CN108112168A - A kind of thickness copper coin internal layer non-functional pad design adding method - Google Patents
A kind of thickness copper coin internal layer non-functional pad design adding method Download PDFInfo
- Publication number
- CN108112168A CN108112168A CN201810075599.3A CN201810075599A CN108112168A CN 108112168 A CN108112168 A CN 108112168A CN 201810075599 A CN201810075599 A CN 201810075599A CN 108112168 A CN108112168 A CN 108112168A
- Authority
- CN
- China
- Prior art keywords
- functional pad
- copper coin
- internal layer
- functional
- thick copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention relates to board design field, more particularly to a kind of thick copper coin internal layer non-functional pad design adding method.The present invention removes non-functional pad by interlayer, and the non-functional pad of reservation is made corresponding lengthen, and the minimum electric clearance between Kong Yukong cannot be influenced, ensure that every layer has non-functional pad to support, without spacious Wu Tongqu, it solves the problems, such as that former design A areas are heated and layering plate bursting easily occurs, improve thick copper coin reliability.
Description
Technical field
The present invention relates to board design field, more particularly to a kind of thick copper coin internal layer non-functional pad design addition side
Method.
Background technology
Circuit board is mainly made of pad, via, mounting hole, conducting wire, component, connector, filling, electrical boundary etc.,
The major function of each component is as follows：Pad：For the metal aperture of welding component pin；Via：There is metallic vias and non-
Metallic vias, wherein metallic vias are used to connect component's feet between each layer；Mounting hole：For fixing circuit board；Conducting wire：With
In the electrical network copper film of connection component's feet；Connector：For the component connected between circuit board；Filling：For ground
The deposited copper of gauze network, can effectively reduce impedance；Electrical boundary：For determining the size of circuit board, on all circuit boards
Component is all no more than the border.
In printed wiring board industry, thick copper coin internal layer usually selects 3 ounces or more of thick copper foil, since copper thickness is very thick,
It is generally necessary to which the very high prepreg of glue content fills bonding, and the more high then coefficient of thermal expansion of prepreg glue content is bigger,
Heat resistance is poorer, and internal layer is just very easy to that layering plate bursting, shadow occurs after being heated if the pitch of holes of design is less than 1.0mm again
Ring the reliability of thickness copper coin.
The content of the invention
The present invention proposes a kind of design adding method of thick copper coin internal layer non-functional pad, uses this design method
It can solve the problems, such as that pitch of holes easily occurs to be layered plate bursting less than 1.0mm thickness copper coin internal layers, improve thick copper coin reliability.
The present invention is achieved through the following technical solutions, a kind of pcb board, including thick copper coin, wherein thick copper coin internal layer bag
Include non-functional pad, non-functional pad includes first portion and second portion, the non-functional pad of first portion and the
The non-functional pad staggered floor of two parts is set.
Further, the non-functional pad of the non-functional pad of first portion and second portion is perpendicular to the direction of layer
On have overlapping project.
Further, the setting of the length of the non-functional pad of first portion and second portion cannot be influenced between Kong Yukong
Minimum electric clearance.
Further, it is smaller than 1.0mm between the hole.
The present invention also provides a kind of thick copper coin internal layer non-functional pad design adding method, wherein, interlayer removal NOT function
Energy property pad, and the non-functional pad of reservation is made corresponding lengthening, ensureing every layer has non-functional pad to support.
Preferably, this method is applied in PCB in thick copper coin design.
The present invention is that the present invention solves pitch of holes less than in 1.0mm thickness copper coins compared with the advantageous effect of the prior art
The technical barrier of layering plate bursting easily occurs after layer is heated, improves the reliability of thick copper coin, reduces cost, improve production
Efficiency is layered plate bursting problem for thick copper coin and provides a solution, promotes the development of printed wiring board production technology.
Description of the drawings
Fig. 1 thick copper coin designs of the prior art
The thick copper coin design that Fig. 2 one embodiment of the invention provides
Specific embodiment
Presently preferred embodiments of the present invention is described in detail below in conjunction with the accompanying drawings.Following embodiment is only used for clearer
Ground illustrates technical scheme, and is not intended to limit the protection scope of the present invention and limits the scope of the invention.
In the prior art, usually thick every layer of copper coin internal layer can all add non-functional pad, and this design is in adjacent holes
Between without non-functional pad support A areas be heated after be very easy to occur layering plate bursting, as shown in Figure 1.
As shown in Fig. 2, thick copper coin internal layer includes non-functional pad, non-functional pad includes for design of the invention specific
A part and second portion, the non-functional pad of first portion and the non-functional pad staggered floor of second portion are set.
Further, the non-functional pad of the non-functional pad of first portion and second portion is perpendicular to the direction of layer
On have overlapping project.
Further, the setting of the length of the non-functional pad of first portion and second portion cannot be influenced between Kong Yukong
Minimum electric clearance.
The present invention removes non-functional pad by interlayer, and the non-functional pad of reservation is made corresponding lengthening, and
The minimum electric clearance between Kong Yukong cannot be influenced, ensure that every layer has non-functional pad to support, without spaciousness
Wu Tongqu, solve the problems, such as that former design A areas are heated and layering plate bursting easily occur, improve thick copper coin reliability.And due to
Reduce the non-functional pad number of plies, drill point abrasion can be reduced, it is quick-fried to further avoid layering for the generation of heat when reducing drilling
The generation of plate, and be conducive to improve wall quality, it is to achieve many things at one stroke.
The present invention solves pitch of holes and is heated less than 1.0mm thickness copper coin internal layers easily occurs the technology hardly possible of layering plate bursting afterwards
Topic, improves the reliability of thick copper coin, reduces cost, improve production efficiency, and being layered plate bursting problem for thick copper coin provides
A solution promotes the development of printed wiring board production technology.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of pcb board, including thick copper coin, it is characterised in that：Thick copper coin internal layer includes non-functional pad, non-functional pad
Including first portion and second portion, the non-functional pad of first portion and the non-functional pad staggered floor of second portion are set
It puts.
2. pcb board according to claim 1, it is characterised in that：The non-functional pad of first portion and second portion it is non-
Functional pad has overlapping to project on the direction perpendicular to layer.
3. pcb board according to claim 1, it is characterised in that：The length of the non-functional pad of first portion and second portion
The setting of degree cannot influence the minimum electric clearance between Kong Yukong.
4. pcb board according to claim 3, it is characterised in that：1.0mm is smaller than between the hole.
5. a kind of thickness copper coin internal layer non-functional pad design adding method, it is characterised in that：Interlayer removes non-functional pad,
And the non-functional pad of reservation is made corresponding lengthening, ensureing every layer has non-functional pad to support.
6. according to the method described in claim 5, this method is applied in PCB in thick copper coin design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810075599.3A CN108112168B (en) | 2018-01-25 | 2018-01-25 | Design adding method for inner layer non-functional bonding pad of thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810075599.3A CN108112168B (en) | 2018-01-25 | 2018-01-25 | Design adding method for inner layer non-functional bonding pad of thick copper plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108112168A true CN108112168A (en) | 2018-06-01 |
| CN108112168B CN108112168B (en) | 2020-04-03 |
Family
ID=62221214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810075599.3A Active CN108112168B (en) | 2018-01-25 | 2018-01-25 | Design adding method for inner layer non-functional bonding pad of thick copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108112168B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111935902A (en) * | 2020-09-23 | 2020-11-13 | 歌尔股份有限公司 | Printed circuit board |
| DE102020115794B3 (en) * | 2020-06-16 | 2021-07-01 | Semikron Elektronik Gmbh & Co. Kg | Printed circuit board with conductor layers arranged one above the other |
| CN113301734A (en) * | 2021-05-06 | 2021-08-24 | 深圳崇达多层线路板有限公司 | Method for improving back drilling capability of high-multilayer circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101547555A (en) * | 2009-05-05 | 2009-09-30 | 福建星网锐捷网络有限公司 | Printed circuit board |
| CN103717012A (en) * | 2012-09-28 | 2014-04-09 | 杭州华三通信技术有限公司 | PCB board via impedance control method and structure |
| CN203708631U (en) * | 2013-10-14 | 2014-07-09 | 北大方正集团有限公司 | Multilayer printed circuit board |
| TW201717723A (en) * | 2015-09-01 | 2017-05-16 | Denso Corp | Multilayer substrate and method for manufacturing same |
-
2018
- 2018-01-25 CN CN201810075599.3A patent/CN108112168B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101547555A (en) * | 2009-05-05 | 2009-09-30 | 福建星网锐捷网络有限公司 | Printed circuit board |
| CN103717012A (en) * | 2012-09-28 | 2014-04-09 | 杭州华三通信技术有限公司 | PCB board via impedance control method and structure |
| CN203708631U (en) * | 2013-10-14 | 2014-07-09 | 北大方正集团有限公司 | Multilayer printed circuit board |
| TW201717723A (en) * | 2015-09-01 | 2017-05-16 | Denso Corp | Multilayer substrate and method for manufacturing same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020115794B3 (en) * | 2020-06-16 | 2021-07-01 | Semikron Elektronik Gmbh & Co. Kg | Printed circuit board with conductor layers arranged one above the other |
| CN111935902A (en) * | 2020-09-23 | 2020-11-13 | 歌尔股份有限公司 | Printed circuit board |
| CN113301734A (en) * | 2021-05-06 | 2021-08-24 | 深圳崇达多层线路板有限公司 | Method for improving back drilling capability of high-multilayer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108112168B (en) | 2020-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9711441B2 (en) | Reduced PTH pad for enabling core routing and substrate layer count reduction | |
| CN102845141B (en) | Circuit board and manufacturing method therefor | |
| US8658904B2 (en) | Flex-rigid wiring board and method for manufacturing the same | |
| JP5122932B2 (en) | Multilayer wiring board | |
| CN102918939B (en) | Circuit board and manufacturing method therefor | |
| CN102090155B (en) | Method for integrating at least one electronic component into a printed circuit board, and printed circuit board | |
| US9578755B2 (en) | Printed wiring board having buildup layers and multilayer core substrate with double-sided board | |
| US9288910B2 (en) | Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component | |
| KR20090091333A (en) | Electronic parts built-in distributing board, and radiating method for the electronic parts built-in distributing board | |
| JP2003174265A (en) | Multilayer wiring circuit substrate | |
| TWI403251B (en) | High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same | |
| CN108112168A (en) | A kind of thickness copper coin internal layer non-functional pad design adding method | |
| TW201220967A (en) | Method and structure for coaxial via routing in printed circuit boards for improved signal integrity | |
| CN105472865A (en) | Circuit board comprising heat transfer structure | |
| JP2006303202A (en) | Printed board with built-in component and manufacturing method thereof | |
| US9098646B2 (en) | Printed circuit board design system and method | |
| CN110167289A (en) | A kind of production method of multilayer circuit board | |
| JP2009054930A (en) | Multi-layer printed wiring board having built-in parts and method of manufacturing the same | |
| JP4521223B2 (en) | Printed wiring board | |
| CN104968138A (en) | Printed circuit board | |
| TW201448702A (en) | Wiring substrate and method for producing wiring substrate | |
| KR100704922B1 (en) | Pcb using paste bump and method of manufacturing thereof | |
| JP4070193B2 (en) | Wiring board and electronic component mounting structure | |
| CN108282954B (en) | Circuit board, electronic equipment and circuit board manufacturing method | |
| JP2010123830A (en) | Printed wiring board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |