JP2002076615A - Printed circuit board and method for soldering to its through hole - Google Patents
Printed circuit board and method for soldering to its through holeInfo
- Publication number
- JP2002076615A JP2002076615A JP2000263887A JP2000263887A JP2002076615A JP 2002076615 A JP2002076615 A JP 2002076615A JP 2000263887 A JP2000263887 A JP 2000263887A JP 2000263887 A JP2000263887 A JP 2000263887A JP 2002076615 A JP2002076615 A JP 2002076615A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead
- free solder
- laminated plate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 title claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims abstract description 98
- 238000007747 plating Methods 0.000 claims description 26
- 230000005484 gravity Effects 0.000 claims description 6
- 230000002265 prevention Effects 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 238000007772 electroless plating Methods 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 102100027207 CD27 antigen Human genes 0.000 description 1
- 101000914511 Homo sapiens CD27 antigen Proteins 0.000 description 1
- 101000917826 Homo sapiens Low affinity immunoglobulin gamma Fc region receptor II-a Proteins 0.000 description 1
- 101000917824 Homo sapiens Low affinity immunoglobulin gamma Fc region receptor II-b Proteins 0.000 description 1
- 101000914514 Homo sapiens T-cell-specific surface glycoprotein CD28 Proteins 0.000 description 1
- 102100029204 Low affinity immunoglobulin gamma Fc region receptor II-a Human genes 0.000 description 1
- 102100027213 T-cell-specific surface glycoprotein CD28 Human genes 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線基板
及びそのスルーホールへの半田付け方法に係り、特に積
層板の表面又は裏面に向かって内径がテーパ状に拡開す
るようにスルーホールを形成することで、ぬれ性の低い
鉛フリー半田でも半田が十分に上がるようにして、スル
ーホールにその上部まで十分な量の鉛フリー半田を充填
することができるようにした、鉛フリー半田による自動
半田付けの実用化に対して画期的なプリント配線基板及
びそのスルーホールへの半田付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method for soldering the same to a through hole, and more particularly, to a method for forming a through hole such that the inner diameter thereof expands in a tapered shape toward the front or back surface of a laminate. By doing so, even if the lead-free solder has low wettability, the solder can be sufficiently raised, and the through-hole can be filled with a sufficient amount of lead-free solder up to its upper part. The present invention relates to a printed wiring board which is revolutionary for practical use of soldering and a method of soldering the same to through holes.
【０００２】[0002]
【従来の技術】電子機器のプリント配線基板に電子部品
を取り付けるための手段として、従来から鉛入り半田が
多用されているが、このような電子機器が廃棄される
と、半田から鉛成分が酸性雨等の影響で徐々に流れ出
し、環境破壊につながることから、近年鉛フリー半田の
開発や該鉛フリー半田を用いた自動半田付けによる実装
が世界的に進められている。2. Description of the Related Art Lead-containing solder has been widely used as a means for attaching an electronic component to a printed wiring board of an electronic device. However, when such an electronic device is discarded, the lead component of the solder becomes acidic. In recent years, lead-free solder has been developed and mounting by automatic soldering using the lead-free solder has been promoted worldwide since the water gradually flows under the influence of rain or the like and leads to environmental destruction.
【０００３】鉛フリー半田としては、例えばＳｎ−Ａｇ
系（錫−銀系）、Ｓｎ−Ｚｎ系（錫−亜鉛系）、Ｓｎ−
Ｃｕ系（錫−銅系）等が開発され、更なる改良が進めら
れているが、いずれの鉛フリー半田も、鉛半田と比較す
ると、銅に対するぬれ性が悪く、例えば鉛半田のぬれ広
がり率が９０％を超えるのに対し、Ｓｎ−Ａｇ系では８
０％前後であり、大気中におけるＳｎ−Ｚｎ系では更に
それ以下である。As a lead-free solder, for example, Sn-Ag
(Tin-silver), Sn-Zn (tin-zinc), Sn-
Although Cu-based (tin-copper) and the like have been developed and further improved, all lead-free solders have poorer wettability to copper as compared with lead solder. Exceeds 90%, whereas Sn-Ag system
It is about 0%, and even lower in the case of the Sn-Zn system in the atmosphere.
