CN207720511U - A kind of cooling mechanism for wiring board - Google Patents
A kind of cooling mechanism for wiring board Download PDFInfo
- Publication number
- CN207720511U CN207720511U CN201721823761.2U CN201721823761U CN207720511U CN 207720511 U CN207720511 U CN 207720511U CN 201721823761 U CN201721823761 U CN 201721823761U CN 207720511 U CN207720511 U CN 207720511U
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- CN
- China
- Prior art keywords
- wiring board
- heat
- heating device
- cushion block
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of cooling mechanisms for wiring board, heating device is installed on wiring board, heating device is vacantly set on wiring board by pin, and the radiating surface of heating device is towards wiring board, cooling cushion block is provided between heating device and wiring board, the side of cooling cushion block is the heat-absorbent surface being bonded with radiating surface, the other side is the contact surface being bonded with wiring board, there is no green oil on heat-absorbent surface and with the copper sheet of spray tin, also being extended on cooling cushion block has heat conducting part, the one side being bonded with wiring board on heat conducting part is thermal conductive surface, thermal conductive surface is corresponded on wiring board is provided with copper foil.The utility model is by being arranged cooling cushion block between assist side and heating device, realize the integrated function of heat absorption, heat conduction, heat dissipation, neither influence wiring board cabling, heat-sinking capability can be increased again, more importantly space occupancy rate is small, the requirement of the harsh installation environment such as narrow space can be met, at low cost, reliability is high.
Description
Technical field
The utility model is related to circuit board technology fields, more particularly, to a kind of cooling mechanism for wiring board.
Background technology
With the rapid development of electronics industry, the trend of electronic product micromation is increasingly apparent, and one piece of pcb board is in addition to fixation
Outside various small electronic components, major function is also provided with being electrically connected to each other for various electronic components.In the driving of pump assembly
In, control circuit board is the core component of whole equipment, however, in reality in use, due to pump assembly structure limitation or
The conditions such as the installation environment of person's harshness influence so that the installation space of wiring board is significantly limited.Such as it is tight in some space structures
In the box-like control box opened, only allows to place one piece of PCB main board, after covering box cover, be not allow for special radiator, this is undoubtedly
Prodigious problem is brought to the heat dissipation of heating module.
Therefore for the normal operation of each component on wiring board, wiring board cabling is not influenced, and needing to design one kind has
The cooling mechanism of effect, to meet requirement.
Utility model content
The purpose of this utility model is that proposing a kind of cooling mechanism for wiring board, solution can not in small space
The problem of radiator is set and influences wiring board heat dissipation.
In order to achieve the above object, the utility model uses following technical scheme：
A kind of cooling mechanism for wiring board is equipped with heating device on wiring board, and heating device is hanging by pin
It is set on wiring board, and the radiating surface of heating device is provided with scattered towards wiring board between heating device and wiring board
The side of heat pad block, cooling cushion block is the heat-absorbent surface being bonded with radiating surface, and the other side is the contact surface being bonded with wiring board, heat absorption
There is no green oil on face and be also extended with the copper sheet of spray tin, on cooling cushion block have heat conducting part, on heat conducting part with
The one side of wiring board fitting is thermal conductive surface, and corresponding to thermal conductive surface on wiring board is provided with copper foil.
Wherein, several vias for interlayer heat dissipation are provided on heat conducting part.By via by the heat of heat-absorbent surface
On conduction to thermal conductive surface, then heat conduction to the copper foil of wiring board, good heat conduction function is realized.
Wherein, the edge of cooling cushion block corresponds to the pin of heating device and offers several pin recessing grooves.Make pin pair
Cooling cushion block forms effective limit, and cooling cushion block forms effective support to heating device.
Wherein, it is not provided with cabling on contact surface.Due to being provided with cabling on heat sink, and there is no cabling on contact surface,
So do not insulate to heat sink worry.
Wherein, cooling cushion block has one or more to be applied in combination.According to the structure of specific component, meet a variety of applied fields
It closes.
To sum up, the cooling mechanism provided by the utility model for wiring board, by between assist side and heating device
Cooling cushion block is set, realizes the integrated function of heat absorption, heat conduction, heat dissipation, neither influences wiring board cabling, and heat radiation energy can be increased
Power, it is often more important that space occupancy rate is small, can meet the requirement of the harsh installation environment such as narrow space, at low cost, reliably
Property it is high.
Description of the drawings
Fig. 1 is the structural schematic diagram for the cooling mechanism for wiring board that the utility model embodiment provides；
Fig. 2 is that the heat-absorbent surface of the radiating gasket for the cooling mechanism for wiring board that the utility model embodiment provides regards
Figure.
In figure：
1- wiring boards；2- heating devices；3- pins；4- cooling cushion blocks；5- heat conducting parts；6- copper foils；7- vias；8- copper
Skin；9- pin recessing grooves.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Referring to Fig. 1 and 2, a kind of cooling mechanism for wiring board is present embodiments provided, including be equipped on wiring board 1
Heating device 2, heating device 2 are vacantly set to by pin 3 on wiring board 1, and the radiating surface of heating device 2 is towards wiring board
1, cooling cushion block 4 is provided between heating device 2 and wiring board 1, the side of cooling cushion block 4 is the suction being bonded with radiating surface
Hot face, the other side are the contact surface being bonded with wiring board 1, do not have green oil on heat-absorbent surface and with the copper sheet 8 of spray tin, cooling cushion block
Also being extended on 4 has a heat conducting part 5, and one side be bonded with wiring board 1 on heat conducting part 5 is thermal conductive surface, on wiring board 1
Corresponding thermal conductive surface is provided with copper foil 6.
Under normal circumstances, if not using radiator, heating device 2 oneself is allowed to radiate, it is contemplated that heat dissipation effect, it also can be into
Row is detached from the hanging setting on wiring board 1 surface, however since pin 3 only plays signal transfer functions, and it goes without doing support, therefore
The problems such as deformation of pin 3, poor contact, can often occur for hanging setting.Therefore now according to heating device 2 allow mounting height,
Select the cooling cushion block 4 of proper height, one makes heating device 2 when by pressure from top to bottom, plays effective support,
So that pin 3 is unlikely to deform, in addition can play good conduction of heat.It should be added that, heating device 2 draws herein
The welding manner of foot 3 is first padded by cooling cushion block 4, is being welded and fixed, and to realize fully fitting, is avoided there are gap,
Influence heat dissipation and support effect.
It is provided with several vias 7 for interlayer heat dissipation on heat conducting part 5, is passed the heat of heat-absorbent surface by via 7
It is directed at thermal conductive surface.Then the heat that heating device 2 distributes is conducted from the radiating surface of heating device 2 to the heat absorption of cooling cushion block 4
Face, then by the thermal conductive surface of the conduction of via 7 to heat conducting part 5, then conduct to the copper foil 6 of wiring board 1, heat diffusion is gone out
It goes, to realize good heat dissipation effect.
The pin 3 that the edge of cooling cushion block 4 corresponds to heating device 2 offers several pin recessing grooves 9 so that pin 3 is right
Cooling cushion block 4 forms effective limit, and cooling cushion block 4 forms effective support to heating device 2.
It should be noted that being not provided with cabling on contact surface, due to being provided with cabling on heat sink, and do not have on contact surface
There is cabling, so do not insulate to heat sink worry.
In specifically used, cooling cushion block 4 can be applied in combination for one or more, be set according to the structure of specific component
It sets, meets various application occasions.
The cooling cushion block of the present embodiment is detected by actual use, the case where compared to without cooling cushion block, can will be sent out
Thermal device surface temperature reduces by 5~10 degree, and effect is fairly obvious.
To sum up, the cooling mechanism for wiring board which provides, by being set between assist side and heating device
Cooling cushion block is set, the integrated function of heat absorption, heat conduction, heat dissipation is realized, neither influences wiring board cabling, and heat radiation energy can be increased
Power, it is often more important that space occupancy rate is small, can meet the requirement of the harsh installation environment such as narrow space, at low cost, reliably
Property it is high.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
With novel thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as
Limitations of the present invention.
Claims (5)
1. a kind of cooling mechanism for wiring board, heating device is installed on the wiring board, which is characterized in that the fever
Device is vacantly set to by pin on the wiring board, and the radiating surface of the heating device is located at towards the wiring board
Cooling cushion block is provided between the heating device and the wiring board, the side of the cooling cushion block is and the heat dissipation face paste
The heat-absorbent surface of conjunction, the other side are the contact surface being bonded with the wiring board, do not have green oil on the heat-absorbent surface and with spray tin
Copper sheet, being also extended on the cooling cushion block has heat conducting part, is bonded with the wiring board on the heat conducting part
It is thermal conductive surface on one side, corresponding to the thermal conductive surface on the wiring board is provided with copper foil.
2. the cooling mechanism according to claim 1 for wiring board, it is characterised in that：It is arranged on the heat conducting part
There are several vias for interlayer heat dissipation.
3. the cooling mechanism according to claim 1 for wiring board, it is characterised in that：The edge pair of the cooling cushion block
The pin of the heating device is answered to offer several pin recessing grooves.
4. the cooling mechanism according to claim 1 for wiring board, it is characterised in that：It is not provided on the contact surface
Cabling.
5. the cooling mechanism according to claim 1 for wiring board, it is characterised in that：The cooling cushion block have one piece or
Polylith is applied in combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721823761.2U CN207720511U (en) | 2017-12-22 | 2017-12-22 | A kind of cooling mechanism for wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721823761.2U CN207720511U (en) | 2017-12-22 | 2017-12-22 | A kind of cooling mechanism for wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207720511U true CN207720511U (en) | 2018-08-10 |
Family
ID=63057372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721823761.2U Active CN207720511U (en) | 2017-12-22 | 2017-12-22 | A kind of cooling mechanism for wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207720511U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN111987055A (en) * | 2020-07-16 | 2020-11-24 | 大同新成新材料股份有限公司 | Semiconductor refrigeration graphene chip |
-
2017
- 2017-12-22 CN CN201721823761.2U patent/CN207720511U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN111987055A (en) * | 2020-07-16 | 2020-11-24 | 大同新成新材料股份有限公司 | Semiconductor refrigeration graphene chip |
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