CN105307384A - Method used for improving heat radiating capability of integrated chip - Google Patents
Method used for improving heat radiating capability of integrated chip Download PDFInfo
- Publication number
- CN105307384A CN105307384A CN201510581853.3A CN201510581853A CN105307384A CN 105307384 A CN105307384 A CN 105307384A CN 201510581853 A CN201510581853 A CN 201510581853A CN 105307384 A CN105307384 A CN 105307384A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- bonding pad
- dissipation bonding
- heat radiating
- green oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
Abstract
The invention relates to a method used for improving the heat radiating capability of an integrated chip. The method comprises the steps of PCB design, PCB green oil processing and PCBA welding. At the stage of PCB design, a first heat radiating pad is arranged at the bottom of the integrated chip; a second heat radiating pad is arranged at a corresponding position at the top of a PCB, wherein the first heat radiating pad is welded at the position; a third heat radiating pad is arranged at a position corresponding to the second heat radiating pad, wherein the position is at the bottom of the PCB; and the second heat radiating pad is connected with the third heat radiating pad through through holes. At the stage of PCB green oil processing, when green oil processing is carried out on the second heat radiating pad and the through holes in the second heat radiating pad, green oil is not printed; when green oil processing is carried out on the third heat radiating pad, green oil is not printed; and when green oil processing is carried out on the through hole in the third heat radiating pad, half taphole design is carried out. At the stage of PCBA welding, steel net window design is carried out on the second heat radiating pad; solder paste is printed on the second heat radiating pad; the first heat radiating pad and the second heat radiating pad are connected through reflow welding; steel net window design is carried out on the third heat radiating pad; and solder paste is printed on the third heat radiating pad.
Description
Technical field
The present invention relates to integrated chip design field, more specifically, relate to a kind of method improving integrated chip heat-sinking capability.
Background technology
At present along with integrated chip develop rapidly, integrated chip needs to realize greater functionality; Therefore this just needs integrated chip to have better heat-sinking capability, ensures the reliability of chip; Ensure the manufacturability of the reliability that chip welds with PCB and PCBA again simultaneously; Current integrated chip heat radiation is achieved by the following scheme, specifically as shown in Figure 1:
One, PCB design: arrange the first heat dissipation bonding pad in the bottom of integrated chip, then at the top of PCB, the position that the first heat dissipation bonding pad is corresponding arranges the second heat dissipation bonding pad, then arranges the 3rd heat dissipation bonding pad in the bottom of PCB; Second heat dissipation bonding pad is connected with the 3rd heat dissipation bonding pad by via;
Two, PCB processing: or not during via green oil printing to the second heat dissipation bonding pad, the 3rd heat dissipation bonding pad and connection, second and third heat dissipation bonding pad and via all do not have green oil;
Three, PCBA welding: make steel mesh to the second heat dissipation bonding pad and to window design, print solder paste on the second heat dissipation bonding pad, is connected with the second heat dissipation bonding pad chip by reflow soldering realization.
But, said method in use, owing to there is not green oil in via, tin cream now on the second heat dissipation bonding pad easily enters in via, causes chips welding to produce rosin joint, and the tin cream simultaneously on the second heat dissipation bonding pad is easily through via, the 3rd heat dissipation bonding pad or the 3rd heat dissipation bonding pad face, place formed tin sweat(ing), cause face, the place out-of-flatness of the 3rd heat dissipation bonding pad, affect the print reliability of PCBA, such scheme does not also realize the maximization of chip cooling in addition.
Summary of the invention
The present invention is the defect solving above prior art, provide a kind of method improving integrated chip heat-sinking capability, the method can improve the radiating effect of integrated chip, solve the second heat dissipation bonding pad and easily leak in tin to via the difficult problem causing integrated chip welding to make generation rosin joint when reflow soldering, and solve the second heat dissipation bonding pad easily produce when reflow soldering tin sweat(ing), leak tin cause the 3rd heat dissipation bonding pad place face out-of-flatness, affect the technical barrier of PCBA print reliability.
For realizing above goal of the invention, the technical scheme of employing is:
Improve a method for integrated chip heat-sinking capability, comprise the following steps:
One, the PCB design stage: the first heat dissipation bonding pad is set in the bottom of integrated chip, the correspondence position carrying out welding at PCB top with the first heat dissipation bonding pad again arranges the second heat dissipation bonding pad, the position corresponding to the second heat dissipation bonding pad bottom PCB is provided with the 3rd heat dissipation bonding pad, and the second heat dissipation bonding pad is connected with the 3rd heat dissipation bonding pad by via;
Two, the PCB green oil process segment:
A) not green oil printing in man-hour is added to the via green oil on the second heat dissipation bonding pad and the second heat dissipation bonding pad;
B) not green oil printing in man-hour is added to the 3rd heat dissipation bonding pad green oil, and the via green oil on the 3rd heat dissipation bonding pad is added do half jack designs man-hour;
Three, PCBA welds the stage:
A) make steel mesh to the second heat dissipation bonding pad to window design, print solder paste on the second heat dissipation bonding pad, then makes the first heat dissipation bonding pad realize being connected by reflow soldering with the second heat dissipation bonding pad;
B) make steel mesh to the 3rd heat dissipation bonding pad to window design, then print solder paste on the 3rd heat dissipation bonding pad.
In such scheme, not green oil printing in man-hour is added to the 3rd heat dissipation bonding pad green oil, and the via green oil on the 3rd heat dissipation bonding pad is added do half jack designs man-hour, so partly fill in green oil in via, therefore when carrying out reflow soldering to the first heat dissipation bonding pad and the second heat dissipation bonding pad, the tin cream of the second heat dissipation bonding pad can not enter in via and cause integrated chip rosin joint, simultaneously, the tin sweat(ing) that produces on the whole that the tin cream of the second heat dissipation bonding pad can not enter into the 3rd heat dissipation bonding pad causes plane out-of-flatness, affect the manufacturability of PCBA welding, and by print solder paste on three heat dissipation bonding pads, the 3rd heat dissipation bonding pad and tin cream is then made to define gun-metal, which increase the volume of heat radiation carrier, so method provided by the invention can reach the object improving chip cooling ability.
Compared with prior art, the invention has the beneficial effects as follows:
1) integrated chip radiating effect is improved;
2) integrated chip useful life is improved;
3) reliability (the second heat dissipation bonding pad leaks in tin to via and causes chips welding rosin joint) of chip and heat dissipation bonding pad is solved;
4) PCBA manufacturability (produce tin sweat(ing), leakage tin causes the out-of-flatness of PCB bottom surface, affect the reliability of PCBA printing) is solved.
Accompanying drawing explanation
Fig. 1 is the implementation process schematic diagram of existing chip cooling scheme.
Fig. 2 is the implementation process schematic diagram of chip radiation method provided by the invention.
Fig. 3 is the schematic diagram of steel mesh partial thickening.
Fig. 4 is the implementing procedure figure of chip radiation method provided by the invention.
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
Below in conjunction with drawings and Examples, the present invention is further elaborated.
Embodiment 1
As shown in Figure 2,4, the method for raising integrated chip heat-sinking capability provided by the invention comprises the following steps:
One, the PCB design stage: the first heat dissipation bonding pad 2 is set in the bottom of integrated chip 1, the correspondence position carrying out welding at PCB top with the first heat dissipation bonding pad 2 again arranges the second heat dissipation bonding pad 3, the position corresponding to the second heat dissipation bonding pad 3 bottom PCB is provided with the 3rd heat dissipation bonding pad 4, second heat dissipation bonding pad 3 and is connected with the 3rd heat dissipation bonding pad 4 by via 5;
Two, the PCB process segment:
A) not green oil printing in man-hour is added to cooking green oil during via 5 green oil printing on the second heat dissipation bonding pad 3 and the second heat dissipation bonding pad 3;
B) cooking green oil to the 3rd heat dissipation bonding pad 4, to add the via 5 green oil processing of man-hour not on green oil printing, the 3rd heat dissipation bonding pad 4 be do half consent to make;
Three, PCBA welds the stage:
A) make steel mesh 6 to the second heat dissipation bonding pad 3 to window design, print solder paste 7 on the second heat dissipation bonding pad 3, then makes the first heat dissipation bonding pad 2 realize being connected by reflow soldering with the second heat dissipation bonding pad 3;
B) make steel mesh 6 to the 3rd heat dissipation bonding pad 4 to window design, then print solder paste 7 on the 3rd heat dissipation bonding pad 4.
In such scheme, not green oil printing in man-hour is added to the 3rd heat dissipation bonding pad 4 green oil, and via 5 green oil on the 3rd heat dissipation bonding pad 4 is added do half jack designs man-hour, so partly fill in green oil in via 5, therefore when carrying out reflow soldering to the first heat dissipation bonding pad 2 and the second heat dissipation bonding pad 3, the tin cream 7 of the second heat dissipation bonding pad 3 can not enter in via 5 and cause integrated chip 1 rosin joint, simultaneously, the tin sweat(ing) that produces on the whole that the tin cream 7 of the second heat dissipation bonding pad 3 can not enter into the 3rd heat dissipation bonding pad 4 causes plane out-of-flatness, affect the manufacturability of PCBA welding, and by print solder paste 7 on three heat dissipation bonding pads, the 3rd heat dissipation bonding pad 4 is then made to define gun-metal with tin cream 7, which increase the volume of heat radiation carrier, so method provided by the invention can reach the object improving chip cooling ability.
In the present embodiment, on the 3rd heat dissipation bonding pad 4 during print solder paste 7, first calculate tin cream 7 thickness of required printing on the 3rd heat dissipation bonding pad 4 according to the actual requirement of heat radiation, then carry out steel mesh 6 particular design, specific as follows:
If tin cream 7 thickness of required printing is lower than the face, place of the 3rd heat dissipation bonding pad 4, then make steel mesh 6 consistency of thickness that tin cream 7 thickness is corresponding with the 3rd heat dissipation bonding pad 4; If tin cream 7 thickness of required printing is higher than the face, place of the 3rd heat dissipation bonding pad 4, then steel mesh 6 needs to make ladder steel mesh 6 and designs, as shown in Figure 3, if when tin cream 7 thickness of required printing is lower than H1, then make tin cream 7 Thickness Design be H1, wherein H1 represents the thickness in the 3rd face, heat dissipation bonding pad 4 place; If when tin cream 7 thickness of required printing is higher than H1, then steel mesh 6 needs to make ladder steel mesh 6 and designs, namely H is brought up in steel mesh 6 Thickness Design of the 3rd heat dissipation bonding pad 4 correspondence local, be specially steel mesh 6 partial thickening making the 3rd heat dissipation bonding pad 4 correspondence, when concrete enforcement, the thickness (H-H1) that steel mesh 6 partial thickening increases is no more than 0.06mm.The scope of H1 exists: between 0.05 ~ 0.2mm.
Compared with prior art, the invention has the beneficial effects as follows:
1) integrated chip radiating effect is improved;
2) integrated chip useful life is improved;
3) reliability (the second heat dissipation bonding pad leaks in tin to via and causes chips welding rosin joint) of chip and heat dissipation bonding pad is solved;
4) PCBA manufacturability (produce tin sweat(ing), leakage tin causes the out-of-flatness of PCB bottom surface, affect the reliability of PCBA printing) is solved.
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.All any amendments done within the spirit and principles in the present invention, equivalent to replace and improvement etc., within the protection range that all should be included in the claims in the present invention.
Claims (3)
1. improve a method for integrated chip heat-sinking capability, it is characterized in that: comprise the following steps:
One, the PCB design stage:
In the bottom of integrated chip, the first heat dissipation bonding pad is set, the correspondence position carrying out welding at PCB top with the first heat dissipation bonding pad again arranges the second heat dissipation bonding pad, the position corresponding to the second heat dissipation bonding pad bottom PCB is provided with the 3rd heat dissipation bonding pad, and the second heat dissipation bonding pad is connected with the 3rd heat dissipation bonding pad by via;
Two, the PCB green oil process segment:
A) not green oil printing in man-hour is added to the via green oil on the second heat dissipation bonding pad and the second heat dissipation bonding pad;
B) not green oil printing in man-hour is added to the 3rd heat dissipation bonding pad green oil, and the via green oil on the 3rd heat dissipation bonding pad is added do half jack designs man-hour;
Three, PCBA welds the stage:
A) make steel mesh to the second heat dissipation bonding pad to window design, print solder paste on the second heat dissipation bonding pad, then makes the first heat dissipation bonding pad realize being connected by reflow soldering with the second heat dissipation bonding pad;
B) make steel mesh to the 3rd heat dissipation bonding pad to window design, then print solder paste on the 3rd heat dissipation bonding pad.
2. the method for raising integrated chip heat-sinking capability according to claim 1, it is characterized in that: on the 3rd heat dissipation bonding pad during print solder paste, first the tin cream thickness of required printing on the 3rd heat dissipation bonding pad is calculated according to the actual requirement of heat radiation, if the tin cream thickness of required printing is lower than the face, place of the 3rd heat dissipation bonding pad, then make the steel mesh consistency of thickness that tin cream thickness is corresponding with the 3rd heat dissipation bonding pad; If the tin cream thickness of required printing is higher than the face, place of the 3rd heat dissipation bonding pad, then make the steel mesh partial thickening that the 3rd heat dissipation bonding pad is corresponding.
3. the method for raising integrated chip heat-sinking capability according to claim 2, is characterized in that: the thickness that described steel mesh partial thickening increases is no more than 0.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510581853.3A CN105307384B (en) | 2015-09-14 | 2015-09-14 | A kind of method for improving integrated chip heat-sinking capability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510581853.3A CN105307384B (en) | 2015-09-14 | 2015-09-14 | A kind of method for improving integrated chip heat-sinking capability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307384A true CN105307384A (en) | 2016-02-03 |
| CN105307384B CN105307384B (en) | 2018-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510581853.3A Active CN105307384B (en) | 2015-09-14 | 2015-09-14 | A kind of method for improving integrated chip heat-sinking capability |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
| CN106304616A (en) * | 2016-08-19 | 2017-01-04 | 浙江宇视科技有限公司 | The radiator structure of a kind of pcb board and the manufacture method of this radiator structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10247702A (en) * | 1997-03-05 | 1998-09-14 | Sumitomo Kinzoku Electro Device:Kk | Ball grid array package and printed board |
| CN1505456A (en) * | 2002-12-05 | 2004-06-16 | 华为技术有限公司 | A printed circuit board and processing method thereof |
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
-
2015
- 2015-09-14 CN CN201510581853.3A patent/CN105307384B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10247702A (en) * | 1997-03-05 | 1998-09-14 | Sumitomo Kinzoku Electro Device:Kk | Ball grid array package and printed board |
| CN1505456A (en) * | 2002-12-05 | 2004-06-16 | 华为技术有限公司 | A printed circuit board and processing method thereof |
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
| CN106304616A (en) * | 2016-08-19 | 2017-01-04 | 浙江宇视科技有限公司 | The radiator structure of a kind of pcb board and the manufacture method of this radiator structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105307384B (en) | 2018-05-08 |
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