CN102984883B - Structure capable of avoiding cold solder joint of elements and method thereof - Google Patents
Structure capable of avoiding cold solder joint of elements and method thereof Download PDFInfo
- Publication number
- CN102984883B CN102984883B CN201210403774.XA CN201210403774A CN102984883B CN 102984883 B CN102984883 B CN 102984883B CN 201210403774 A CN201210403774 A CN 201210403774A CN 102984883 B CN102984883 B CN 102984883B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil layer
- pcb
- leg
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 16
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 16
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 16
- 238000003466 welding Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
The invention discloses a structure capable of avoiding cold solder joint of elements. The structure comprises a printed circuit broad (PCB) used for being pasted with the elements. The PCB comprises a solder resisting layer, a copper foil layer and welding pads arranged on the copper foil layer. Welding feet of the elements are aligned to the lower ends of element bodies or higher than the lower ends of the element bodies. A sunken notch is formed in a position, corresponding to the lower portions of the element bodies, of the PCB. The sunken notch is provided with no solder resisting layer or the copper foil layer inside, or the sunken notch is provided with no solder resisting layer and the thickness of the copper foil layer in the sunken notch is smaller than that of the copper foil layer on the periphery of sunken notch. The invention also discloses a corresponding method for avoiding cold solder joint of the elements. The problem that void-welding of the elements is easy to occur due to the fact that the welding feet of the elements are higher than the element bodies is effectively solved.
Description
Technical field
The present invention relates to hardware electronic, particularly relate to a kind of structure and the method for avoiding element rosin joint.
Background technology
The SMT(surface mounting technology that traditional handicraft is used) in material, the leg of element is compared with component body, is generally concordant with component body lower end or a little less than component body lower end, as shown in Figure 1.But, as shown in Figures 2 and 3, for some special material element, the leg 2 of element is higher than component body 1 lower end, due to PCB(printed circuit board (PCB)) solder mask 3 and copper foil layer 4 have certain thickness, component body 1 is mounted on solder mask 3, and there is difference in height with component body 1 in the leg 2 of element, during attachment, the leg 2 of element is slightly higher than the position of the pad 6 on PCB, and tin cream cannot wrap up leg well.Like this, leg 2 and the PCB pad 6 solder reflow postwelding of element are easy to form rosin joint, and cause SMT fraction defective high, production efficiency is low.
Summary of the invention
Main purpose of the present invention is exactly for above-mentioned this kind of particular components, provides a kind of structure and the method that can avoid element rosin joint dexterously, solves element leg easily causes element rosin joint problem than this height.
For achieving the above object, the present invention is by the following technical solutions:
A kind of structure avoiding element rosin joint, comprise the PCB for mount components, the pad that described PCB comprises solder mask, copper foil layer and is located on copper foil layer, the leg of described element is concordant with component body lower end or higher than component body lower end, position under the corresponding described component body of described PCB offers sinking breach, without solder mask and copper foil layer in described sinking breach, or the interior copper foil layer thickness without solder mask and in described sinking breach of described sinking breach is less than the copper foil layer thickness of surrounding.
Preferably, described sinking breach is arranged to its degree that described element is sunk the leg of described element is just fallen on the pad of element.
A kind of method avoiding element rosin joint, described component mounter is on PCB, the pad that described PCB comprises solder mask, copper foil layer and is located on copper foil layer, the leg of described element is concordant with component body lower end or higher than component body lower end, said method comprising the steps of:
Position under the corresponding described component body of described PCB forms sinking breach, and without solder mask and copper foil layer in described sinking breach, or the interior copper foil layer thickness without solder mask and in described sinking breach of described sinking breach is less than the copper foil layer thickness of surrounding;
During mount components, described component body is put into described sinking breach, make the pad of leg close to element of described element.
Preferably, described sinking breach is arranged to its degree that described element is sunk the leg of described element is just fallen on the pad of element.
The technique effect that the present invention is useful:
By PCB originally corresponding to the solder mask under component body and copper foil layer is all or part of digs up, because element sinks, make this element leg draw close component pads, like this, the material problem of faulty soldering that element leg brings than this height during welding, can be solved well.Adopt the present invention, during the attachment of SMT material, can not there is rosin joint in this material, improve production efficiency, reduces fault and occur and maintenance probability, reduce cost.
Accompanying drawing explanation
Fig. 1 is traditional element mounting structure schematic diagram, and the leg of this element is concordant with component body lower end or a little less than component body lower end;
Fig. 2 is the element schematic that leg is higher than component body lower end;
Fig. 3 is the mounting structure schematic diagram on traditional particular components PCB, and the leg of this element is higher than component body lower end;
Fig. 4 is the structural representation avoiding element rosin joint of one embodiment of the invention.
Embodiment
By reference to the accompanying drawings the present invention is described in further detail by the following examples.
Refer to Fig. 4, in some embodiments, the structure of element rosin joint is avoided to comprise PCB for mount components, the pad 6 that described PCB comprises base material 5, solder mask 3, copper foil layer 4 and is located on copper foil layer 4, the leg 2 of described element is concordant with component body 1 lower end or higher than component body 1 lower end, position under the corresponding described component body 1 of described PCB offers sinking breach, without solder mask and copper foil layer in described sinking breach.Described sinking breach may also be without solder mask and copper foil layer thickness in described sinking breach is less than copper foil layer 4 thickness of surrounding, as long as make the leg 2 of described element effectively draw close pad 6 in element.Like this, tin cream can wrap up leg 2 well, makes it rosin joint to occur.
Preferably, described sinking breach is arranged to its degree that described element is sunk the leg 2 of described element is just fallen on the pad 6 of element.
In some embodiments, the method for element rosin joint is avoided to comprise the following steps:
Position under the corresponding described component body 1 of described PCB forms sinking breach, without solder mask and copper foil layer in described sinking breach.Described sinking breach may also be without solder mask and copper foil layer thickness in described sinking breach is less than copper foil layer 4 thickness of surrounding, as long as make the leg 2 of described element effectively draw close pad 6 in element.
During mount components, described component body 1 is put into described sinking breach, make the pad 6 of leg 2 close to element of described element.
Preferably, described sinking breach is arranged to its degree that described element is sunk the leg 2 of described element is just fallen on the pad 6 of element.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (4)
1. avoid the structure of element rosin joint for one kind, comprise the PCB for mount components, the pad that described PCB comprises solder mask, copper foil layer and is located on copper foil layer, the leg of described element is concordant with component body lower end or higher than component body lower end, the feature of described structure is, position under the corresponding described component body of described PCB is without solder mask and copper foil layer, or without solder mask and copper foil layer thickness is less than the copper foil layer thickness of surrounding, to form sinking breach, make the straight leg of the described element putting into described sinking breach keep being carried in component pads straightly.
2. avoid the structure of element rosin joint as claimed in claim 1, it is characterized in that, described sinking breach is arranged to its degree that described element is sunk and the leg of described element is just fallen on the pad of element.
3. avoid the method for element rosin joint for one kind, described component mounter is on PCB, and described PCB comprises solder mask, copper foil layer is located at pad on copper foil layer, and the leg of described element is concordant with component body lower end or higher than component body lower end, the feature of described method is, comprises the following steps:
Position under the corresponding described component body of described PCB forms sinking breach, and described sinking breach is by the described position of described PCB without solder mask and copper foil layer, or without solder mask and the copper foil layer thickness that copper foil layer thickness is less than surrounding formed;
During mount components, described component body is put into described sinking breach, make the straight leg of described element keep being carried on the pad of element straightly.
4. avoid the method for element rosin joint as claimed in claim 3, it is characterized in that, described sinking breach is arranged to its degree that described element is sunk and the leg of described element is just fallen on the pad of element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403774.XA CN102984883B (en) | 2012-10-22 | 2012-10-22 | Structure capable of avoiding cold solder joint of elements and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403774.XA CN102984883B (en) | 2012-10-22 | 2012-10-22 | Structure capable of avoiding cold solder joint of elements and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102984883A CN102984883A (en) | 2013-03-20 |
| CN102984883B true CN102984883B (en) | 2015-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210403774.XA Expired - Fee Related CN102984883B (en) | 2012-10-22 | 2012-10-22 | Structure capable of avoiding cold solder joint of elements and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102984883B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463053B (en) * | 2018-04-26 | 2020-02-18 | 歌尔股份有限公司 | PCB design method and PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201928517U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Circuit board with pit |
| CN202889788U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Structure for preventing element from pseudo soldering |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200404706A (en) * | 2003-12-05 | 2004-04-01 | Chung Shan Inst Of Science | Composite material structure for rotary-wings and its producing method |
| CN100546431C (en) * | 2004-11-11 | 2009-09-30 | 夏普株式会社 | Flexible printed circuit board and manufacture method thereof, semiconductor device and electronic equipment |
| KR100782405B1 (en) * | 2006-10-27 | 2007-12-07 | 삼성전기주식회사 | Method of manufacturing printed circuit board |
| DE102008018386A1 (en) * | 2008-04-11 | 2009-10-15 | Siemens Aktiengesellschaft | Holding device with carrier element and circuit board |
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2012
- 2012-10-22 CN CN201210403774.XA patent/CN102984883B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201928517U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Circuit board with pit |
| CN202889788U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Structure for preventing element from pseudo soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102984883A (en) | 2013-03-20 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 |