CN202799397U - Surface mounted device - Google Patents
Surface mounted device Download PDFInfo
- Publication number
- CN202799397U CN202799397U CN 201220295985 CN201220295985U CN202799397U CN 202799397 U CN202799397 U CN 202799397U CN 201220295985 CN201220295985 CN 201220295985 CN 201220295985 U CN201220295985 U CN 201220295985U CN 202799397 U CN202799397 U CN 202799397U
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- CN
- China
- Prior art keywords
- pcb substrate
- breach
- surface mount
- pad
- mount device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a surface mounted device. The surface mounted device comprises a printed circuit board (PCB) substrate, a shell and an electronic component, wherein the shell is assembled on the PCB substrate to form an accommodating space; the electronic component is accommodated in the accommodating space; notches which penetrate through the upper surface and the lower surface of the PCB substrate are formed at the periphery of the PCB substrate; and bonding pads which are used for welding the PCB substrate to a client and play a role in electric conduction are arranged on inner walls of the notches. As the notches are formed at the periphery of the PCB substrate, and the bonding pads are arranged in the notches, tin can be added into the notches to avoid the phenomenon that poor pseudo soldering is caused when the PCB substrate is fixed with the client by welding so as to reduce the scrap rate of the product.
Description
[technical field]
The utility model relates to installing electronic elements or device, relates in particular to a kind of surface mount device.
[background technology]
Along with the development of sociometric technique, utilize quantity and the type of the device of circuit board rapid growth all to occur.The frequency that device, chip and housing etc. are installed to circuit board has increased too.The improvement that device is installed helps to promote to be equipped with the development of the final products of device, and can greatly reduce cost and the complexity of product.
The installation of device can realize by welding, bonding and other similar method.Traditional circuit board all is at circuit board pad to be set, then utilize pad with on the welding circuit board road client, but, after circuit board is installed on the client, usually because the rosin joint phenomenon causes circuit board and client fixing not firm, even because the rosin joint phenomenon causes the device on the circuit board can not be by the pad electric connection good with the external world.
Therefore, be necessary to provide a kind of new surface mount device for the problems referred to above.
[utility model content]
The purpose of this utility model is to provide a kind of surface mount device, and this surface mount device can effectively improve when being welded on the client because of PCB substrate paster, because the product that the rosin joint phenomenon causes reimbursement situation.
A kind of surface mount device, it comprises that PCB substrate, assembly form the shell of spatial accommodation and be contained in electronic devices and components in the described spatial accommodation on described PCB substrate, the periphery of described PCB substrate is provided with the breach that runs through PCB substrate upper and lower surface, and the inwall of described breach is provided with for the PCB substrate being welded on the client and the pad of an electric action.
Preferably, described breach is circular arc type.
Preferably, described pad comprises the circular arc type first that is placed in the breach with the notch geometry coupling, described pad also comprises and is connected with described first and is embedded second portion in the PCB substrate, and described second portion in the form of sheets and be exposed to the lower surface of described PCB substrate.
Preferably, described breach quantity is four and is symmetrical arranged in twos about the axis of described PCB substrate.
Preferably, described pad and PCB substrate integrated injection molding.
Preferably, described shell is fixed in described PCB substrate by conducting resinl.
The beneficial effects of the utility model are: the utility model arranges breach at PCB substrate periphery, establish pad in the breach, if PCB substrate and client produce rosin joint when bad by being welded and fixed, can make up at this breach Nei Jiaxi, thereby reduce the scrappage of product.
[description of drawings]
Fig. 1 is the first visual angle schematic isometric of the utility model surface mount device;
Fig. 2 is the second visual angle schematic isometric of surface mount device shown in Figure 1;
Fig. 3 is the PCB substrate front view of surface mount device shown in Figure 1;
Fig. 4 is PCB substrate and the shell separation graph of surface mount device shown in Figure 1.
[embodiment]
The utility model is described in further detail below in conjunction with drawings and embodiments.
As depicted in figs. 1 and 2, the utility model provides a kind of surface mount device 1, it comprises that PCB substrate 10, assembly form the shell 11 of spatial accommodation and be contained in electronic devices and components in the described spatial accommodation (indicating) on described PCB substrate 10, and described electronic devices and components are fixed in PCB substrate 10.
