JP3113400B2 - Electronic circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a highly integrated semiconductor chip by high-density fine connection.

[0002]

2. Description of the Related Art In order to increase the speed of an electronic computer, it is necessary to reduce the wiring length of a semiconductor integrated circuit used for calculation and storage. For this reason, the degree of integration of semiconductor integrated circuits is increasing. With the increase in the degree of integration of the semiconductor integrated circuit, the number of input / output terminals from the semiconductor integrated circuit to the wiring board has increased, and the connection portion has been steadily miniaturized. For this reason, there are problems such as a decrease in strength of the connection portion and a shortened life.

On the other hand, there has been proposed a technique for cooling a semiconductor chip to reduce stress / strain applied to a connection portion between the chip and the wiring board and other connection portions and to improve reliability of the connection portion. I have. For example, JP-A-2
According to JP-A-7456, as shown in FIG. 7, cooling water is circulated inside a bellows 15 having a bellows structure,
A structure that cools the semiconductor chip 2 by contacting the semiconductor chip 2 is disclosed. In addition, for example, in Japanese Patent Application Laid-Open No. 1-125962, a structure in which cooling water is brought into contact with cooling water via a diaphragm 16 having a structure for absorbing stress as shown in FIG. Japanese Unexamined Patent Publication No. Hei 3-283451 discloses a structure in which the semiconductor chip 2 is cooled by bringing the semiconductor chip 2 into contact with a cooling member via solder, as shown in FIG.

In addition, due to the high integration of electronic circuits, the heat generation density in the integrated circuits is increased, and the structure is deformed due to a change in the internal temperature of the circuit during the mounting process and the actual operation and a thermal expansion from the three-dimensional temperature distribution. The impact of has become a serious problem. Further, improvement of cooling performance is also an important issue in order to cope with changes in internal temperature, uniform temperature distribution, and an increase in heat generation density.

In view of this, a conventional type in which the heat dissipating area is increased by means of the comb teeth 19 as shown in FIG. 10 to forcibly air-cool, a type in which water is cooled by contact with the water cooling system and the comb teeth 20 as shown in FIG. The liquid immersion type, in which the chip is directly immersed and cooled, or the indirect water-cooled type, in which the chip is fixed to the module cap with a brazing filler metal or solder and cooled close to the water-cooled jacket as described in the above-mentioned publication, is used to improve cooling performance. Technology is being developed. These techniques are disclosed in Japanese Patent Laid-Open No. 2-83.
No. 957.

[0006]

However, in the above-mentioned prior art, it is not compatible with obtaining sufficient heat radiation characteristics and good workability and assemblability of a semiconductor module structure including a cooling system. There was a problem.

Further, in any of the semiconductor module structures described in the prior art, when the structure is thermally deformed during a mounting process, a connection failure may occur.
In addition, the connection portion may be broken due to the cycle of the transient temperature distribution due to repetition of ON / OFF in the actual operation. These are considered to be problems caused by the structure of the conventional structure. Since such problems reduce the reliability of connection of the semiconductor module, development of a structure for improving these is desired.

The problems of the prior art will be specifically described. The above-mentioned bellows and diaphragm structure have good cooling performance,
When replacing a defective chip, the water cooling system must be removed, and the repairability is poor. Since the water-cooling system has a large number of components, the number of components that must be removed when replacing a defective chip increases, and variations in processing accuracy and assembly accuracy greatly affect the life of the connection portion. In addition, a bellows or diaphragm structure must be provided with a spring structure in order not to apply stress to the chip. Therefore, a space for the spring structure is required, and there is a limit to miniaturization of the entire module structure.

Next, the comb tooth heat conduction structure has an advantage that the displacement within the range of the meshing engagement of the comb teeth can be tolerated. Therefore, the workability, assemblability and repairability are better than other structures. Since the contact thermal resistance of the tooth structure is large, there is a limit to the reduction of the thermal resistance. Therefore, the cooling performance cannot be improved with respect to the increase in the chip heat generation density. There is also a problem that the module height is increased in order to secure a comb tooth space.

