JP2006186086A - Method for soldering printed circuit board and guide plate for preventing bridge - Google Patents

Method for soldering printed circuit board and guide plate for preventing bridge Download PDF

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JP2006186086A
JP2006186086A JP2004377535A JP2004377535A JP2006186086A JP 2006186086 A JP2006186086 A JP 2006186086A JP 2004377535 A JP2004377535 A JP 2004377535A JP 2004377535 A JP2004377535 A JP 2004377535A JP 2006186086 A JP2006186086 A JP 2006186086A
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soldering
guide plate
circuit board
method
printed circuit
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Akihide Mizutani
Tsuneo Nakamura
常夫 中村
彰秀 水谷
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Itoo:Kk
Tooya:Kk
株式会社 トーヤ
株式会社イトー
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Abstract

PROBLEM TO BE SOLVED: To provide a soldering method for effectively preventing the so-called bridge phenomenon in which melted solder strings out between adjacent leads, and to provide a guide plate for preventing bridges used for the soldering method in an automatic soldering method of a printed circuit board by a dipping method.
SOLUTION: In the method for soldering each kind of electronic component to a through-hole on the printed circuit board via a lead in a process for passing a melted solder bath, the sheet-like guide plate for preventing bridges in which the surface is machined in a mesh is interposed on the substrate surface of a soldering tool, an intermediate layer, and a soldering surface before soldering in the melted solder bath. The guide plate for bridges is used in the soldering method.
COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、プリント基板を溶融はんだ槽の溶融はんだに接触させることにより、該基板上に各種電子部品をはんだ付けする方法と、該はんだ付けに際してリード間に溶融はんだが連なる所謂ブリッジ現象を防止するための、ブリッジ防止用ガイド板に関する。 The present invention is by contacting a printed circuit board in a molten solder of the molten solder bath to prevent the process of soldering various electronic parts on a substrate, a so-called bridge phenomenon that molten solder continuous between the leads during the soldering for, to bridge prevention guide plate.

プリント基板に対する各種電子部品等のはんだ付け方法は、大別して鏝付け法、リフロー法および浸漬法がある。 Soldering method of various electronic components for printed circuit board, iron with methods to broadly classified into a reflow method and a dipping method. これらの中で鏝付け法は軸心に松脂を充填したはんだ線をプリント基板の半田付け部に当接して、該はんだ線をはんだ鏝で加熱溶融させながらはんだ付けを行うものであり、その生産性は極めて悪いものであるが、耐熱性に劣る電子部品をはんだ付けしたり、他のはんだ付け方法で発生した未はんだやブリッジ等のはんだ付け不良を修正する方法としては、依然として重宝されている。 Trowel with methods among these are in contact solder wire filled with pine resin to the axis to the soldering portion of the printed circuit board, which performs soldered while heating and melting in iron solder the solder line, its production Although sex is extremely bad, as a method of modifying or soldering electronic components poor in heat resistance, such as unsoldered and bridges that occur in other soldering method soldering defects, it is still useful . また、リフロー法ははんだ粉末とペースト状フラックスによって調製された粘調性のソルダーペーストを、スクリーン印刷やディスペンサー吐出による手段によってプリント基板上の必要箇所に塗布し、その後該基板をリフロー炉のような加熱装置において加熱することによってはんだ付けを行う方法である(例えば、特許文献1参照)。 Moreover, the reflow method has a viscous solder paste prepared by solder powder and a paste-like flux is applied to necessary portions on the printed circuit board by means by screen printing or a dispenser discharge, such as a subsequent substrate reflow furnace a method of performing soldering by heating in a heating apparatus (e.g., see Patent Document 1). このリフロー法は、選択される複数の必要箇所に同時にはんだ付けができるため、信頼性と生産性に優れた方法であるが、所定のはんだ粉末を製造するために多くの工程を要し、しかも特定の粒度のはんだ粉末を得るためには歩留まりが悪く、高コストとなるという問題があり、それに起因してコンピューターや携帯電話など、比較的に付加価値の高い電子機器に限って採用されるはんだ付け方法である。 The reflow method, since it is soldered simultaneously to multiple necessary places to be selected, is a method and reliability superior productivity, it requires many steps to produce a predetermined solder powder, moreover poor yield in order to obtain a solder powder of a particular particle size, there is a problem of a high cost, etc. it due computers and mobile phones, the solder employed only in high-value relatively electronic device it is a marked way.

