CN102881599A - Ball attachment process for ball grid array - Google Patents
Ball attachment process for ball grid array Download PDFInfo
- Publication number
- CN102881599A CN102881599A CN2012103462198A CN201210346219A CN102881599A CN 102881599 A CN102881599 A CN 102881599A CN 2012103462198 A CN2012103462198 A CN 2012103462198A CN 201210346219 A CN201210346219 A CN 201210346219A CN 102881599 A CN102881599 A CN 102881599A
- Authority
- CN
- China
- Prior art keywords
- bga
- carrier
- steel mesh
- ball
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a ball attachment process for a ball grid array, and belongs to the technical field of microelectronics. BGAs can be contained in batches through a carrier, and the carrier is overlapped with a steel mesh for batch solder paste printing. BGA repair operation is simplified, and production efficiency is improved. Moreover, the use of an expensive ball attachment fixture is avoided, so that cost is lowered.
Description
Technical field
The present invention relates to a kind of BGA and plant ball technique, belong to microelectronics technology.
Background technology
Along with the IC(of ball grid array structure hereinafter referred to as BGA) development and the extensive use of encapsulation, it will become the optimal selection of high density, high-performance, multi-functional encapsulation.Because the special packing forms of BGA, solder joint is positioned at package bottom and for being hemispheric tin ball, the composition of tin ball is generally Sn/Ag/Cu, fusing point is 217 ℃, in welding process, tin club and tin cream fuse into one, and packaging body and pcb board pad are connected together.If but the welding appearance is bad, then it need be disassembled and reprocess, BGA tin club after the dismounting is peeled off by pcb board, stay solder joint not of uniform size, therefore, think that secondary uses BGA, just must plant ball to it and process, namely again add scolding tin at solder joint, make the ball size on the solder joint consistent.
Existing ball-establishing method has following two kinds, method one be with special-purpose plant the ball chuck tool first paste solder printing on the pad of BGA, on pad, add again a certain size tin ball, tin cream plays the effect that sticks the tin ball, in the process of heating subsequently, tin ball and tin cream just are fused together, thereby form new solder joint at the BGA pad.Its specific operation process is: 1, be ready to first the special-purpose ball chuck tool of planting, with alcohol cleaning and oven dry, in order to avoid the tin ball rolls and has some setbacks planting the ball chuck tool; The chip of 2, needs being planted ball be placed on plant on the ball chuck tool fixing; 3, tin cream is thawed naturally and stir, then evenly be coated onto on the scraping blade; 4, on positioning pedestal, put paste solder printing frame and print solder paste, and the speed of angle, dynamics and pulling will as far as possible control good hand's tin scraping cream the time, throw off gently the paste solder printing frame after finishing; 5, after each pad on the affirmation BGA evenly is printed on tin cream, again tin ball frame is put the location, then put into the tin ball, shake and plant the ball chuck tool, allow the tin ball roll into mesh, confirm just can keep the tin ball well and take off plate after each mesh has a tin ball; 6, the BGA that has just planted the tin ball is taken out with the Reflow Soldering baking from positioning pedestal, the amount I is toasted with heat gun.So just finish and planted ball.This method operating procedure is many, and the production cycle is long, and production cost is high, and the special-purpose ball chuck tool of planting is expensive, and efficient is low, is merely able to carry out the one single chip operation at every turn.
Another method and first method are similar, just change tin cream into weld-aiding cream, and operating process is still very loaded down with trivial details, and the production cycle is long, and cost is high, efficient is low, and the production quality is unstable, and heating process is easily fallen the tin ball.
Summary of the invention
For addressing the above problem, the invention provides a kind of simple to operately, cost-effective BGA plants ball technique.
