CN204912999U - Stove carrier is crossed to wave -soldering - Google Patents

Abstract

The utility model discloses a carrier for wave soldering, which comprises a synthetic stone bottom plate and a special cover plate designed for PCB boards. The synthetic stone bottom plate is provided with a plurality of PCB board sinking areas and a plurality of cover plate guide holes. , There are also two stud fastening nuts on the synthetic stone bottom plate, multiple guide posts, two fixed star-shaped handle screws, multiple spring pressure rods and multiple special-shaped spring pressure blocks are set on the special cover. Copper sleeves are embedded in all places on the board where spring rods and spring pressing blocks are placed. The utility model can eliminate the floating height of the components on the PCB, the inclination of the components and the problems of pinching when they are directly passed through the furnace, so that the quality of the processed PCB boards can fully meet the standard, and there is no need to manually adjust the floating height of the components again. And inclined repair, while ensuring the quality, it also saves manpower and material resources, reduces unnecessary damage and scrap, and saves the cost of manufacturing materials.

Description

A carrier for wave soldering

technical field

The utility model relates to the technical field of PCB welding, in particular to a carrier for wave soldering.

Background technique

The current wave soldering furnace carrier generally uses a single PCB board to insert the parts and then directly goes to the wave soldering chain to grab the splint and pass the furnace, which is easy to cause problems such as component floating height, component tilting, PCB clamp deformation, etc., which affects product quality. Unable to meet customer requirements at one time. The defective products produced need to be repaired, which increases unnecessary production and processing procedures and wastes manpower and material resources. Therefore, those skilled in the art are devoting themselves to developing a new type of wave soldering oven carrier to solve the above problems.

Utility model content

In view of the above-mentioned defects of the prior art, the technical problem to be solved by the utility model is to provide a wave soldering furnace carrier to solve the problem that the prior art wave soldering furnace tools are prone to defective products when processing PCB boards, resulting in It needs to be repaired again, which is a waste of manpower and material resources.

In order to achieve the above purpose, the utility model provides a carrier for wave soldering, which is characterized in that it includes a synthetic stone bottom plate and a special cover designed for the PCB board, and the synthetic stone bottom plate is provided with a plurality of PCB boards to place The sinking area and a plurality of cover plate guide holes, the synthetic stone bottom plate is also provided with two stud fastening nuts, and the special cover plate is provided with a plurality of guide posts, two fixed star handle screws, A plurality of spring pressing rods and a plurality of special-shaped spring pressing blocks, all places on the special cover plate where the spring bars and spring pressing blocks are installed are embedded with copper sleeves.

The above-mentioned carrier for wave soldering is characterized in that: the two sides of the synthetic stone bottom plate are track sides with a size of 8mm*2mm.

The above-mentioned carrier for wave soldering is characterized in that: the special cover plate is also provided with two pick-up positions.

The above-mentioned carrier for wave soldering is characterized in that there are two sinking areas for placing the PCB board.

The above-mentioned carrier for wave soldering is characterized in that there are four guide holes on the cover plate.

The above-mentioned carrier for wave soldering is characterized in that there are four guide posts.

The above-mentioned carrier for wave soldering is characterized in that: the number of spring pressing rods is forty-two.

The above-mentioned carrier for wave soldering is characterized in that there are seven special-shaped spring pressing blocks.

The beneficial effects of the utility model are:

1. When the carrier of the utility model is used to carry out wave soldering and tinning operations on PCB boards, problems such as floating height and component inclination of components on the PCB board can be eliminated, and the quality of the PCB boards processed by the furnace can be eliminated. It can completely meet the standard, and there is no need to manually repair the floating height and tilt of the components again, which saves manpower and material resources while ensuring quality.

2. When the carrier of the utility model is used to carry out wave soldering and tinning operations on the PCB board, it can solve the problem of pinch damage when the PCB board is directly passed through the furnace, reduce unnecessary damage and scrap, and save the cost of manufacturing materials.

The conception, specific structure and technical effects of the present utility model will be further described below in conjunction with the accompanying drawings, so as to fully understand the purpose, characteristics and effects of the present utility model.

Description of drawings

Fig. 1 is a structural schematic diagram of a synthetic stone bottom plate of a wave soldering furnace carrier of the present invention;

Fig. 2 is a schematic diagram of the side view structure of the special cover plate for the wave soldering carrier of the utility model;

Fig. 3 is a structural schematic diagram of a top view of a special cover plate for a wave soldering furnace carrier of the present invention;

Fig. 4 is a schematic diagram of the track side structure of the wave soldering carrier of the present invention.