一方、浸漬法は自動はんだ付け装置を用いてプリント基板に複数の電子部品を同時にはんだ付けする方法であり、該自動はんだ付け装置の噴流はんだ槽の噴流ノズルから噴流する溶融はんだに、プリント基板を接触させながら順次はんだ付けするため、はんだ自体を得るためには手間の係る加工を要さず、多数のはんだ付け箇所を一連の作業ではんだ付けするという経済性と生産性に優れた方法である。 On the other hand, the dipping method is a method of simultaneously soldering a plurality of electronic components on a printed board using an automatic soldering apparatus, the molten solder jetted from the jet nozzle of the jet solder bath of the automatic soldering apparatus, the printed circuit board to put successively soldering while contacting, without requiring processing of a hassle to obtain the solder itself, it is an excellent way to productivity and economic efficiency of soldering a large number of soldering points in a series of operations . 従って現在においてはテレビ、ビデオ、DVD、各種オーディオ機器、家電製品などの電子回路を構成するための、プリント基板のはんだ付け方法として広く採用されている。 Thus in the current television, video, DVD, various audio equipment, for constituting an electronic circuit, such as home appliances, have been widely employed as a method of soldering a printed circuit board.

上記の浸漬法における従来の自動はんだ付け装置は、例えば図8に示すようにフラクサー20、プリヒーター30、噴流はんだ槽40、冷却機50等の処理装置が順次備えられており、これらの処理装置上にプリント基板を搬送する搬送装置が設置されている。 Conventional automatic soldering apparatus in the above dipping method, for example fluxer 20, as shown in FIG. 8, the pre-heater 30, the jet solder tank 40 is provided with the sequential processing unit such as a cooler 50, these processor conveying device is provided for transporting the printed circuit board on top. 該自動はんだ付け装置におけるプリント基板のはんだ付け方法は、該プリント基板(図示せず)を搬送装置によって矢印方向へ搬送しながら、フラクサー20によってフラックスを塗布した後、プリヒーター30において予備加熱を施し、噴流はんだ槽40ではんだ付け部への溶融はんだの侵入を促し、次いで冷却機50で侵入した溶融はんだを冷却固化してろう付を完了する仕組みとなっている。 Soldering of a PCB in the automatic soldering apparatus, while conveying the printed circuit board (not shown) by the conveying device in the direction of the arrow, after applying flux by fluxer 20, subjected to preliminary heating in the preheater 30 in the jet solder tank 40 encourage the molten solder from entering the soldered portion, and then has a complete mechanism to brazing the molten solder penetrated by cooler 50 and cooled and solidified. この際、噴流はんだ槽40は荒波はんだ槽60と仕上げはんだ槽70のダブルウェーブはんだ槽を構成し、荒波はんだ槽60で形成されたツララやブリッジなどのはんだ付け不良を、仕上げはんだ槽70における穏やかな噴流波によって修正するように構成されている(例えば、特許文献2参照)。 In this case, jet solder tank 40 constitutes a double wave soldering bath of solder bath 70 and finishing rough seas solder bath 60, the soldering defects such as icicle and bridges formed in rough seas solder bath 60, moderate in the finish solder bath 70 It is configured to modify by a jet flow (e.g., see Patent Document 2).
特開平5−198932号公報(第1〜4頁、図1〜6) JP-5-198932 discloses (the first to fourth pages, FIGS. 1-6) 特許第2687218号公報(第1〜3頁、図2) Japanese Patent No. 2687218 (first to third pages, FIG. 2)