The present invention is that the technical scheme that its problem of solution adopts is:
BGA plants ball technique, may further comprise the steps:
1) steel mesh is installed to carries out contraposition on the printing machine, printing machine is the printing machine of common production and application, steel mesh is consistent with the plate size that generally is installed on the printing machine, so other anchor clamps need to be installed on printing machine again, can directly be installed on the installing rack of printing machine, difference is, steel mesh is provided with the through hole corresponding with phase of solder joint on the BGA, so that tin cream can just be coated on the solder joint;
2) tin cream is thawed and stir, then evenly be coated on the steel mesh;
3) several BGA are contained on the carrier, described carrier is a flat board, which is provided with some width groove consistent with the BGA width, and its length just is the length of several BGA after placed side by side, and its degree of depth is consistent with the height of BGA; 4) carrier is installed on the platform of printing machine, carries out paste solder printing.Described steel mesh and carrier are provided with location hole accurately to be positioned at carrier on the steel mesh, through hole on the steel mesh is just in time cooperated with the solder joint of BGA, this location hole can be half-blind hole, printing machine is provided with two-way camera, two-way camera is between steel mesh and carrier, can shine simultaneously location hole on steel mesh and the carrier, then the computer of the position feedback of location hole on steel mesh and the carrier to the printing machine, computer drives the motor on the printing machine again, adjusts the platform of having placed carrier, makes the position of positioning hole of steel mesh and carrier corresponding one by one, be reached for the purpose of carrier location, then two-way camera is removed, and motor drives steel mesh again and overlaps with carrier, prints;
5) be completed for printing after, check whether the tin cream on each BGA pad prints evenly;
6) confirm that printing is no problem after, BGA is put into the Reflow Soldering baking;
7) finish and plant ball.
The invention has the beneficial effects as follows: easy BGA reprocesses operation, has improved production efficiency; And need not to use the expensive ball chuck tool of planting, thereby reduced cost.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is operational flowchart of the present invention;
Fig. 2 is the structural representation of carrier of the present invention;
Fig. 3 is that BGA is installed in the schematic diagram on the carrier;
Fig. 4 is the structural representation of steel mesh of the present invention;
Fig. 5 is the structure diagram of BGA of the present invention;
Fig. 6 is that carrier of the present invention is installed in the schematic diagram on the steel mesh.
Embodiment
As shown in Figure 1, BGA plants ball technique, may further comprise the steps:
Step S1 installs to steel mesh 2 on the installing rack 4 of printing machine and carries out contraposition, and printing machine is the printing machine of common production and application, can be automatically, semi-automatic or manual, and the present invention adopts full automatic printing machine, to enhance productivity.Steel mesh 2 is consistent with the plate size that generally is installed on the printing machine, so other anchor clamps need to be installed on printing machine again, difference is, as shown in Figure 4, steel mesh 2 is provided with the through hole 21 corresponding with phase of solder joint on the BGA, so that tin cream can just be coated on the solder joint.
Need to prove, the diameter of described through hole 21 is through calculating, and below in conjunction with accompanying drawing 5, and the BGA take spot pitch as 0.5mm is example, and computational methods are described: the distance that the center of BGA solder joint is adjacent the center of solder joint is d=0.5mm; The solder joint tin radius of a ball is R
1=0.15mm; The BGA gross thickness is h
1=0.94mm, packaging body thickness are h
2=0.74mm.
The principle that then equates with the volume of stanniferous amount in the tin cream according to the tin sphere volume of device solder joint, the radius R of through hole 21
2Thickness h with steel mesh 2
3Can calculate by following formula:
Π×R
1 2×（h
1-h
2-R
1）+1/2×4/3×Π×R
1 3=0.8×Π×R
2 2×h
3
Wherein Π is circumference ratio, and 0.8 is the volume ratio (when crossing Reflow Soldering, scaling powder can be lost) of metal in tin cream, obtains following formula behind the simplified formula:
15×R
1 2×（h
1-h
2-R
1）+10×R
1 3=12×R
2 2×h
3
Substitution numerical value d=0.5, R
1=0.15, h
1=0.94, h
2After=0.74, obtain following formula:
0.00421875=?R
2 2×h
3
The thickness h of steel mesh 2 of the present invention
3Be 0.15mm, diameter R that then can calculating place through hole 21
2=0.1677mm.
Step S2 thaws tin cream and stirs, and then evenly is coated on the steel mesh 2.
Step S3 is contained in several BGA on the carrier 1, shown in accompanying drawing 2, accompanying drawing 3, described carrier 1 is a flat board, which is provided with some width groove consistent with the BGA width 11, its length just is the length of several BGA after placed side by side, and its degree of depth is consistent with the height of BGA.
Step S4 as shown in Figure 6, is installed to carrier 1 on the platform 5 of printing machine, carries out paste solder printing.Described carrier 1 is provided with location hole 12 so that carrier 1 accurately is positioned on the steel mesh 2, and the through hole 21 on the steel mesh 2 is just in time cooperated with the solder joint of BGA, and this location hole 12 can be half-blind hole.Printing machine is provided with two-way camera 3, two-way camera 3 is between steel mesh 2 and carrier 1, can shine simultaneously location hole 12 on steel mesh 2 and the carrier 1, then the computer of the position feedback of location hole 12 on steel mesh 2 and the carrier 1 to the printing machine, computer drives the motor on the printing machine again, the platform 5 of carrier 1 has been placed in adjustment, make location hole 12 positions of steel mesh 2 and carrier 1 corresponding one by one, be reached for the purpose of carrier 1 location, then two-way camera 3 is removed, motor drives steel mesh 2 again and overlaps with carrier 1, prints.
