CN205726673U

CN205726673U - Little board component for mobile phone

Info

Publication number: CN205726673U
Application number: CN201620591963.8U
Authority: CN
Inventors: 王书会
Original assignee: XIANGYANG VIKO TECHNOLOGY Co Ltd
Current assignee: XIANGYANG VIKO TECHNOLOGY Co Ltd
Priority date: 2016-06-17
Filing date: 2016-06-17
Publication date: 2016-11-23
Anticipated expiration: 2026-06-17

Abstract

This utility model belongs to electronic device field, is specifically related to a kind of little board component for mobile phone.This utility model aims to solve the problem that existing SMT technique cannot effectively suppress the problem that SMD is subjected to displacement when reflow soldering.For this purpose, little board component of the present utility model includes the platelet being connected on cell phone mainboard and the SMD being welded on described platelet, it is provided with pad on described platelet, arrange on described pad and help layer, described helping is coated with soldering paste on layer, described SMD is soldered on described pad by described soldering paste, it is characterised in that described in help layer to be divided into multiple window.Owing to pad is divided into multiple wicket, scheme of the present utility model makes, and when the SMD on mobile phone platelet is carried out reflow soldering, the surface tension of scolding tin is fully dissolved, element will not be moved, so that producer is without taking any measure just can ensure welding quality.

Description

Little board component for mobile phone

Technical field

This utility model belongs to electronic device field, is specifically related to a kind of little board component for mobile phone.

Background technology

SMT (Surface Mounted Technology), i.e. surface mounting technique, be in current Electronic Assemblies industry Popular a kind of technology and technique.SMT generally includes the operations such as Yin Xi, solidification, paster and reflow soldering.Carrying out reflow soldering Time, if SMD (Surface Mounted Devices, i.e. surface mount device) has the length and width of one end pad (pad) to exceed 300 mils (mil), will be subjected to displacement phenomenon and cause weld defect.Specifically, molten in backflow due to the tin cream on pad During change, the surface tension of element welding end is uneven, and one end that tension force is bigger hauls element along rotating bottom it, produces displacement existing As.

At present, the defect that reflow soldering produces is processed producer by SMT and is settled a dispute by the parties concerned themselves, and a kind of measure is to reduce or change steel mesh The figure of opening reduces the coating of solder(ing) paste, and another kind of measure is that some glue is fixing before welding to be processed.But, this change steel Net opening figure reduces the method for tin cream coating and easily produces rosin joint or dry joint phenomenon, and the complicated procedures putting glue fixing will Increase processing cost, extension of the work cycle.

Therefore, this area needs a kind of new technical scheme to solve the problems referred to above.

Utility model content

In order to solve the problems referred to above of the prior art, it is solution existing SMT technique and cannot effectively suppress SMD returning The problem being subjected to displacement when fluid welding connects, this utility model provides a kind of little board component for mobile phone.This little board component includes The platelet being connected on cell phone mainboard and the SMD being welded on described platelet, described platelet is provided with pad, on described pad Setting helps layer, described in help and on layer, be coated with soldering paste, described SMD is soldered on described pad by described soldering paste, its Be characterised by, described in help layer to be divided into multiple window.

Above-mentioned in the preferred implementation of the little board component of mobile phone, the length and width of described pad is above 300 mils.

Above-mentioned in the preferred implementation of the little board component of mobile phone, arrange between each adjacent described window Window spacing.

Above-mentioned in the preferred implementation of the little board component of mobile phone, described in the window width of spacing be 8 mils.

Above-mentioned in the preferred implementation of the little board component of mobile phone, described in help layer to be divided into two, three Or four windows.

Above-mentioned in the preferred implementation of the little board component of mobile phone, described SMD is motor and/or mike.

Above-mentioned in the preferred implementation of the little board component of mobile phone, described soldering paste is tin cream.

Above-mentioned in the preferred implementation of the little board component of mobile phone, described platelet is connected to described hands by winding displacement Mainboard.

Skilled addressee readily understands that, owing to pad is divided into multiple wicket, side of the present utility model Case makes, and when the SMD on mobile phone platelet is carried out reflow soldering, the surface tension of scolding tin is fully dissolved so that element is not Can be moved, so that producer is without taking any measure just can ensure welding quality.

