CN201928517U - Circuit board with pit - Google Patents
Circuit board with pit Download PDFInfo
- Publication number
- CN201928517U CN201928517U CN2010205032557U CN201020503255U CN201928517U CN 201928517 U CN201928517 U CN 201928517U CN 2010205032557 U CN2010205032557 U CN 2010205032557U CN 201020503255 U CN201020503255 U CN 201020503255U CN 201928517 U CN201928517 U CN 201928517U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pit
- welding
- solder joint
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model relates to a circuit board with a pit. One or a plurality of pits is pressed by a mould on an element welding point of a flexible circuit board such as in a patch type, and then a solder paste is printed, a patch element is welded by reflow welding, and a tin root is formed in the welding point pit of the circuit board by tin solder so that the element is more firmly welded and combined with the circuit board and is difficult to drop. Or a pit is pressed at the whole element position on the circuit board by the mould, the element partly or wholly falls into the pit during welding to be encircled and is difficult to drop from the circuit board after welding. Compared with an ordinary patch type flexible circuit board, with the adoption of the utility model, the welding combination intensity of the element and the circuit board is greatly strengthened, the reliability of the product is improved, and maintenance of the product in the using process is greatly reduced.
Description
Technical field
The utility model belongs to field of circuit boards, is specifically related to circuit board SMT welding electronic component field.With the element solder joint of the flexible circuit board of patch type, press one or more pits with mould, and then the seal tin cream, surface mount elements, the Reflow Soldering welding, scolding tin forms the tin root in circuit board solder joint pit, and it is more firm that element and circuit board solder bond are got, difficult drop-off.Perhaps, on circuit board whole position of components is pressed a pit with mould, with an element part or all fall in the pit, element is formed surround during welding, welding back element is difficult to come off from circuit board.
Background technology
Common flexible circuit board is behind welding (for example SMT welding) element, and for example, when flexible circuit board bent, element came off easily.
In addition, for example, especially out of doors use as LED lamp band application scenario, because the flexible circuit board of SMT soldered elements will stand harsh climatic environment, for example greatly the temperature difference, be exposed to the sun, adverse weather condition such as sleet, or the like, be easy to weaken the bond strength at SMT solder joint place or even cause the solder joint place to be thrown off, thereby cause the entire product fault or even lost efficacy.
Therefore, the soldered elements bond strength problem that how to solve flexible circuit board with and weatherability, be puzzlement flexible circuit board field technical barrier for many years always, this in addition limited circuit board particularly the flexible circuit panel products in the application of many outdoor occasions.
In order to address these problems, according to some aspects of the present utility model, can take to form (for example mold pressing) pit in circuit board bond pad locations or position of components, after making element SMT welding, scolding tin forms the tin root, element is firmly buried slotting solder bond form the firm solder bond of encirclement on the sidewall of pit bottom and pit in the circuit board or with element.
The utility model content
According to one side of the present utility model, provide a kind of circuit board with pit.For example, the element solder joint of the flexible circuit board of patch type can be extruded one or more pits with mould, and then the seal tin cream, surface mount elements, Reflow Soldering welding, scolding tin forms the tin root in circuit board solder joint pit, it is more firm that element and circuit board solder bond are got, difficult drop-off.Perhaps, can press a pit to whole position of components on circuit board with mould, with an element part or all fall in the pit, element be formed surround during welding, welding back element is difficult to come off from circuit board.
More specifically, provide a kind of circuit board, had the solder joint that is formed on the circuit board, it is characterized in that, described circuit board also comprises: the one or more pits that form at the solder joint place of described circuit board; With the element that is welded on described solder joint place; Wherein, when welding, scolding tin enters and forms the tin root architecture that strengthens solder bond intensity in the pit.
The utility model also provides a kind of circuit board, has solder joint that is formed on the circuit board and the element that is welded on the solder joint, it is characterized in that described circuit board also comprises:
One or more pits that position of components on described solder joint forms, described pit is configured such that described componentry ground or is absorbed in fully in the described pit, thereby makes described element be surrounded partially or entirely by the scolding tin in the described pit after welding.
According to one side of the present utility model, described circuit board is a flexible circuit board, and described welding is the SMT welding.
According on the other hand of the present utility model, the bottom surface of described element and side are welded on respectively on the bottom and sidewall of described pit.
The utility model also provides a kind of LED lamp band, comprises the circuit board according to design of the present utility model, and wherein, element comprises LED.
According to one side of the present utility model, form one or more pits in the bond pad locations of flexible circuit board, after the SMT welding, scolding tin forms " tin root " in pit, element is firmly welded.
According on the other hand of the present utility model, flexible circuit board forms pit at whole position of components, and after the SMT welding, element is besieged in pit, makes element postwelding difficult drop-off.
According on the other hand of the present utility model, described pit is semicircle or conical or the square bodily form or polyhedron shape.Or the polyhedral cone bodily form.
According on the other hand of the present utility model, described pit, the degree of depth all falls in the hole element greater than component thickness.
According on the other hand of the present utility model, described pit, the degree of depth is less than or equal to component thickness, and componentry is fallen in the hole.
According on the other hand of the present utility model, described pit, in bond pad locations, the bottom surface of element and side are welded on respectively on the bottom and sidewall of pit.
The utility model is compared with the flexible circuit board of common patch type, strengthened the solder bond intensity of element and wiring board widely, improved reliability of products and, significantly reduced product maintenance in use for example in the weatherability of various outdoor application.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is the schematic diagram that does not form the flexible circuit board of pit.
Fig. 2 is the solder joint position of flexible circuit board at element, presses the schematic diagram that extrudes a plurality of pits with mould.
Fig. 3 is that flexible circuit board is in the weldering component position, with the pit schematic diagram of mould extrusion.
Fig. 4 is for extruding a plurality of pits, the cross-sectional structure schematic diagram behind the SMT paster soldered elements at circuit board solder joint place.
Fig. 5 is that circuit board extrudes pit, the cross-sectional structure schematic diagram behind the SMT paster soldered elements at weldering element place.
The parts label
1, flexible circuit board; 2, surface mount elements; 3, scolding tin; 4, circuit board component solder joint; 5, weldering element place; 6, the pit that on solder joint, forms; 7, the pit that forms at weldering element place;
Embodiment
To the specific embodiment of a kind of circuit board with pit of the utility model be described in more detail below.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.
In the utility model, for example, " circuit board " can be the flexible circuit board (or claim flexible PCB, flexible circuit board) of any kind, single face circuit board for example, and double-sided PCB, multilayer circuit board, or the like.
" pit " in the utility model should be done the understanding of broad sense, its connotation comprises the recessed structure that helps to strengthen the bond strength between element and the circuit board applicable to the Any shape of inventive concept of the present utility model or structure, include but not limited to, pit, recess, groove, recess, or the like, these all are that those skilled in the art are thinkable after reading and having understood the utility model.
Describe the utility model in detail below in conjunction with embodiment.
Embodiment one, form pit at the solder joint place
1,, forms (for example extruding) one or a plurality of pit 6 (as shown in Figure 2) at solder joint 4 places with mould with common flexible circuit board 1 (as shown in Figure 1).
2, extrude the local print solder paste of pit 6 at circuit board, the SMT surface mount elements 2 then, through the Reflow Soldering welding, make scolding tin 3 form the tin root, thereby element 2 is firmly buried slotting solder bond (as shown in Figure 4) on wiring board 1.
Embodiment two, form pit at weldering element place
1, with common flexible circuit board 1 (as shown in Figure 1), 5 places form (for example extruding with mould) pit 7 (as shown in Figure 3) at the weldering position of components.
2, extrude the solder joint place print solder paste in the place of pit 7 at circuit board, the SMT surface mount elements 2 then, make the part of element 2 or all fall into 7 li of pits, element 2 is surrounded by pit 7, through Reflow Soldering welding, make on the bottom and sidewall that scolding tin 3 is welded on pit 7 respectively with the bottom surface and the side of element 2.(as shown in Figure 5).
Below in conjunction with the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (8)
1. a circuit board has the solder joint that is formed on the circuit board, it is characterized in that, described circuit board also comprises:
The one or more pits that form at the solder joint place of described circuit board; With
Be welded on the element on the pit at described solder joint place;
Wherein, when welding, scolding tin enters and forms the tin root architecture that strengthens solder bond intensity in the pit.
2. circuit board according to claim 1 is characterized in that described circuit board is a flexible circuit board, and described welding is the SMT welding.
3. circuit board according to claim 1 is characterized in that, described circuit board is single face wiring board, double-sided wiring board or multilayer circuit board.
4. a circuit board has solder joint that is formed on the circuit board and the element that is welded on the solder joint, it is characterized in that described circuit board also comprises:
One or more pits that position of components on described solder joint forms, described pit is configured such that described componentry ground or is absorbed in fully in the described pit, thereby makes described element be surrounded partially or entirely by the scolding tin in the described pit after welding.