Detailed ways

As shown in Figures 1, 2, and 3, a carrier for wave soldering is characterized in that it includes a synthetic stone base plate 1 and a special cover plate 2 designed for PCB boards. The synthetic stone base plate 1 is provided with multiple The sinking area 3 and a plurality of cover plate guide holes 4 are placed on the PCB board, two stud fastening nuts 5 are arranged on the synthetic stone bottom plate 1, and a plurality of guide posts 6 are arranged on the special cover plate 2 , two fixed star-shaped handle screws 7, a plurality of spring pressing rods 8 and a plurality of special-shaped spring pressing blocks 9, all spring bars 8 and spring pressing blocks 9 on the special cover plate 2 are embedded with copper sleeves 10.

As shown in FIG. 4 , in this embodiment, the synthetic stone bottom plate 1 is processed with track sides 12 with a size of 8mm*2mm on both sides.

In this embodiment, the special cover 2 is also provided with two access positions 11 .

In this embodiment, there are two sinking areas 3 for placing the PCB board.

In this embodiment, there are four cover guide holes 4 .

In this embodiment, there are four guide posts 6 .

In this embodiment, there are forty-two spring pressing rods 8 .

In this embodiment, there are seven special-shaped spring pressing blocks 9 .

When in use, put two PCB boards into the position of the sinking area 3 on the PCB board, and insert the four guide holes 4 on the synthetic stone base plate 1 through the four guide posts 6 on the special cover plate 2 . Screw the two fixed star handle screws 7 on the special cover plate 2 with both hands, and fix them in the two stud fastening nuts 5 of the synthetic stone bottom plate 1, so that the forty screws on the special cover plate 2 The two spring pressing bars 8 and the seven special-shaped spring pressing blocks 9 on the special cover plate 2 press the components that need to be pressed in place. The copper sleeve 10 embedded in all the spring pressing bars and pressing blocks on the special cover plate 2 is used to adjust the pressing stroke of the spring pressing bar 8 and the special-shaped spring pressing block 9, so that the spring pressing bar 8 and the special-shaped spring pressing block 9 can effectively press the PCB board components. Pick up the entire carrier through the two hand positions 11 provided on the special cover plate 2, process the track edge 12 with a size of 8mm*2mm on both sides with the synthetic stone bottom plate 1, and carry out the tinning operation through the furnace with the wave soldering chain.

The preferred specific embodiments of the present utility model have been described in detail above. It should be understood that those skilled in the art can make many modifications and changes according to the concept of the present utility model without creative efforts. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the utility model through logical analysis, reasoning or limited experiments on the basis of the prior art should be within the scope of protection defined by the claims .

Claims (8)

1. A wave soldering furnace carrier is characterized in that: it comprises a synthetic stone base plate (1) and a special cover plate (2) designed for PCB boards, and a plurality of PCB boards are arranged on the synthetic stone base plate (1) Place the sinking area (3) and a plurality of cover plate guide holes (4), and two stud fastening nuts (5) are also arranged on the synthetic stone bottom plate (1), and the special cover plate (2) There are a plurality of guide posts (6), two fixed star handle screws (7), a plurality of spring pressing rods (8) and a plurality of special-shaped spring pressing blocks (9), and the special cover plate (2) The places of all dress spring rods (8) and spring pressing blocks (9) are all embedded copper sleeves (10). 2 . A carrier for wave soldering according to claim 1 , characterized in that: the synthetic stone bottom plate ( 1 ) is processed with track sides ( 12 ) with a size of 8mm*2mm. 3 . 3. A carrier for wave soldering as claimed in claim 1, characterized in that: said special cover plate (2) is also provided with two pick-up positions (11). 4. A carrier for wave soldering according to claim 1, characterized in that there are two sinking areas (3) for placing the PCB board. 5. A carrier for wave soldering according to claim 1, characterized in that there are four guide holes (4) on the cover plate. 6. A wave soldering refractory carrier according to claim 1, characterized in that there are four guide posts (6). 7. A wave soldering refractory carrier according to claim 1, characterized in that there are forty-two spring pressing rods (8). 8. A carrier for wave soldering according to claim 1, characterized in that there are seven special-shaped spring pressing blocks (9).