JP2006303202A - Printed board with built-in component and manufacturing method thereof - Google Patents

Printed board with built-in component and manufacturing method thereof Download PDF

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JP2006303202A
JP2006303202A JP2005123133A JP2005123133A JP2006303202A JP 2006303202 A JP2006303202 A JP 2006303202A JP 2005123133 A JP2005123133 A JP 2005123133A JP 2005123133 A JP2005123133 A JP 2005123133A JP 2006303202 A JP2006303202 A JP 2006303202A
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electronic component
component
wiring board
printed wiring
structure
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Koichi Takahashi
浩一 高橋
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Cmk Corp
日本シイエムケイ株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

PROBLEM TO BE SOLVED: To provide a printed board with built-in component capable of solving a problem of unnecessary radiation noise due to an electronic component arranged in the printed board and capable of easily drawing out a circuit wire from the electronic component, and to provide a method for manufacturing the printed board with built-in electronic component.
SOLUTION: In the printed board with built-in component where the electronic component 6 is arranged on a conductive layer of an inner layer part of the printed board, a cover-shaped shielding body 34 of which the side face and upper surface consist of a metallic conductor is arranged on the upper part of the electronic component 6, the electronic component 6 is arranged in the cover-shaped shielding body, and space between the cover-shaped shielding body 34 and the electronic component 6 is tightly sealed by insulating resin. The method for manufacturing the printed board with built-in electronic component comprises a process for forming a circuit wire from a pad in which the electronic component 6 is arranged, a process for laminating prepreg with a punching and a double-sided copper-plated laminating board with a through-hole on the upper part of the electronic component 6, and a process for applying a cover-state conductor plating on the upper part of the through-hole.
COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、内蔵された電子部品からの不要輻射雑音を遮蔽し、かつ、外部雑音から当該内蔵された電子部品及び回路配線を保護する電子部品内蔵型のプリント配線板及びその製造方法に関する。 The present invention shields the unnecessary radiation noise from the built-in electronic components and electronic component built-in printed circuit board to protect the electronic components and circuit wiring, which is the internal from the external noise, and a method for producing the same.

近年、プリント配線板の小型化、高密度化が求められる中で、従来はプリント配線板の表面に実装されていた各種の電子部品をプリント配線板の内部に導入することによって得られる部品内蔵型のプリント配線板に関する技術がある。 Recently, miniaturization of printed wiring board, in which densification is required, the component built-in conventionally obtained by introducing various electronic components that have been mounted on the surface of the printed wiring board in the interior of the printed wiring board a technique regarding a printed wiring board. この部品内蔵型のプリント配線板は、電子部品がプリント配線板の内部に導入された構造となっているため、表面実装部の小スペース化や高密度化に対応でき、前記プリント配線板のさらなる発展に大きく寄与するものである。 The component built-in printed wiring board, since the electronic component is in the introduced structures within the printed wiring board, can correspond to the small space and high density surface mount portion, further the printed circuit board it is intended to contribute significantly to the development.

加えて、部品内蔵型のプリント配線板は電気的な配線構造が、従来の平面的な表面実装部からプリント配線板の内層部分を使用することで、例えば、LSI直下に受動部品を配置する構造などの立体的な配置が可能になるため、LSIの高速伝送時のリードインダクタンスを低減することが可能になり、動作に対応するための信号配線を最適化にする際に有効であるなどの利点も有する。 Structure addition, the component built-in printed circuit board electrical wiring structure, by a conventional planar surface mount section using an inner layer portion of the printed wiring board, for example, passive components are placed directly below LSI since it is possible to three-dimensional arrangement of such, advantages such as it is possible to reduce lead inductance during high-speed transmission of LSI, it is effective in the optimization of the signal lines to respond to operation also it has.

しかしながら、部品内蔵型のプリント配線板には、不要輻射雑音の問題がある。 However, the printed wiring board of the component built-in, there is the unnecessary radiation noise problem. これは、電子部品の高機能化や高速化に伴い、電子部品から発生する電磁波が、通信障害や電子部品間の干渉による誤作動などを生じさせるものとして大きな問題となっていた。 This, along with high performance and speed of electronic components, electromagnetic waves generated from electronic components has been a major problem as causing the like malfunction due to interference between the communication failure or electronic components. また同様に、埋設した電子部品及び回路配線から発生する不要輻射雑音により、周辺に配置されている電子部品及び回路配線が誤作動などを生じさせることもあり、この点でも大きな問題となっていた。 Similarly, the unnecessary radiation noise generated from the electronic component and the circuit wiring buried, sometimes cause such actuation electronic components and circuit wirings are arranged around erroneous, it has been a major problem in this respect .

斯かる部品内蔵型のプリント配線板における不要輻射雑音の問題を解決する技術としては、例えば図7に示されるようなプリント配線板が既に報告されている(特許文献1参照)。 As a technique for solving the problem of unnecessary radiation noise in such a component-embedded-type printed wiring board, for example, a printed wiring board as shown in Figure 7 it has already been reported (see Patent Document 1).

すなわち、電子部品80から発生する不要輻射雑音を遮蔽するために、電子部品80を実装するエリア内部である収納部に蓋をする上部配線板72の下側片面、あるいは両面に金属膜78を形成するものであり、さらに、電子部品80を実装するエリアとして各種形状の収納穴が設けられた中部配線板73の収納穴の内壁側面部に金属膜である金属導体層74を設けることで、この電子部品を実装するエリアが外部から完全に密閉され、この密閉されたエリア内部に気密空間75を有する構成により解決するものである。 That is, in order to shield the unnecessary radiation noise generated from the electronic component 80, the lower single-sided metal film 78 or on both sides, of the upper wiring board 72 for the lid to the housing portion is an internal area for mounting electronic components 80 formed is intended to further, by providing the metal conductor layer 74 is a metal film on the inner wall side surface of the receiving hole of the middle wiring board 73 housing hole of various shapes are provided as an area for mounting electronic components 80, the the area for mounting electronic components are completely sealed from the outside, is intended to solve the configuration with airtight space 75 inside the sealed area.

このような図7に示される構造体は、電子部品を実装するエリアが外部から完全に密閉されることで、電子部品80から発生する不要輻射雑音を遮蔽し、隣接する他の電子部品への干渉を抑制することができる構造体となり、前記の不要輻射雑音などの問題を解消し得る。 Such 7 in the structure shown, by the area for mounting electronic components are completely sealed from the outside, to shield the unnecessary radiation noise generated from the electronic component 80, to adjacent other electronic components forming the structural body capable of suppressing interference, it may solve the problem of the unnecessary radiation noise.