5. circuit board according to claim 4 is characterized in that described circuit board is a flexible circuit board, and described welding is the SMT welding.
6. circuit board according to claim 4 is characterized in that, described circuit board is single face wiring board, double-sided wiring board or multilayer circuit board.
7. circuit board according to claim 4 is characterized in that, the bottom surface of described element and side are welded on respectively on the bottom and sidewall of described pit.
8. a LED lamp band comprises that wherein, described element comprises LED as each described circuit board among the claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205032557U CN201928517U (en) | 2010-08-24 | 2010-08-24 | Circuit board with pit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205032557U CN201928517U (en) | 2010-08-24 | 2010-08-24 | Circuit board with pit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201928517U true CN201928517U (en) | 2011-08-10 |
Family
ID=44432350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205032557U Expired - Lifetime CN201928517U (en) | 2010-08-24 | 2010-08-24 | Circuit board with pit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201928517U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102984883A (en) * | 2012-10-22 | 2013-03-20 | 广东欧珀移动通信有限公司 | Structure capable of avoiding cold solder joint of elements and method thereof |
| CN103192150A (en) * | 2013-03-29 | 2013-07-10 | 上海安费诺永亿通讯电子有限公司 | Electronic component welding method |
| CN106332445A (en) * | 2015-06-30 | 2017-01-11 | 欣兴电子股份有限公司 | Manufacture method of flexible circuit board |
| CN108617091A (en) * | 2018-05-30 | 2018-10-02 | 太龙（福建）商业照明股份有限公司 | A kind of on-plane surface pcb board |
-
2010
- 2010-08-24 CN CN2010205032557U patent/CN201928517U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102984883A (en) * | 2012-10-22 | 2013-03-20 | 广东欧珀移动通信有限公司 | Structure capable of avoiding cold solder joint of elements and method thereof |
| CN102984883B (en) * | 2012-10-22 | 2015-07-15 | 广东欧珀移动通信有限公司 | Structure capable of avoiding cold solder joint of elements and method thereof |
| CN103192150A (en) * | 2013-03-29 | 2013-07-10 | 上海安费诺永亿通讯电子有限公司 | Electronic component welding method |
| CN106332445A (en) * | 2015-06-30 | 2017-01-11 | 欣兴电子股份有限公司 | Manufacture method of flexible circuit board |
| CN106332445B (en) * | 2015-06-30 | 2019-02-19 | 欣兴电子股份有限公司 | The manufacturing method of flexible circuit board |
| CN108617091A (en) * | 2018-05-30 | 2018-10-02 | 太龙（福建）商业照明股份有限公司 | A kind of on-plane surface pcb board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201928517U (en) | Circuit board with pit | |
| CN204168608U (en) | A kind of circuit board efficient quality guaranteeing printing ladder steel mesh | |
| CN103796446A (en) | High-efficiency manufacturing method of large-scale array type photoelectric transmit-receive sensor | |
| CN203368927U (en) | PCB pad | |
| CN201928516U (en) | Circuit board with etched pit | |
| CN201256484Y (en) | Stamp type metalized semi-pore circuit board | |
| CN204031568U (en) | Flexible printed circuit board | |
| CN202111936U (en) | Double-sided aluminum core circuit board with plughole resin | |
| CN203192932U (en) | Antenna device with smaller clearance areas | |
| CN202364474U (en) | PCB structure for handset | |
| CN113066397B (en) | LED display module assembly stable in structure, roughness are good | |
| CN210519001U (en) | Ultra-long flexible circuit board for LED lamp strip | |
| CN202026529U (en) | Printed circuit board | |
| CN202475939U (en) | Packaging structure of board-to-board connector | |
| CN201298604Y (en) | Data card product | |
| CN201438787U (en) | Circuit board | |
| CN101085566A (en) | Novel leaking net plate | |
| CN203480782U (en) | Novel surface-mounted LED digital display | |
| CN201160140Y (en) | Solder leg structure of contact terminal of computer input/output connector | |
| CN203351666U (en) | Led module | |
| CN201860515U (en) | Two-sided LED circuit board component for welding, connecting and conducting | |
| CN201039588Y (en) | Double-side circuit board with welding tray structure | |
| CN219659997U (en) | PCB packaging structure based on light miniature SMT components and parts | |
| CN204029816U (en) | A kind of chip diode | |
| CN218388083U (en) | Double-layer circuit board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110810 |
|
| CX01 | Expiry of patent term |