ところでプリント基板のはんだ付けは、プリント基板上に形成されたスルーホールに、その表面から例えばコネクタ等の電子部品のリードを挿入して、該リードとスルーホール間をはんだによって接続したり、プリント基板の裏側に搭載された電子部品の電極とプリント基板のランドとを接続することによって行われるため、溶融したはんだは細いスルーホールの内部や角ばった電子部品の隅部にまで、十分に侵入しないとはんだの付着しない未はんだが生ずる。 Meanwhile soldering printed circuit board, the through holes formed in the printed circuit board, by inserting the electronic component leads, for example connectors, etc. from the surface, or connected by soldering between the lead and the through-hole, the printed circuit board to be done by connecting the electrodes of the electronic component and the printed circuit board lands mounted on the back of, to the corners of the electronic component aeration inside and corners of the molten solder is narrow through holes, if not penetrate sufficiently cause is not yet solder does not solder adhesion. また、上記従来技術においても明らかなように、プリント基板に溶融したはんだを付着させる噴流はんだ槽には、溶融はんだを荒れた状態で噴流させる一次噴流ノズルと、溶融はんだを穏やかな状態で噴流させる二次噴流ノズルとが設けられ、所謂ダブルウェーブはんだ槽を構成している。 Further, as is apparent in the above prior art, the jet solder bath to deposit molten solder to a printed circuit board, a primary jet nozzle for jetting a state in which rough the molten solder, thereby jets the molten solder in a gentle state the secondary jet nozzle and is provided, constitutes a so-called double wave soldering bath. この一次噴流ノズルは強い吐出力を以ってプリント基板のスルーホールや電子部品等の隅部に溶融はんだを侵入させ、未はんだを防ぐために機能するが、該一次噴流ノズルによって形成される溶融はんだの荒波は、文字通り荒れた状態ではんだ付け部に接触するため、はんだ付け部にツララやブリッジが形成される。 This primary jet nozzle is infested molten solder in the corner portion such as a through hole and electronic components of the printed circuit board drives out strong ejection force, the molten solder will function to prevent unsoldered, formed by the primary jet nozzle rough seas, in order to contact the soldered portion in a state where the rough literally icicles and bridges are formed in the soldered portion. プリント基板にツララが形成されると、その尖った先端から放電して電子機器の破壊を招くことが懸念され、また、ブリッジが形成されてリード間が連なると、電子回路に短絡が生じて電子機器の機能が損なわれることがある。 When icicles are formed on the printed circuit board, it is a concern that lead to destruction of the electronic device to discharge from the sharpened tip, and when the bridge is formed continuous is between the leads, occurs a short circuit in the electronic circuit electronic there is the function of the device is impaired. そこで一次噴流ノズルによって発生したツララやノズルを、上記二次噴流ノズルによる穏やかな溶融はんだ波によって再溶融させて除去するように構成されている。 Therefore the icicle and nozzles generated by the primary jet nozzle, and is configured to remove by re-melting by gentle molten solder wave by the secondary jet nozzle.

このようにダブルウェーブ方式の噴流はんだ槽の開発と工程の改良が相俟って、プリント基板におけるはんだ付け方法は著しく改善され、生産性の向上に加えて製品の信頼性も大幅に向上した。 Thus I development and process phases 俟 improvement of the jet solder bath of a double wave method, soldering method in the printed board is significantly improved, it was also greatly improved product reliability in addition to the improvement of productivity. 然しながら近年、高密度の集積回路用ICチップなど、多機能な電子部品の開発が著しく進化して、それらの電子部品を搭載するためのプリント基板のはんだ付け方法においては、リードのピッチ間隔がますます狭隘化されるなどなお改善の余地を残し、かつ煩雑な工程を重ねるはんだ付け方法を採用しているにも拘らず、依然としてはんだ付不良、とりわけブリッジの発生については未だ十分な防止対策が確立されておらず、手間の掛かるはんだ付け後の修正作業が必要不可欠となるなど、生産性の向上と品質の信頼性の確保などについては更に解決を望まれる課題が残されていた。 However in recent years, high-density integrated circuit IC chip, developed significantly evolution of multifunctional electronic components, in the method of soldering a printed circuit board for mounting these electronic components increases the pitch of the leads masu leave the room, such as a further improvement is narrowing, and in spite of have adopted the soldering method to overlay a complicated process, still poor soldering, among other things still enough prevention measures established for the occurrence of a bridge not not been, and correction work after soldering laborious becomes indispensable, problems still desired to solve for ensuring of improving the quality of the reliability of the productivity had been left. 本発明は斯かる課題を解決することを所期の目的とし、簡略な手段によってブリッジの発生を防止するプリント基板のはんだ付け方法と、ブリッジ防止用ガイド板を提供するものである。 The present invention is to solve such problems and intended purpose, provides a method of soldering a printed circuit board to prevent the occurrence of the bridge by means of a simple means, a bridge prevention guide plate.

上記課題を解決するための本発明によるプリント基板のはんだ付け方法は、溶融はんだ槽を通過する過程でプリント基板のスルーホールに、リードを介して各種電子部品をはんだ付けする方法において、はんだ付け用冶具の基板面、中間層およびはんだ面に、表面をメッシュ状に加工したシート状のブリッジ防止用ガイド板を介在させ、しかる後に溶融はんだ槽ではんだ付けすることを特徴的構成要件とするものである。 Soldering of a PCB according to the present invention for solving the above problems, the through-hole of the printed circuit board in the process of passing through the molten solder bath, a method for soldering various electronic parts via leads, for soldering substrate surface of the jig, the intermediate layer and the solder surface, the surface is interposed processed sheet-form bridge prevention guide plate in a mesh, in which a characteristic configuration requirements that soldering with molten solder bath thereafter is there.

また、本発明による上記プリント基板のはんだ付け方法において、前記ブリッジ防止用ガイド板が、表面をメッシュ状に加工された金属もしくは耐熱性樹脂からなるシート状の薄板によって形成されることを特徴とするものである。 Further, in the method of soldering the PCB according to the present invention, the bridge preventing the guide plate, characterized in that it is formed by a sheet-shaped thin plate made of a surface of the processed metal or heat-resistant resin into a mesh it is intended.

さらに本発明によるブリッジ防止用ガイド板は、溶融はんだ槽を通過する過程でプリント基板のスルーホールに、リードを介して各種電子部品をはんだ付けする方法において、はんだ付け用冶具の基板面、中間層およびはんだ面に介在して、溶融はんだによるブリッジの形成を防止することを特徴的構成要件とするものである。 Furthermore bridge prevention guide plate according to the present invention, the through-hole of the printed circuit board in the process of passing through the molten solder bath, a method for soldering various electronic parts via leads, the substrate surface of the soldering jig, the intermediate layer and interposed solder surface, it is an characteristic configuration requirements to prevent the formation of bridges by the molten solder.

また、本発明による前記ブリッジ防止用ガイド板が、表面をメッシュ状に加工された金属もしくは耐熱性樹脂からなるシート状の薄板によって形成されることを特徴とするものである。 Further, the bridge preventing the guide plate according to the invention is characterized in being formed by a sheet-shaped thin plate made of a surface of the processed metal or heat-resistant resin in a mesh.

本発明に係る上記プリント基板のはんだ付け方法によれば、静波状態におけるはんだ浴との接触によってプリント基板のスルーホールへのリードのはんだ付けが完了するので、主として荒波噴流槽における溶融はんだ粒の飛散に起因するツララが発生せず、しかも該プリント基板とはんだ浴面との間に介在するブリッジ防止用ガイド板によって、リード間に連なる溶融はんだが絶たれてブリッジの形成が未然に防止され、若しくは該ブリッジ防止用ガイド板を取り外すことによって、前記リードのピッチ間に連なって形成されたブリッジが同時に除去されるため、はんだ付け後の修正作業は完全に省略される。 According to the soldering method of the printed circuit board according to the present invention, since soldering of the leads to the through-hole of the printed circuit board by contact with a solder bath at Shizunami state is completed, primarily scattering of the molten solder particles in rough seas jet tank due to icicles it does not occur, yet the bridge prevention guide plate interposed between said printed circuit board and the solder bath surface, formation of the bridge is cut off the molten solder leading to between the leads is prevented, or by removing the bridge prevention guide plate, since the bridges formed continuous with the pitch between the leads is removed simultaneously correcting work after soldering is omitted entirely. また、従来から汎用されている荒波噴流はんだ槽によるはんだ付け後、仕上げはんだ槽によるはんだ不良の修正工程を要することもなく、はんだ付け面におけるブリッジが容易に除去されるため、プリント基板における電子回路の形成のためのはんだ付けが簡略な操作によって容易に実施できる。 Furthermore, after soldering by rough seas jet solder bath which is generally conventional, without requiring a correction step of soldering defects due to finishing the solder bath, since the bridge at the soldering surface is easily removed, the electronic circuit in the printed circuit board soldering for the formation can be easily carried out by simple operation. 従って高密度集積回路を有する各種電子部品等を搭載するプリント基板を、高い信頼性を維持しながら低価格で提供することが可能となる。 Therefore the printed circuit board for mounting various electronic parts and the like having a high density integrated circuits, it is possible to provide at low cost with high reliability.

また、本発明のプリント基板のはんだ付け方法に用いられるブリッジ防止用ガイド板は、汎用性の素材を用いて容易に作製することができるため、プリント基板はんだ付け方法におけるブリッジ防止用ガイド板として安価に提供することができる。 Furthermore, a soldering method to prevent bridging guide plate used in the printed circuit board of the present invention, it is possible to readily produced using the versatility of the material, low cost as a bridge for preventing the guide plate in the printed circuit board soldering method it is possible to provide in.

以下、本発明の実施の形態について添付した図面に基づいて更に詳細に説明する。 It will be described below in greater detail with reference to the accompanying drawings an embodiment of the present invention.
図1は本発明のプリント基板のはんだ付け方法に係る一実施例を示す拡大断面図、図2は本発明のプリント基板のはんだ付け方法に係る他の実施例を示す拡大断面図、図3は本発明のプリント基板のはんだ付け方法に用いられるブリッジ防止用ガイド板の一実施例を模式的に示す拡大平面図、図4は本発明のプリント基板のはんだ付け方法に係るさらに他の実施例を示す拡大断面図、図5は本発明のプリント基板のはんだ付け方法に係るさらに他の実施例を示す拡大断面図、図6は本発明のプリント基板のはんだ付け方法に用いられるブリッジ防止用ガイド板の他の実施例を模式的に示す拡大平面図、図7は同じくさらに他の実施例のブリッジ防止用ガイド板を模式的に示す拡大平面図である。 Figure 1 is an enlarged sectional view showing an embodiment of the method of soldering a printed circuit board of the present invention, enlarged cross-sectional view 2 showing another embodiment of the method of soldering a printed circuit board of the present invention, FIG. 3 enlarged plan view schematically showing an embodiment of a bridge prevention guide plate used in the soldering method PCB of the present invention, a further embodiment of the method of soldering a printed circuit board of Figure 4 is the invention enlarged cross-sectional view illustrating, FIG. 5 is an enlarged sectional view showing still another embodiment according to the method of soldering a printed circuit board of the present invention, FIG. 6 is bridge prevention guide plate used in the method of soldering a printed circuit board of the present invention other embodiments enlarged plan view schematically showing of FIG. 7 is an enlarged plan view similarly showing still bridge prevention guide plate of another embodiment schematically.
[実施例] [Example]

