CN204315569U - Flip-chip and wafer stage chip attachment tool group - Google Patents
Flip-chip and wafer stage chip attachment tool group Download PDFInfo
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- CN204315569U CN204315569U CN201520025745.3U CN201520025745U CN204315569U CN 204315569 U CN204315569 U CN 204315569U CN 201520025745 U CN201520025745 U CN 201520025745U CN 204315569 U CN204315569 U CN 204315569U
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Abstract
The utility model discloses a kind of flip-chip and wafer stage chip attachment tool group, comprising: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate, and the tin cream printing steel plate be extruded to shape for print solder paste and to weld-aiding cream.The attaching method of the utility model flip-chip and wafer stage chip and attachment tool group, can first print a certain amount of weld-aiding cream, make weld-aiding cream shape quantitatively again when printing tin cream, be convenient to adopt conventional surface chip mounter to carry out surface mount to flip-chip and wafer-level packaging chip, do not need special mounting device.
Description
Technical field
The utility model relates to flip-chip and wafer stage chip attachment tool group.
Background technology
In response on market for the demand that electronic product is compact, microsize flip-chip (Flip Chip) and wafer-level packaging chip (WLCSP) should accumulate and give birth to, and flip-chip and wafer-level packaging chip attachment cannot be produced with traditional tin cream processing procedure, need special equipment to mount, production cost is high.
The general method to flip-chip or wafer-level packaging chip attachment and step are mainly at present:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) paste solder printing: the printing of tin cream steel mesh is carried out to IC support plate, flip-chip or wafer-level packaging chip place do not stamp tin cream;
3) liquid scaling powder is picked again by special mounting device paster after flip-chip or the first contraposition of wafer-level packaging chip;
4) conventional surface chip mounter is used to carry out other element pasters;
5) Reflow Soldering is crossed;
6) bottom glue (Under Fill) is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
Above-mentioned general operational method has following defect:
(1) special mounting device investment amount is quite high, but often every sheet IC support plate needs the flip-chip that mounts and wafer-level packaging number of chips few, cause equipment mobility quite low, equipment investment is reclaimed not easily;
(2) liquid scaling powder picks its attached work amount uncontrollable, especially picking after scaling powder cannot contraposition, therefore must before picking liquid scaling powder leading contraposition again row pick row attachment again after liquid scaling powder, liquid scaling powder easily pollutes patch device and causes and safeguard that cleaning cost increases in the process;
(3) because the liquid scaling powder amount of picking cannot strictly control, therefore Reflow Soldering must be cleaned after completing, to reduce the residual of scaling powder; But after flip-chip and wafer-level packaging chip positioning, very little with the spacing of support plate, cleaning not easily, space will be produced by causing the coated processing procedure of bottom filler that causes of welding assisted agent residuals, element running adstante febre may produce gas explosion phenomenon, there is the problem of assembly reliability to produce, and affect by this, make the dynamical mode of production also be difficult to realize.
Utility model content
The purpose of this utility model is to provide a kind of flip-chip and wafer stage chip attachment tool group, can first print a certain amount of weld-aiding cream, make weld-aiding cream shape quantitatively again when printing tin cream, be convenient to adopt conventional surface chip mounter to carry out surface mount to flip-chip and wafer-level packaging chip, do not need special mounting device.
For achieving the above object, the utility model provides a kind of flip-chip and wafer stage chip attachment tool group, comprise: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate, and the tin cream printing steel plate be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate and is comprised weld-aiding cream Printing Zone, and be provided with weld-aiding cream printing hole in described weld-aiding cream Printing Zone, the steel plate thickness of described weld-aiding cream Printing Zone is 0.06mm;
Described tin cream is printed steel plate and is comprised: paste solder printing district, and prints corresponding weld-aiding cream shaping area, weld-aiding cream Printing Zone on steel plate with weld-aiding cream;
Paste solder printing hole is provided with in described paste solder printing district;
Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole in described weld-aiding cream shaping area to shape hole, the height (degree of depth) in described weld-aiding cream sizing hole is 0.05mm.
The utility model also provides the attaching method of flip-chip and wafer stage chip, it uses above-mentioned flip-chip and wafer stage chip attachment tool group, and comprises the steps:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) use weld-aiding cream to print steel plate and print a certain amount of weld-aiding cream in advance;
3) tin cream is used to print steel plate print solder paste, while print solder paste, utilize weld-aiding cream sizing hole to be extruded to shape to the weld-aiding cream printed, the weld-aiding cream that weld-aiding cream is shaped in hole is uniformly distributed, and unnecessary weld-aiding cream is extruded weld-aiding cream sizing hole and removes, leaving the weld-aiding cream that sizing is quantitative;
4) conventional surface chip mounter is used to carry out other elements and flip-chip or wafer-level packaging chip attachment;
5) Reflow Soldering is crossed;
6) bottom glue is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
Preferably, described step 2) and step 3) carry out on different print stations.
Advantage of the present utility model and beneficial effect are: the attaching method and the attachment tool group that provide a kind of flip-chip and wafer stage chip, can first print a certain amount of weld-aiding cream, make weld-aiding cream shape quantitatively again when printing tin cream, be convenient to adopt conventional surface chip mounter to carry out surface mount to flip-chip and wafer-level packaging chip, do not need special mounting device.
After IC support plate top tray is fixing, printing weld-aiding cream and print solder paste need prepare two print stations, First print station uses weld-aiding cream print steel plate and print a certain amount of weld-aiding cream in advance, second print station use tin cream print steel plate print solder paste and weld-aiding cream is shaped quantitatively, then transferring load to conventional patch machine and carry out paster operation; Flip-chip or wafer-level packaging chip attachment only use a chip mounter carry out and do not need special patch device, reduce the input of special equipment by this, again through normal reflux weldering after paster completes, complete attachment operation.
Weld-aiding cream prints steel plate to print a certain amount of weld-aiding cream, the steel plate of weld-aiding cream Printing Zone need be thinned to desired thickness; Printing weld-aiding cream thickness the best of flip-chip and wafer-level packaging chip is 0.05mm, and for meeting weld-aiding cream demand, the steel plate thickness of weld-aiding cream Printing Zone is 0.06mm.
The computing formula that weld-aiding cream prints volume is: V=S × N × T;
Wherein, V is that weld-aiding cream prints volume, and S is that weld-aiding cream prints steel plate perforate (printing hole) area, and N is that weld-aiding cream prints steel plate number of aperture, and T is the steel plate thickness that weld-aiding cream prints steel plate Printing Zone.
Described tin cream prints steel plate when print solder paste, and the pressure of scraper, except print solder paste, also can extrude the weld-aiding cream in weld-aiding cream sizing hole, the weld-aiding cream that weld-aiding cream is shaped in hole is uniformly distributed, unnecessary weld-aiding cream is extruded weld-aiding cream sizing hole, and is removed, and leaves the weld-aiding cream that sizing is quantitative.Weld-aiding cream shaping area is remained weld-aiding cream after printing steel plate printing and cleans by tin cream, can reuse.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that the utility model weld-aiding cream prints steel plate;
Fig. 2 is the schematic diagram that the utility model tin cream prints steel plate.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection range of the present utility model with this.
The technical scheme that the utility model is specifically implemented is:
As shown in Figure 1 and Figure 2, the utility model provides a kind of flip-chip and wafer stage chip attachment tool group, comprise: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate A0, and the tin cream printing steel plate B0 be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate A0 and is comprised weld-aiding cream Printing Zone A1, and be provided with weld-aiding cream printing hole A2 in described weld-aiding cream Printing Zone A1, the steel plate thickness of described weld-aiding cream Printing Zone A1 is 0.06mm;
Described tin cream is printed steel plate B0 and is comprised: paste solder printing district B1, and prints the corresponding weld-aiding cream shaping area B2 of weld-aiding cream Printing Zone A1 on steel plate A0 with weld-aiding cream;
Paste solder printing hole B3 is provided with in described paste solder printing district B1;
Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole A2 in described weld-aiding cream shaping area B2 to shape hole B4, the height (degree of depth) of described weld-aiding cream sizing hole B4 is 0.05mm.
The utility model also provides the attaching method of flip-chip and wafer stage chip, it uses above-mentioned flip-chip and wafer stage chip attachment tool group, and comprises the steps:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) use weld-aiding cream to print steel plate A0 and print a certain amount of weld-aiding cream in advance;
3) tin cream is used to print steel plate B0 print solder paste, while print solder paste, utilize weld-aiding cream sizing hole B4 to be extruded to shape to the weld-aiding cream printed, the weld-aiding cream that weld-aiding cream is shaped in the B4 of hole is uniformly distributed, unnecessary weld-aiding cream extruded weld-aiding cream sizing hole B4 and remove, leaving the weld-aiding cream that sizing is quantitative;
4) conventional surface chip mounter is used to carry out other elements and flip-chip or wafer-level packaging chip attachment;
5) Reflow Soldering is crossed;
6) bottom glue is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
Described step 2) and step 3) carry out on different print stations.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (1)
1. flip-chip and wafer stage chip attachment tool group, is characterized in that, comprising: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate, and the tin cream printing steel plate be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate and is comprised weld-aiding cream Printing Zone, and be provided with weld-aiding cream printing hole in described weld-aiding cream Printing Zone, the steel plate thickness of described weld-aiding cream Printing Zone is 0.06mm;
Described tin cream is printed steel plate and is comprised: paste solder printing district, and prints corresponding weld-aiding cream shaping area, weld-aiding cream Printing Zone on steel plate with weld-aiding cream;
Paste solder printing hole is provided with in described paste solder printing district;
Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole in described weld-aiding cream shaping area to shape hole, the height in described weld-aiding cream sizing hole is 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520025745.3U CN204315569U (en) | 2015-01-15 | 2015-01-15 | Flip-chip and wafer stage chip attachment tool group |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520025745.3U CN204315569U (en) | 2015-01-15 | 2015-01-15 | Flip-chip and wafer stage chip attachment tool group |
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| Publication Number | Publication Date |
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| CN204315569U true CN204315569U (en) | 2015-05-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576426A (en) * | 2015-01-15 | 2015-04-29 | 苏州市易德龙电器有限公司 | Mounting method of flip chip and wafer level chip and mounting jig set |
| CN110739228A (en) * | 2019-10-25 | 2020-01-31 | 扬州万方电子技术有限责任公司 | method for quickly mounting BGA chip |
-
2015
- 2015-01-15 CN CN201520025745.3U patent/CN204315569U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576426A (en) * | 2015-01-15 | 2015-04-29 | 苏州市易德龙电器有限公司 | Mounting method of flip chip and wafer level chip and mounting jig set |
| CN110739228A (en) * | 2019-10-25 | 2020-01-31 | 扬州万方电子技术有限责任公司 | method for quickly mounting BGA chip |
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Address after: Chun Hing Road Xiangcheng District Economic Development Zone in Suzhou City, Jiangsu Province, No. 50 215000 Patentee after: Suzhou eTron Polytron Technologies Inc Address before: Chun Hing Road Xiangcheng District Economic Development Zone in Suzhou City, Jiangsu Province, No. 6 215000 Patentee before: Suzhou Etron Electronics Co.,Ltd |