Step S5 after being completed for printing, checks whether the tin cream on each BGA pad prints evenly, if inhomogeneous then need again to print.
Step S6 after the printing of confirming is no problem, is put into the Reflow Soldering baking with BGA.
Step S7 finishes and plants ball.
Above specification is described, only is principle of the present invention and embodiment, everyly carries out any simple modification and variation according to essence of the present invention, all belongs within the protection range of the presently claimed invention.
Claims (4)
1.BGA plant ball technique, it is characterized in that, may further comprise the steps:
1) steel mesh is installed to carries out contraposition on the printing machine and fix;
2) tin cream is coated onto on the steel mesh;
3) several BGA are contained on the carrier;
4) carrier is installed on the printing machine, steel mesh is overlapped with carrier carry out paste solder printing;
5) be completed for printing after, check whether the tin cream on each BGA pad prints evenly;
6) behind the affirmation printing OK, be put into the Reflow Soldering baking;
7) finish and plant ball.
2. BGA according to claim 1 plants ball technique, it is characterized in that, described carrier is a flat board, which is provided with some width groove consistent with the BGA width.
3. BGA according to claim 1 plants ball technique, it is characterized in that, described steel mesh and carrier are provided with location hole.
4. BGA according to claim 1 plants ball technique, it is characterized in that, described steel mesh is provided with the through hole corresponding with phase of solder joint on the BGA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210346219.8A CN102881599B (en) | 2012-09-18 | 2012-09-18 | BGA plants ball technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210346219.8A CN102881599B (en) | 2012-09-18 | 2012-09-18 | BGA plants ball technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102881599A true CN102881599A (en) | 2013-01-16 |
| CN102881599B CN102881599B (en) | 2016-05-04 |
Family
ID=47482880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210346219.8A Expired - Fee Related CN102881599B (en) | 2012-09-18 | 2012-09-18 | BGA plants ball technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102881599B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231138A (en) * | 2013-05-08 | 2013-08-07 | 无锡江南计算技术研究所 | Ball grid array (BGA) balling single-point repair method |
| CN103252552A (en) * | 2013-04-02 | 2013-08-21 | 深圳市卓茂科技有限公司 | Automatic ball mounter for BGAs (ball grid arrays) |
| CN105081497A (en) * | 2015-07-17 | 2015-11-25 | 伟创力电子技术(苏州)有限公司 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
| CN106098575A (en) * | 2016-06-23 | 2016-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
| CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
| CN110931372A (en) * | 2019-11-28 | 2020-03-27 | 廖文明 | Ball forming and ball planting method for BGA chip printing solder paste |
| CN115008878A (en) * | 2022-06-17 | 2022-09-06 | 西安微电子技术研究所 | Tin paste printing device and method for BTC packaging device for repair |
| CN115458420A (en) * | 2022-09-16 | 2022-12-09 | 惠州市则成技术有限公司 | Ball mounting process for IC carrier plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5787580A (en) * | 1996-11-19 | 1998-08-04 | Lg Information & Communications, Ltd. | Method for making radio-frequency module by ball grid array package |
| CN200993959Y (en) * | 2006-12-12 | 2007-12-19 | 英业达股份有限公司 | Soldered ball implanting device |
| CN101150080A (en) * | 2006-09-21 | 2008-03-26 | 伟创力电子科技（上海）有限公司 | Ball replanting technology for global array encapsulation chip |
| CN101777503A (en) * | 2008-12-03 | 2010-07-14 | 株式会社日立工业设备技术 | Solder ball printer |
| CN102157403A (en) * | 2010-02-11 | 2011-08-17 | 芯讯通无线科技（上海）有限公司 | Multiple chip ball mounting device and method |
| CN102368472A (en) * | 2011-10-28 | 2012-03-07 | 三星半导体(中国)研究开发有限公司 | Ball placement equipment and ball placement method |
-
2012
- 2012-09-18 CN CN201210346219.8A patent/CN102881599B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5787580A (en) * | 1996-11-19 | 1998-08-04 | Lg Information & Communications, Ltd. | Method for making radio-frequency module by ball grid array package |