以下本発明を実施例により更に具体的に説明するが、本発明はこれによって拘束されるものではなく、本発明の主旨の範囲内において自由に設計変更が可能である。 The present invention will be described more specifically by examples below, the present invention is thereby not intended to be bound, it is possible to freely design changes within the scope of the gist of the present invention.

本発明において用いられる上記ブリッジ防止用ガイド板は、基本的にはステンレス鋼など耐食性金属の薄板をシート状に延伸したものを素材として形成され、その表面はプリント基板のスルーホールに対応してメッシュ状に加工され、プリント基板とはんだ浴面との間に介在するようはんだ付け用冶具によって固定される。 The bridge prevention guide plate used in the present invention is basically formed of those stretched sheet of corrosion resistant metal such as stainless steel sheet as a material, the surface is corresponding to the through-hole of the printed circuit board mesh are processed into Jo, it is secured by soldering jig so interposed between the printed circuit board and the solder bath surface. この際、プリント基板に搭載される電子部品のリードは、プリント基板に形成されたスルーホールに挿入され、ブリッジ防止用ガイド板のメッシュ状の貫通孔を通してはんだ浴面に接触する。 In this case, the electronic component leads to be mounted on the printed circuit board is inserted into through holes formed in the printed circuit board, contacts a solder bath surface through the mesh-shaped through holes of the bridge prevention guide plate. 次いではんだ浴面の上昇に伴って溶融はんだはスルーホール内に侵入し、リードと基板のスルーホールとのはんだによる接続が完了する。 Then molten solder with increasing solder bath surface penetrates into the through hole, solder connection between the leads and the through-hole of the substrate is completed. 冷却固化が確認された後、はんだ冶具からプリント基板を取り外すと、シート状のブリッジ防止用ガイド板は、プリント基板の裏面から容易に剥離し、リードのピッチ間に連なっていた溶融はんだによるブリッジも同時に除去され、リードとプリント基板のスルーホールとは、健全な形で溶着するよう構成されている。 After cooling and solidification is confirmed, by removing the printed circuit board from the solder jig, a sheet-like bridge prevention guide plate is easily peeled off from the back surface of the printed circuit board, also the bridge by molten solder which has been continuous between the leads of the pitch are removed at the same time, the lead and the printed circuit board through hole, is configured to weld in a healthy manner.

一方、本発明に関連する他のブリッジ防止用ガイド板は、シート状の耐熱性樹脂を素材として形成され、はんだ用冶具の中間層もしくははんだ浴面に接して介在し、溶融はんだが離れる際にリード間に連なるはんだを絶って、ブリッジが形成するのを未然に防ぐために機能するものであり、用いられる耐熱性樹脂としてはポリアミド類が好ましく採用される。 While the other bridge prevention guide plate related to the present invention is formed a sheet-like heat-resistant resin as a material, interposed in contact with the intermediate layer or the solder bath surface of the solder jig, on leaving the molten solder standing solder continuous between the leads, which functions to prevent the bridge from forming, as the heat-resistant resin used polyamides are preferably used. なおこの際、シート状の耐熱性樹脂を素材として形成される当該ブリッジ防止用ガイド板に代えて、前記金属製薄板をメッシュ状に加工したシート状のブリッジ防止用ガイド板が、何ら差し支えなく用いられることは言うまでも無い。 Note at this time, instead of the bridge prevention guide plate which is formed a sheet-like heat-resistant resin as a material, processed sheet bridge prevention guide plate the metallic sheet into a mesh is used not harm any is it is needless to say.