In addition, the solder fixing structure has advantages such as a simple structure and good repairability, and the cooling performance can be greatly improved because the chip can be brought close to the cooling system, and further, the module can be significantly reduced in size. There are many, but it is difficult to deal with the warpage of the substrate. That is, most substrates have warpage, but when the substrate is warped, the chip is also tilted. In that case, the distance between the chip and the cooling system differs depending on the degree of warpage of the substrate. Therefore, the amount of solder to be filled between the chip and the cooling system varies depending on the part of the substrate. If these variations were individually dealt with, manufacturing efficiency would be extremely reduced. But,
The solder fixing structure is a structure in which the stress at the junction between the chip and the cooling system is absorbed by the solder. Therefore, if the amount of solder is not adjusted, the stress applied to the chip at the junction between the chip and the solder increases.

[0011] It is an object of the present invention to facilitate the replacement of electronic circuit components, to be small in size, to have high cooling performance,
Another object of the present invention is to provide an electronic circuit device that does not apply stress to electronic circuit components even when the substrate is warped, and a high-performance electronic computer including the electronic circuit device as an operation / memory element.

[0012]

According to the present invention, there is provided a substrate, an electronic circuit component, a connecting means for electrically connecting the substrate and the electronic circuit component, and an electronic circuit. An electronic circuit device comprising: a cooling unit that cools a component; and a connecting unit that contacts both the cooling unit and the electronic circuit component to thermally connect the cooling unit and the electronic circuit component. The connection means includes a plate-shaped member having a through-hole, and a filling member filling the through-hole, wherein the plate-shaped member is configured to contact an opening of the through-hole with the electronic circuit component. And a side in contact with the cooling means, wherein the filling member at least partially contacts the electronic circuit component and closes an opening of the through hole on the electronic circuit component side. An electronic circuit device is provided.

[0013]

According to the present invention, the electronic circuit component is disposed on the substrate, and is further electrically connected to the substrate by connection means. The connection means conducts heat of the electronic circuit component to the cooling means by contacting both the electronic circuit component and the cooling means, thereby cooling the electronic circuit component.

[0014] The connecting means includes a plate-like member having a through hole,
A filling member for filling the through hole. The plate-shaped member has an opening of the through hole on the side that contacts the electronic circuit component and on the side that contacts the cooling means. The filling member is
At least a part thereof contacts the electronic circuit component and closes the opening of the through hole on the electronic circuit component side.

When the board is warped, the positional relationship between the plate-like member and the electronic circuit component is determined by the warpage of the board.
In the present invention, the variation can be tolerated with the same amount of the filling member. That is, due to the warpage of the substrate, the plate member and the electronic circuit component are
When the distance is large, the gap between the plate-shaped member and the electronic circuit component is large, and the gap is filled by the filling member. Therefore, the amount of the filling member filling the inside of the through hole is reduced. When the plate-shaped member and the electronic circuit component are close to each other, the gap between the plate-shaped member and the electronic circuit component is small, and the amount of the filling member filling the inside of the through hole increases. In either case, the filling member closes the opening of the through hole on the electronic circuit component side. This is a technique made possible because the plate-like member has a through hole penetrating from the electronic component side to the cooling means side.

Further, since the electronic circuit device of the present invention has a simple structure, the electronic circuit components can be easily replaced. Further, since the electronic circuit component is directly connected to the cooling means by the filling member and the plate member, the cooling efficiency is high.

As described above, in the electronic circuit device of the present invention, by using the through-hole in the plate-like member and the filling member for directly connecting the plate-like member and the electronic circuit component by filling the through-hole, Provided is an electronic circuit device that does not apply stress to electronic circuit components even when the substrate is warped.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic circuit device according to one embodiment of the present invention will be described below with reference to FIGS.

First, the mounting structure of the electronic circuit device according to the first embodiment of the present invention will be described with reference to FIG. The electronic circuit device according to the present embodiment includes an insulating multilayer substrate 1 having signal pins 9 on the back surface.
And a plurality of (only one is shown in FIG. 1) semiconductor chips 2 on the insulating multilayer substrate 1. The semiconductor chip 2 and the insulating multilayer substrate 1 are connected by solder bumps 8. The electronic circuit device also includes a cooling jacket 4 for cooling the semiconductor chip, and a top plate 3, a filling member 5, and a heat transfer plate 6 for thermally connecting the semiconductor chip 2 to the cooling jacket 4. ing. The top plate 3, the filling member 5, and the heat transfer plate 6 are in contact with the cooling jacket 4 via the heat conductive grease 11. The top plate and the filling member 5 are
It is also in contact with the semiconductor chip 2. The top plate 3 is supported by a frame 7 arranged at an end of the substrate 8. Substrate 1 and frame 7, frame 7 and top plate 1
Numerals 0 are connected by a brazing material 10, respectively. The cooling jacket 4 has a cooling pipe 4a for circulating cooling water therein.
have.

