CN103763868A - Method for soldering 0201 capacitor row - Google Patents
Method for soldering 0201 capacitor row Download PDFInfo
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- CN103763868A CN103763868A CN201410031871.XA CN201410031871A CN103763868A CN 103763868 A CN103763868 A CN 103763868A CN 201410031871 A CN201410031871 A CN 201410031871A CN 103763868 A CN103763868 A CN 103763868A
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- steel mesh
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Abstract
The invention provides a method for soldering 0201 capacitor row. The method comprises the steps that scaling powder printing is carried out on a substrate; a steel mesh with holes is used for carrying out soldering paste printing, the positions of the holes of the steel mesh correspond to the position of the 0201 capacitor row which is about to be subjected to soldering paste printing, and areas, corresponding to the printed scaling powder, of the steel mesh is not provided with holes; chip pasting is carried out, chips are pasted on the scaling powder, and the 0201 capacitor row is pasted on the soldering paste; reflow soldering is carried out, so that the chips and the 0201 capacitor row are fixed on the substrate.
Description
Technical field
The present invention relates to integrated antenna package field, more particularly, the present invention relates to a kind of 0201 electric capacity row welding method.
Background technology
Flip chip technology is by array-like, to arrange I/O(I/O on the surface of integrated chip) terminal, chip is directly arranged on substrate in upside-down mounting mode, by the I/O terminal of above-mentioned array-like, is connected to form electrical connection with electrode corresponding on substrate.The bare chip of upside-down mounting and common SMT(surface mounting technology) device is different, its salient point is many, diameter and pitch little, be not suitable for adopting the mode of Printing Paste to weld.
But, in high performance chip packaging, in same packaging body, except bare chip, also have electric capacity or the electric capacity row that filtering is used to need welding on the other hand.Meanwhile, filter capacitor need to adopt soldering paste to weld, and therefore has in process of production two technological processes of print fluxing and soldering paste.
Thus, in batch production, filtered electrical perhaps electric capacity is arranged required soldering paste and is adopted the mode of printing to provide, and the required scaling powder of bare chip adopts the mode dipping to provide substantially, needs special equipment.For print, encapsulate or do not possess the equipment of the function of dipping, adopt the mode of twice printing, realize the distribution of soldering paste and scaling powder; in Solder-Paste Printing process; need guarantee solder paste amounts, prevent the defects such as few tin, rosin joint, the scaling powder of Bing Duiqian road printing is protected.
The shortcoming of prior art is: 1) adopt the mode dipping to distribute scaling powder, need special equipment, input cost is large; 2) need customization special fixture, the cycle is long, is only only applicable to produce in enormous quantities.That is to say, the method for prior art too high cycle of cost for small displacement is produced is oversize.
Summary of the invention
Technical problem to be solved by this invention is for there being above-mentioned defect in prior art, when a kind of solder paste amounts when guaranteeing 0201 electric capacity typesetting and printing brush is provided, improves the qualification rate of 0201 electric capacity row welding and the method for reliability.
According to the present invention, a kind of 0201 electric capacity row welding method is provided, it comprises:
First step: carry out scaling powder printing on substrate;
Second step: adopt the steel mesh that is formed with perforate to carry out Solder-Paste Printing, wherein the position of opening of steel mesh is put corresponding to 0201 electric capacity ranking that will Printing Paste, and do not form perforate in the corresponding region of the scaling powder with printing of steel mesh;
Third step: carry out paster, pasting chip mount 0201 electric capacity row on soldering paste on scaling powder;
The 4th step: carry out reflow soldering, to make chip and 0201 electric capacity row be fixed to substrate.
Preferably, in a side relative with substrate of steel mesh, the corresponding region of the scaling powder with printing of steel mesh is formed with groove; The position corresponding with position will Printing Paste steel mesh is formed with perforate; And in the side deviating from substrate of steel mesh, in the regional extent of perforate, be formed with groove.
Preferably, the size of the perforate of steel mesh on the length direction along soldering paste pad is larger than the length of soldering paste pad.
Preferably, the size of the perforate of steel mesh on the length direction along soldering paste pad is 1.05 times of length of soldering paste pad.
Preferably, in second step, the steel mesh that is formed with perforate is arranged on the substrate that is printed with scaling powder, scaling powder is contained in the groove of a side relative with substrate, and in perforate, fill soldering paste, and remove steel mesh fill full weld cream in perforate after, the soldering paste in perforate is retained on the soldering paste pad of substrate.
Preferably, in first step, adopt paste soldering flux on substrate, to carry out scaling powder printing.
The present invention is by improving steel mesh opening mode, and the deposition while having guaranteed Solder-Paste Printing has been implemented protection to the scaling powder of printing simultaneously, can prevent scolding tin bridging at increase steel mesh opening simultaneously.The print that the present invention is particularly suitable in Flip-Chip Using is produced or small lot batch manufacture.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily to the present invention, there is more complete understanding and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the flow chart of 0201 electric capacity row welding method according to the preferred embodiment of the invention.
Fig. 2 schematically shows the perforate inscribe figure of the steel mesh that 0201 electric capacity row welding method adopts according to the preferred embodiment of the invention.
Fig. 3 schematically shows the schematic diagram of 0201 electric capacity row welding method according to the preferred embodiment of the invention.
Fig. 4 schematically shows the detailed maps of 0201 electric capacity row welding method according to the preferred embodiment of the invention.
It should be noted that, accompanying drawing is used for illustrating the present invention, and unrestricted the present invention.Note, the accompanying drawing that represents structure may not be to draw in proportion.And in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Fig. 1 schematically shows the flow chart of 0201 electric capacity row welding method according to the preferred embodiment of the invention.
Specifically, as shown in Figure 1,0201 electric capacity row welding method comprises according to the preferred embodiment of the invention:
First step S1: adopt for example paste soldering flux to carry out scaling powder 200 on substrate 100 and print; After this, preferably check printing quality with the scaling powder of guaranteeing printing evenly, foreign, without bubble;
Second step S2: adopt the steel mesh 300 that is formed with perforate to carry out Solder-Paste Printing, wherein the position of opening of steel mesh is put corresponding to 0201 electric capacity ranking that will Printing Paste, and does not form perforate (thereby the scaling powder of protection printing is unaffected) in the corresponding region of the scaling powder with printing of steel mesh; After this, preferably check solder paste deposits amount and guarantee that soldering paste is not offset, and before guaranteeing, the scaling powder shape of printing is intact;
Specifically, Fig. 2 schematically shows the perforate inscribe figure of the steel mesh that 0201 electric capacity row welding method adopts according to the preferred embodiment of the invention.With reference to figure 2, the length of perforate is that L, width are W, and the degree of depth is T; For the selection of steel mesh thickness:
Surface mount device soldering paste bonding pad opening, sectional area is greater than 2/3 with lateral area than (that is, (L × W)/[2 × (L+W) × T]), can show that 0201 class component steel mesh thickness should be less than 0.12mm; And the general steel plate thickness >=0.15mm using.Thus, in encapsulation process, push scaling powder when preventing follow-up Solder-Paste Printing, need carry out overleaf etching protection, will specifically describe below.
Specifically, preferably, as shown in Figure 3, in second step S2, the side relative with substrate of steel mesh (while being Printing Paste and a side of substrate contacts), the corresponding region of the scaling powder 10 with printing of steel mesh is formed with groove 11; The position corresponding with position will Printing Paste 20 steel mesh is formed with perforate 21; And the side deviating from substrate of steel mesh (while being Printing Paste not with a side of substrate contacts), in the regional extent 22 of perforate 21, be formed with groove, to make the reduced thickness of the steel mesh in this region, thereby make the height attenuate of the soldering paste of follow-up printing.That is, now, in the situation that can adopting existing steel disc, for meeting filter capacitor (holding row) steel mesh thickness requirement, filter capacitor (holding row) position attenuate
Further, suppose that the soldering paste length of bonding pad on substrate is Y, width is X; For guaranteeing solder paste amounts, steel mesh perforate extends out along its length, and the size with the perforate that makes steel mesh on the length direction along soldering paste pad is greater than soldering paste pad, as shown in Figure 4; So not only can guarantee reflow soldering tin amount but also can the company's of preventing tin.Specifically, as shown in Figure 4, the size of the perforate of steel mesh on the length direction along soldering paste pad is larger than the length of soldering paste pad, preferably, the size of the perforate of steel mesh on the length direction along soldering paste pad is 1.05 times of length of soldering paste pad, can prevent scolding tin bridging increasing steel mesh opening thus simultaneously.
Thus, specifically, for example, second step S2 can comprise such operation, the steel mesh that is formed with perforate is arranged on the substrate that is printed with scaling powder, scaling powder is contained in the groove of a side relative with substrate, and in perforate, fills soldering paste, and remove steel mesh fill full weld cream in perforate after, the soldering paste in perforate is retained on the soldering paste pad of substrate.
Third step S3: carry out paster, pasting chip mount 0201 electric capacity row (for example filter capacitor) on soldering paste on scaling powder; Whether the polarity dots that preferably checks chip after paster is correct, and guarantees that chip and electric capacity are without skew;
The 4th step S4: carry out reflow soldering, to make chip and 0201 electric capacity row be fixed to substrate; Preferably, after reflow soldering, check quality of welding spot (abnormal without skew, rosin joint etc.).
The present invention is under the steel mesh thickness of specifying, and by improving steel mesh opening mode, the deposition while guaranteeing Solder-Paste Printing is implemented protection to the scaling powder of printing simultaneously, can prevent scolding tin bridging at increase steel mesh opening simultaneously.The print that the present invention is particularly suitable in Flip-Chip Using is produced or small lot batch manufacture.