プリント基板1として、板厚1.6mmの基材がガラス繊維から成るリジッド基板を採用し、図1に示すように該基板1にリード3つき電子部品2をはんだ付けするに際し、溶融はんだ浴と前記基板1との間に介在するようにして、板厚が0.15mmのオーステナイト系ステンレス鋼製でシート状のブリッジ防止用ガイド板5を戴置し、はんだ付け用冶具によって固定した。 As the printed circuit board 1, when the base material of the plate thickness 1.6mm adopts a rigid substrate made of glass fiber, soldering the lead 3 with the electronic components 2 on the substrate 1 as shown in FIG. 1, the molten solder bath so as to be interposed between the substrate 1, the thickness is the placing of the bridge prevention guide plate 5 of the sheet made 0.15mm austenitic stainless steel, and fixed by soldering jig. 該ブリッジ防止用ガイド板5の表面には、図3に模式的に示すようなメッシュ5−1が、前記プリント基板1のスルーホール4に対応するようにして形成され、電子部品2のリード3は該スルーホール4に挿入され、ブリッジ防止用ガイド板5の当該メッシュ5−1を突き抜けて溶融はんだの浴面(図示せず)に向かって突出する。 The The surface of the bridge prevention guide plate 5, a mesh 5-1 schematically shown in FIG. 3, is formed so as to correspond to the through-hole 4 of the printed circuit board 1, the leads 3 of the electronic component 2 is inserted into the through-hole 4, penetrate the mesh 5-1 bridge prevention guide plate 5 projecting toward the molten solder bath surface (not shown). このようにしてセットされたプリント基板1を、図示を省略した自動はんだ付け装置における搬送手段によって噴流はんだ槽上に移動し、上昇したはんだ浴面に浸漬してスルーホール4への溶融はんだの侵入を果たし、該スルーホール4へのリード3の接合を完了する。 Such a printed circuit board 1 set in the moved by transport means in an automatic soldering apparatus which is not shown on the jet solder tank, molten solder from entering and immersed in elevated solder bath surface into the through-hole 4 the play, to complete the bonding of the leads 3 into the through-hole 4. その後自動はんだ付け装置における工程の流れの中で、強制的に冷却固化されたプリント基板1をはんだ付け冶具から取外し、さらに前記ブリッジ防止用ガイド板5を剥離すると、隣接するリード3のピッチ間において連なって形成されていたブリッジも同時に除去され、該リード3のピッチ間におけるブリッジは皆無であった。 Thereafter in the step of the flow in the automatic soldering apparatus, remove the printed circuit board 1 which is forcibly cooled and solidified from the soldering jig, further peeling the bridge prevention guide plate 5, the pitch between adjacent leads 3 It is removed also bridges were formed by continuous simultaneous, bridge between the pitch of the lead 3 there was no. また、スルーホール4内においてリード3は健全な状態ではんだ付けされていることが確認された。 In addition, it was confirmed lead 3 that are soldered in a healthy state in the through-hole 4.

図2に示すようにプリント基板1aにはんだ付けされる電子部品2aが、2列で複数段のリード3aを有するコネクタ部品であることを除いて、他は実施例1と実質的に同様にしてプリント基板1aに対する電子部品のはんだ付けを実施した。 Electronic component 2a to be soldered to the printed circuit board 1a shown in FIG. 2, except that a connector component having a plurality of stages of lead 3a in two rows, other out in substantially the same manner as in Example 1 It was performed soldering of electronic components to the print board 1a. なお、この際に用いたブリッジ防止用ガイド板は材質的には実施例1と同様の素材を用い、図6において模式的に示されるように加工したブリッジ防止用ガイド板5aを採用し、はんだ付け終了後のブリッジの除去、並びにスルーホール4aにおけるリード3aのはんだ付け状態等は、実施例1とほぼ同様の成果が確認された。 Incidentally, bridge prevention guide plate used in this case is using the same materials as in Example 1 to materially employs a processed bridge prevention guide plate 5a as shown schematically in FIG. 6, the solder removal of attached after completion of the bridge, as well as soldering state of lead 3a at the through-hole 4a is substantially the same results as in example 1 was confirmed.

プリント基板1bにはんだ付けする電子部品2bとして、5列で複数段のリード3bを供えたコネクタを採用し、図4に示すようにはんだ付け用冶具6bの中間層(プリント基板1bの裏面とはんだ浴面の中間層)に、図7に示すようなメッシュ構造に加工された板厚0.15mmのオーステナイト系ステンレス鋼製のブリッジ防止用ガイド板5cを介在させた以外は、実質的に実施例1と同様にしてプリント基板1bに対する電子部品2bのはんだ付けを実施した。 As electronic components 2b of soldering to the printed circuit board 1b, a plurality of stages of leads 3b adopts a connector equipped with five columns, the back surface and the solder of the intermediate layer (PCB 1b soldering jig 6b as shown in FIG. 4 the intermediate layer) of the bath surface, except that was interposed austenitic stainless steel bridge prevention guide plate 5c of the mesh structure in the processed thickness 0.15mm, as shown in FIG. 7, substantially example 1 was carried out soldering of electronic components 2b to the print substrate 1b in the same manner as. はんだ用冶具6bの中間層に位置して溶融はんだ浴とプリント基板1bとの間に介在する本実施例におけるブリッジ防止用ガイド板5bは、はんだ浴面から離れる際にリード3b間に連なる溶融はんだを絶ち、隣接するリード3bのピッチ間に連なるブリッジの形成が未然に防止されると共に、プリント基板1bにおけるスルーホール4bと、それぞれのリード3bとは完璧な状態ではんだ付けされ、得られたプリント基板の電子回路が健全な状態で機能することが確認された。 Bridge prevention guide plate 5b in this embodiment interposed between the molten solder bath was located in the middle layer and the printed board 1b of the solder jig 6b are molten solder leading to between the lead 3b when away from the solder bath surface the cut off, with the formation of bridges leading to the pitch between adjacent leads 3b is prevented, and the through hole 4b in the printed board 1b, the respective leads 3b are soldered in perfect condition, the prints obtained it was confirmed that the electronic circuit board to function in healthy condition.

ブリッジ防止用ガイド板5cの取付け位置を、図5に示すようにはんだ冶具6cの下端部、はんだ浴面に近接して設置した以外は上記実施例3と同様にしてプリント基板1cに対する電子部品2cのはんだ付けを実施した。 The mounting position of the bridge prevention guide plate 5c, electronic component 2c against the lower end, except that installed in proximity to the solder bath surface in the same manner as in Example 3 PCB 1c of solder jig 6c as shown in FIG. 5 the soldering was carried out. その結果、実施例3とほぼ同様の成果が確認された。 As a result, almost the same results as Example 3 were confirmed.

上記各実施例からも明らかなように、本発明に係る上記プリント基板のはんだ付け方法によれば、静波状態におけるはんだ浴との接触によってプリント基板のスルーホールへのリードのはんだ付けが完了するので、主として荒波噴流槽における溶融はんだ粒の飛散に起因するツララが発生せず、しかも該プリント基板とはんだ浴面との間に介在したブリッジ防止用ガイド板を取り外すことによって、前記リードのピッチ間に連なって形成されたブリッジが同時に除去されるため、はんだ付け後の修正作業は完全に省略される。 As is apparent from the above embodiments, according to the soldering method of the printed circuit board according to the present invention, since soldering of the leads to the through-hole of the printed circuit board by contact with the solder bath is completed in Shizunami state mainly without icicle occurs due to scattering of the molten solder particles in heavy seas jet tank, yet by removing the bridge prevention guide plate interposed between the printed circuit board and the solder bath surface, the pitch between the leads since the bridges formed by continuous is removed simultaneously correcting work after soldering is omitted entirely. また、従来から汎用されている荒波噴流はんだ槽によるはんだ付け後、仕上げはんだ槽によるはんだ不良の修正工程を要することもなく、はんだ付け面におけるブリッジが容易に除去されるため、プリント基板における電子回路の形成のためのはんだ付けが簡略な操作によって容易に実施できる。 Furthermore, after soldering by rough seas jet solder bath which is generally conventional, without requiring a correction step of soldering defects due to finishing the solder bath, since the bridge at the soldering surface is easily removed, the electronic circuit in the printed circuit board soldering for the formation can be easily carried out by simple operation. 従って高密度集積回路を有する各種電子部品等を搭載するプリント基板を、高い信頼性を維持しながら低価格で提供することが可能となる。 Therefore the printed circuit board for mounting various electronic parts and the like having a high density integrated circuits, it is possible to provide at low cost with high reliability.

また、本発明のプリント基板のはんだ付け方法に用いられるブリッジ防止用ガイド板は、汎用性の素材を用いて容易に作製することができるため、プリント基板のはんだ付け方法におけるブリッジ防止用のガイド板として安価に提供することができるので、当該技術分野におけるブリッジ防止用ガイド板、若しくはプリント基板のはんだ付け方法として幅広く採用されることが期待される。 The bridge prevention guide plate used in the soldering method PCB of the present invention, it is possible to readily produced using the versatility of the material, the guide plate for bridge prevention of soldering of a PCB it is possible to inexpensively provide a bridge for preventing the guide plate in the art, or the printed circuit board to be widely employed as a soldering method is expected.

本発明のプリント基板のはんだ付け方法に係る一実施例を示す拡大断面図である。 Is an enlarged sectional view showing an embodiment of the method of soldering a printed circuit board of the present invention. 本発明のプリント基板のはんだ付け方法に係る他の実施例を示す拡大断面図である。 Another embodiment of the method of soldering a printed circuit board of the present invention is an enlarged cross-sectional view illustrating. 本発明のプリント基板のはんだ付け方法に用いられるブリッジ防止用ガイド板の一実施例を模式的に示す拡大平面図である。 An embodiment of a bridge prevention guide plate used in the method of soldering a printed circuit board of the present invention is an enlarged plan view schematically showing. 本発明のプリント基板のはんだ付け方法に係るさらに他の実施例を示す拡大断面図である。 Is an enlarged sectional view showing still another embodiment according to the soldering method PCB of the present invention. 本発明のプリント基板のはんだ付け方法に係るさらに他の実施例を示す拡大断面図である。 Is an enlarged sectional view showing still another embodiment according to the soldering method PCB of the present invention. 本発明のプリント基板のはんだ付け方法に用いられるブリッジ防止用ガイド板の他の実施例を模式的に示す拡大平面図である。 Another embodiment of the bridge prevention guide plate used in the method of soldering a printed circuit board of the present invention is an enlarged plan view schematically showing. 同じく本発明のプリント基板のはんだ付け方法に用いられるさらに他の実施例のブリッジ防止用ガイド板を模式的に示す拡大平面図である。 Also is an enlarged plan view of the bridge prevention guide plate of another embodiment used in the soldering method shown schematically PCB of the present invention. 従来のプリント基板のはんだ付け方法に用いられる自動はんだ付け装置を、模式的に示すフローチャートである。 The automatic soldering apparatus used in the soldering method of a conventional printed circuit board is a flowchart schematically showing.

符号の説明 DESCRIPTION OF SYMBOLS

1、1a、1b、1c プリント基板 2、2a、2b、2c 電子部品 3、3a、3b、3c リード 4、4a、4b、4c スルーホール 5、5a、5b、5c ブリッジ防止用ガイド板 5−1、5a−1、5b−1 メッシュ 5−2、5a−2、5b−2 ホール 5−3、5a−3、5b−3 取付け孔 6、6a、6b、6c はんだ付け用冶具 1, 1a, 1b, 1c PCB 2, 2a, 2b, 2c electronic components 3, 3a, 3b, 3c leads 4, 4a, 4b, 4c through holes 5, 5a, 5b, 5c bridge prevention guide plate 5-1 , 5a-1,5b-1 mesh 5-2,5a-2,5b-2 hole 5-3,5a-3,5b-3 attachment holes 6, 6a, 6b, 6c soldering jig

Claims (4)

  1. 溶融はんだ槽を通過する過程でプリント基板のスルーホールに、リードを介して各種電子部品をはんだ付けする方法において、はんだ付け用冶具の基板面、中間層およびはんだ面に、表面をメッシュ状に加工したシート状のブリッジ防止用ガイド板を介在させ、しかる後に溶融はんだ槽ではんだ付けすることを特徴とするプリント基板のはんだ付け方法。 Machining the through-hole of the printed circuit board in the process of passing through the molten solder bath, a method for soldering various electronic parts via leads, the substrate surface of the soldering jig, the intermediate layer and the solder side, the surface a mesh the sheet-like bridge prevention guide plate interposed, soldering of a PCB, characterized in that soldering with molten solder bath thereafter.
  2. 前記ブリッジ防止用ガイド板が、表面をメッシュ状に加工された金属または耐熱性樹脂からなる、シート状の薄板によって形成されることを特徴とする請求項1に記載のプリント基板のはんだ付け方法。 It said bridge preventing the guide plate, a surface consisting of machined metal or a heat resistant resin in a mesh and soldering method of the printed board according to claim 1, characterized in that it is formed by a sheet-shaped thin plate.
  3. 溶融はんだ槽を通過する過程でプリント基板のスルーホールに、リードを介して各種電子部品をはんだ付けする方法において、はんだ付け用冶具の基板面、中間層およびはんだ面に介在して、溶融はんだによるブリッジの形成を防止することを特徴とするブリッジ防止用ガイド板。 The through-hole of the printed circuit board in the process of passing through the molten solder bath, a method for soldering various electronic parts via leads, the substrate surface of the soldering jig, interposed intermediate layer and solder surfaces, by molten solder bridge prevention guide plate, characterized in that to prevent the formation of bridges.
  4. 前記ブリッジ防止用ガイド板が、表面をメッシュ状に加工された金属または耐熱性樹脂からなる、シート状の薄板によって形成されることを特徴とする請求項3に記載のブリッジ防止用ガイド板。 It said bridge preventing the guide plate, a surface consisting of machined metal or a heat resistant resin in a mesh and bridge prevention guide plate according to claim 3, characterized in that it is formed by a sheet-shaped thin plate.

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