CN106250872A - A kind of fingerprint module and electronic equipment - Google Patents
A kind of fingerprint module and electronic equipment Download PDFInfo
- Publication number
- CN106250872A CN106250872A CN201610674730.9A CN201610674730A CN106250872A CN 106250872 A CN106250872 A CN 106250872A CN 201610674730 A CN201610674730 A CN 201610674730A CN 106250872 A CN106250872 A CN 106250872A
- Authority
- CN
- China
- Prior art keywords
- becket
- ground
- path
- circuit board
- conductive path
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Elimination Of Static Electricity (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of fingerprint module and electronic equipment, described electronic equipment includes that described fingerprint module and control circuit, described fingerprint module include fingerprint chip, becket, circuit board；Described fingerprint chip is arranged in described becket, described circuit board includes via and the first ground path being connected with described fingerprint chip, described via is provided with conductive path, described becket connects described conductive path, described conductive path is for being connected with the second ground path, and described first ground path insulate with described second ground path.When being hit by electrostatic, electrostatic can be avoided described first ground path and directly be released to machine system ground, and then avoids described fingerprint chip by static interference and damage.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of fingerprint module and electronic equipment.
Background technology
Fingerprint recognition button in terminal is due to often in contact with human body and the reason that accepts electrostatic test etc., and Yi Shoujing
Electricity hits.
In prior art, fingerprint recognition button includes that fingerprint module, fingerprint module include circuit board, becket and becket
In fingerprint chip, GND and the GND of fingerprint chip in the becket in fingerprint module and circuit board connect together.
When becket is hit by electrostatic, electrostatic is easy to go here and there into fingerprint chip, so that it is by static interference and damage.
Summary of the invention
The technical problem that present invention mainly solves is to provide fingerprint film group and the electronic equipment of a kind of ground connection, described to avoid
Fingerprint chip in fingerprint module is by static interference and damage.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: a kind of fingerprint module, including fingerprint core
Sheet, becket, circuit board；
Wherein, described fingerprint chip is arranged in described becket, described circuit board include via and with described fingerprint core
The first ground path that sheet connects, described via is provided with conductive path, and described becket connects described conductive path, described conduction
Path is for being connected with the second ground path, and described first ground path insulate with described second ground path.
Wherein, described becket is connected with described conductive path by SMT.
Wherein, described fingerprint module, farther include conduction stiffening plate, described conduction stiffening plate is arranged at described circuit
The backboard side to described becket, described second ground path is machine system ground, and described conduction stiffening plate is connected to described
Between conductive path and described machine system ground.
Wherein, described fingerprint module, farther include conducting adhesive cloth, described conducting adhesive cloth is connected to described conduction reinforcement
Between plate and described machine system ground.
For solving above-mentioned technical problem, another technical solution used in the present invention is: a kind of electronic equipment, including fingerprint
Chip, becket, first circuit board, second circuit board；
Described fingerprint chip is arranged in described becket, described first circuit board include via and with described fingerprint core
The first ground path that sheet, second circuit board connect, described via is provided with conductive path, and described becket connects described conduction and leads to
Road, described conductive path is for being connected with the second ground path, and described first ground path insulate with described second ground path.
Wherein, described becket is connected with described conductive path by SMT.
Wherein, described electronic equipment farther includes conduction stiffening plate, and described conduction stiffening plate is arranged at described first electricity
The road backboard side to described becket, described second ground path is machine system ground, and described conduction stiffening plate is connected to institute
State between conductive path and described machine system ground.
Wherein, described electronic equipment farther includes conducting adhesive cloth, and described conducting adhesive cloth is connected to described conduction stiffening plate
And between described machine system ground.
The invention has the beneficial effects as follows: be different from the situation of prior art, fingerprint film group internal circuit board of the present invention includes
Via and the first ground path being connected with described fingerprint chip, described via is provided with conductive path, and described becket connects institute
Stating conductive path, described conductive path is used for being connected with the second ground path, described first ground path and described second ground connection
Line insulation.When becket is hit by electrostatic, electrostatic can be released to the second ground path by conductive path, and then avoids
Fingerprint chip is by static interference and damage.
Accompanying drawing explanation
Fig. 1 is the structural representation of fingerprint module embodiment of the present invention；
Fig. 2 is the electrostatic conducting path schematic diagram of fingerprint module embodiment of the present invention shown in Fig. 1；
Fig. 3 is the structural representation of electronic apparatus embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
The present invention will be described in detail with embodiment below in conjunction with the accompanying drawings.