| CN101150080A (en) * | 2006-09-21 | 2008-03-26 | 伟创力电子科技（上海）有限公司 | Ball replanting technology for global array encapsulation chip |
| CN200993959Y (en) * | 2006-12-12 | 2007-12-19 | 英业达股份有限公司 | Soldered ball implanting device |
| CN101777503A (en) * | 2008-12-03 | 2010-07-14 | 株式会社日立工业设备技术 | Solder ball printer |
| CN102157403A (en) * | 2010-02-11 | 2011-08-17 | 芯讯通无线科技（上海）有限公司 | Multiple chip ball mounting device and method |
| CN102368472A (en) * | 2011-10-28 | 2012-03-07 | 三星半导体(中国)研究开发有限公司 | Ball placement equipment and ball placement method |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103252552A (en) * | 2013-04-02 | 2013-08-21 | 深圳市卓茂科技有限公司 | Automatic ball mounter for BGAs (ball grid arrays) |
| CN103231138A (en) * | 2013-05-08 | 2013-08-07 | 无锡江南计算技术研究所 | Ball grid array (BGA) balling single-point repair method |
| CN103231138B (en) * | 2013-05-08 | 2015-10-07 | 无锡江南计算技术研究所 | BGA plants ball single-point repair method |
| CN105081497A (en) * | 2015-07-17 | 2015-11-25 | 伟创力电子技术(苏州)有限公司 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
| CN106098575A (en) * | 2016-06-23 | 2016-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
| CN106098575B (en) * | 2016-06-23 | 2018-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
| CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
| CN110931372A (en) * | 2019-11-28 | 2020-03-27 | 廖文明 | Ball forming and ball planting method for BGA chip printing solder paste |
| CN115008878A (en) * | 2022-06-17 | 2022-09-06 | 西安微电子技术研究所 | Tin paste printing device and method for BTC packaging device for repair |
| CN115458420A (en) * | 2022-09-16 | 2022-12-09 | 惠州市则成技术有限公司 | Ball mounting process for IC carrier plate |
| CN115458420B (en) * | 2022-09-16 | 2024-04-02 | 惠州市则成技术有限公司 | Ball mounting process of IC carrier plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102881599B (en) | 2016-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102881599A (en) | Ball attachment process for ball grid array | |
| CN103406629B (en) | Full-automatic vertical inductance component tin soldering machine | |
| CN102415225B (en) | Process for production of circuit board | |
| CN205406943U (en) | Full -automatic LD chip eutectic device | |
| CN209517675U (en) | A kind of pcb board automatic soldering machine | |
| CN103317200A (en) | Welding method and jig for adhering lead on circuit board | |
| CN107872928A (en) | A kind of LED module copper post, copper post pad, the welding method of web plate and copper post | |
| CN108188535A (en) | A kind of mobile phone camera module group welding fixture and its welding charging method | |
| CN207824302U (en) | A kind of auxiliary welding equipment of circuit board | |
| CN105336633A (en) | Ball mounting tool for BGA chip | |
| CN104378926B (en) | PoP chips integrate jig and its application method | |
| CN104576426A (en) | Mounting method of flip chip and wafer level chip and mounting jig set | |
| CN103871915B (en) | Manually BGA ball attachment machine | |
| CN204160014U (en) | A kind of environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants ball tool | |
| CN203401175U (en) | Full-automatic vertical type inductor soldering machine | |
| CN103100775A (en) | Ball grid array (BGA) - printed circuit board (PCB) relative position adjustment system | |
| CN204315569U (en) | Flip-chip and wafer stage chip attachment tool group | |
| CN102581410A (en) | Soldering process for diode chip | |
| CN105870027A (en) | Ball mounting tool for BGA chips | |
| CN202603054U (en) | BGA-PCB relative-position adjustment system in BGA repair work station | |
| CN207077059U (en) | A kind of tin soldering machine made for remote control | |
| CN107708329A (en) | The method that BGA plants ball and assembling is realized in a kind of once backflow simultaneously | |
| CN102990183B (en) | Method for transferring paste soldering flux in process of repairing ball grid array (BGA) device | |
| CN208738287U (en) | A kind of novel fixed device of LED charactrons digital screen production | |
| CN207239357U (en) | One kind spray tin nozzle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Huimin Inventor after: Peng Yongqiang Inventor before: Huang Qinghua |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: HUANG QINGHUA TO: LIU HUIMIN PENG YONGQIANG |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 |