As shown in Figure 3 and Figure 4, described shell 11 is fixed in PCB substrate 10 by conducting resinl.The periphery of described PCB substrate 10 is provided with the breach 12 that runs through PCB substrate 10 upper and lower surfaces, these breach 12 preferred easily circular arcs of processing that adopt, the inwall of described breach 12 is provided with for the pad 13 that PCB substrate 10 is welded on the client, again in conjunction with shown in Figure 2, described pad 13 comprises the circular arc type first 131 that is placed in the breach 12 with breach 12 form fit, described pad 13 also comprises and is connected with described first 131 and is embedded PCB substrate 10 interior second portions 132, and described second portion 132 in the form of sheets and be exposed to the lower surface of described PCB substrate 10.Described breach 12 quantity are four and are symmetrical arranged in twos about the axis of described PCB substrate 10.And, described pad 13 and PCB substrate 10 integrated injection moldings.PCB substrate 10 is welded to client by described pad 13 pasters and gets on, because the periphery of PCB substrate 10 is provided with breach 12, when detecting when the rosin joint situation occurring between PCB substrate 10 and the client, can remedy at above-mentioned breach 12 Nei Jiaxi, the tin of adding breach 12 can remedy the rosin joint between pad 13 and the client, make pad 13 and client electrical communication, greatly reduced the scrappage of product.
Above-described only is preferred embodiments of the present utility model; should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the utility model creation design; can also make improvement, but these all belong to protection range of the present utility model.
Claims (6)
1. surface mount device, it comprises that PCB substrate, assembly form the shell of spatial accommodation and be contained in electronic devices and components in the described spatial accommodation on described PCB substrate, it is characterized in that: the periphery of described PCB substrate is provided with the breach that runs through PCB substrate upper and lower surface, and the inwall of described breach is provided with for the PCB substrate being welded on the client and the pad of an electric action.
2. surface mount device according to claim 1, it is characterized in that: described breach is circular arc type.
3. surface mount device according to claim 2, it is characterized in that: described pad comprises the circular arc type first that is placed in the breach with the notch geometry coupling, described pad also comprises and is connected with described first and is embedded second portion in the PCB substrate, and described second portion in the form of sheets and be exposed to the lower surface of described PCB substrate.
4. it is characterized in that according to claim 1 or 3 described surface mount devices: described breach quantity is four and is symmetrical arranged in twos about the axis of described PCB substrate.
5. surface mount device according to claim 4 is characterized in that: described pad and PCB substrate integrated injection molding.
6. surface mount device according to claim 1 or 5, it is characterized in that: described shell is fixed in described PCB substrate by conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220295985 CN202799397U (en) | 2012-06-21 | 2012-06-21 | Surface mounted device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220295985 CN202799397U (en) | 2012-06-21 | 2012-06-21 | Surface mounted device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202799397U true CN202799397U (en) | 2013-03-13 |
Family
ID=47826561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220295985 Expired - Fee Related CN202799397U (en) | 2012-06-21 | 2012-06-21 | Surface mounted device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202799397U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102740610A (en) * | 2012-06-21 | 2012-10-17 | 瑞声声学科技(深圳)有限公司 | Surface mounted device and assembly method |
| CN106373901A (en) * | 2016-08-31 | 2017-02-01 | 北京无线电测量研究所 | Dispersion glue patch method for microwave bare chip |
-
2012
- 2012-06-21 CN CN 201220295985 patent/CN202799397U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102740610A (en) * | 2012-06-21 | 2012-10-17 | 瑞声声学科技(深圳)有限公司 | Surface mounted device and assembly method |
| CN106373901A (en) * | 2016-08-31 | 2017-02-01 | 北京无线电测量研究所 | Dispersion glue patch method for microwave bare chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170522 Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8 Patentee after: AAC Technologies (Singapore) Co., Ltd. Address before: Wujin Nanxiashu town Jiangsu city Changzhou province 213167 Co-patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd. Patentee before: AAC Acoustic Technologies (Changzhou) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20210621 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |