CN207053863U - A kind of printed circuit board (PCB) - Google Patents
A kind of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN207053863U CN207053863U CN201720631177.0U CN201720631177U CN207053863U CN 207053863 U CN207053863 U CN 207053863U CN 201720631177 U CN201720631177 U CN 201720631177U CN 207053863 U CN207053863 U CN 207053863U
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- China
- Prior art keywords
- pcb
- pcb board
- heat dissipation
- power electronic
- printed circuit
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- Structure Of Printed Boards (AREA)
Abstract
It the utility model is related to a kind of printed circuit board (PCB).The power electronic element that can be generated heat during work including pcb board and in the pcb board one side, heat dissipation metal slip is additionally provided with pcb board another side, heat dissipation metal slip patchhole is additionally provided with pcb board, extend into the heating region of the power electronic element of heating after the bending of heat dissipation metal slip through pcb board by patchhole.Radiated on the heat dissipation metal slip that can be directly transferred to by the heat that heat dissipation metal slip sends power electronic element on pcb board another side, the structure that copper need not be covered again by laying one layer of insulating heat-conduction material on aluminum board is radiated, and solves the technical problem that existing printed circuit board radiating technology process is complicated, product rejection rate is high, maintenance is inconvenient.
Description
Technical field
It the utility model is related to a kind of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is the important part of electronic product, including pcb board and in the pcb board one side
The power electronic element that can be generated heat during work, on power electronic element radiating circle, the radiating technique of power electronic element is one
Challenge, with the development of high-density power electronics, the radiating of high power density power electronic mainly passes through aluminium base and copper base
Radiating, to reach the requirement of high power density, this is that one kind lays one layer of insulating heat-conduction material on aluminum board, then covers copper, is done
Into one side or multilayer circuit board technique, power transistor is then welded on the heat conduction above such as aluminium base, transistor passes through circuit
Plate, heat-conducting insulation material are transmitted on the aluminium base contacted, reach the purpose of heat conduction！The shortcomings that this technique maximum is exactly
The hot coefficient of complex process, circuit board and aluminium base is different, is ftractureed after easily causing long-time temperature difference alternation, separation.Welding
Technique heating difficulty is big, and product rejection rate is high, and yields is low, and product repairing is inconvenient, and mounting process is complicated, it is impossible to pcb
It is directly connected to, maintenance process complex operation, sometimes damage is irreversible that most important shortcoming is exactly that cost is too high and not
It is easy to popularize.
Utility model content
The utility model provides a kind of printed circuit board (PCB), and to solve, existing printed circuit board radiating technology process is complicated, produces
The technical problem that product scrappage is high, maintenance is inconvenient.
In order to solve the above technical problems, the utility model adopts the technical scheme that：
A kind of printed circuit board (PCB), including the power electricity that can be generated heat when pcb board and work in the pcb board one side
Subcomponent, it is characterized in that, heat dissipation metal slip is additionally provided with the pcb board another side, metal is additionally provided with the pcb board
Fin strips patchhole, the hair is extend into through the pcb board by the patchhole after the heat dissipation metal slip bending
The heating region of the power electronic element of heat.
Radiating piece is additionally provided with the top of the power electronic element, the radiating piece is connected by metallic support and pcb board
Connect, one end that the metallic support is connected with pcb board while the heating region for extending into the power electronic element of the heating.
The metallic support intersects and connected as one on the pcb with the heat dissipation metal slip.
The radiating piece is sheet metal.
Be provided with multiple vias in pcb board region corresponding to the power electronic element, the power electronic element with
Solder(ing) paste is provided between the pcb board, the solder(ing) paste penetrates into the another side of the pcb board simultaneously by the multiple via
Scolding tin layer of paste is formed in another side, the scolding tin layer of paste contacts connection with the heat dissipation metal slip on the another side.
The heat dissipation metal slip of the heating region of the power electronic element for extending into the heating and the heating
The metal part welding of power electronic element.
The heat dissipation metal slip is copper sheet or metal alloy.
Radiator is additionally provided with outside heat dissipation metal slip on the pcb board another side.
Heat conductive isolation sheet is additionally provided between heat dissipation metal slip and the radiator on the pcb board another side.
After above-mentioned technical proposal is employed, due to being additionally provided with heat dissipation metal slip on pcb board another side, on pcb board
Heat dissipation metal slip patchhole is additionally provided with, heating is extend into through pcb board by patchhole after the bending of heat dissipation metal slip
The heating region of power electronic element.It can be directly transferred to by the heat that heat dissipation metal slip sends power electronic element
Radiated on heat dissipation metal slip on pcb board another side, it is not necessary to by laying one layer of insulating heat-conduction material on aluminum board
The structure for covering copper again is radiated, and solves complicated existing printed circuit board radiating technology process, product rejection rate height, maintenance not
Convenient technical problem.In addition, being additionally provided with radiating piece at the top of power electronic element, radiating piece passes through metallic support and PCB
Plate connects, and one end that metallic support is connected with pcb board while extend into the heating region of the power electronic element of heating.Add
One heat dissipation path, the scattered of heat is further speeded up.Finally, set in the pcb board region corresponding to power electronic element
There are multiple vias, solder(ing) paste is provided between power electronic element and pcb board, solder(ing) paste penetrates into pcb board by multiple vias
Another side and another side formed scolding tin layer of paste.The heat that power electronic element is sent is delivered to by solder(ing) paste by via
The scolding tin layer of paste of the another side of pcb board is radiated, and increases heat dissipation path again, greatly accelerates the scattered of heat.Especially
It is the combination of three kinds of heat dissipation paths, substantially increases the efficiency of radiating, is enhanced about more than once than existing radiating process efficiency.And
And it is cheap using the technical solution of the utility model cost, the operating procedure as ordinary circuit board, by Experimental comparison, lead
Hot property exceedes original aluminium base similar technique, and welding procedure is simple, and maintenance process is simple, assembly and disassembly technique, mounting process letter
It is single, it can directly be docked with common pcb board, thoroughly solve the defects of aluminium base similar technique, maintain original
Power density, not only good heat dissipation effect have a very big cost advantage, and installation effectiveness and high in machining efficiency, with any electricity
Road plate can dock, and compared with aluminium base technique, be further without middle transition part, and aluminium base needs contact pin transition, increases cost,
Reduce reliability.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment.
In figure, 1 it is pcb board, 2 is power electronic element, 3 is solder(ing) paste, 4 is scolding tin layer of paste, 5 is heat dissipation metal slip, 6
It is radiating piece for patchhole, 7,8 is metallic support, 9 is radiating piece device, 10 is heat conductive isolation sheet, 11 is via.
Embodiment
As shown in figure 1, a kind of printed circuit board (PCB), including can be generated heat when pcb board 1 and work in the one side of pcb board 1
Power electronic element 2, such as transistor of power electronic element 2, be provided with the region of pcb board 1 corresponding to power electronic element 2
Multiple vias 11, are provided with solder(ing) paste 3 between power electronic element 2 and pcb board 1, solder(ing) paste 3 is penetrated into by multiple vias 11
The another side of pcb board 1 simultaneously forms scolding tin layer of paste 4 in another side, is additionally provided with and welds outside the scolding tin layer of paste 4 on the another side of pcb board 1
Tin paste layer 4 contacts such as copper sheet bar of heat dissipation metal slip 5 of connection, and the patchhole 6 of heat dissipation metal slip 5 is additionally provided with pcb board 1,
Heat dissipation metal slip 5 extend into the heating region of the power electronic element 2 of heating by patchhole 6 through pcb board 1 after bending,
It extend into the metal of the heat dissipation metal slip 5 and the power electronic element 2 of heating of the heating region of the power electronic element 2 of heating
Part is welded, and heat dissipation metal slip 5 is copper sheet or metal alloy, and the top of power electronic element 2 is additionally provided with radiating piece 7, is dissipated
Warmware 7 is connected by metallic support 8 with pcb board 1, one end that metallic support 8 is connected with pcb board 1 while the work(for extending into heating
The heating region of rate electronic component 2, metallic support 8 intersect and connected as one on PCB with heat dissipation metal slip 5, radiating piece 7
For sheet metal, radiator 9, heat dissipation metal slip 5 and radiator 9 are additionally provided with outside the heat dissipation metal slip 5 on pcb board another side
Between be provided with heat conductive isolation sheet 10, so that the heat on heat dissipation metal slip 5 can disperse as early as possible.Due to power electronic element 2
Multiple vias 11 are provided with the corresponding region of pcb board 1, solder(ing) paste 3 is provided between power electronic element 2 and pcb board 1,
Solder(ing) paste 3 penetrates into the another side of pcb board 1 by multiple vias 11 and forms scolding tin layer of paste 4 in another side.Power electronic element
The scolding tin layer of paste 4 for the another side that 2 heats sent are delivered to pcb board 1 by via 11 by solder(ing) paste 3 is radiated, and is not required to
The structure to cover copper again by laying one layer of insulating heat-conduction material on aluminum board is radiated, and is solved existing printed circuit board (PCB) and is dissipated
The technical problem that thermal process complex process, product rejection rate are high, maintenance is inconvenient.In addition, the solder(ing) paste on the another side of pcb board 1
The heat dissipation metal slip 5 that connection is contacted with scolding tin layer of paste 4 is additionally provided with outside layer 4.Heat dissipation metal slip 5 is additionally provided with pcb board 1
Patchhole 6, heat dissipation metal slip 5 extend into the hair of the power electronic element 2 of heating by patchhole 6 through pcb board 1 after bending
Thermal region.The heat that power electronic element 2 is sent can be directly transferred on the another side of pcb board 1 by heat dissipation metal slip 5
Heat dissipation metal slip 5 on radiated, add a heat dissipation path, further speeded up the scattered of heat.Finally, power
The top of electronic component 2 is additionally provided with radiating piece 7, and radiating piece 7 is connected by metallic support 8 with pcb board 1, metallic support 8 with
One end that pcb board 1 connects extend into the heating region of the power electronic element 2 of heating simultaneously.Increase heat dissipation path again, greatly
It is big to accelerate the scattered of heat.The combination of especially three kinds heat dissipation paths, the efficiency of radiating is substantially increased, than existing radiating
Process efficiency is enhanced about more than once.And it is cheap using the technical solution of the utility model cost, as ordinary circuit board
Operating procedure, by Experimental comparison, heat conductivility exceedes original aluminium base similar technique, and welding procedure is simple, maintenance process
Simply, assembly and disassembly technique, mounting process is simple, can directly be docked with common pcb board 1, thoroughly solve aluminium base similar to work
The defects of skill, original power density is maintained, not only good heat dissipation effect, there is very big cost advantage, and install
Efficiency and high in machining efficiency, can be docked with any circuit board, compared with aluminium base technique, be further without middle transition part, and aluminium
Substrate needs contact pin transition, increases cost, reduces reliability.
Claims (9)
1. a kind of printed circuit board (PCB), including the power electronic that can be generated heat when pcb board and work in the pcb board one side
Element, it is characterized in that, heat dissipation metal slip is additionally provided with the pcb board another side, being additionally provided with metal on the pcb board dissipates
Backing bar patchhole, the heating is extend into through the pcb board by the patchhole after the heat dissipation metal slip bending
Power electronic element heating region.
2. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, radiating is additionally provided with the top of the power electronic element
Part, the radiating piece are connected by metallic support with pcb board, one end that the metallic support is connected with pcb board while are extend into
The heating region of the power electronic element of the heating.
3. printed circuit board (PCB) as claimed in claim 2, it is characterized in that, the metallic support is with the heat dissipation metal slip in institute
State and intersect on PCB and connect as one.
4. printed circuit board (PCB) as claimed in claim 3, it is characterized in that, the radiating piece is sheet metal.
5. printed circuit board (PCB) as claimed in claim 2 or claim 3, it is characterized in that, the pcb board area corresponding to the power electronic element
Multiple vias are provided with domain, solder(ing) paste is provided between the power electronic element and the pcb board, the solder(ing) paste passes through
The multiple via penetrate into the another side of the pcb board and another side formed scolding tin layer of paste, the scolding tin layer of paste with it is described
Heat dissipation metal slip contact connection on another side.
6. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, the power electronic element for extending into the heating
The metal part of the heat dissipation metal slip of heating region and the power electronic element of the heating is welded.
7. printed circuit board (PCB) as claimed in claim 6, it is characterized in that, the heat dissipation metal slip is copper sheet or metal alloy.
8. printed circuit board (PCB) as claimed in claim 6, it is characterized in that, outside the heat dissipation metal slip on the pcb board another side
It is additionally provided with radiator.
9. printed circuit board (PCB) as claimed in claim 8, it is characterized in that, heat dissipation metal slip on the pcb board another side with
Heat conductive isolation sheet is additionally provided between the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720631177.0U CN207053863U (en) | 2017-06-01 | 2017-06-01 | A kind of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720631177.0U CN207053863U (en) | 2017-06-01 | 2017-06-01 | A kind of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207053863U true CN207053863U (en) | 2018-02-27 |
Family
ID=61491543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720631177.0U Active CN207053863U (en) | 2017-06-01 | 2017-06-01 | A kind of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207053863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426913A (en) * | 2017-06-01 | 2017-12-01 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
-
2017
- 2017-06-01 CN CN201720631177.0U patent/CN207053863U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426913A (en) * | 2017-06-01 | 2017-12-01 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 Floors 1-3 and 1-5 of Block A, Block B2, Jinweiyuan Industrial Plant, Longshan District, Pingshan New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Gold Power Technology Co., Ltd. Address before: 518000 Shenzhen, Guangdong, Pingshan new industrial zone, poly dragon hill area Jinwei Industrial Zone A 1 floor. Patentee before: Shenzhen Gold Power Technology Co., Ltd. |
|
| CP02 | Change in the address of a patent holder |