The top plate 3 is made of ceramic.
The top plate 3 has a through hole penetrating from the semiconductor chip 2 side to the cooling jacket 4 side. The through hole is provided at a mounting position of the semiconductor chip 2. The size of the opening of the through hole on the semiconductor chip 2 side is slightly smaller than the size of the semiconductor chip 2. The top plate 3 is arranged such that the upper surface of the semiconductor chip 2 and the lower surface of the top plate 3 are substantially in the same plane.

In this through hole, a filling member 5 made of low melting point metal (for example, In48Sn (melting point: about 120 ° C.), Bi56.3Pb
(Melting point: about 125 ° C)). The melting point of the material forming the filling member 5 is lower than the melting point of the solder forming the solder bumps 8. A heat transfer plate 6 made of a highly heat conductive metal such as Cu is placed on the opening on the cooling jacket 4 side. At least a part of the filling member 5 contacts the electronic circuit component, and closes an opening of the through hole on the electronic circuit component side.

Furthermore, the heat transfer path is expanded by providing a step by expanding the through hole on the cooling jacket 4 side. The heat transfer metal thin plate 6 is also provided with a step corresponding to the shape of the projecting portion 3a of the step on the top plate side. This overhang 3a
It has a role as a reinforcing material for increasing the rigidity of the top plate 3. Further, when the processing accuracy and the assembling accuracy of the insulating substrate 1 and the top plate 3 are poor, the overhanging portion supports the heat transfer plate 6 at the time of fastening the cooling jacket 4, so that excessive pressure is applied to the solder bumps 8. It also serves as a spacer to prevent the addition.

Here, in this embodiment, as shown in FIG. 1, the lower surface of the heat transfer plate 6 has a curvature. In the case of having such a curvature, the filling member 5 spreads from the center side of the heat transfer plate 6, so that a void is hardly formed on the connection surface. In addition, since the thickness of the filling member becomes smaller toward the center of the chip, the structure has a smaller thermal resistance, and there is an advantage that the temperature distribution of the entire module is made uniform.

A procedure for assembling the electronic circuit device according to the present embodiment will be described. First, the semiconductor chip 2 is connected to the substrate 1 by the solder bump 8. Next, on the substrate 1,
The frame 7 is attached with the brazing material 10. Then, the top plate 3 is mounted on the frame 7. At this time, the semiconductor chip 2 is arranged such that the lower surface of the top plate 3 and the upper surface of the semiconductor chip 2 coincide with each other, and the height of the top plate 3 does not apply pressure to the semiconductor chip 2.

From the through hole of the top plate 3 onto the semiconductor chip 2,
A lump of low melting point metal for forming the filling member 5 is placed.
Next, the low melting point metal is heated and melted to completely fill the gap between the semiconductor chip 2 and the top plate 3 and the opening of the through hole on the semiconductor chip 2 side. Further, the heat transfer plate 6 is placed in the opening of the through hole on the cooling jacket side in a state where the low melting point metal is melted. At this time, the heat transfer plate 6 is brought into contact with the molten low melting point metal. When the low melting point metal overflows from the upper surface of the top plate 3, it is removed by suction. Next, the low melting point metal is cooled and solidified to form the filling member 5. On the top plate 3 and the heat transfer plate 6, heat conductive grease 11 is applied,
Complete with a water-cooled jacket.

Next, a procedure for replacing the semiconductor chip 2 at the time of repairing the electronic circuit device of the present embodiment will be described. First, the water cooling jacket 4 is removed. Then, the filling member 5 is heated to melt the low melting point metal that forms the filling member 5. In this state, the heat transfer plate 6 is removed, and the molten low melting point metal is sucked. Next, remove the top plate 3,
Replace the semiconductor chip.

As described above, in the electronic circuit device of the present embodiment, the semiconductor chip 2 is in contact with the cooling jacket 4 via the heat conductive grease 11, the heat transfer plate 6, and the filling member 5. Thermal conductive grease 11, heat transfer plate 6, and filling member 5
Since the semiconductor chip 2 has good thermal conductivity, the semiconductor chip 2 can be effectively cooled. In addition, even when the substrate is warped, the filling member 5 fills the gap between the semiconductor chip 2 and the top plate 3 and allows the warpage of the substrate without applying stress to the semiconductor chip 2. .