Accompanying drawing explanation

Fig. 1 is the structure chart of the welding window of the first embodiment of the present utility model；

Fig. 2 is the structure chart of the welding window of the second embodiment of the present utility model；

Fig. 3 is the structure chart of the welding window of the 3rd embodiment of the present utility model.

Detailed description of the invention

Preferred implementation of the present utility model is described with reference to the accompanying drawings.Skilled artisan would appreciate that It is that these embodiments are used only for explaining know-why of the present utility model, it is not intended that limit protection of the present utility model Scope.

Little board component for mobile phone of the present utility model includes the platelet being connected on cell phone mainboard and is welded to described SMD on platelet, wherein said platelet is connected on described cell phone mainboard by winding displacement, and described platelet is provided with pad, institute Stating to arrange on pad and help layer, this can use any known method to realize.Described helping is coated with soldering paste on layer, institute State SMD to be soldered on described pad by described soldering paste, and described in help layer to be divided into multiple window.Specifically, this Planting segmentation can use any known method to realize, as long as the welding window on pad can be divided into many sub regions i.e. Can.Preferably, the length and width of described pad is above 300 mils.It is further preferred that each adjacent described window it Between be both provided with spacing of windowing, and described in the window width of spacing be 8 mils.The spacing of windowing of this size can be well Welding window is separated so that big surface tension cannot be formed when reflow soldering.It is further preferred that according to described The shape and size of SMD, described in help layer can be divided into two, three, four windows or other are any number of many Individual window.Refering to Fig. 1,2 and 3, Fig. 1,2 and 3 are the welding window according to each different embodiments of the present utility model respectively Structure chart.Specifically, in the embodiment of figure 1, pad is divided into two windows 1 and 2.In the embodiment of Fig. 2, Pad is divided into three windows 10,20 and 30.In the embodiment of fig. 3, pad be divided into four windows 100,200, 300 and 400.It should be noted that pad in Fig. 1-3 and the quantity of window and shape are merely possible to what example provided, this This can be made adjustment by skilled person as required.It should be noted that SMD described above is motor or Mike Wind.

The key point of utility model is that helping layer is not to window routinely when SMD carries out pad design, but according to The length and width of pad graphics area are windowed (two, three or four), have the welding resistance of 8mil to be spaced between window, and this is spaced in weldering When connecing, the surface tension of scolding tin is fully dissolved so that element is not moved.Welding producer is without taking any measure Welding quality can be ensured.Further, the technical solution of the utility model is done further operation process without being processed producer Produce and implement, save processing cost, shorten the process-cycle

So far, describe the technical solution of the utility model already in connection with preferred implementation shown in the drawings, but, this Skilled person is it is easily understood that protection domain of the present utility model is expressly not limited to these detailed description of the invention.? On the premise of principle of the present utility model, correlation technique feature can be made the change of equivalent by those skilled in the art Or replace, within these changes or the technical scheme after replacing it fall within protection domain of the present utility model.

Claims

1., for a little board component for mobile phone, this little board component includes the platelet being connected on cell phone mainboard and is welded to described SMD on platelet, described platelet is provided with pad, described pad is arranged and helps layer, described in help and on layer, be coated with weldering Cream, described SMD is soldered on described pad by described soldering paste,

It is characterized in that, described in help layer to be divided into multiple window.

Little board component for mobile phone the most according to claim 1, it is characterised in that the length and width of described pad is all More than 300 mils.

Little board component for mobile phone the most according to claim 2, it is characterised in that between each adjacent described window It is both provided with spacing of windowing.

Little board component for mobile phone the most according to claim 3, it is characterised in that described in the window width of spacing be 8 Mil.

Little board component for mobile phone the most according to any one of claim 1 to 4, it is characterised in that described in help layer It is divided into two, three or four windows.

Little board component for mobile phone the most according to claim 5, it is characterised in that described SMD is motor and/or Mike Wind.

Little board component for mobile phone the most according to claim 6, it is characterised in that described soldering paste is tin cream.

Little board component for mobile phone the most according to claim 7, it is characterised in that described platelet is connected to by winding displacement Described cell phone mainboard.