medium discharge path formation part 10 Cooling block 25 Cooling block fixed frame 28 Cooling block support base 30 Cooling block mechanism part 90 Cooling medium Circulator (chiller)
95 Insulating hose 100 Metal base plate cooling device

Claims (7)

A metal base plate cooling device in a solder reflow system used for soldering a metal base plate and a plurality of insulating substrates in a power semiconductor module, wherein each of the plurality of insulating substrates is arranged on the surface of the metal base plate. Correspondingly, a metal base plate cooling apparatus comprising a cooling block mechanism portion provided with a cooling protrusion that contacts the back surface of the metal base plate. The cooling block mechanism has a cooling medium circulation path therein, and further, a cooling medium circulator that sends the cooling medium to the cooling block mechanism, and heat insulation that connects the cooling medium circulator and the cooling block mechanism. The metal base plate cooling device according to claim 1, further comprising a hose. The cooling block mechanism portion is constituted by a plurality of cooling blocks each having the cooling protrusion, and each cooling block can independently contact the cooling protrusion with a metal base plate. 3. The metal base plate cooling device according to 1 or 2 . Wherein each cooling block, the metal base plate cooling apparatus according to claim 3, characterized in that it includes a position preparation mechanism in the cooling block mechanism so that it can correspond to the arrangement of the insulating substrate in the metal base plate table surface .
The metal base plate cooling device according to any one of claims 1 to 4, wherein the cooling protrusion is movable up and down independently. 6. The metal base plate cooling device according to claim 5, wherein at least a part of the cooling protrusion is made of a metal bellows. The metal base plate cooling device according to any one of claims 1 to 6, wherein an area of the cooling protrusion is smaller than an area of the insulating substrate.

Images