Further, as described above, since the electronic circuit device of the present embodiment has a small number of components, the semiconductor chip 2 can be easily replaced at the time of repair.

Further, since the step is provided inside the through hole, there is an advantage that the contact area between the top plate 3 and the filling member 5 is large and the joining strength between the top plate and the filling member is large.

The semiconductor chip 2 is made of a low melting metal.
Since the temperature difference between the melting point and the room temperature is small because of the connection between the top plate 3 and the top plate 3, the deformation of the member due to the thermal expansion and thermal contraction of the structural member during the heating and cooling process at the time of connection is small, so that the solder bump Hardly give any extra stress or strain to the steel.

A second embodiment of the present invention will be described with reference to FIG.

The present embodiment is an example in which the size of the opening of the through hole in the embodiment of FIG. 1 is substantially equal to or slightly larger than the size of the semiconductor chip 2. In this case, even when the insulating multilayer wiring board 1 and the top plate or the cap 3 are warped and the upper surface of the semiconductor chip 2 is positioned above the lower surface of the top plate 3, the semiconductor chip 2 is inserted into the through hole. , The upper surface of the semiconductor chip 2 does not contact the top plate. Therefore, the top surface of the semiconductor chip 2 and the top plate 3 can be connected without applying extra pressure to the solder bumps 8.

A third embodiment of the present invention will be described with reference to FIG.

This embodiment is an embodiment in which no step is provided in the through hole. The size of the opening of the through hole is substantially equal to the size of the semiconductor chip 2 as in the second embodiment.
Slightly larger. Because there is no step in the through hole,
The processing of the top plate 3 is simple and can flexibly cope with the warpage of the insulated wiring board 1 as in the embodiment of FIG.

Further, in this embodiment, when replacing the semiconductor chip 2 at the time of repair, the filling member 5 and the heat transfer plate 6 are replaced.
After removing the semiconductor chip 2, it is also possible to replace the semiconductor chip 2 from the through hole without removing the top plate 3. In this case, the number of replacement steps can be reduced, so that the repair efficiency can be increased.

A fourth embodiment of the present invention will be described with reference to FIG.

In this embodiment, the size of the through hole of the top plate 3 on the side of the semiconductor chip 2 is made equal to or larger than that of the semiconductor chip 2 and the size of the opening on the side of the cooling jacket 4 is reduced. Is provided. Although the cooling path is narrowed by this step, there is an advantage that the rigidity of the top plate 3 is increased.

A fifth embodiment of the present invention will be described with reference to FIG.

In the embodiment shown in FIG. 5, members constituting the top plate 3 at the outer peripheral portion and the inner portion are changed. The outer peripheral portion was formed of a thick plate frame, and the inner portion was formed of a workpiece 12 of an intermediate thin metal plate.
The workpiece 12 made of an intermediate thin metal plate has a through-hole in the mounting part of the semiconductor chip 2. With this configuration, the rigidity of the mounting portion of the semiconductor chip 2 can be reduced while the rigidity of the top plate 3 as a whole is kept high, and the stress on the solder bumps can be reduced.

A sixth embodiment of the present invention will be described with reference to FIG.

In the electronic circuit device 3 of the present embodiment, O-rings 14a and 14b are arranged between the top plate 3 and the frame 7, and between the frame 7 and the insulating multilayer wiring board 1, respectively. Also, between the top plate 3 and the semiconductor chip 2,
An O-ring 14c is arranged. O-rings 14a, 14
b and 14c are for hermetic sealing and for preventing the filling member 5 from leaking. An exhaust pipe 13 was arranged on the frame 7.

In this case, before the filling member 5 is filled, the gas inside the airtight space formed by the top plate 3 and the substrate 1 is exhausted from the exhaust pipe 13 in a high-temperature atmosphere. If the processing accuracy of the inner surface of the member constituting this space is poor, that is, if the processing accuracy of the top plate 3 is poor, or if the multilayer substrate 1 is severely undulated, exhaust is not sufficiently performed. Accuracy can be detected at the same time. Further, there is an advantage that a substantially constant load can be applied to all the solder bumps 8. In addition, the structure is such that hermetic sealing can be performed by injecting and sealing an inert gas from the exhaust pipe 13 after sealing.

In the first to sixth embodiments described above, the top plate 3 and the frame 7 supporting the top plate 3 may be formed as a cap-shaped member having an integral structure.
Further, even when the semiconductor chip 2 is replaced with a chip carrier or other electronic circuit components, any configuration is possible.

The effects of the above-described six embodiments are summarized as follows.

(1) The semiconductor chip 2 and the top plate 3 are structurally separated during the mounting process, and the stress generated at each joint is reduced.
Distortion can be reduced.

(2) The low melting point metal constituting the filling member 5 has low rigidity at the same time, thereby absorbing deformation due to internal temperature change and temperature distribution during actual operation, and causing stress and strain generated at other joints. Can be reduced.

(3) The top plate 3 can be connected to the cooling jacket 4 via the heat conductive grease 11, and the heat radiating path can be specified. In addition, since the semiconductor chip 2 can be brought closer to the cooling system, the thermal resistance decreases, and the cooling performance can be improved, so that the temperature distribution and temperature rise in the electronic circuit device are reduced, and the thermal deformation of the entire electronic circuit device is reduced.

(4) In a state where the low melting point metal constituting the filling member 5 in the through-hole is melted, the upper surface of the top plate 3 and the upper surface of the heat transfer plate 6 are simultaneously cooled while being pressed by a flat plate, thereby cooling the multilayer substrate 1. And the upper surface of the electronic circuit device can be flattened.

(5) Since the surface of the heat transfer plate 6 on the side of the semiconductor chip 2 has a curvature and a convex shape, the low melting point metal constituting the filling member spreads from the center and spreads, thereby causing connection defects such as voids. Can be greatly reduced.

(6) Due to the curvature of the heat transfer plate 6, the thermal resistance of the filling member 5 becomes minimum at the center of the chip 2, and the temperature distribution generated in the chip 2 due to the heat generated by the chip 2 is reduced. Therefore, thermal stress and strain generated in the solder bumps 8 due to thermal deformation of the chip 2 are reduced.

(7) In the replacement of the defective chip 2, the low melting point metal constituting the filling member 5 is first melted and sucked, and after the chip 2 and the top plate 3 are completely separated, repair is performed. it can.

In this embodiment, the heat transfer plate 6 has a curvature. However, the heat transfer plate 6 does not necessarily have to have a curvature, and a simple flat plate or a stepped flat plate may be formed by selecting a shape suitable for the required performance. good.

[0053]

As described above, according to the present invention, the electronic circuit device can be easily replaced, and is a small electronic circuit device having high cooling performance.
An electronic circuit device that does not apply stress to electronic circuit components even when the substrate is warped can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the structure of an electronic circuit device according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing the structure of an electronic circuit device according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing the structure of an electronic circuit device according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing the structure of an electronic circuit device according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing the structure of an electronic circuit device according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view showing the structure of an electronic circuit device according to a sixth embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a structure of an electronic circuit device using a bellows structure for a cooling unit in the related art.

FIG. 8 is a cross-sectional view showing the structure of an electronic circuit device using a diaphragm on the upper surface of a module according to a conventional technique.

FIG. 9 is a cross-sectional view showing a structure of an electronic circuit device in which the upper surface of a module and the back surface of an LSI are fixed by soldering in a conventional technique.

FIG. 10 is a cross-sectional view showing a structure of an electronic circuit device using a comb tooth according to a conventional technique.

FIG. 11 is a cross-sectional view showing a structure of an electronic circuit device using a comb tooth according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulated multilayer wiring board, 2 ... Chip, 3 ... Top plate, 4 ... Cooling jacket, 5 ... Low melting point metal, 6 ... Heat transfer plate, 7 ... Module frame, 8 ... Solder bump, 9 ... I / O pin,
DESCRIPTION OF SYMBOLS 10 ... Brazing filler metal, 11 ... Thermal conductive grease, 12 ... Intermediate metal thin plate, 13 ... Exhaust pipe, 14 ... O-ring, 15 ... Bellows, 16 ... Diaphragm, 17 ... Solder for chip back surface fixing, 18 ... Support Ring, 19 ... heat radiation fin, 20 ...
Comb teeth.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kiyoshi Matsui 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd. Production Research Laboratory (72) Inventor Masahide Harada 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. Production Technology Laboratory (72) Inventor Toshitada Nezu 1 Horiyamashita, Hadano-shi, Kanagawa Prefecture Hitachi, Ltd. Kanagawa Plant (72) Inventor Mitsuru Shirai 1-Horiyamashita, Hadano-shi, Kanagawa Hitachi, Ltd. (56) References JP-A-5-102354 (JP, A) JP-A-3-113837 (JP, U) Patent 2821229 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , (DB name) H01L 23/36 H01L 23/473

Claims (10)

(57) [Claims] An electronic circuit component disposed on the substrate; cooling means for cooling the electronic circuit component; and cooling means for contacting both the cooling means and the electronic circuit component. And a connecting means for thermally connecting the electronic circuit component and the electronic circuit component, wherein the connecting device is disposed between the electronic circuit component and the cooling unit, and has a through hole at an upper portion of the electronic circuit component. a plate-like member, a heat transfer plate disposed in the through-hole, before
And a solidified filling member that fills the space in the through hole.
Only , the heat transfer plate has a surface facing the electronic circuit component,
The filling member has a convex shape with respect to the electronic circuit component, and the rigidity after solidification is higher than the rigidity of the heat transfer plate.
And the filling member is provided between the heat transfer plate and the electronic circuit component.
And the heat transfer plate and the electronic circuit component are separated from each other.
An electronic circuit device having a contact arrangement . An electronic circuit component disposed on the substrate; cooling means for cooling the electronic circuit component; and cooling means for contacting both the cooling means and the electronic circuit component. And a connecting means for thermally connecting the electronic circuit component and the electronic circuit component, wherein the connecting device is disposed between the electronic circuit component and the cooling unit, and has a through hole at an upper portion of the electronic circuit component. a plate-like member, a heat transfer plate disposed in the through-hole, before
And a solidified filling member that fills the space in the through hole.
Only, the heat transfer plate has a surface facing the electronic circuit component,
The filling member has a convex shape with respect to the electronic circuit component, and the rigidity after solidification is higher than the rigidity of the heat transfer plate.
And the filling member is provided between the heat transfer plate and the electronic circuit component.
And the heat transfer plate and the electronic circuit component are separated from each other.
An electronic circuit device having a contact arrangement . A cooling means for cooling the electronic circuit component; a cooling means for cooling the electronic circuit component; a cooling means for contacting both the cooling means and the electronic circuit component; And a connecting means for thermally connecting the electronic circuit component and the electronic circuit component, wherein the connecting device is disposed between the electronic circuit component and the cooling unit, and has a through hole at an upper portion of the electronic circuit component. A plate-shaped member, a heat transfer plate disposed in the through-hole, and a filling member filling the through-hole, wherein the rigidity of the filling member is smaller than the rigidity of the heat transfer plate; The plate has a surface facing the electronic circuit component,
The electronic circuit component is convex, and between the convex surface and the electronic circuit component, the filling member is filled,
The convex surface and the electronic circuit component are not in contact with each other, and the heat transfer plate has a predetermined distance on an inner wall surface of the through hole.
In order to prevent access to the electronic circuit components,
Electronic circuit device characterized by having a step portion
Place. 4. The electronic circuit device according to claim 1 , wherein an inner wall surface of the through hole is provided to prevent the heat transfer plate from approaching the electronic circuit component more than a predetermined distance. An electronic circuit device comprising: 5. The electronic circuit device according to claim 1 , wherein the surface of the heat transfer plate on the cooling means side is on the same plane as the surface of the plate member on the cooling means side. An electronic circuit device, comprising: 6. The electronic circuit device according to claim 1 , wherein said connecting means supports said plate-like member on said substrate without contacting said electronic circuit component. An electronic circuit device further comprising a member. 7. The electronic circuit device according to claim 6 , wherein
In the plate-like member, the opening of the through-hole on the side of the electronic circuit component is larger than the electronic circuit component, and the support member has a height at which a part of the electronic circuit component enters the through-hole. An electronic circuit device supporting the plate member. 8. The electronic circuit device according to claim 2 , wherein
The electronic circuit device, wherein the electronic circuit component is electrically connected to the substrate by solder, and a melting point of the filling member is lower than a melting point of the solder. 9. The electronic circuit device according to claim 1 , wherein said filling member is solder. 10. The electronic circuit device according to claim 1 , wherein said electronic circuit component is a semiconductor chip or a chip carrier.