CN104936385A - Method of SMT surface mount technology - Google Patents
Method of SMT surface mount technology Download PDFInfo
- Publication number
- CN104936385A CN104936385A CN201510331471.5A CN201510331471A CN104936385A CN 104936385 A CN104936385 A CN 104936385A CN 201510331471 A CN201510331471 A CN 201510331471A CN 104936385 A CN104936385 A CN 104936385A
- Authority
- CN
- China
- Prior art keywords
- mounting
- paster
- smt
- detect
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a method of an SMT surface mount technology, comprising the steps as follows: dispensing-silk-screen printing-printing detection-mounting-mounting solidification-mounting detection-soldering in a reflow oven- detecting-packaging. The method of the invention could detect the mounting state in real time. The SMT mounting finished product is detected by using a 40-time magnifying lens. A microscope is used to detect the doubt mounting to ensure the qualified rate of the SMT mounting. The reflow oven is controlled by using 16 temperature zones, and the temperature can be controlled between plus or minus 3 degrees centigrade to plus or minus 5 degrees centigrade to ensure the stability of reflow soldering. A loading tool is used to load the mounting, and the single loading tool could load two or more than two PCB plates to enhance productivity.
Description
Technical field
The present invention relates to a kind of SMT surface patch process, belong to electroporation field.
Background technology
Along with developing by leaps and bounds of electronic technology and IT industry, in the production process of electronic product, circuit assembly technical equipment has transferred the Automated electronic multi pack system of technology-intensive type to from original labor-intensive manual machinery operation.The appearance of SMT technology fundamentally changes traditional Denso production form, SMT paster is surface mounting technology, be called for short SMT paster, every field is penetrated into as circuit assembly technology of new generation, SMT patch products has that compact conformation, volume are little, vibration resistance, shock resistance, high frequency characteristics is good, production efficiency advantages of higher.SMT paster occupies leading position in circuit board dress connection technique.
Summary of the invention
The invention provides a kind of method of high efficiency extraction separation of Silver fungus polysaccharides, the yield both having improved tremella polysaccharides keeps the biologically active of polysaccharide simultaneously.
A kind of SMT surface patch process, comprises the following steps:
(1) glue is put
(2) silk screen printing: use Vision recognition system, machine identifies the MARK on pcb board automatically, automatically adjusts pcb board position by servo-control system, improves printing precision;
(3) printing inspection;
(4) paster;
(5) paster solidification;
(6) paster detects: adopt multiplex's section to detect, detect paster state in real time;
(7) reflow ovens welding: reflow ovens passes through airflow circulating, on two surfaces up and down of element, efficient heat trnasfer is produced with relatively low temperature, make miniaturized component avoid overheated simultaneously, avoid causing PCB to be out of shape because one side is heated, the upper a large amount of phase of solder joint of PCB to being heated equably, thus realizes Reflow Soldering;
(8) check after stove;
(9) pack.
The invention has the advantages that:
1, the SMT surface patch technique of this project research, being used widely in company, by improvement of production process step and technological parameter, improves SMT paster quality;
2, the completing of this project, improve the core competitiveness of my company, Project Product promotes the popularity of my company, and creates larger profit for company;
3, this project is compared with traditional product, have that compact conformation, volume are little, vibration resistance, shock resistance, high frequency characteristics is good, production efficiency is high
Summary, have that compact conformation, volume are little, vibration resistance, shock resistance, high frequency characteristics is good, production efficiency advantages of higher.
Embodiment
A kind of SMT surface patch process, comprises the following steps:
(1) glue is put
(2) silk screen printing: use Vision recognition system, machine identifies the MARK on pcb board automatically, automatically adjusts pcb board position by servo-control system, improves printing precision;
(3) printing inspection;
(4) paster;
(5) paster solidification;
(6) paster detects: adopt multiplex's section to detect, detect paster state in real time, and SMT paster finished product adopts 40 times of magnifying glasses to detect, and to there being doubt paster, adopting microscopic examination again, guaranteeing SMT paster qualification rate;
(7) reflow ovens welding: reflow ovens adopts 16 warm areas to control, temperature controlling range is between ± 3 DEG C-± 5 DEG C, ensure that the stability of reflow soldering, reflow ovens, by airflow circulating, on two surfaces up and down of element, produces efficient heat trnasfer with relatively low temperature, make miniaturized component avoid overheated simultaneously, avoid causing PCB to be out of shape because one side is heated, the upper a large amount of phase of solder joint of PCB to being heated equably, thus realizes Reflow Soldering;
(8) check after stove;
(9) pack.
The above; be only part embodiment of the present invention, but protection scope of the present invention is not limited thereto, any those skilled in the art are in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (2)
1. a SMT surface patch process, comprises the following steps:
(1) glue is put
(2) silk screen printing: use Vision recognition system, machine identifies the MARK on pcb board automatically, automatically adjusts pcb board position by servo-control system, improves printing precision;
(3) printing inspection;
(4) paster;
(5) paster solidification;
(6) paster detects: adopt multiplex's section to detect, detect paster state in real time;
(7) reflow ovens welding: reflow ovens passes through airflow circulating, on two surfaces up and down of element, efficient heat trnasfer is produced with relatively low temperature, make miniaturized component avoid overheated simultaneously, avoid causing PCB to be out of shape because one side is heated, the upper a large amount of phase of solder joint of PCB to being heated equably, thus realizes Reflow Soldering;
(8) check after stove;
(9) pack.
2. SMT surface patch process as claimed in claim 1, is characterized in that: described step (7) reflow ovens adopts 16 warm areas to control, and temperature controlling range is between ± 3 DEG C-± 5 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510331471.5A CN104936385A (en) | 2015-06-16 | 2015-06-16 | Method of SMT surface mount technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510331471.5A CN104936385A (en) | 2015-06-16 | 2015-06-16 | Method of SMT surface mount technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104936385A true CN104936385A (en) | 2015-09-23 |
Family
ID=54123261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510331471.5A Pending CN104936385A (en) | 2015-06-16 | 2015-06-16 | Method of SMT surface mount technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104936385A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937482A (en) * | 2017-03-31 | 2017-07-07 | 柳州译海网络科技有限公司 | A kind of electronic product method for manufacturing of energy-saving and emission-reduction |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
-
2015
- 2015-06-16 CN CN201510331471.5A patent/CN104936385A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937482A (en) * | 2017-03-31 | 2017-07-07 | 柳州译海网络科技有限公司 | A kind of electronic product method for manufacturing of energy-saving and emission-reduction |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150923 |