CN102740610B - Surface mount device and assemble method - Google Patents
Surface mount device and assemble method Download PDFInfo
- Publication number
- CN102740610B CN102740610B CN201210207077.7A CN201210207077A CN102740610B CN 102740610 B CN102740610 B CN 102740610B CN 201210207077 A CN201210207077 A CN 201210207077A CN 102740610 B CN102740610 B CN 102740610B
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- Prior art keywords
- pcb substrate
- breach
- pad
- client
- surface mount
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A kind of surface mount device and assemble method are the present invention relates to, described surface mount device comprises the shell that PCB substrate, assembly form spatial accommodation in described PCB substrate and the electronic devices and components be contained in described spatial accommodation, the periphery of described PCB substrate is provided with the breach running through PCB substrate upper and lower surface, and the inwall of described breach is provided with for PCB substrate being welded to pad client also playing electric action.The present invention arranges breach at PCB substrate periphery, establishes pad in breach, if PCB substrate and client by be welded and fixed produce rosin joint bad time, can make up at this breach Nei Jiaxi, thus decrease the scrappage of product.
Description
[technical field]
The present invention relates to installing electronic elements or device, particularly relate to a kind of surface mount device and assemble method.
[background technology]
Along with the development of sociometric technique, the growth sharply that utilized the quantity of the device of circuit board and type all to occur.The frequency that device, chip and housing etc. are installed to circuit board adds too.The improvement of device installation is contributed to the development of the final products promoting to be provided with device, and greatly can reduce cost and the complexity of product.
The installation of device can be realized by welding, bonding and other similar method.Traditional circuit board is all arrange pad on circuit boards, then utilize pad by welding circuit board road client, but, circuit board is installed to after in client, usually because rosin joint phenomenon causes circuit board and client fixing not firm, even cause the device on circuit board not by the good electric connection of pad and the external world because of rosin joint phenomenon.
Therefore, be necessary to provide a kind of new surface mount device and assemble method for the problems referred to above.
[summary of the invention]
The object of the present invention is to provide a kind of surface mount device and assemble method, can effectively improve because when PCB substrate paster is welded in client, because the product reimbursement situation that rosin joint phenomenon causes.
A kind of surface mount device, it comprises the shell that PCB substrate, assembly form spatial accommodation in described PCB substrate and the electronic devices and components be contained in described spatial accommodation, the periphery of described PCB substrate is provided with the breach running through PCB substrate upper and lower surface, and the inwall of described breach is provided with for PCB substrate being welded to pad client also playing electric action.
Preferably, described breach is circular arc type.
Preferably, described pad comprises the circular arc type Part I being placed in and mating with notch geometry in breach, described pad also comprises and to be connected with described Part I and to be embedded Part II in PCB substrate, and described Part II in the form of sheets and be exposed to the lower surface of described PCB substrate.
Preferably, described breach quantity is four and axis about described PCB substrate is symmetrical arranged between two.
Preferably, described pad and PCB substrate integrated injection molding.
Preferably, described shell is fixed on described PCB substrate by conducting resinl.
A kind of assemble method of surface mount device, this assemble method comprises the steps: to provide the PCB substrate with electronic devices and components, the periphery of described PCB substrate is provided with the breach running through PCB substrate upper and lower surface, the inwall of described breach is provided with for PCB substrate being welded to pad client also playing electric action, described pad comprises the circular arc type Part I being placed in and mating with notch geometry in breach, described pad also comprises and to be connected with described Part I and to be embedded Part II in PCB substrate, described Part II in the form of sheets and be exposed to the lower surface of described PCB substrate, welded the pad solder in PCB substrate to client by paster, add tin by the pad Part I in breach and be electrically connected client to make PCB substrate.
Beneficial effect of the present invention is: the present invention arranges breach at PCB substrate periphery, establishes pad in breach, if PCB substrate and client by be welded and fixed produce rosin joint bad time, can make up at this breach Nei Jiaxi, thus decrease the scrappage of product.
[accompanying drawing explanation]
Fig. 1 is the first visual angle schematic isometric of surface mount device of the present invention;
Fig. 2 is the second visual angle schematic isometric of surface mount device shown in Fig. 1;
Fig. 3 is the PCB substrate front view of surface mount device shown in Fig. 1;
Fig. 4 is PCB substrate and the shell separation graph of surface mount device shown in Fig. 1.
[embodiment]
Below in conjunction with drawings and embodiments, the invention will be further described.
As depicted in figs. 1 and 2, the invention provides a kind of surface mount device 1, it comprises the shell 11 that PCB substrate 10, assembly form spatial accommodation in described PCB substrate 10 and the electronic devices and components (sign) be contained in described spatial accommodation, and described electronic devices and components are fixed on PCB substrate 10.