【０００４】一方、図１９及び図２０に示すように、従
来のプリント配線基板１のスルーホール２は、例えば両
面に銅箔層３ａが形成された両面銅張りの積層板３に形
成され、めっき処理により、無電解めっき層５及び電解
めっき層６を形成したものであるが、溶解した鉛フリー
半田４を用いてディップ式（ディップソルダリング法）
により半田付けを行っても、スルーホール２の内径が一
定であるため、ぬれ性の悪い鉛フリー半田４では該スル
ーホール２に十分上がらず、該スルーホール２の５０乃
至７０％程度しか鉛フリー半田４を充填できないという
問題点があった。On the other hand, as shown in FIGS. 19 and 20, a through hole 2 of a conventional printed wiring board 1 is formed, for example, on a double-sided copper-clad laminate 3 having a copper foil layer 3a formed on both sides, and is formed by plating. An electroless plating layer 5 and an electrolytic plating layer 6 are formed by a treatment, and a dip method (dip soldering method) is performed by using a dissolved lead-free solder 4.
Even if soldering is performed, the inner diameter of the through-hole 2 is constant, so that the lead-free solder 4 having poor wettability does not sufficiently rise in the through-hole 2 and only about 50 to 70% of the through-hole 2 is lead-free. There is a problem that the solder 4 cannot be filled.
【０００５】強い活性剤を含むフラックスを用いれば、
鉛フリー半田のぬれ性を向上させることが可能ではある
が、強い活性剤は、回路の腐食や絶縁抵抗の低下に悪影
響を及ぼすことになるという問題があり、フラックスの
改良だけでスルーホールに十分に鉛フリー半田を充填で
きるようにすることは困難であった。With a flux containing a strong activator,
Although it is possible to improve the wettability of lead-free solder, there is a problem that strong activators will adversely affect circuit corrosion and lower insulation resistance. It has been difficult to allow lead-free solder to be filled.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、上記した従
来技術の欠点を除くためになされたものであって、その
目的とするところは、積層板にスルーホールを形成し該
スルーホールにめっきを施してなり表裏が電気的に接続
されたプリント配線基板において、積層板の表面又は裏
面に向かって内径がテーパ状に拡開するようにスルーホ
ールを形成することによって、ぬれ性の悪い鉛フリー半
田でもスルーホールに上がり易くなるようにして、該ス
ルーホールの上部まで鉛フリー半田を充填できるように
することである。SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned disadvantages of the prior art, and an object of the present invention is to form a through hole in a laminated plate and plating the through hole. By forming through holes so that the inner diameter expands in a tapered shape toward the front or back surface of the laminated board, lead-free with poor wettability The object is to make it easy for the solder to ascend to the through-hole so that the lead-free solder can be filled up to the upper part of the through-hole.
【０００７】また他の目的は、上記構成において、積層
板の厚さ方向の中程は狭くそこから表面及び裏面に向か
って夫々内径がテーパ状に拡開するようにスルーホール
を形成し、該スルーホールに鉛フリー半田を充填し易い
ように構成することによって、鉛フリー半田実装の実用
化に大きく貢献するプリント配線基板を提供することで
ある。Another object of the present invention is to form a through-hole in the above-described structure so that the middle of the laminated plate in the thickness direction is narrow and the inner diameter of the laminated plate is gradually expanded toward the front surface and the back surface. An object of the present invention is to provide a printed wiring board which greatly contributes to the practical use of lead-free soldering by configuring a through-hole so as to be easily filled with lead-free solder.
【０００８】更に他の目的は、内径が一定な同径部と該
同径部に連続し積層板の表面又は裏面に向かって拡開す
るテーパ部とからなるスルーホールを積層板に形成し、
該スルーホールに同径部側から鉛フリー半田を充填し易
いように構成することによって、スルーホールに対する
工数が少なく、かつ鉛フリー半田をスルーホールの上部
まで十分に充填可能なプリント配線基板を低コストで提
供することである。[0008] Still another object is to form a through hole in a laminated plate having a constant-diameter portion having a constant inner diameter and a tapered portion continuous with the same-diameter portion and expanding toward the front surface or the back surface of the laminated plate.
By configuring the through-hole to be easily filled with lead-free solder from the same diameter side, the number of processes for the through-hole is small, and the printed wiring board capable of sufficiently filling lead-free solder up to the upper portion of the through-hole is reduced. The cost is to provide.
【０００９】また他の目的は、積層板の表面又は裏面に
向かって内径がテーパ状に拡開するようにスルーホール
を形成し該スルーホールにめっきを施し、該スルーホー
ルの小径側に溶融した鉛フリー半田を接触させて、該ス
ルーホールの上部まで十分な量の鉛フリー半田を充填す
ることによって、鉛フリー半田のぬれ性の悪さを補っ
て、鉛フリー半田実装の実用化を可能とすることであ
る。Another object is to form a through-hole so that the inner diameter expands in a tapered shape toward the front surface or the back surface of the laminate, apply plating to the through-hole, and melt the small-diameter side of the through-hole. By contacting lead-free solder and filling a sufficient amount of lead-free solder up to the top of the through-hole, it compensates for poor wettability of lead-free solder and enables the practical use of lead-free solder mounting That is.
