CN105357900A - PAD design method capable of for eliminating special-shaped SMD component reflow soldering displacement - Google Patents
PAD design method capable of for eliminating special-shaped SMD component reflow soldering displacement Download PDFInfo
- Publication number
- CN105357900A CN105357900A CN201510883218.0A CN201510883218A CN105357900A CN 105357900 A CN105357900 A CN 105357900A CN 201510883218 A CN201510883218 A CN 201510883218A CN 105357900 A CN105357900 A CN 105357900A
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- Prior art keywords
- smd
- pad
- printed circuit
- circuit board
- layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a method for mounting a special-shaped SMD on a printed circuit board. The objective of the invention is to solve the problem of the incapability of an existing SMT to effectively inhibit the displacement of SMDs in reflow soldering. The method comprises the following steps that: a soldering assisting layer is arranged on a pad of the printing circuit board; the soldering assisting layer on the pad of the printing circuit board is coated with solder paste; an SMD is pasted onto the printed circuit board by means of the solder paste; and reflow soldering is performed on the printed circuit board with the SMD. The method is characterized in that the method further comprises the step that the soldering assisting layer is divided into two windows before the pad of the printing circuit board is coated with the solder paste. Since a welding window is divided into a plurality of small windows, and therefore, when reflow soldering is performed on the special-shaped SMD on the printing circuit board, the surface tension of the solder paste is fully resolved, and the component will not move, and therefore, a welding manufacturer can ensure welding quality without taking any measures required.
Description
Technical field
The present invention relates to electronic equipment, specifically provide a kind of and eliminate the PAD method for designing that special-shaped SMD solder reflowing components connects displacement.
Background technology
SMT (SurfaceMountedTechnology), i.e. surface mounting technology is most popular a kind of technology and technique in current Electronic Assemblies industry.SMT generally includes the operations such as Yin Xi, solidification, paster and reflow soldering.When carrying out reflow soldering, if special-shaped SMD (SurfaceMountedDevices, i.e. surface mounted device) there are the length and width of one end pad (pad) more than 300 mils (mil), will phenomenon be subjected to displacement and cause weld defect.Specifically, because the tin cream on pad is when refluxing fusing, the surface tension of element welding end is uneven, and one end that tension force is larger hauls element along rotating bottom it, produces offset phenomena.
At present, the defect that reflow soldering produces is processed producer by SMT and is settled a dispute by the parties concerned themselves, a kind of measure be reduce or change steel mesh opening figure to reduce the coating of solder(ing) paste, another kind of measure puts that glue is fixing to be processed before welding.But the method that this change steel mesh opening figure reduces tin cream coating easily produces rosin joint or dry joint phenomenon, and the complicated procedures putting glue fixing will increase processing cost, extension of the work cycle.Therefore, this area needs a kind of new technical scheme to solve this problem.
Summary of the invention
In order to solve foregoing problems, being the problem that solution existing SMT technique cannot effectively suppress special-shaped SMD to be subjected to displacement when reflow soldering, having the invention provides a kind of method of installing SMD on a printed circuit.The method comprises the following steps: to arrange on the pad of described printed circuit board (PCB) to help layer; The pad of described printed circuit board (PCB) helps solder paste application on layer; By described soldering paste, described SMD is attached on described printed circuit board (PCB); And reflow soldering is carried out to the printed circuit board (PCB) posting described SMD, it is characterized in that, described method comprises further: on the pad of described printed circuit board (PCB) before solder paste application, and the described layer that helps is divided at least two windows.
In the preferred implementation of said method, the length of at least one corresponding pad of described SMD and width are all more than 300 mils.
In the preferred implementation of said method, between each adjacent described window, be provided with spacing of windowing.
In the preferred implementation of said method, described in the window width of spacing be 8 mils.
In the preferred implementation of said method, described in help layer to be divided into two, three or four windows.
In the preferred implementation of said method, described SMD is special-shaped SMD.
In the preferred implementation of said method, described soldering paste is tin cream.
According to a further aspect in the invention, a kind of printed circuit board (PCB) is provided to comprise pad and SMD, described pad is arranged and helps layer, described helping on layer is coated with soldering paste, described SMD is soldered on described pad by described soldering paste, it is characterized in that, described in help layer to be divided at least two windows.
In the preferred implementation of above-mentioned printed circuit board (PCB), the length of at least one corresponding pad of described SMD and width are all more than 300 mils; And/or be provided with spacing of windowing between each adjacent described window; And/or described in the window width of spacing be 8 mils; And/or described in help layer to be divided into two, three or four windows; And/or described SMD is special-shaped SMD; And/or described soldering paste is tin cream.
According to a further aspect of the invention, provide a kind of pad, described pad arranged and helps layer, described in help on layer and be coated with soldering paste, SMD is soldered on described pad by described soldering paste, it is characterized in that, described in help layer to be divided at least two windows.
Those skilled in the art it is easily understood that, because the welding window on pad is divided into multiple wicket, method of the present invention makes, when carrying out reflow soldering to the special-shaped SMD on printed circuit board (PCB) (PCB), the surface tension of scolding tin is fully dissolved, element can not be moved, thus make welding producer just can ensure welding quality without the need to taking any measure.
Accompanying drawing explanation
Fig. 1 is the flow chart that the special-shaped SMD solder reflowing components of elimination according to the present invention connects the PAD method for designing of displacement;
Fig. 2 is the structure chart of welding window according to first embodiment of the invention;
Fig. 3 is the structure chart of welding window second embodiment of the invention;
Fig. 4 is the structure chart of the welding window according to the 3rd execution mode of the present invention.
Embodiment
With reference to the accompanying drawings the preferred embodiment of the present invention is described.One skilled in the art will appreciate that these execution modes only for explaining know-why of the present invention, and not intended to be limits the scope of the invention.Such as, although the application describes in conjunction with SMT, technical scheme of the present invention also can be applied to other any occasions needing to carry out SMD reflow soldering, and this change should not be construed as limiting the invention.
First with reference to Fig. 1, method of installing special-shaped SMD on a printed circuit of the present invention originates in step S10.In step slo, on the pad of printed circuit board (PCB), setting helps layer.This can adopt any known method to realize.Next, in step S20, the described layer that helps is divided into multiple window.This segmentation also can adopt any known method to realize, as long as the welding window on pad can be divided into multiple subregion.Then in step s 30, divided the helping on layer on pad applies tin cream.Then in step s 40, by tin cream, special-shaped SMD is attached on printed circuit board (PCB).Finally, in step s 50, reflow soldering is carried out to the printed circuit board (PCB) posting special-shaped SMD.
Preferably, the length of at least one corresponding with described special-shaped SMD pad and width are all more than 300 mils.This is because, be easy to make when reflow soldering SMD that warpage or displacement occur more than the pad of 300 mils.In addition, preferably, between each adjacent described window, be provided with spacing of windowing, and described in the window width of spacing be at least 8 mils.The spacing of windowing of this size can be separated by welding window well, makes to form large surface tension when reflow soldering.It is further preferred that according to the shape and size of described special-shaped SMD, described in help layer can be divided into two, three, multiple windows of four windows or other any amount.
Next consult Fig. 2,3 and 4, Fig. 2,3 and 4 be the structure chart of the welding window according to each different execution mode of the present invention respectively.Specifically, in the execution mode of Fig. 2, pad is separated into two windows 1 and 2.In the embodiment of fig. 3, pad is separated into three windows 10,20 and 30.In the embodiment illustrated in fig. 4, pad is separated into four windows 10,20,30 and 40.It should be noted that, the pad in Fig. 2-4 and the quantity of window and shape are only given as examples, and those skilled in the art can make adjustment to this as required.
Correspondingly, the present invention also provides a kind of printed circuit board (PCB).This printed circuit board (PCB) comprises pad and special-shaped SMD, described pad is arranged and helps layer, described in help on layer and be coated with tin cream, described special-shaped SMD is soldered on described pad by described tin cream, and described in help layer to be divided at least two windows.Same as above, preferably, the length of at least one corresponding pad of described special-shaped SMD and width are all more than 300 mils.Be provided with spacing of windowing between more preferably each adjacent described window, and described in the window width of spacing be 8 mils.In addition, the present invention also provides a kind of pad, described pad is arranged and helps layer, described in help on layer and be coated with tin cream, special-shaped SMD is welded on described pad by described tin cream, and described in help layer to be divided at least two windows.
Can find out in conjunction with description above, technical scheme of the present invention can be implemented in practice in the following order.First, the packaging information of components and parts is obtained.When choosing components and parts, device producer is with source map for package design reference, if special-shaped SMD device has one end pad length and width all more than 300mil, then when will consider reflow soldering, the impact of bond pad surface tension force, need be optimized design to pad.Secondly, design is optimized to pad.Surface tension is a very important physical concept in solder reflow process, and its existence can cause various weld defect.In SMT produces, element is placed on solder(ing) paste, the surface tension that the moment of tin cream fusing is formed can act on the pad pad of components and parts, concerning chip component, because element weight is very light, if bonding pad area difference is too large, pad thermal capacity is just different, then on pad, tin cream fusing time is inconsistent, and the surface tension produced during tin cream fusing is also inconsistent, one end that tension force is larger hauls element along rotating bottom it, thus causes the generation of device offset phenomena.Pad design is the part of PCB design most critical, which provide a determination the welding position of components and parts on pcb board, is related to manufacturability during reliability and the welding of device welding.Pad design should not make on surface tension undue concentration at one end or one axle of scolding tin, if the power suffered by keeping is balanced, device would not offset relative to pad.Determine must carry out pad optimal design for special-shaped SMD device time, pad layer carries out setting according to device package size or Reference Design, but need layer will be helped to be divided into two, three or four windows, keep 8mil welding resistance spacing between window.That is, when reflow soldering, will be broken down into two, three, a four or more part compared with the surface tension of large bonding pad, the tension force of each several part is all relatively little, components and parts can not be driven to rotate or skew.
Key point of the present invention is when carrying out pad design to special-shaped SMD, layer is helped not to be window routinely, but window (two, three or four) according to the length and width of pad graphics area, the welding resistance interval of 8mil is had between window, when this is interposed between welding, the surface tension of scolding tin is fully dissolved, element is not moved.Welding producer can ensure welding quality without the need to taking any measure.Further, technical scheme of the present invention is done further operation process can produce enforcement without the need to being processed producer, saves processing cost, shortens the process-cycle.
So far, shown by reference to the accompanying drawings preferred implementation describes technical scheme of the present invention, but those skilled in the art are it is easily understood that protection scope of the present invention is obviously not limited to these embodiments.Under the prerequisite not departing from principle of the present invention, those skilled in the art can make equivalent change or replacement to correlation technique feature, and these changes or the technical scheme after replacing it all will fall within protection scope of the present invention.Such as; although describe operating procedure of the present invention according to particular order above; but; do not departing under general principle of the present invention-be about to help layer to be separated into the prerequisite of multiple window; those skilled in the art can adopt any specific order as required or delete in steps or increase extra step, and the technical scheme after adjustment will fall into protection scope of the present invention.
Claims (10)
1. a method of SMD is installed on a printed circuit, comprises the following steps:
The pad of described printed circuit board (PCB) is arranged and helps layer;
The pad of described printed circuit board (PCB) helps solder paste application on layer;
By described soldering paste, described SMD is attached on described printed circuit board (PCB); And
Reflow soldering is carried out to the printed circuit board (PCB) posting described SMD,
It is characterized in that, described method comprises further: on the pad of described printed circuit board (PCB) before solder paste application, and the described layer that helps is divided at least two windows.
2. method of installing SMD on a printed circuit according to claim 1, is characterized in that, the length of at least one corresponding pad of described SMD and width are all more than 300 mils.
3. method of installing SMD on a printed circuit according to claim 2, is characterized in that, is provided with spacing of windowing between each adjacent described window.
4. method of installing SMD on a printed circuit according to claim 3, is characterized in that, described in the window width of spacing be 8 mils.
5. method of installing SMD on a printed circuit according to any one of claim 1 to 4, is characterized in that, described in help layer to be divided into two, three or four windows.
6. method of installing SMD on a printed circuit according to any one of claim 1 to 5, is characterized in that, described SMD is special-shaped SMD.
7. method of installing SMD on a printed circuit according to any one of claim 1 to 6, is characterized in that, described soldering paste is tin cream.
8. printed circuit board (PCB) comprises pad and a SMD, described pad is arranged and helps layer, described in help on layer and be coated with soldering paste, described SMD is soldered on described pad by described soldering paste,
It is characterized in that, described in help layer to be divided at least two windows.
9. printed circuit board (PCB) according to claim 8, is characterized in that:
The length of at least one corresponding pad of described SMD and width are all more than 300 mils; And/or
Spacing of windowing is provided with between each adjacent described window; And/or
The width of described spacing of windowing is 8 mils; And/or
The described layer that helps is divided into two, three or four windows; And/or
Described SMD is special-shaped SMD; And/or
Described soldering paste is tin cream.
10. a pad, described pad is arranged and helps layer, described in help on layer and be coated with soldering paste, SMD is soldered on described pad by described soldering paste,
It is characterized in that, described in help layer to be divided at least two windows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510883218.0A CN105357900A (en) | 2015-12-03 | 2015-12-03 | PAD design method capable of for eliminating special-shaped SMD component reflow soldering displacement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510883218.0A CN105357900A (en) | 2015-12-03 | 2015-12-03 | PAD design method capable of for eliminating special-shaped SMD component reflow soldering displacement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105357900A true CN105357900A (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510883218.0A Pending CN105357900A (en) | 2015-12-03 | 2015-12-03 | PAD design method capable of for eliminating special-shaped SMD component reflow soldering displacement |
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| CN (1) | CN105357900A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587948A (en) * | 2018-12-28 | 2019-04-05 | 维沃移动通信有限公司 | A kind of circuit board arrangement and its processing method |
| CN113597137A (en) * | 2021-08-10 | 2021-11-02 | 苏州维信电子有限公司 | SMT (surface mount technology) component welding method and circuit board product |
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| CN101141855A (en) * | 2007-10-23 | 2008-03-12 | 福建星网锐捷网络有限公司 | Halftone |
| JP2009054969A (en) * | 2007-08-29 | 2009-03-12 | Shinko Electric Ind Co Ltd | Wiring board and manufacturing method thereof |
| CN100473259C (en) * | 2004-04-13 | 2009-03-25 | 纬创资通股份有限公司 | Circuit board assembling method and structure, and tool for assembling said structure |
| CN102378484A (en) * | 2010-08-13 | 2012-03-14 | 雅达电子有限公司 | Method for improving solder joint reliability, printed circuit board, packaging device and packaging module |
-
2015
- 2015-12-03 CN CN201510883218.0A patent/CN105357900A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100473259C (en) * | 2004-04-13 | 2009-03-25 | 纬创资通股份有限公司 | Circuit board assembling method and structure, and tool for assembling said structure |
| JP2009054969A (en) * | 2007-08-29 | 2009-03-12 | Shinko Electric Ind Co Ltd | Wiring board and manufacturing method thereof |
| CN101141855A (en) * | 2007-10-23 | 2008-03-12 | 福建星网锐捷网络有限公司 | Halftone |
| CN102378484A (en) * | 2010-08-13 | 2012-03-14 | 雅达电子有限公司 | Method for improving solder joint reliability, printed circuit board, packaging device and packaging module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587948A (en) * | 2018-12-28 | 2019-04-05 | 维沃移动通信有限公司 | A kind of circuit board arrangement and its processing method |
| CN109587948B (en) * | 2018-12-28 | 2021-02-02 | 维沃移动通信有限公司 | Circuit board device and processing method thereof |
| CN113597137A (en) * | 2021-08-10 | 2021-11-02 | 苏州维信电子有限公司 | SMT (surface mount technology) component welding method and circuit board product |
| CN113597137B (en) * | 2021-08-10 | 2022-08-16 | 苏州维信电子有限公司 | SMT (surface mount technology) component welding method and circuit board product |
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Application publication date: 20160224 |