CN102984883A - Structure capable of avoiding cold solder joint of elements and method thereof - Google Patents
Structure capable of avoiding cold solder joint of elements and method thereof Download PDFInfo
- Publication number
- CN102984883A CN102984883A CN201210403774XA CN201210403774A CN102984883A CN 102984883 A CN102984883 A CN 102984883A CN 201210403774X A CN201210403774X A CN 201210403774XA CN 201210403774 A CN201210403774 A CN 201210403774A CN 102984883 A CN102984883 A CN 102984883A
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- Prior art keywords
- copper foil
- foil layer
- sinking
- pcb
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 16
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 16
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 16
- 238000003466 welding Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a structure capable of avoiding cold solder joint of elements. The structure comprises a printed circuit broad (PCB) used for being pasted with the elements. The PCB comprises a solder resisting layer, a copper foil layer and welding pads arranged on the copper foil layer. Welding feet of the elements are aligned to the lower ends of element bodies or higher than the lower ends of the element bodies. A sunken notch is formed in a position, corresponding to the lower portions of the element bodies, of the PCB. The sunken notch is provided with no solder resisting layer or the copper foil layer inside, or the sunken notch is provided with no solder resisting layer and the thickness of the copper foil layer in the sunken notch is smaller than that of the copper foil layer on the periphery of sunken notch. The invention also discloses a corresponding method for avoiding cold solder joint of the elements. The problem that void-welding of the elements is easy to occur due to the fact that the welding feet of the elements are higher than the element bodies is effectively solved.
Description
Technical field
The present invention relates to hardware electronic, particularly relate to a kind of structure and method of avoiding the element rosin joint.
Background technology
The SMT(surface mounting technology that traditional handicraft is used) in the material, the leg of element is compared with component body, generally is concordant with the component body lower end or a little less than the component body lower end, as shown in Figure 1.Yet, as shown in Figures 2 and 3, for some special material element, the leg 2 of element is higher than component body 1 lower end, because the PCB(printed circuit board (PCB)) solder mask 3 and copper foil layer 4 certain thickness is arranged, component body 1 is mounted on the solder mask 3, and there is difference in height in the leg 2 of element with component body 1, when mounting, the leg 2 of element is slightly higher than the position of the pad 6 on the PCB, and tin cream can't wrap up leg well.Like this, leg 2 and the PCB pad 6 solder reflow postweldings of element are easy to form rosin joint, cause the SMT fraction defective high, and production efficiency is low.
Summary of the invention
Main purpose of the present invention is exactly for above-mentioned this class particular components, and a kind of structure and the method that can avoid dexterously the element rosin joint is provided, and solves the element leg easily causes the element rosin joint than this height problem.
For achieving the above object, the present invention is by the following technical solutions:
A kind of structure of avoiding the element rosin joint, comprise the PCB for mount components, described PCB comprises solder mask, copper foil layer and is located at pad on the copper foil layer, the leg of described element is concordant with the component body lower end or be higher than the component body lower end, position under the corresponding described component body of described PCB offers the sinking breach, in the described sinking breach without solder mask and copper foil layer, perhaps in the described sinking breach without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer thickness.
Preferably, described sinking breach is arranged to its degree that makes described element sinking so that the leg of described element is just fallen on the pad of element.
A kind of method of avoiding the element rosin joint, described component mounter is to PCB, described PCB comprises solder mask, copper foil layer and is located at pad on the copper foil layer that the leg of described element is concordant with the component body lower end or be higher than the component body lower end, said method comprising the steps of:
Position under the corresponding described component body of described PCB forms the sinking breach, in the described sinking breach without solder mask and copper foil layer, perhaps in the described sinking breach without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer thickness;
During mount components, described component body is put into described sinking breach, so that the leg of described element is near the pad of element.
Preferably, described sinking breach is arranged to its degree that makes described element sinking so that the leg of described element is just fallen on the pad of element.
The technique effect that the present invention is useful:
By PCB is upper originally corresponding to the solder mask under the component body with copper foil layer is all or part of digs up, because element sinks, make this element leg draw close component pads, like this, can solve well the material problem of faulty soldering that the element leg brings than this height during welding.Adopt the present invention, when the SMT material mounted, rosin joint can not occur in this material, has improved production efficiency, had reduced fault generation and maintenance probability, had reduced cost.
Description of drawings
Fig. 1 is traditional element mounting structure schematic diagram, and the leg of this element is concordant with the component body lower end or a little less than the component body lower end;
Fig. 2 is the leg element schematic diagram higher than component body lower end;
Fig. 3 is the mounting structure schematic diagram on the traditional particular components PCB, and the leg of this element is higher than component body lower end;
Fig. 4 is the structural representation of avoiding the element rosin joint of one embodiment of the invention.
Embodiment
By reference to the accompanying drawings the present invention is further described in detail by the following examples.
See also Fig. 4, in some embodiments, avoid the structure of element rosin joint to comprise PCB for mount components, described PCB comprises base material 5, solder mask 3, copper foil layer 4 and is located at pad 6 on the copper foil layer 4, the leg 2 of described element is concordant with component body 1 lower end or be higher than component body 1 lower end, position under the corresponding described component body 1 of described PCB offers the sinking breach, and described sinking breach is interior without solder mask and copper foil layer.Described sinking breach also without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer 4 thickness, as long as make the leg 2 of described element effectively draw close pad 6 in element.Like this, tin cream can well leg 2 parcels, make it rosin joint not to occur.
Preferably, described sinking breach is arranged to its degree that makes described element sinking so that the leg 2 of described element is just fallen on the pad 6 of element.
In some embodiments, avoid the method for element rosin joint may further comprise the steps:
Position under the corresponding described component body 1 of described PCB forms the sinking breach, and described sinking breach is interior without solder mask and copper foil layer.Described sinking breach also without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer 4 thickness, as long as make the leg 2 of described element effectively draw close pad 6 in element.
During mount components, described component body 1 is put into described sinking breach, so that the leg 2 of described element is near the pad 6 of element.
Preferably, described sinking breach is arranged to its degree that makes described element sinking so that the leg 2 of described element is just fallen on the pad 6 of element.
Above content is the further description of the present invention being done in conjunction with concrete preferred implementation, can not assert that implementation of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (4)
1. structure of avoiding the element rosin joint, comprise the PCB for mount components, described PCB comprises solder mask, copper foil layer and is located at pad on the copper foil layer, the leg of described element is concordant with the component body lower end or be higher than the component body lower end, described structure is characterised in that, position under the corresponding described component body of described PCB offers the sinking breach, in the described sinking breach without solder mask and copper foil layer, perhaps in the described sinking breach without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer thickness.
2. the structure of avoiding the element rosin joint as claimed in claim 1 is characterized in that, described sinking breach is arranged to its degree that makes described element sinking so that the leg of described element is just fallen on the pad of element.
3. method of avoiding the element rosin joint, described component mounter is to PCB, and described PCB comprises that solder mask, copper foil layer be located at the pad on the copper foil layer, and the leg of described element is concordant with the component body lower end or be higher than the component body lower end, described method is characterised in that, may further comprise the steps:
Position under the corresponding described component body of described PCB forms the sinking breach, in the described sinking breach without solder mask and copper foil layer, perhaps in the described sinking breach without the copper foil layer thickness in solder mask and the described sinking breach less than around copper foil layer thickness;
During mount components, described component body is put into described sinking breach, so that the leg of described element is near the pad of element.
4. the method for avoiding the element rosin joint as claimed in claim 3 is characterized in that, described sinking breach is arranged to its degree that makes described element sinking so that the leg of described element is just fallen on the pad of element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403774.XA CN102984883B (en) | 2012-10-22 | 2012-10-22 | Structure capable of avoiding cold solder joint of elements and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403774.XA CN102984883B (en) | 2012-10-22 | 2012-10-22 | Structure capable of avoiding cold solder joint of elements and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102984883A true CN102984883A (en) | 2013-03-20 |
| CN102984883B CN102984883B (en) | 2015-07-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210403774.XA Expired - Fee Related CN102984883B (en) | 2012-10-22 | 2012-10-22 | Structure capable of avoiding cold solder joint of elements and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102984883B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463053A (en) * | 2018-04-26 | 2018-08-28 | 歌尔股份有限公司 | A kind of pcb board design method and pcb board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121224A1 (en) * | 2003-12-05 | 2005-06-09 | Optimum Care International Tech. Inc. | Circuit board having deposit holes |
| CN1784119A (en) * | 2004-11-11 | 2006-06-07 | 夏普株式会社 | Flexible wiring substrate, method for producing it, semiconductor device and electronic device |
| CN101170878A (en) * | 2006-10-27 | 2008-04-30 | 三星电机株式会社 | Method for manufacturing print circuit board |
| US20090257206A1 (en) * | 2008-04-11 | 2009-10-15 | Bernd Beyer | Holding apparatus |
| CN201928517U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Circuit board with pit |
| CN202889788U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Structure for preventing element from pseudo soldering |
-
2012
- 2012-10-22 CN CN201210403774.XA patent/CN102984883B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121224A1 (en) * | 2003-12-05 | 2005-06-09 | Optimum Care International Tech. Inc. | Circuit board having deposit holes |
| CN1784119A (en) * | 2004-11-11 | 2006-06-07 | 夏普株式会社 | Flexible wiring substrate, method for producing it, semiconductor device and electronic device |
| CN101170878A (en) * | 2006-10-27 | 2008-04-30 | 三星电机株式会社 | Method for manufacturing print circuit board |
| US20090257206A1 (en) * | 2008-04-11 | 2009-10-15 | Bernd Beyer | Holding apparatus |
| CN201928517U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Circuit board with pit |
| CN202889788U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Structure for preventing element from pseudo soldering |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463053A (en) * | 2018-04-26 | 2018-08-28 | 歌尔股份有限公司 | A kind of pcb board design method and pcb board |
| CN108463053B (en) * | 2018-04-26 | 2020-02-18 | 歌尔股份有限公司 | PCB design method and PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102984883B (en) | 2015-07-15 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 |
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| CF01 | Termination of patent right due to non-payment of annual fee |