CN105307384B - A kind of method for improving integrated chip heat-sinking capability - Google Patents
A kind of method for improving integrated chip heat-sinking capability Download PDFInfo
- Publication number
- CN105307384B CN105307384B CN201510581853.3A CN201510581853A CN105307384B CN 105307384 B CN105307384 B CN 105307384B CN 201510581853 A CN201510581853 A CN 201510581853A CN 105307384 B CN105307384 B CN 105307384B
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- Prior art keywords
- heat dissipation
- bonding pad
- dissipation bonding
- green oil
- pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of method for improving integrated chip heat-sinking capability, comprise the following steps：First, PCB design phase：In the bottom of integrated chip, the first heat dissipation bonding pad is set, the correspondence position welded again at the top of PCB with the first heat dissipation bonding pad sets the second heat dissipation bonding pad, the position that PCB bottoms correspond to the second heat dissipation bonding pad is provided with the 3rd heat dissipation bonding pad, and the second heat dissipation bonding pad is connected by via hole with the 3rd heat dissipation bonding pad；2nd, the PCB green oils process segment：a）Not green oil printing when being processed to the via hole green oil on the second heat dissipation bonding pad and the second heat dissipation bonding pad；Not green oil printing when b) being processed to the 3rd heat dissipation bonding pad green oil, and while being processed to the via hole green oil on the 3rd heat dissipation bonding pad, does half jack designs；3rd, PCBA welds the stage：a）Steel mesh windowing design is done to the second heat dissipation bonding pad, the print solder paste on the second heat dissipation bonding pad, then makes the first heat dissipation bonding pad and the second heat dissipation bonding pad be realized by reflow soldering and connect；b）Steel mesh windowing design is done to the 3rd heat dissipation bonding pad, then the print solder paste on the 3rd heat dissipation bonding pad.
Description
Technical field
The present invention relates to integrated chip design field, more particularly, to a kind of side for improving integrated chip heat-sinking capability
Method.
Background technology
Developed rapidly now with integrated chip, integrated chip needs realization more multi-functional；Therefore this just needs integrated core
Piece has more preferable heat-sinking capability, ensures the reliability of chip；Ensure chip and the reliability and PCBA of PCB welding again at the same time
Manufacturability；Integrated chip heat dissipation at present is to be achieved by the following scheme, specific as shown in Figure 1：
First, PCB design：The first heat dissipation bonding pad is set in the bottom of integrated chip, then in the top of PCB, the first heat dissipation
Second heat dissipation bonding pad is set on the corresponding position of pad, then the 3rd heat dissipation bonding pad is set in the bottom of PCB；Second heat dissipation bonding pad leads to
Cross via hole and the 3rd heat dissipation bonding pad is attached；
2nd, PCB is processed：To not printed during the via hole green oil printing of the second heat dissipation bonding pad, the 3rd heat dissipation bonding pad and connection
Greenwash oil, second and third heat dissipation bonding pad and via hole all do not have green oil；
3rd, PCBA is welded：Do steel mesh windowing to the second heat dissipation bonding pad to design, the print solder paste on the second heat dissipation bonding pad,
Chip and the second heat dissipation bonding pad are realized by reflow soldering to be connected.
However, the above method is when in use, since green oil being not present in via hole, the tin cream on the second heat dissipation bonding pad at this time
It is easily accessible in via hole, causes chip welding to produce rosin joint, while the tin cream on the second heat dissipation bonding pad easily propagates through via hole,
Tin sweat(ing) is formed in the 3rd heat dissipation bonding pad or the 3rd heat dissipation bonding pad place face, causes the place face of the 3rd heat dissipation bonding pad uneven
It is whole, the print reliability of PCBA is influenced, in addition such scheme is also not carried out the maximization of chip cooling.
The content of the invention
The defects of present invention is solves the above prior art, there is provided a kind of method for improving integrated chip heat-sinking capability,
This method can improve the heat dissipation effect of integrated chip, solve the second heat dissipation bonding pad and tin is easily leaked in reflow soldering to conducting
Cause integrated chip welding to make the problem of generation rosin joint in hole, and solve the second heat dissipation bonding pad and easily produced in reflow soldering
Face out-of-flatness where raw tin sweat(ing), leakage tin cause the 3rd heat dissipation bonding pad, influences the technical barrier of PCBA print reliabilities.
To realize above goal of the invention, the technical solution of use is：
A kind of method for improving integrated chip heat-sinking capability, comprises the following steps：
First, PCB design phase：First heat dissipation bonding pad is set in the bottom of integrated chip, then is radiated at the top of PCB with first
The correspondence position that pad is welded sets the second heat dissipation bonding pad, and the position that PCB bottoms correspond to the second heat dissipation bonding pad is provided with
3rd heat dissipation bonding pad, the second heat dissipation bonding pad are connected by via hole with the 3rd heat dissipation bonding pad；
2nd, the PCB green oils process segment：
a）Not green oil printing when being processed to the via hole green oil on the second heat dissipation bonding pad and the second heat dissipation bonding pad；
b）Not green oil printing when being processed to the 3rd heat dissipation bonding pad green oil, and the via hole green oil on the 3rd heat dissipation bonding pad is added
Man-hour does half jack designs；
3rd, PCBA welds the stage：
a）Steel mesh windowing design is done to the second heat dissipation bonding pad, the print solder paste on the second heat dissipation bonding pad, then makes first to dissipate
Hot weld disk and the second heat dissipation bonding pad are realized by reflow soldering to be connected；
b）Steel mesh windowing design is done to the 3rd heat dissipation bonding pad, then the print solder paste on the 3rd heat dissipation bonding pad.
In such scheme, not green oil printing when being processed to the 3rd heat dissipation bonding pad green oil, and to leading on the 3rd heat dissipation bonding pad
Through hole green oil is cooked half jack designs when processing, so half plug green oil in via hole, therefore dissipated to the first heat dissipation bonding pad and second
When hot weld disk carries out reflow soldering, the tin cream of the second heat dissipation bonding pad, which will not be entered in via hole, causes integrated chip rosin joint, together
When, the tin sweat(ing) that produces on the whole that the tin cream of the second heat dissipation bonding pad will not enter the 3rd heat dissipation bonding pad causes plane out-of-flatness,
The manufacturability of PCBA welding is influenced, and by the print solder paste on three heat dissipation bonding pads, then so that the 3rd heat dissipation bonding pad and tin cream
Gun-metal is formd, which increase the volume of heat dissipation carrier, so method provided by the invention can reach raising chip and dissipate
The purpose of thermal energy power.
Compared with prior art, the beneficial effects of the invention are as follows：
1）Improve integrated chip heat dissipation effect；
2）Improve integrated chip service life；
3）Solve the reliability of chip and heat dissipation bonding pad（Second heat dissipation bonding pad leaks tin to causing chip to weld in via hole
Rosin joint）；
4）Solve PCBA manufacturabilitys（Generation tin sweat(ing), leakage tin cause the out-of-flatness of PCB bottom surfaces, influence the reliable of PCBA printings
Property）.
Brief description of the drawings
Fig. 1 is the implementation process schematic diagram of existing chip cooling scheme.
Fig. 2 is the implementation process schematic diagram of chip radiation method provided by the invention.
Fig. 3 is the schematic diagram of steel mesh partial thickening.
Fig. 4 is the implementing procedure figure of chip radiation method provided by the invention.
Embodiment
Attached drawing is only for illustration, it is impossible to is interpreted as the limitation to this patent；
Below in conjunction with drawings and examples, the present invention is further elaborated.
Embodiment 1
As shown in Figure 2,4, the method provided by the invention for improving integrated chip heat-sinking capability comprises the following steps：
First, PCB design phase：First heat dissipation bonding pad 2 is set in the bottom of integrated chip 1, then is dissipated at the top of PCB with first
The correspondence position that hot weld disk 2 is welded sets the second heat dissipation bonding pad 3, and the position that PCB bottoms correspond to the second heat dissipation bonding pad 3 is set
The 3rd heat dissipation bonding pad 4 is equipped with, the second heat dissipation bonding pad 3 is connected by via hole 5 with the 3rd heat dissipation bonding pad 4；
2nd, the PCB process segments：
a）During to cooking green oil processing during 5 green oil printing of via hole on the second heat dissipation bonding pad 3 and the second heat dissipation bonding pad 3 not
Green oil printing；
Not green oil printing, 5 green oil of via hole on the 3rd heat dissipation bonding pad 4 when b) cooking green oil processing to the 3rd heat dissipation bonding pad 4
Processing is to do the making of half consent；
3rd, PCBA welds the stage：
a）The windowing design of steel mesh 6 is done to the second heat dissipation bonding pad 3, the print solder paste 7 on the second heat dissipation bonding pad 3, then makes the
One heat dissipation bonding pad 2 and the second heat dissipation bonding pad 3 are realized by reflow soldering to be connected；
b）The windowing design of steel mesh 6 is done to the 3rd heat dissipation bonding pad 4, then the print solder paste 7 on the 3rd heat dissipation bonding pad 4.
In such scheme, not green oil printing when being processed to 4 green oil of the 3rd heat dissipation bonding pad, and on the 3rd heat dissipation bonding pad 4
5 green oil of via hole is cooked half jack designs when processing, so half plug green oil in via hole 5, therefore to the first heat dissipation bonding pad 2 and the
When two heat dissipation bonding pads 3 carry out reflow soldering, the tin cream 7 of the second heat dissipation bonding pad 3, which will not be entered in via hole 5, causes integrated chip
1 rosin joint, meanwhile, the tin sweat(ing) that produces on the whole that the tin cream 7 of the second heat dissipation bonding pad 3 will not enter the 3rd heat dissipation bonding pad 4 causes
Plane out-of-flatness, influences the manufacturability of PCBA welding, and by the print solder paste 7 on three heat dissipation bonding pads, then so that the 3rd dissipates
Hot weld disk 4 forms gun-metal with tin cream 7, which increase the volume of heat dissipation carrier, so method provided by the invention can
Achieve the purpose that to improve chip cooling ability.
In the present embodiment, in print solder paste 7 on the 3rd heat dissipation bonding pad 4, the is calculated according to the actual requirement of heat dissipation first
7 thickness of tin cream of required printing on three heat dissipation bonding pads 4, then carries out 6 special designing of steel mesh, specific as follows：
If 7 thickness of tin cream of required printing is less than the place face of the 3rd heat dissipation bonding pad 4, dissipate 7 thickness of tin cream and the 3rd
Corresponding 6 consistency of thickness of steel mesh of hot weld disk 4；If 7 thickness of tin cream of required printing is higher than the place face of the 3rd heat dissipation bonding pad 4,
Steel mesh 6, which needs to make ladder steel mesh 6, to be designed, if as shown in figure 3, when 7 thickness of tin cream of required printing is less than H1, makes tin cream 7 thick
Degree is designed as H1, and wherein H1 represents the thickness in 4 place face of the 3rd heat dissipation bonding pad；If 7 thickness of tin cream of required printing is higher than H1,
Then steel mesh 6, which needs to make ladder steel mesh 6, designs, i.e., brings up to H 4 corresponding 6 thickness of the steel mesh design of the 3rd heat dissipation bonding pad is local, have
Body is makes 4 corresponding 6 partial thickening of steel mesh of the 3rd heat dissipation bonding pad, when specific implementation, the increased thickness of 6 partial thickening of steel mesh
Degree（H-H1）No more than 0.06mm.The scope of H1 exists：Between 0.05 ~ 0.2mm.
Compared with prior art, the beneficial effects of the invention are as follows：
1）Improve integrated chip heat dissipation effect；
2）Improve integrated chip service life；
3）Solve the reliability of chip and heat dissipation bonding pad（Second heat dissipation bonding pad leaks tin to causing chip to weld in via hole
Rosin joint）；
4）Solve PCBA manufacturabilitys（Generation tin sweat(ing), leakage tin cause the out-of-flatness of PCB bottom surfaces, influence the reliable of PCBA printings
Property）.
Obviously, the above embodiment of the present invention is only intended to clearly illustrate example of the present invention, and is not pair
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (3)
- A kind of 1. method for improving integrated chip heat-sinking capability, it is characterised in that：Comprise the following steps：First, PCB design phase：The first heat dissipation bonding pad is set in the bottom of integrated chip, then is welded with the first heat dissipation bonding pad at the top of PCB corresponding Position sets the second heat dissipation bonding pad, and the position that PCB bottoms correspond to the second heat dissipation bonding pad is provided with the 3rd heat dissipation bonding pad, and second dissipates Hot weld disk is connected by via hole with the 3rd heat dissipation bonding pad；2nd, the PCB green oils process segment：a）Not green oil printing when being processed to the via hole green oil on the second heat dissipation bonding pad and the second heat dissipation bonding pad；b）Not green oil printing when being processed to the 3rd heat dissipation bonding pad green oil, and when being processed to the via hole green oil on the 3rd heat dissipation bonding pad Do half jack designs；3rd, PCBA welds the stage：a）Steel mesh windowing design is done to the second heat dissipation bonding pad, the print solder paste on the second heat dissipation bonding pad, then makes the first heatsink welding Disk and the second heat dissipation bonding pad are realized by reflow soldering to be connected；b）Steel mesh windowing design is done to the 3rd heat dissipation bonding pad, then the print solder paste on the 3rd heat dissipation bonding pad.
- 2. the method according to claim 1 for improving integrated chip heat-sinking capability, it is characterised in that：In the 3rd heat dissipation bonding pad During upper print solder paste, the tin cream thickness of required printing on the 3rd heat dissipation bonding pad is calculated according to the actual requirement of heat dissipation first, if institute The tin cream thickness that need to be printed is less than the place face of the 3rd heat dissipation bonding pad, then makes tin cream thickness steel mesh corresponding with the 3rd heat dissipation bonding pad Consistency of thickness；If the tin cream thickness of required printing is higher than the place face of the 3rd heat dissipation bonding pad, make the 3rd heat dissipation bonding pad corresponding Steel mesh partial thickening.
- 3. the method according to claim 2 for improving integrated chip heat-sinking capability, it is characterised in that：The steel mesh locally increases Thick increased thickness is no more than 0.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510581853.3A CN105307384B (en) | 2015-09-14 | 2015-09-14 | A kind of method for improving integrated chip heat-sinking capability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510581853.3A CN105307384B (en) | 2015-09-14 | 2015-09-14 | A kind of method for improving integrated chip heat-sinking capability |
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| Publication Number | Publication Date |
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| CN105307384A CN105307384A (en) | 2016-02-03 |
| CN105307384B true CN105307384B (en) | 2018-05-08 |
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| CN201510581853.3A Active CN105307384B (en) | 2015-09-14 | 2015-09-14 | A kind of method for improving integrated chip heat-sinking capability |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
| CN106304616A (en) * | 2016-08-19 | 2017-01-04 | 浙江宇视科技有限公司 | The radiator structure of a kind of pcb board and the manufacture method of this radiator structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10247702A (en) * | 1997-03-05 | 1998-09-14 | Sumitomo Kinzoku Electro Device:Kk | Ball grid array package and printed board |
| CN1505456A (en) * | 2002-12-05 | 2004-06-16 | 华为技术有限公司 | A printed circuit board and processing method thereof |
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
-
2015
- 2015-09-14 CN CN201510581853.3A patent/CN105307384B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10247702A (en) * | 1997-03-05 | 1998-09-14 | Sumitomo Kinzoku Electro Device:Kk | Ball grid array package and printed board |
| CN1505456A (en) * | 2002-12-05 | 2004-06-16 | 华为技术有限公司 | A printed circuit board and processing method thereof |
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
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| Publication number | Publication date |
|---|---|
| CN105307384A (en) | 2016-02-03 |
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