As shown in Figure 3 and Figure 4, described shell 11 is fixed on PCB substrate 10 by conducting resinl.The periphery of described PCB substrate 10 is provided with the breach 12 running through PCB substrate 10 upper and lower surface, this breach 12 preferably adopts the circular arc of easily processing, the inwall of described breach 12 is provided with the pad 13 for PCB substrate 10 being welded in client, again shown in composition graphs 2, described pad 13 comprises the circular arc type Part I 131 be placed in breach 12 form fit in breach 12, described pad 13 also comprises and to be connected with described Part I 131 and to be embedded Part II 132 in PCB substrate 10, and described Part II 132 in the form of sheets and be exposed to the lower surface of described PCB substrate 10.Described breach 12 quantity is four and axis about described PCB substrate 10 is symmetrical arranged between two.Further, described pad 13 and PCB substrate 10 integrated injection molding.PCB substrate 10 is welded to client by described pad 13 paster and gets on, periphery due to PCB substrate 10 is provided with breach 12, when detect to there is rosin joint situation between PCB substrate 10 and client time, can remedy at above-mentioned breach 12 Nei Jiaxi, the tin added in breach 12 can make up the space between pad 13 and client, make pad 3 and client electrical communication, thus greatly reduce the scrappage of product.
As shown in Figure 2 and Figure 4, present invention also offers a kind of assemble method of surface mount device, this assemble method comprises the steps: the PCB substrate 10 providing having electronic components and parts (sign), the periphery of described PCB substrate 10 is provided with the breach 12 running through PCB substrate 10 upper and lower surface, the inwall of described breach 12 is provided with for PCB substrate 10 being welded to the pad 13 client also playing electric action, described pad 13 comprises the circular arc type Part I 131 be placed in breach 12 form fit in breach 12, described pad 13 also comprises and to be connected with described Part I 131 and to be embedded Part II 132 in PCB substrate 10, described Part II 132 in the form of sheets and be exposed to the lower surface of described PCB substrate 10, by paster welding, the pad 13 in PCB substrate 10 is welded to client, add tin by the pad Part I 131 in breach 12 and be electrically connected client to make PCB substrate 10.
In the present invention, client refers to for assembling device, electronic component and the Related product etc. that use disclosed surface mount device.
Adopt the assemble method of surface mount device provided by the invention, when PCB substrate 10 and client by be welded and fixed produce rosin joint bad time, can make up at this breach 12 Nei Jiaxi, the tin added in breach 12 can make up the space between pad 13 and client, make pad 3 and client electrical communication, thus greatly reduce the scrappage of product.
Above-described is only better embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art at this, without departing from the concept of the premise of the invention, can also make improvement, but these all belongs to protection scope of the present invention.
Claims (1)
1. an assemble method for surface mount device, is characterized in that, this assemble method comprises the steps:
PCB substrate with electronic devices and components is provided, the periphery of described PCB substrate is provided with the breach running through PCB substrate upper and lower surface, the inwall of described breach is provided with for PCB substrate being welded to pad client also playing electric action, described pad comprises the circular arc type Part I being placed in and mating with notch geometry in breach, described pad also comprises and to be connected with described Part I and to be embedded Part II in PCB substrate, and described Part II in the form of sheets and be exposed to the lower surface of described PCB substrate;
By paster welding, the Part II of the pad in PCB substrate is welded to client;
When detect to there is rosin joint situation between PCB substrate and client time, add tin by the pad Part I in breach and be electrically connected client to make PCB substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210207077.7A CN102740610B (en) | 2012-06-21 | 2012-06-21 | Surface mount device and assemble method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210207077.7A CN102740610B (en) | 2012-06-21 | 2012-06-21 | Surface mount device and assemble method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102740610A CN102740610A (en) | 2012-10-17 |
| CN102740610B true CN102740610B (en) | 2015-09-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210207077.7A Expired - Fee Related CN102740610B (en) | 2012-06-21 | 2012-06-21 | Surface mount device and assemble method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102740610B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260297A (en) * | 2017-12-29 | 2018-07-06 | 深圳市兴森快捷电路科技股份有限公司 | A kind of method and system for improving point glue surface Chip patch yields |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| CN201298585Y (en) * | 2005-11-17 | 2009-08-26 | Cts公司 | Electronic device with an oscillator module wireless basic structure and oscillator component with a basic structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193491A (en) * | 2006-11-17 | 2008-06-04 | 群康科技(深圳)有限公司 | Printed circuit board |
| US8294526B2 (en) * | 2008-10-03 | 2012-10-23 | Cts Corporation | Ovenized crystal oscillator assembly |
| CN201937955U (en) * | 2010-11-26 | 2011-08-17 | 比亚迪股份有限公司 | Circuit board and module |
| CN202799397U (en) * | 2012-06-21 | 2013-03-13 | 瑞声声学科技(常州)有限公司 | Surface mounted device |
-
2012
- 2012-06-21 CN CN201210207077.7A patent/CN102740610B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| CN201298585Y (en) * | 2005-11-17 | 2009-08-26 | Cts公司 | Electronic device with an oscillator module wireless basic structure and oscillator component with a basic structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102740610A (en) | 2012-10-17 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20210621 |