Referring to Fig. 1, fingerprint module 100 of the present invention, including fingerprint chip 110, becket 120, circuit board 130；
Fingerprint chip 110 is arranged in becket 120, and circuit board 130 is respectively by SMT 161, SMT 162 and fingerprint core
Sheet 110, becket 120 are connected to the same side.Circuit board 130 include at circuit board 130 outer arrange via 131 and with
The first ground path (not shown) that fingerprint chip 110 connects.The GND of circuit board 130, and mistake are avoided in the setting of via 131
The internal conductive path that is provided with in hole 131, becket 120 electrically connects conductive path by SMT 162, and conductive path is for connecing with second
Ground connection.First ground path and the insulation of the second ground path.
Fingerprint module 100 also includes that conduction stiffening plate 140, conduction stiffening plate 140 are arranged at circuit board 130 back to becket
The side of 120, and be connected with machine system ground 150 by conducting adhesive cloth 170.Second ground path i.e. machine system ground 150, leads
Electricity stiffening plate 140 is connected between conductive path and machine system ground 150.
Referring to Fig. 2, in fingerprint film group 100 uses, when electrostatic touches becket 120, electrostatic is by via 131
The conductive path conduction in portion is to conduction stiffening plate 140, then is conducted to machine system ground 150 by conducting adhesive cloth 170.Due to via
131 GND avoiding circuit board 130, therefore electrostatic will not reach fingerprint chip 110 via circuit board 130, and then avoid right
The static interference of fingerprint chip 110 and damage.
Referring to Fig. 3, electronic equipment 200 involved in the present invention mainly includes fingerprint chip 110, becket 120 and
One circuit board 210 and second circuit board 220.
Wherein, fingerprint chip 110 is internal is provided with GND 111 and PIN 112, and is connected with first circuit board 210, then divides
It is not connected with second circuit board 220 through GND line 230 and holding wire 240.
Circuit board 130 in the concrete visible aforementioned fingerprint film group 100 of first circuit board 210, and fingerprint chip 110, metal
Ring 120 and first circuit board 210 and between relation can also see aforementioned fingerprint film group 100, here is omitted.
The foregoing is only embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every utilization is originally
Equivalent structure or equivalence flow process that description of the invention and accompanying drawing content are made convert, or are directly or indirectly used in what other were correlated with
Technical field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (8)
1. a fingerprint module, it is characterised in that including:
Fingerprint chip, becket, circuit board；
Described fingerprint chip is arranged in described becket, and described circuit board includes via and be connected with described fingerprint chip
One ground path, described via is provided with conductive path, and described becket connects described conductive path, described conductive path for
Second ground path connects, described first ground path and described second ground path insulation.
Fingerprint module the most according to claim 1, it is characterised in that
Described becket is connected with described conductive path by SMT.
Fingerprint module the most according to claim 1, it is characterised in that
Farther including conduction stiffening plate, described conduction stiffening plate is arranged at the described circuit board side back to described becket,
Described second ground path is machine system ground, and described conduction stiffening plate is connected to described conductive path and described machine system ground
Between.
Fingerprint module the most according to claim 3, it is characterised in that
Farther including conducting adhesive cloth, described conducting adhesive cloth is connected between described conduction stiffening plate and described machine system ground.
5. an electronic equipment, it is characterised in that including:
Fingerprint chip, becket, first circuit board, second circuit board；
Described fingerprint chip is arranged in described becket, described first circuit board include via and with described fingerprint chip,
The first ground path that two circuit boards connect, described via is provided with conductive path, and described becket connects described conductive path, institute
State conductive path for being connected with the second ground path, described first ground path and described second ground path insulation.
Electronic equipment the most according to claim 5, it is characterised in that
Described becket is connected with described conductive path by SMT.
Electronic equipment the most according to claim 5, it is characterised in that
Farther including conduction stiffening plate, described conduction stiffening plate is arranged at described first circuit board back to the one of described becket
Side, described second ground path is machine system ground, and described conduction stiffening plate is connected to described conductive path and described complete machine system
Between system ground.
Electronic equipment the most according to claim 7, it is characterised in that
Farther including conducting adhesive cloth, described conducting adhesive cloth is connected between described conduction stiffening plate and described machine system ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610674730.9A CN106250872A (en) | 2016-08-16 | 2016-08-16 | A kind of fingerprint module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610674730.9A CN106250872A (en) | 2016-08-16 | 2016-08-16 | A kind of fingerprint module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106250872A true CN106250872A (en) | 2016-12-21 |
Family
ID=57592158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610674730.9A Withdrawn CN106250872A (en) | 2016-08-16 | 2016-08-16 | A kind of fingerprint module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106250872A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803079A (en) * | 2017-01-20 | 2017-06-06 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal |
| CN106845422A (en) * | 2017-01-22 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module, fingerprint identification method and mobile terminal |
| CN106845409A (en) * | 2017-01-22 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module and mobile terminal |
| CN106874859A (en) * | 2017-01-22 | 2017-06-20 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module and mobile terminal |
| CN107682476A (en) * | 2017-09-18 | 2018-02-09 | 维沃移动通信有限公司 | A kind of mobile terminal |
| WO2018133764A1 (en) * | 2017-01-20 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and mobile terminal |
| CN108363501A (en) * | 2017-01-26 | 2018-08-03 | 义隆电子股份有限公司 | Touch device with fingerprint sensing element and electronic device |
| CN110866516A (en) * | 2019-11-25 | 2020-03-06 | 维沃移动通信有限公司 | Electronic device |
| CN112232112A (en) * | 2020-09-03 | 2021-01-15 | 江西合力泰科技有限公司 | Fingerprint module with strong antistatic property |
| CN113065389A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Fingerprint chip, fingerprint chip module and electronic equipment |
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| CN101216877A (en) * | 2007-01-04 | 2008-07-09 | 祥群科技股份有限公司 | Sliding type fingerprint sensing element and its method of preparation |
| CN104077572A (en) * | 2014-07-02 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and terminal device |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
| CN205303461U (en) * | 2015-12-01 | 2016-06-08 | 华天科技（西安）有限公司 | Prevent fingerprint sensing chip package structure of static |
| CN105825165A (en) * | 2015-11-20 | 2016-08-03 | 维沃移动通信有限公司 | Fingerprint identification module, terminal device and assembling method |
| CN105844219A (en) * | 2016-03-17 | 2016-08-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and terminal thereof, and fingerprint identification chip packaging method |
-
2016
- 2016-08-16 CN CN201610674730.9A patent/CN106250872A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101216877A (en) * | 2007-01-04 | 2008-07-09 | 祥群科技股份有限公司 | Sliding type fingerprint sensing element and its method of preparation |
| CN104077572A (en) * | 2014-07-02 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and terminal device |
| CN105825165A (en) * | 2015-11-20 | 2016-08-03 | 维沃移动通信有限公司 | Fingerprint identification module, terminal device and assembling method |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
| CN205303461U (en) * | 2015-12-01 | 2016-06-08 | 华天科技（西安）有限公司 | Prevent fingerprint sensing chip package structure of static |
| CN105844219A (en) * | 2016-03-17 | 2016-08-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and terminal thereof, and fingerprint identification chip packaging method |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803079A (en) * | 2017-01-20 | 2017-06-06 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal |
| WO2018133764A1 (en) * | 2017-01-20 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and mobile terminal |
| WO2018133665A1 (en) * | 2017-01-22 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and electronic device |
| CN106874859A (en) * | 2017-01-22 | 2017-06-20 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module and mobile terminal |
| WO2018133664A1 (en) * | 2017-01-22 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and electronic device |
| CN106845409A (en) * | 2017-01-22 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module and mobile terminal |
| CN106845422A (en) * | 2017-01-22 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module, fingerprint identification method and mobile terminal |
| CN106845409B (en) * | 2017-01-22 | 2020-03-06 | Oppo广东移动通信有限公司 | Fingerprint identification module and mobile terminal |
| CN106874859B (en) * | 2017-01-22 | 2020-04-03 | Oppo广东移动通信有限公司 | Fingerprint identification module and mobile terminal |
| CN108363501A (en) * | 2017-01-26 | 2018-08-03 | 义隆电子股份有限公司 | Touch device with fingerprint sensing element and electronic device |
| CN107682476A (en) * | 2017-09-18 | 2018-02-09 | 维沃移动通信有限公司 | A kind of mobile terminal |
| CN110866516A (en) * | 2019-11-25 | 2020-03-06 | 维沃移动通信有限公司 | Electronic device |
| CN110866516B (en) * | 2019-11-25 | 2022-12-27 | 维沃移动通信有限公司 | Electronic device |
| CN112232112A (en) * | 2020-09-03 | 2021-01-15 | 江西合力泰科技有限公司 | Fingerprint module with strong antistatic property |
| CN113065389A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Fingerprint chip, fingerprint chip module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161221 |
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| WW01 | Invention patent application withdrawn after publication |