しかしながら、図7に示される構造体は、電子部品80からの配線の引き回しにおいて問題を生じる。 However, the structure shown in FIG. 7, cause problems in the routing of the wiring from the electronic component 80. すなわち、電子部品80を密閉構造とすることで不要輻射雑音の問題が解消するが、密閉構造としていることで電子部品80からの配線は、下部配線板71に配置される、はんだバンプ79と接続ランド70及び非貫通導通穴77を介して、電子部品80の下層へ引き出すことが必要になり、同層に配置される他の隣接する電子部品との接続が困難であり、高密度化するプリント配線板を背景に回路配線の引き回しにおいて問題となっていたのが実状であった。 That is, the connection is to eliminate unwanted radiation noise problem by the electronic component 80 and the sealing structure, the wiring from the electronic component 80 by which a closed structure is disposed under the wiring board 71, the solder bumps 79 via the land 70 and the non-through conducting hole 77, it is required to withdraw to the underlying electronic components 80, it is difficult to connect to other neighboring electronic components disposed in the same layer, printing to densify had become a problem in routing of the circuit wiring circuit board in the background was circumstances.

特開2002−84070号公報 JP 2002-84070 JP

このような背景に基づき本発明が解決しようとする課題は、プリント配線板の内部に配置された電子部品による不要輻射雑音の問題を解消することに加え、当該電子部品からの回路配線を引き出し易くすることで、電子部品の高密度な配置が容易に行なえる部品内蔵型のプリント配線基板を提供することにある。 Problems to be solved by the present invention on the basis of this background, in addition to eliminating the unnecessary radiation noise caused by electronic components arranged in the interior of the printed wiring board problems, easily pull the circuit wiring from the electronic component doing, in that a high density arrangement of electronic components to provide a printed wiring board easily component built-in.

本発明者は、上記課題を解決するために種々検討を重ねた。 The present inventor has made various studies in order to solve the above problems. その結果、プリント配線板の内部に配置される電子部品の上方面に、絶縁基材と予め当該電子部品を収納できる形状に加工したスルーホールを順に積み重ね、当該スルーホールの上面に導体を設けることにより形成される蓋型形状のシールド体により覆われた電子部品を有する部品内蔵型プリント配線板が有効であることを見出して発明を完成するに至った。 As a result, the upper face of the electronic components disposed in the interior of the printed wiring board, stacked sequentially through holes formed into a shape that can advance accommodating the electronic component and the insulating substrate, providing a conductor on the upper surface of the through hole component-embedded printed wiring board having an electronic component covered by the shield member of the cover shape which is formed by has led to the completion of the present invention have found that it is effective.

すなわち、本発明は、プリント配線板の内層部の導体層に電子部品が配置された部品内蔵型プリント配線板において、当該電子部品の上方面に、側面部と上面部とが金属導体からなる蓋型形状のシールド体が設けられていると共に、当該蓋型形状のシールド体の内部に電子部品が配置され、かつ当該蓋型形状のシールド体と前記電子部品との間が絶縁樹脂にて密封封止されていることを特徴とする部品内蔵型プリント配線板により上記課題を解決したものである。 That is, the present invention is the component-embedded printed wiring board in which an electronic component is disposed on the conductive layer of the inner layer of the printed wiring board, a lid on the upper face of the electronic component, and the side surface portion and the upper surface portion made of a metal conductor with shield body type shape is provided, hermetic electronic components disposed within the shield body of the lid-shaped, and between the shield member of the cover-shaped and said electronic component with an insulating resin the component-embedded printed wiring board, characterized by being sealed is obtained by solving the above problems.

また、本発明は、前記シールド体と、前記電子部品が配置された導体層とが非接触状態となっていることを特徴とする部品内蔵型プリント配線板により上記課題を解決したものである。 Further, the present invention includes: the shield body, the component-embedded printed wiring board, wherein the electronic component is arranged conductor layer, characterized in that in the non-contact state is obtained by solving the above problems.

また、本発明は、前記シールド体内部において電子部品が配置されたパッドと、当該パッドと同一層部におけるシールド体外部の他のパッドとが回路配線により接続されていることを特徴とする部品内蔵型プリント配線板により上記課題を解決したものである。 Further, the present invention is built-in component of the pad in which an electronic component is disposed in the shield body portion, and the other pad of the shield member outside the said pad and the same layer unit is characterized in that it is connected by circuit wiring the type printed wiring board is obtained by solving the above problems.

また、本発明は、前記電子部品が、受動部品、能動部品又はモジュールであることを特徴とする部品内蔵型プリント配線板により上記課題を解決したものである。 Further, the present invention, the electronic component is obtained by solving the above problems by passive components, the component-embedded printed wiring board, characterized in that an active component or module.

また、本発明は、プリント配線板の内層部に電子部品が配置された部品内蔵型プリント配線板の製造方法において、当該電子部品が配置されるパッド部から回路配線を形成する工程と、当該電子部品の上方面に、あらかじめ抜き部を設けたプリプレグとあらかじめスルーホールを設けた両面銅張り積層板とを積層する工程と、当該スルーホールの上方面に蓋状態の導体めっきを付与する工程からなることを特徴とする部品内蔵型プリント配線板の製造方法により上記課題を解決したものである。 Further, the present invention provides a method of manufacturing a component-embedded printed wiring board on which electronic components in the inner layer portion is arranged in the printed wiring board, a step of forming a circuit wiring from the pad portion where the electronic component is disposed, the electronic the upper face of the component, a step of laminating the double-sided copper clad laminate in which a previously through hole prepreg having a pre vent portion, comprising the step of imparting a conductor plating lid state upper face of the through hole the method for manufacturing a component-embedded printed wiring board, characterized in that is obtained by solving the above problems.

本発明によれば、プリント配線板の内層部に配置された電子部品の上方面に、側面部と上面部とが金属導体からなる蓋型形状のシールド体が配置されているので、埋設した電子部品から発生する不要輻射雑音を遮蔽することができる結果、隣接する他の電子部品への干渉を抑制でき、同時に外部雑音から埋設した電子部品及び回路への影響を防ぐこともできる。 According to the present invention, the upper face of the electronic component disposed on the inner layer of the printed wiring board, since the shield lid shape in which the side surface portion and the upper surface portion made of a metal conductor is disposed and embedded electronic the results can be shielded unnecessary radiation noise generated from the parts, it is possible to suppress interference with adjacent other electronic components, it is also possible to simultaneously prevent the influence of the electronic components and circuits embedded from external noises. しかも、当該電子部品からの回路配線の引回しを、電子部品が配置された同一の層にて行なうことができる。 Moreover, the routing of the circuit wiring from the electronic component can be carried out in the same layer on which electronic components are arranged.

以下本発明の実施の形態を図面と共に説明する。 Hereinafter will be described an embodiment of the present invention in conjunction with the accompanying drawings.

まず、第1の実施の形態について、図1〜図4を用いて説明する。 First, a first embodiment will be described with reference to FIGS.

図1(a)に示したように、まず、始めに絶縁材2の両面に銅箔1a及び銅箔1bを積層してなる両面銅張り積層板10を用意する。 As shown in FIG. 1 (a), first, a double-sided copper clad laminate 10 formed by laminating copper foils 1a and the copper foil 1b on both surfaces of the insulating material 2 first. 次いで、図1(b)に示したように両面銅張り積層板10に層間接続ビア3を設けた後に、片面の銅箔1aのみを回路形成し、回路配線4及び電子部品を実装するためのパッド5を設ける。 Then, after providing the vias 3 in double-sided copper-clad laminate 10 as shown in FIG. 1 (b), only the circuit forming one side of a copper foil 1a, for mounting the circuit wiring 4 and the electronic component the pad 5 is provided.

前記層間接続ビア3は、主にレーザーによるコンフォーマルビア形成方法やカッパーダイレクトビア形成方法などを用いて穴あけ形成した後に、導体めっきを付与して形成する。 The vias 3 is mainly after drilling formed by using a conformal via forming method and kappa direct via formation method by laser is formed by applying a conductive plating.

また、銅箔1aの回路形成に関しては、ドライフィルムを使用した露光、現像、エッチング、剥離の工程を順次行なうサブトラクティブ回路形成方法などにより形成する。 As for the circuit formation of the copper foil 1a, exposure using a dry film, developing, etching, formed by a subtractive circuit forming method for sequentially performing a peeling process. ここで、図1(b)における回路配線4及び電子部品を実装するためのパッド5の各導体の厚みは、要求されるプリント配線板の構造に従い調整する。 Here, each conductor of the thickness of the pad 5 for mounting the circuit wiring 4 and the electronic component in FIG. 1 (b), is adjusted in accordance with the structure of the required printed circuit board. 図1(b)上においては、導体のエッチング量を調整したところで、回路配線4の導体厚みをパッド5の導体厚みより薄い状態を示しているが、前記両方の導体厚みは同一の厚さでも良い。 In the FIG. 1 (b), the at adjusting the amount of etching of the conductor, but the conductor thickness of the circuit wiring 4 shows a thinner state than the conductor thickness of the pad 5, wherein both the conductor thickness at the same thickness good.

次いで、パッド5上に電子部品6を配置し、配置後は図1(c)に示される電子部品実装後のプリント配線板11を得る。 Then, the electronic component 6 is placed on the pad 5, disposed after obtaining a printed wiring board 11 after the electronic component mounting shown in Figure 1 (c). ここでの電子部品6の配置方法としては、はんだペーストを使用した実装の形態の他に、導電性フィルム接着剤や異方性導電接着剤を使用したプレイスメント方式の実装形態などにより行われる。 The arrangement method of the electronic component 6 in this case, in addition to the form of implementation using a solder paste is performed by such implementation of placement system using a conductive film adhesive or an anisotropic conductive adhesive.

図1(c)に示される電子部品実装後のプリント配線板11は、電子部品6が配置されるパッド5aから2通りの回路配線の引き回しが行なえる。 The printed wiring board 11 after the electronic component mounting as shown in FIG. 1 (c), routing is performed in the circuit wiring of two ways from the pad 5a for the electronic component 6 are arranged. すなわち、1つは電子部品6が配置されるパッド5aから層間接続ビア3を介して下層の導体への接続方法、もう1つは電子部品6が配置されるパッド5aから回路配線4を介して同一の層に配置される他のパッド5bへの接続方法である。 That is, one method of connecting the pads 5a the electronic component 6 is arranged to vias 3 through the underlying conductor and one through the circuit wiring 4 from the pad 5a the electronic component 6 are arranged is a method of connecting to other pads 5b disposed on the same layer.

また、ここで使用される電子部品6としては、チップ形状の抵抗体やコンデンサなどの受動部品、もしくはICやLSIなどの能動部品、あるいはモジュールなどが好適に使用される。 As the electronic component 6 as used herein, passive components such as resistors and capacitors chip shape or IC and active components such as LSI, or modules, etc., are preferably used.

次に、図2を用い、前記電子部品6をプリント配線板の内部に内蔵してなる構造体及び電子部品6からの回路配線の引き回し方法について説明する。 Next, referring to FIG. 2, the structure becomes built into the interior of the electronic component 6 a printed wiring board and the routing method of the circuit wiring from the electronic component 6 will be described.

まず、図2(a)に示されるように、電子部品6をプリント配線板の上に配置してなる先に得られた電子部品実装後のプリント配線板11を使用し、当該電子部品6の上方面よりあらかじめ抜き部25を設けたプリプレグ24及びあらかじめスルーホール23を設けた両面銅張り積層板20を順に重ねて積層する。 First, as shown in FIG. 2 (a), using the printed wiring board 11 after the electronic component mounting previously obtained formed by arranging the electronic components 6 on the printed circuit board, of the electronic component 6 overlapping double-sided copper-clad laminate 20 in which the prepreg 24 and advance through hole 23 provided in advance vent portion 25 from the upper surface is provided in order to laminate.

ここで、プリプレグ24の抜き部25はルーター穴あけなどにより行ない、当該抜き部25の大きさは電子部品6と同様の大きさもしくは電子部品6より若干大きく形成することが良い。 Here, cut-out portion 25 of prepreg 24 is performed by such as a router drilling, the size of the vent portion 25 is better to slightly larger than the electronic components of the same six size or the electronic component 6. これは、使用するプリプレグ24により積層加熱時の流れる樹脂成分の量が異なり、当該プリプレグ24の樹脂流れ量を考慮するためである。 This is different in the amount of resin component flowing during lamination heated by prepreg 24 to be used, in order to consider the resin flow amount of the prepreg 24.

また、前記両面銅張り積層板20へのスルーホール23の形成は、例えば次の手順にて行なう。 The formation of the through hole 23 to the double-sided copper-clad laminate 20 is, for example carried out by the following procedure. 始めに、両面銅張り積層板を用意して、ドリルもしくはルーターによりスルーホール用の穴あけを行なう。 First, to prepare a double-sided copper-clad laminate, performing drilling for through-hole with a drill or router. 当該スルーホールの開口部の大きさは前記プリプレグ24に設けた抜き部25と同様の大きさもしくは若干大きく形成することが良い。 The size of the opening of the through hole, it is better to form large the same size or slightly the vent portion 25 provided to the prepreg 24. これは、積層加熱時にプリプレグ24より流れる樹脂成分を当該スルーホール23内に充填させるためである。 This resin component flowing from the prepreg 24 in order to fill in the through hole 23 during lamination heating.

次いで、スルーホールの開口部をデスミアなどにより洗浄し、銅めっき22を付着させた後に、求められる構造に回路形成を行なう。 Then, the opening of the through hole washed due desmearing, after depositing a copper plating 22 performs circuit formed sought structure. スルーホール23部の回路形成に関しては、ドライフィルムを使用した露光、現像、エッチング、剥離の工程を順次行なうサブトラクティブ回路形成方法などにより形成する。 For the circuit formation of the through hole 23 parts, exposure using a dry film, developing, etching, formed by a subtractive circuit forming method for sequentially performing a peeling process. ここで同時に、図1(a)におけるスルーホール23の付近において求められる構造の回路配線(図示省略)を形成しても良い。 Here the same time, may be formed circuit wiring structure obtained in the vicinity of the through hole 23 (not shown) in FIG. 1 (a). このようにして、図2(a)に示される両面銅張り積層板20を得る。 In this manner, a double-sided copper-clad laminate 20 shown in FIG. 2 (a).

ここでのスルーホール23の構造は、図2(a)に示される垂直な壁面の構造でも良く、また、スルーホール23の壁面はテーパー角度を有する斜めの形状でも良い。 Structure of the through hole 23 in this case may be a structure of a vertical wall surface as shown in FIG. 2 (a), also the wall surface of the through hole 23 may be at an oblique shape having a taper angle. これは、前記のような積層加熱時にプリプレグ24より流れる樹脂成分を当該スルーホール23内に充填し易い構造体となるためである。 This resin component flowing from the prepreg 24 when the laminated heating as the is because the easy structure filled in the through hole 23. さらに、スルーホール23は電子部品6をシールドすることを主要な役割としているため、当該電子部品6のシールドが行ない易い構造であることが重要である。 Further, the through hole 23 because it has a major role to shield the electronic component 6, it is important that the shielding of the electronic component 6 is likely structure performs. そのため、スルーホール23の構造は、円形構造の他に四角形構造や多角形構造として使用することが良い。 Therefore, the structure of the through hole 23 may be used as another in a square structure or polygonal structure of the circular structure.

次いで、図2(a)に示される構造体で積層加熱プレスを行なうことにより、加熱にてプリプレグ24内の樹脂26の成分が流れ、電子部品6の周辺を隙間無く、密封封止状態にすると共に、両面銅張り積層板20のスルーホール23内を隙間無く充填し、積層終了後には図2(b)に示されるL1からL4の4層構造の部品内蔵型のプリント配線板が得られる。 Then, by performing the laminating thermally pressed at the structure shown in FIG. 2 (a), the component of the resin 26 in the prepreg 24 flows in heating, without any gap around the electronic components 6, to hermetically seal state together, the inside of the through hole 23 of the double-sided copper clad laminate 20 was filled without a gap, component built-in printed wiring board having a four-layer structure of L1 - L4 shown in FIG. 2 (b) is obtained after lamination completion.

ここで、図2(b)に示される構造体において、プリプレグ24内の樹脂26が盛り上がりL1部において凸部となる場合がある。 Here, in the structure shown in FIG. 2 (b), there is a case where a convex portion in the L1 parts upsurge resin 26 in the prepreg 24. このような場合には、積層終了後にバフ研磨などによる物理研磨処理を行ない、表層部分の平坦化を行ない、図2(b)に示されるような表面が平坦な構造体を得る。 In such a case, performs physical polishing treatment such as by buffing after lamination completion performs flattening of the surface layer portion, the surface as shown in FIG. 2 (b) obtain a flat structure.

図2(b)に示される構造体は、プリント配線板の内層部に配置された電子部品6の側面部にスルーホール23からなるシールド体を配置した構造となり、電子部品6から発生する不要輻射雑音を遮蔽し、また、隣接する他の電子部品から干渉を抑制することができる。 Structure shown in FIG. 2 (b), becomes a structure in which a shield member made of the through hole 23 on the side surface of the electronic component 6 arranged in the inner layer portion of the printed wiring board, unnecessary radiation generated from the electronic component 6 shield the noise, also it is possible to suppress interference from other adjacent electronic components.

また、前記スルーホール23からなるシールド体は、図2(b)に示される構造体においてL1及びL2に位置する。 The shield body made of the through hole 23 is positioned in the L1 and L2 in the structure shown in FIG. 2 (b). すなわち、前記スルーホール23からなるシールド体は、電子部品6が配置されるパッド5や回路配線4からなるL3の導体層と非接触状態の構造となる。 That is, the shield member made of the through hole 23, a conductor layer and a non-contact state structure L3 consisting pad 5 and circuit wiring 4 on which electronic components 6 are arranged.

また、当該電子部品6は実装パッド5aに配置され、当該から実装パッド5aの回路配線4の引回しが、同一の層(図2(b)内L3層目)にて行なえることとなり、他のパッド5bとの電気的な接続が可能になる。 Moreover, the electronic component 6 are arranged in the mounting pads 5a, routing of circuit wiring 4 of the mounting pads 5a from the can, it is possible perform in the same layer (see FIG. 2 (b) in L3 th layer), the other allowing the electrical connection between the pad 5b. さらに、電子部品6は実装パッド5aに配置され、当該から実装パッド5aから層間接続ビア3を介して下層(図2(b)内L4層目)への配線の引き回しが可能になる。 Moreover, the electronic component 6 is disposed on the mounting pad 5a, it becomes possible to lead the wiring to the lower (L4-layer in FIG. 2 (b)) through the vias 3 from the mounting pads 5a from the.

次いで、図2(b)に示される構造体の表面に化学銅めっき及び電解銅めっきを順に行ない、銅めっき31が付着された図3(a)に示される構造体を得る。 Then, and FIG. 2 (b) to perform the surface chemical copper plating and electrolytic copper plating of the structure in the order shown, to obtain a structure the copper plating 31 is shown in FIG. 3 which is attached (a).

次いで、図3(a)に示される構造体の表面に付着された銅めっき31部の回路形成をサブトラクティブ方法などにより行ない、スルーホール23に接続される蓋部34の形成及び必要とされる回路配線を形成し、図3(b)に示される構造体を得る。 Then, the circuit formation of the copper plating 31 parts attached to the surface of the structure shown in FIGS. 3 (a) is performed by such subtractive methods, is a cover portion 34 formed and need to be connected to the through-holes 23 forming a circuit wiring to obtain a structure shown in FIG. 3 (b).

ここで、当該図3(b)に示される構造体は、プリント配線板の内層部に配置された電子部品6の上方面に、スルーホール23による側面部と蓋部34による上面部とが金属導体からなる蓋型形状のシールド体を配置した構造となっている。 Here, the structure shown in the figure. 3 (b), the upper face of the electronic component 6 arranged in an inner layer portion of the printed circuit board, and the top portion by the side surface portion and the lid portion 34 by the through-hole 23 is a metal has become was placed shield lid shape made of a conductor structure.

プリント配線板の内層部に配置された電子部品6の上方面に、側面部と上面部とが金属導体からなる蓋型形状のシールド体を配置することで、埋設した電子部品6から発生する不要輻射雑音を遮蔽し、隣接する他の電子部品への干渉を抑制でき、同時に外部雑音から埋設した電子部品及び回路への影響を防ぐ効果も有する。 The upper face of the electronic component 6 arranged in an inner layer portion of the printed circuit board, that is the side surface portion and the upper surface portion to place the shield lid shape made of a metal conductor, unnecessary generated from the electronic component 6 was embedded the radiation noise shields, can suppress interference to adjacent other electronic components, also it has an effect of simultaneously preventing the influence on the electronic components and circuits embedded from external noises.

また、図3(b)に示される構造体において、電子部品6の下方面に前記回路形成の際に、電子部品6よりも面積の広い銅部36を形成することで、当該銅部36は電子部品6の下方面のシールドとしても良い。 Further, in the structure shown in FIG. 3 (b), during the circuit formation under surface of the electronic component 6, by forming a large copper section 36 area than the electronic component 6, the copper 36 it may be used as the lower surface of the shield of the electronic component 6. これは、前記電子部品6を外部雑音より保護する際に、電子部品6の上方面と下方面の両面でシールドした方が効果的であり、加えて、前記回路形成により当該銅部36は容易に形成できる利点を有するためである。 This is in protecting the electronic component 6 from the outside noise, better to shield on both sides of the upper surface and the lower surface of the electronic component 6 is effective, in addition, the copper portion 36 by the circuit formed easily This is because an advantage that can be formed.

さらに、図3(b)に示される構造体において、電子部品6の上方面の蓋部34及び下方面の銅部36は、平面で平坦な構造であるため電源層として使用することができる。 Further, in the structure shown in FIG. 3 (b), the copper portion 36 on the lid portion 34 and the lower surface of the surface of the electronic component 6 can be used as a power supply layer for a flat structure in plan.

次に、図3(b)に示される構造体へのビルトアップ構造を図4を用いて説明する。 Will now be described with reference to FIG. 4 a built-up structure to the structure shown in FIG. 3 (b).

図4では、先に得られた図3(b)に示される構造体に、プリプレグ32及び銅箔を積層により順に積み重ね、層間接続ビア3を設けた後に、回路形成によりパッド5及び必要とされる回路配線35を形成したものである。 In Figure 4, the structure shown in FIG. 3 obtained above (b), stacked in this order by laminating prepreg 32 and the copper foil, after providing the vias 3, is a pad 5 and required by the circuit formed that is obtained by forming a circuit wiring 35. このように、プリプレグ32及び銅箔を積層により順に積み重ねることで目的とする層数を有する部品内蔵型の多層プリント配線板を形成することができる。 Thus, it is possible to form the component built-in multilayer printed wiring board having a number of layers of interest by stacking sequentially by stacking the prepreg 32 and the copper foil.

図4に示される構造体は、本発明における部品内蔵型プリント配線板の構造体である。 Structure shown in FIG. 4 is a structure of the component-embedded printed wiring board in the present invention. 当該構造体の機能としては、プリント配線板の内層部に配置された電子部品6の上方面に、スルーホール23からなる側面部と蓋部34からなる上面部とが金属導体からなる蓋型形状のシールド体を配置することで、埋設した電子部品6から発生する不要輻射雑音を遮蔽し、隣接する他の電子部品への干渉を抑制でき、同時に外部雑音から埋設した電子部品及び回路への影響を防ぐ。 The function of the structure, the upper face of the electronic component 6 arranged in an inner layer portion of the printed circuit board, a lid shape that the upper surface portion comprising a side portion and a lid portion 34 comprising a through-hole 23 is made of a metal conductor by disposing the shielding member shields the unnecessary radiation noise generated from the electronic component 6 are embedded, can suppress interference to adjacent other electronic components, at the same time the influence of the electronic components and circuits embedded from external noises prevent.

また、電子部品6が配置された導体層と、前記蓋型形状のシールド体とが非接触状態となっているため、当該非接触状態の箇所において回路配線の配置が可能になる結果、電子部品6からの回路配線の引き回しが広範囲に行なえるので有利である。 Further, a conductor layer on which an electronic component 6 are arranged, the order in which the shield body of the lid-shaped is in a non-contact state, the results it is possible to place the circuit wiring in place of the non-contact state, the electronic component routing of the circuit wiring from 6 is advantageous because a wide range can be performed.

さらに、図3(b)に示される構造説明において記載した如く、電子部品6の上方面の蓋部34及び下方面の銅部36は、平面で平坦な構造であるため電源層として使用することができる。 Furthermore, as described in the structure description given in FIG. 3 (b), the copper portion 36 on the lid portion 34 and the lower surface of the surface of the electronic component 6 is to be used as a power supply layer for a flat structure in plan can. そのために、図4に示される構造体において、蓋部34及びの銅部36の外層方面に回路配線35を形成した場合に、当該回路配線35は信号線として使用することができることから伝送線路となり、下層が電源グランド層であることからマイクロストリップラインを形成できるので有利である。 Therefore, in the structure shown in FIG. 4, in the case of forming a circuit wiring 35 on the outer surface of the lid portion 34 and the copper portion 36, the circuit wiring 35 becomes a transmission line because it can be used as a signal line is advantageous because it forms a microstrip line since the lower layer is a power ground layer.

次に、第2の実施の形態について、図5及び図6を用いて説明する。 Next, a second embodiment will be described with reference to FIGS.

図5(a)に示したように、まず、始めに前記図1(c)で得た電子部品実装後のプリント配線板11を用意する。 As shown in FIG. 5 (a), first, a printed wiring board 11 after the electronic component mounting obtained in FIG 1 (c) first. 次いで、当該電子部品実装後のプリント配線板11の下方面よりプリプレグ32及び銅箔33を順に配置する。 Then, placing the prepreg 32 and the copper foil 33 from the lower surface of the printed wiring board 11 after the electronic component mounting order. 併せて、当該電子部品実装後のプリント配線板11の上方面よりあらかじめ開口部を設けたプリプレグ24、あらかじめスルーホール23を設けた両面銅張り積層板20、プリプレグ32及び銅箔33を順に配置し、積層により接着する。 In addition, placing the electronic component prepreg 24 is provided in advance opening than upper face of the mounting post of the printed wiring board 11, double-sided copper-clad laminate 20 is provided in advance through hole 23, the prepreg 32 and the copper foil 33 in order , it is bonded by lamination.

ここで、プリプレグ24の開口部はルーター穴あけにより行ない、当該開口部の大きさは電子部品6と同様の大きさもしくは電子部品6より若干大きく形成することが良い。 Here, the opening of the prepreg 24 is performed by the router drilling, the size of the opening portion is good to slightly larger than the electronic components of the same six size or the electronic component 6. これは、使用するプリプレグ24により積層加熱時の流れる樹脂成分の量が異なり、当該プリプレグ24の樹脂流れ量を考慮するためである。 This is different in the amount of resin component flowing during lamination heated by prepreg 24 to be used, in order to consider the resin flow amount of the prepreg 24.

また、前記両面銅張り積層板20へのスルーホール23の形成は次の手順にて行なう。 The formation of the through hole 23 to the double-sided copper-clad laminate 20 is performed by the following procedure. 始めに、両面銅張り積層板を用意して、ドリルもしくはルーターによりスルーホール用の穴あけを行なう。 First, to prepare a double-sided copper-clad laminate, performing drilling for through-hole with a drill or router. 当該スルーホール開口部の大きさは前記プリプレグ24に設けた抜き部25と同様の大きさもしくは若干大きく形成することが良い。 The size of the through hole opening portion is good to form large the same size or slightly the vent portion 25 provided to the prepreg 24. これは、積層加熱時にプリプレグ24より流れる樹脂成分を当該スルーホール23内に充填させるためである。 This resin component flowing from the prepreg 24 in order to fill in the through hole 23 during lamination heating.

ここでのスルーホール23の構造は、図5(a)に示される垂直な壁面の構造でも良く、また、スルーホール23の壁面はテーパー角度を有する斜めの形状でも良い。 Structure of the through hole 23 in this case may be a structure of a vertical wall surface as shown in FIG. 5 (a), also the wall surface of the through hole 23 may be at an oblique shape having a taper angle. これは、前記のような積層加熱時にプリプレグ24より流れる樹脂成分を当該スルーホール23内に充填し易い構造体となるためである。 This resin component flowing from the prepreg 24 when the laminated heating as the is because the easy structure filled in the through hole 23.

次いで、前記スルーホール開口部に、銅めっき22を付着させ、また目的とする構造に回路形成を行ない図5(a)に示される両面銅張り積層板20を得る。 Then, to obtain the through hole opening, depositing a copper plating 22 and the double-sided copper-clad laminate 20 shown in FIG. 5 performs circuit formed structure of interest (a).

図5(a)に示される構造体で積層による加熱を行なうことで、抜き部を設けたプリプレグ24及びプリプレグ32内の樹脂26の成分が流れ、電子部品6の周辺を隙間無く包むとともに、両面銅張り積層板20のスルーホール23内を隙間無く充填し、積層終了後には図5(b)に示される6層構造の部品内蔵型のプリント配線板が得られる。 5 by performing the heating by multilayer in structure (a), the component of the resin 26 flows in the prepreg 24 and the prepreg 32 having a cut-out portion, with wrap without a gap surrounding the electronic component 6, both surfaces within the through hole 23 of the copper clad laminate 20 was filled without a gap, component built-in printed circuit board 6 layer structure shown in FIG. 5 (b) is obtained after lamination completion.

次いで、図5(b)に示される6層構造の部品内蔵型のプリント配線板に、スルーホール23に接続されるように層間接続ビア3を設けた後に、表面の銅箔の回路形成をサブトラクティブ方法などにより行ない、蓋部34の形成及び必要とされる回路配線を形成し、図6に示される構造体を得る。 Then, the component built-in printed circuit board 6 layer structure as shown in FIG. 5 (b), after providing the vias 3 to be connected to the through-hole 23, the circuit formation of the copper foil surface subtransactions performed due active method, to form the forming and the required circuit wiring of the cover portion 34 to obtain a structure shown in FIG.

ここで、当該図6に示される構造体は、プリント配線板の内層部に配置された電子部品6の上方面に、スルーホール23及び層間接続ビア3による側面部と、蓋部34による上面部とが金属導体からなる蓋型形状のシールド体を配置した構造となっている。 Here, the structure shown in the figure 6, the upper face of the electronic component 6 arranged in an inner layer portion of the printed circuit board, and side portions by the through holes 23 and vias 3, the upper surface portion by the lid portion 34 bets are a structure in which the shield lid shape made of a metal conductor. 斯かる構造により、電子部品6から発生する不要輻射雑音を遮蔽し、隣接する他の電子部品から干渉を抑制できる。 With such a structure, to shield the unnecessary radiation noise generated from the electronic parts 6 can suppress interference from other adjacent electronic components. また、当該電子部品6からの回路配線の引回しを、電子部品が配置された同一の層にて行なうことができる。 Further, the routing of the circuit wiring from the electronic component 6 can be carried out in the same layer on which electronic components are arranged.

試験例 本発明における、スルーホール23と蓋部34からなる蓋型形状のシールド体について、そのシールド効果を確認するために、電界強度を比較するシミュレーション試験を行なった。 In Test Example The present invention will shield lid shape consisting of the through hole 23 and the lid 34, in order to confirm the shielding effect, simulations were performed study comparing field strength. シミュレーション試験に使用するプリント配線板の構造体としては、(i)図4に示される部品内蔵型プリント配線板の構造体よりスルーホール23と蓋部34を除いたプリント配線板の構造体(シールド機能が無い構造)と、(ii)図4に示される本発明の部品内蔵型プリント配線板の構造体(シールド機能を有する構造)とを使用した。 The structure of the printed wiring board to be used in the simulation test, (i) 4 in the component-embedded printed wiring board structure of a printed wiring board except for the through hole 23 and the lid portion 34 from the structure shown (Shield feature that there is no structure), it was used and (ii) component-embedded printed wiring board structure of the present invention shown in FIG. 4 (a structure having a shielding function).

試験方法としては、CST社製の電磁界解析シミュレータ(MW−Studio)を使用して、前記2種の構造体におけるモデルを作製し、非定常解析によって電界強度の比較を検討した。 The test method uses the CST manufactured by electromagnetic field analysis simulator (MW-Studio), to prepare a model of the two structures was studied comparing the field strength by transient analysis.

解析方法としては、埋設された部品が接続される配線の始端部から、電圧0.4[V]、立ち上り時間50[ps]の矩形信号を入力し、当該配線の終端部より出力させる。 As analysis method, from the beginning of wires buried parts are connected, the voltage 0.4 [V], and enter a rectangular signal rise time 50 [ps], is outputted from the terminal end of the wiring. その時に、埋設された部品の上部1mmの位置に配置した電界強度解析用の測定端子にて、入力信号に対しての電界の強度を時間軸によって解析した。 At that time, in buried parts of the measuring terminals for electric field strength analysis arranged in the position above 1 mm, the strength of the electric field of the input signal analyzed by the time axis.

すなわち、図4に示される部品内蔵型プリント配線板の構造体において、入力端子部90より0.4[V]の矩形信号を入力し、当該矩形信号を出力端子部91より出力させる。 That is, in the structure of the component-embedded printed wiring board shown in FIG. 4, to input a rectangular signal from the input terminal unit 90 0.4 [V], and outputs the rectangular signal from the output terminal 91. その際に、信号の入出力における電界強度の測定箇所を、図4に示される部品内蔵型プリント配線板の蓋部34の上方向部に設置して測定することで、埋設された部品の上部における電界強度の解析を行った。 At that time, the measurement point of the electric field intensity in the input and output of signals, by measuring installed toward portions on the component-embedded printed wiring board of the lid portion 34 shown in FIG. 4, buried components top of the analysis of the electric field intensity in the went.

前記測定の結果について、(i)図4に示される部品内蔵型プリント配線板の構造体よりスルーホール23と蓋部34を除いたプリント配線板の構造体(シールド機能が無い構造)の場合を図8(a)に示し、(ii)図4に示される本発明の部品内蔵型プリント配線板の構造体(シールド機能を有する構造)の場合を図8(b)に示した。 The results of the measurement, the case of (i) a printed wiring board structure excluding the through holes 23 and the lid portion 34 from the structure of the component-embedded printed wiring board shown in FIG. 4 (structure shielding function without) Figure 8 shows (a), the shown in (ii) component-embedded printed wiring board structure of the present invention shown in Figure 4. Figure 8 in the case of (a structure having a shielding function) (b).

図8(a)に示されるシールド機能が無い構造の場合、矩形信号入力時に埋設した電子部品の上部の電界強度は最大4500[V/m]となることが確認された。 For the structure shielding function is not shown in FIG. 8 (a), the upper portion of the electric field strength of the electronic component embedded in the time of the rectangular signal input is to be a maximum 4500 [V / m] was confirmed. 一方、図8(b)に示される本発明のシールド機能を有する構造の場合、矩形信号入力時に埋設した電子部品の上部の電界強度は最大1300[V/m]となることが確認された。 On the other hand, when the structure having a shielding function of the present invention shown in FIG. 8 (b), the upper portion of the electric field strength of the electronic component embedded in the time of the rectangular signal input is to be a maximum 1300 [V / m] was confirmed. したがって、図4に示される本発明のシールド機能を有する部品内蔵型プリント配線板の構造体は、埋設された部品のシールド構造により、矩形信号を入力した時に埋設部品や回路配線から発生する不要輻射雑音を遮蔽する効果が得られたことが確認された。 Thus, component-embedded printed wiring board structure having a shielding function of the present invention shown in Figure 4, the shield structure buried part, unnecessary radiation generated from embedded parts and circuit wiring when inputted rectangular signal the effect of shielding the noise was obtained was confirmed.

すなわち、前記(i)シールド機能が無い構造の場合には、埋設された電子部品及びその周辺の回路配線から発生する不要輻射雑音の影響を、当該部品の上層に配置した信号線(伝送線路)や電子部品等が受ける不具合を生じる。 That is, the (i) in the case shielding function without structure, embedded electronic component and the influence of unnecessary radiation noise generated from the circuit wiring around it, a signal line disposed on the upper layer of the component (transmission line) results in a problem that and electronic parts and the like is subjected.

一方、前記(ii)本発明のシールド機能を有する構造の場合には、埋設された電子部品及びその周辺の回路配線から発生する不要輻射雑音による不具合を防ぐことが可能になり、当該部品の上層に配置した信号線(伝送線路)や電子部品等を配置した場合にも、不要輻射雑音の影響を遮蔽する効果を有する。 On the other hand, in the case of a structure having a shielding function of the (ii) the present invention, it is possible to prevent problems caused by unnecessary radiation noise generated from the embedded electronic components and circuit wirings around the top layer of the component If the placement signal line (transmission line) or electronic components is arranged also has the effect of shielding the influence of the unnecessary radiation noise.

加えて、前記埋設された電子部品及びその周辺の回路配線自身も、前記上層に配置した電源や回路配線等からの不要輻射雑音の影響を受けない構造となり、シールド機能を介して互いに干渉しないことで、不要輻射雑音を低減する効果があることが確認された。 In addition, the embedded electronic components and circuit wiring itself around the well becomes a structure which is not affected by unnecessary radiation noise from the power supply and the circuit wiring or the like disposed in the upper layer, that do not interfere with each other through the shielding function in, it was confirmed that the effect of reducing the unnecessary radiation noise.

本発明における部品内蔵型プリント配線板は、埋設された電子部品及び回路配線をシールド材で覆うことにより不要輻射雑音を遮蔽し、同時に、外部雑音の影響からも電子部品及び回路配線を保護することが可能になることで、部品内蔵型プリント配線板のEMC(electromagnetic compatibility)特性が向上する。 Component-embedded printed wiring board in the present invention is to shield the unnecessary radiation noise by covering the buried electronic components and circuit wirings in shielding material, at the same time, to protect the electronic components and circuit wiring from the influence of external noises is that it allows, the component-embedded printed wiring board EMC (electromagnetic compatibility) characteristics are improved.
加えて、雑音対策として部品間などに充分な絶縁スペースを設ける必要がなくなるために、部品内蔵型プリント配線板の高密度化が可能となる。 In addition, since it is not necessary to provide a sufficient insulating space like between the parts as a noise countermeasure, high density of component-embedded printed wiring board it is possible.

本発明の第1の実施の形態を示す概略断面工程説明図。 Schematic cross-sectional process diagram showing a first embodiment of the present invention. 図1に引き続く概略断面工程説明図。 Subsequent schematic cross-sectional process diagram in Figure 1. 図2に引き続く概略断面工程説明図。 Subsequent schematic cross-sectional process diagram in Figure 2. 図3に引き続く概略断面工程説明図。 Subsequent schematic cross-sectional process diagram in FIG. 本発明の第2の実施の形態を示す概略断面工程説明図。 Schematic cross-sectional process diagram showing a second embodiment of the present invention. 図5に引き続く概略断面工程説明図。 Subsequent schematic cross-sectional process diagram in FIG. 従来の部品内蔵型プリント配線板の概略断面説明図。 Schematic cross-sectional view of a conventional component-embedded printed wiring board. 試験例における試験結果を示すグラフ。 Graph showing test results in Test Example.

符号の説明 DESCRIPTION OF SYMBOLS

1,1a,1b:銅箔2:絶縁材3:層間接続ビア4:回路配線5,5a,5b:パッド6:電子部品10:両面銅張り積層板11:電子部品実装後のプリント配線板20:両面銅張り積層板22:銅めっき23:スルーホール24:プリプレグ25:抜き部26:樹脂31:銅めっき32:プリプレグ33:銅箔34:蓋部35:回路配線36:銅部70:接続ランド71:下部配線版72:上部配線版73:中部配線版74:金属導体層75:気密空間77:非貫通導通穴78:金属膜79:バンプ80:電子部品 1, 1a, 1b: copper foil 2: insulator 3: vias 4: circuit wiring 5, 5a, 5b: Pad 6: electronic component 10: double-sided copper-clad laminate 11: the printed wiring board 20 after the electronic component mounting : double-sided copper-clad laminate 22: copper plating 23: through hole 24: prepreg 25: vent portion 26: resin 31: a copper plating 32: prepreg 33: copper foil 34: lid 35: circuit wiring 36: copper 70: connection land 71: lower wiring plate 72: upper wiring plate 73: Central wiring boards 74: a metal conductor layer 75: airtight space 77: non-through conducting holes 78: metal film 79: bump 80: electronic component

Claims (5)

  1. プリント配線板の内層部の導体層に電子部品が配置された部品内蔵型プリント配線板において、当該電子部品の上方面に、側面部と上面部とが金属導体からなる蓋型形状のシールド体が設けられていると共に、当該蓋型形状のシールド体の内部に電子部品が配置され、かつ当該蓋型形状のシールド体と前記電子部品との間が絶縁樹脂にて密封封止されていることを特徴とする部品内蔵型プリント配線板。 In component-embedded printed wiring board in which an electronic component is disposed on the conductive layer of the inner layer of the printed wiring board, the surface on of the electronic component, shielding body cover shape in which the side surface portion and the upper surface portion made of a metal conductor together provided, the electronic component is disposed within the shield body of the lid-shaped, and that between the shield member of the cover-shaped and said electronic component is hermetically sealed with an insulating resin component-embedded printed wiring board, wherein.
  2. 前記シールド体と、前記電子部品が配置された導体層とが非接触状態となっていることを特徴とする請求項1に記載の部品内蔵型プリント配線板。 It said shield body and component-embedded printed wiring board according to claim 1, wherein the electronic component is arranged conductor layer, characterized in that in the non-contact state.
  3. 前記シールド体内部において電子部品が配置されたパッドと、当該パッドと同一層部におけるシールド体外部の他のパッドとが回路配線により接続されていることを特徴とする請求項1又は2のいずれか1項に記載の部品内蔵型プリント配線板。 A pad in which an electronic component is disposed in the shield body portion, either the other pad of the shield member outside the said pad and the same layer unit of claim 1 or 2, characterized in that it is connected by circuit wiring component-embedded printed wiring board according to (1).
  4. 前記電子部品が、受動部品、能動部品又はモジュールであることを特徴とする請求項1〜3のいずれか1項に記載の部品内蔵型プリント配線板。 The electronic component is a passive component, the component-embedded printed wiring board according to claim 1, characterized in that the active component or module.
  5. プリント配線板の内層部に電子部品が配置された部品内蔵型プリント配線板の製造方法において、当該電子部品が配置されるパッド部から回路配線を形成する工程と、当該電子部品の上方面に、あらかじめ抜き部を設けたプリプレグとあらかじめスルーホールを設けた両面銅張り積層板とを積層する工程と、当該スルーホールの上方面に蓋状態の導体めっきを付与する工程からなることを特徴とする部品内蔵型プリント配線板の製造方法。 The method for manufacturing a printed wiring board inner layer component-embedded printed wiring board on which the electronic components are disposed of, forming a circuit wiring from the pad portion where the electronic component is disposed, on the upper face of the electronic component, parts, wherein the step of laminating the double-sided copper-clad laminate having a previously through hole prepreg having a pre-cut-out portion, in that it consists of applying a conductive plating of the lid state upper face of the through hole method for manufacturing embedded printed wiring board.
JP2005123133A 2005-04-21 2005-04-21 Printed board with built-in component and manufacturing method thereof Pending JP2006303202A (en)

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JP2008130915A (en) * 2006-11-22 2008-06-05 Murata Mfg Co Ltd Component built-in substrate
JP2008182024A (en) * 2007-01-24 2008-08-07 Dainippon Printing Co Ltd Wiring board including electronic component and method for removing electromagnetic noise of the same
JP2008235527A (en) * 2007-03-20 2008-10-02 Fujitsu Ltd Method of manufacturing component built-in substrate
JP2008283114A (en) * 2007-05-14 2008-11-20 Dainippon Printing Co Ltd Electronic component mounting wiring board, and electromagnetic noise removal method of electronic component mounting wiring board
JP2009147249A (en) * 2007-12-18 2009-07-02 Minami Kk Method of mounting electronic component on printed wiring board
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JP2017512424A (en) * 2014-02-26 2017-05-18 エプコス アクチエンゲゼルシャフトEpcos Ag Package for tunable filter
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JPWO2016047446A1 (en) * 2014-09-26 2017-04-27 株式会社村田製作所 Method of manufacturing a multilayer module and laminated modules
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