Be understandable that, although the present invention discloses as above with preferred embodiment, but above-described embodiment is not in order to limit the present invention.For any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (6)
1. a 0201 electric capacity row welding method, is characterized in that comprising:
First step: carry out scaling powder printing on substrate;
Second step: adopt the steel mesh that is formed with perforate to carry out Solder-Paste Printing, wherein the position of opening of steel mesh is put corresponding to 0201 electric capacity ranking that will Printing Paste, and do not form perforate in the corresponding region of the scaling powder with printing of steel mesh;
Third step: carry out paster, pasting chip mount 0201 electric capacity row on soldering paste on scaling powder;
The 4th step: carry out reflow soldering, to make chip and 0201 electric capacity row be fixed to substrate.
2. 0201 electric capacity row welding method according to claim 1, is characterized in that, in a side relative with substrate of steel mesh, the corresponding region of the scaling powder with printing of steel mesh is formed with groove; The position corresponding with position will Printing Paste steel mesh is formed with perforate; And in the side deviating from substrate of steel mesh, in the regional extent of perforate, be formed with groove.
3. 0201 electric capacity row welding method according to claim 2, is characterized in that, the size of the perforate of steel mesh on the length direction along soldering paste pad is larger than the length of soldering paste pad.
4. 0201 electric capacity row welding method according to claim 3, is characterized in that, the size of the perforate of steel mesh on the length direction along soldering paste pad is 1.05 times of length of soldering paste pad.
5. 0201 electric capacity row welding method according to claim 2, it is characterized in that, in second step, the steel mesh that is formed with perforate is arranged on the substrate that is printed with scaling powder, scaling powder is contained in the groove of a side relative with substrate, and in perforate, fill soldering paste, and remove steel mesh fill full weld cream in perforate after, the soldering paste in perforate is retained on the soldering paste pad of substrate.
6. 0201 electric capacity row welding method according to claim 1 and 2, is characterized in that, adopts paste soldering flux on substrate, to carry out scaling powder printing in first step.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410031871.XA CN103763868B (en) | 2014-01-23 | 2014-01-23 | A kind of 0201 electric capacity row's welding method |
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| CN201410031871.XA CN103763868B (en) | 2014-01-23 | 2014-01-23 | A kind of 0201 electric capacity row's welding method |
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| CN103763868A true CN103763868A (en) | 2014-04-30 |
| CN103763868B CN103763868B (en) | 2016-11-23 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576426A (en) * | 2015-01-15 | 2015-04-29 | 苏州市易德龙电器有限公司 | Mounting method of flip chip and wafer level chip and mounting jig set |
| CN106954353A (en) * | 2017-05-12 | 2017-07-14 | 郑州云海信息技术有限公司 | A kind of steel mesh method for designing for solving electric capacity missing solder |
| CN107731693A (en) * | 2017-10-16 | 2018-02-23 | 苏州日月新半导体有限公司 | The operational method and its tool of scaling powder |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN109411360A (en) * | 2018-08-29 | 2019-03-01 | 深圳市天毅科技有限公司 | A kind of chip generation method and chip |
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| JPH05111761A (en) * | 1991-10-14 | 1993-05-07 | Mitsubishi Electric Corp | Method for supplying solder |
| US5984166A (en) * | 1997-07-09 | 1999-11-16 | Mask Technology, Inc. | Process for creating fine and coarse pitch solder deposits on printed ciruit boards |
| CN1866487A (en) * | 2005-05-17 | 2006-11-22 | 华为技术有限公司 | Ball mounting method and apparatus for ball grid array packaging substrate |
| CN103303012A (en) * | 2013-05-08 | 2013-09-18 | 无锡江南计算技术研究所 | Resistance-capacitance and bare-chip coplanar printing method |
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2014
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Patent Citations (4)
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| JPH05111761A (en) * | 1991-10-14 | 1993-05-07 | Mitsubishi Electric Corp | Method for supplying solder |
| US5984166A (en) * | 1997-07-09 | 1999-11-16 | Mask Technology, Inc. | Process for creating fine and coarse pitch solder deposits on printed ciruit boards |
| CN1866487A (en) * | 2005-05-17 | 2006-11-22 | 华为技术有限公司 | Ball mounting method and apparatus for ball grid array packaging substrate |
| CN103303012A (en) * | 2013-05-08 | 2013-09-18 | 无锡江南计算技术研究所 | Resistance-capacitance and bare-chip coplanar printing method |
Non-Patent Citations (1)
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| ZX_YSH: "《电子物料特性汇总》", 28 April 2012, 百度文库 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576426A (en) * | 2015-01-15 | 2015-04-29 | 苏州市易德龙电器有限公司 | Mounting method of flip chip and wafer level chip and mounting jig set |
| CN106954353A (en) * | 2017-05-12 | 2017-07-14 | 郑州云海信息技术有限公司 | A kind of steel mesh method for designing for solving electric capacity missing solder |
| CN107731693A (en) * | 2017-10-16 | 2018-02-23 | 苏州日月新半导体有限公司 | The operational method and its tool of scaling powder |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN109411360A (en) * | 2018-08-29 | 2019-03-01 | 深圳市天毅科技有限公司 | A kind of chip generation method and chip |
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| CN103763868B (en) | 2016-11-23 |
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