【００１０】更に他の目的は、積層板の厚さ方向の中程
は狭くそこから表面及び裏面に向かって夫々内径がテー
パ状に拡開するようにスルーホールを形成し該スルーホ
ールにめっきを施し、該スルーホールにめっきを施し、
ディップ式又は噴流式半田付けにより該スルーホールの
穴方向の途中まで溶融した鉛フリー半田を充填すること
により、該鉛フリー半田を表面張力に起因するぬれ性に
より該スルーホール内を上昇させると共に、内径のテー
パ状の拡開に伴って重力の影響を減らすことで更に容易
に該スルーホール内を上昇させ、該スルーホールの上部
まで十分な量の前記鉛フリー半田を充填できるようにす
ることによって、鉛フリー半田実装の実用化を可能とす
ることであり、またこれによって鉛半田による地球環境
汚染の防止に貢献できるようにすることである。[0010] Still another object is to form a through hole so that the inner diameter of the laminated plate is narrow in the middle of the thickness direction and the inner diameter of the laminated plate is tapered toward the front surface and the back surface, and plating is applied to the through hole. And plating the through holes,
By filling the molten lead-free solder halfway in the hole direction of the through-hole by dip type or jet type soldering, the lead-free solder is raised inside the through-hole by wettability due to surface tension, By lowering the influence of gravity with the tapered expansion of the inner diameter, the inside of the through-hole can be more easily raised, so that a sufficient amount of the lead-free solder can be filled up to the top of the through-hole. Another object of the present invention is to enable the practical use of lead-free solder mounting and to contribute to the prevention of global environmental pollution due to lead solder.
【００１１】[0011]
【課題を解決するための手段】要するに本発明（請求項
１）は、積層板にスルーホールを形成し該スルーホール
にめっきを施してなり表裏が電気的に接続されたプリン
ト配線基板において、前記積層板の表面又は裏面に向か
って内径がテーパ状に拡開するように前記スルーホール
を形成したことを特徴とするものである。In summary, the present invention (claim 1) relates to a printed wiring board in which a through hole is formed in a laminated board, and the through hole is plated to electrically connect the front and back sides. The through hole is formed such that the inner diameter expands in a tapered shape toward the front surface or the back surface of the laminate.
【００１２】また本発明（請求項２）は、積層板にスル
ーホールを形成し該スルーホールにめっきを施してなり
表裏が電気的に接続されたプリント配線基板において、
前記積層板の厚さ方向の中程は狭くそこから表面及び裏
面に向かって夫々内径がテーパ状に拡開するように前記
スルーホールを形成し、該スルーホールの上部まで鉛フ
リー半田を充填し易いように構成したことを特徴とする
ものである。Further, the present invention (claim 2) provides a printed wiring board in which a through hole is formed in a laminated plate and the through hole is plated to electrically connect the front and back surfaces.
The through hole is formed such that the inner diameter of the laminated plate is narrow in the middle of the thickness direction and the inner diameter expands in a tapered shape toward the front surface and the back surface, and lead-free solder is filled up to the upper portion of the through hole. It is characterized in that it is configured to be easy.
【００１３】また本発明（請求項３）は、積層板にスル
ーホールを形成し該スルーホールにめっきを施してなり
表裏が電気的に接続されたプリント配線基板において、
内径が一定な同径部と該同径部に連続し前記積層板の表
面又は裏面に向かって拡開するテーパ部とからなるスル
ーホールを前記積層板に形成し、該スルーホールの上部
まで前記同径部側から鉛フリー半田を充填し易いように
構成したことを特徴とするものである。[0013] The present invention (claim 3) provides a printed wiring board in which a through hole is formed in a laminated plate and the through hole is plated to electrically connect the front and back sides.
A through hole is formed in the laminated plate having a constant inner diameter and a tapered portion that is continuous with the same diameter portion and expands toward the front surface or the back surface of the laminated plate and extends to the top of the through hole. The lead-free solder is easily filled from the same diameter side.
【００１４】また本発明方法（請求項４）は、積層板の
表面又は裏面に向かって内径がテーパ状に拡開するよう
にスルーホールを形成し該スルーホールにめっきを施
し、該スルーホールの小径側に溶融した鉛フリー半田を
接触させて、該スルーホールの上部まで十分な量の前記
鉛フリー半田を充填することを特徴とするものである。In the method of the present invention (claim 4), a through-hole is formed such that the inner diameter expands in a tapered shape toward the front surface or the back surface of the laminate, and the through-hole is plated. A molten lead-free solder is brought into contact with the small diameter side, and a sufficient amount of the lead-free solder is filled up to the upper portion of the through hole.
【００１５】また本発明方法（請求項５）は、積層板の
厚さ方向の中程は狭くそこから表面及び裏面に向かって
夫々内径がテーパ状に拡開するようにスルーホールを形
成し、該スルーホールにめっきを施し、ディップ式又は
噴流式半田付けにより該スルーホールの穴方向の途中ま
で溶融した鉛フリー半田を充填することにより、該鉛フ
リー半田を表面張力に起因するぬれ性により該スルーホ
ール内を上昇させると共に、内径のテーパ状の拡開に伴
って重力の影響を減らすことで更に容易に該スルーホー
ル内を上昇させ、該スルーホールの上部まで十分な量の
前記鉛フリー半田を充填することを特徴とするものであ
る。In the method of the present invention (claim 5), a through hole is formed such that the middle of the laminated plate in the thickness direction is narrow and the inner diameters of the laminated plate are tapered toward the front and back surfaces, respectively. The through-hole is plated and filled with molten lead-free solder halfway in the hole direction of the through-hole by dipping or jet soldering, so that the lead-free solder is wetted due to surface tension. By raising the inside of the through-hole and reducing the influence of gravity accompanying the tapered expansion of the inner diameter, the inside of the through-hole is more easily raised, and a sufficient amount of the lead-free solder is provided up to the upper part of the through-hole. Is filled.
【００１６】[0016]
【発明の実施の形態】以下本発明を図面に示す実施例に
基いて説明する。本発明の第１実施例に係るプリント配
線基板（以下、「基板」という。）１１は、図１及び図
１０に示すように、積層板１３にスルーホール１２を形
成し、該スルーホール１２にめっきを施してなり、表裏
が電気的に接続されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments shown in the drawings. As shown in FIGS. 1 and 10, a printed wiring board (hereinafter, referred to as a “substrate”) 11 according to a first embodiment of the present invention has a through hole 12 formed in a laminate 13, and the through hole 12 is formed in the through hole 12. Plating is applied, and the front and back are electrically connected.
【００１７】スルーホール１２は、積層板１３の厚さ方
向の中程は狭く、そこから表面１３ａ及び裏面１３ｂに
向かって夫々内径がテーパ状に拡開するように形成され
ており、例えばサブトラクティブ法の一種であるパネル
プレーティング法によりめっき処理がなされている。The through hole 12 is formed such that the middle of the laminated plate 13 in the thickness direction is narrow, and the inner diameter of the through hole 12 is tapered toward the front surface 13a and the back surface 13b. Plating is performed by a panel plating method, which is one of the methods.
【００１８】ここで基板１１の加工工程について説明す
ると、図１に示すように、例えば表面１３ａ及び裏面１
３ｂに銅箔層１３ｃを形成してなる、両面銅張りのガラ
スエポキシ樹脂製の積層板１３にまず丸穴状のスルーホ
ール１２を形成し、表面１３ａ側及び裏面１３ｂ側の角
部（図示せず）を夫々例えば切削して面取りして、中程
から表面１３ａ及び裏面１３ｂに向かって夫々内径がテ
ーパ状に拡開するように形成する。The processing steps of the substrate 11 will now be described. For example, as shown in FIG.
First, a round hole-shaped through hole 12 is formed in a double-sided copper-clad glass epoxy resin laminated plate 13 having a copper foil layer 13c formed on 3b, and corners on the front surface 13a side and the back surface 13b side (shown in FIG. ) Are formed, for example, by cutting and chamfering, so that the inner diameters are tapered toward the front surface 13a and the back surface 13b from the middle.
【００１９】次に図７に示すように、積層板１３に無電
解めっきを行い、例えばパラジウムからなる無電解めっ
き層１４を形成する。更に積層板１３に電解めっきを行
い、図８に示すように、例えば銅からなる電解めっき層
１５を形成する。Next, as shown in FIG. 7, an electroless plating is performed on the laminate 13 to form an electroless plating layer 14 made of, for example, palladium. Further, electrolytic plating is performed on the laminate 13 to form an electrolytic plating layer 15 made of, for example, copper, as shown in FIG.
【００２０】続いて、図８に示すように、積層板１３の
表面１３ａ及び裏面１３ｂにドライフィルム１６を貼着
し、ポジパターンとして露光及び現像を行った後、エッ
チングを行い、図９に示すように、スルーホール１２の
部分及びその他の回路パターン（図示せず）以外の、ド
ライフィルム１６、電解めっき層１５、無電解めっき層
１４及び銅箔層１３ｃを除去する。Subsequently, as shown in FIG. 8, a dry film 16 is adhered to the front surface 13a and the back surface 13b of the laminated plate 13, exposed and developed as a positive pattern, and then subjected to etching, as shown in FIG. Thus, the dry film 16, the electrolytic plating layer 15, the electroless plating layer 14, and the copper foil layer 13c other than the through hole 12 and other circuit patterns (not shown) are removed.
【００２１】そしてドライフィルム１６を除去すること
により、図１０に示すように、スルーホール１２に銅め
っき（電解めっき層１５）が施された基板１１が完成す
る。なお特に図示しないが、基板１１の両面にソルダレ
ジストをコーティングしてもよい。Then, by removing the dry film 16, the substrate 11 having the through holes 12 plated with copper (electrolytic plating layer 15) is completed as shown in FIG. Although not particularly shown, both surfaces of the substrate 11 may be coated with a solder resist.
【００２２】また基板１１の製造をサブトラクティブ法
の一種であるパネルプレーティング法により行っている
ものとしたが、本願発明はこれに限定されるものではな
く、同様にサブトラクティブ法の一種であるパターンプ
レーティング法や、アディティブ法等によるものでもよ
く、スルーホール１２にめっきが施されて両面が電気的
に接続された状態となればよい。そしてこれは以下の実
施例においても同様である。The substrate 11 is manufactured by a panel plating method, which is a kind of subtractive method. However, the present invention is not limited to this, and is also a kind of a subtractive method. A pattern plating method, an additive method, or the like may be used, as long as plating is applied to the through hole 12 so that both surfaces are electrically connected. This is the same in the following embodiments.
【００２３】本発明の第２実施例に係る基板２１は、図
２及び図１４に示すように、積層板２３にスルーホール
２２を形成し、該スルーホール２２にめっきを施してな
り、表裏が電気的に接続されている。As shown in FIGS. 2 and 14, a substrate 21 according to a second embodiment of the present invention is formed by forming a through-hole 22 in a laminated plate 23 and plating the through-hole 22 so that the front and back surfaces are opposite. It is electrically connected.
【００２４】スルーホール２２は、積層板２３の厚さ方
向の中程の内径は狭くかつ一定に形成され、表面２３ａ
及び裏面２３ｂの付近における内径は夫々広くなるよう
に段付きに形成されている。めっき処理を含む基板２１
の加工工程は、第１実施例と同様であり、スルーホール
２２には、銅箔層２３ｃ、無電解めっき層２４及び電解
めっき層２５が夫々形成されている。The through hole 22 is formed such that the inner diameter in the middle of the thickness direction of the laminated plate 23 is small and constant, and the surface 23 a
And the inside diameter in the vicinity of the back surface 23b is formed stepwise so as to be wider. Substrate 21 including plating process
Is the same as that of the first embodiment, and the copper foil layer 23c, the electroless plating layer 24, and the electrolytic plating layer 25 are formed in the through holes 22, respectively.
【００２５】本発明の第３実施例に係る基板３１は、図
３及び図１５に示すように、積層板３３にスルーホール
３２を形成し、該スルーホール３２にめっきを施してな
り、表裏が電気的に接続されている。As shown in FIGS. 3 and 15, a substrate 31 according to a third embodiment of the present invention is formed by forming a through hole 32 in a laminated plate 33 and plating the through hole 32, and It is electrically connected.
【００２６】スルーホール３２は、積層板３３の厚さ方
向の中央から表面３３ａ及び裏面３３ｂに向かって夫々
内径がテーパ状に拡開するように形成されている。めっ
き処理を含む基板３１の加工工程は、第１実施例と同様
であり、スルーホール３２には、銅箔層３３ｃ、無電解
めっき層３４及び電解めっき層３５が夫々形成されてい
る。The through hole 32 is formed such that the inner diameter of the laminated plate 33 is tapered from the center in the thickness direction toward the front surface 33a and the back surface 33b. The processing steps of the substrate 31 including the plating process are the same as in the first embodiment, and the copper foil layer 33c, the electroless plating layer 34, and the electrolytic plating layer 35 are formed in the through holes 32, respectively.
【００２７】本発明の第４実施例に係る基板４１は、図
４及び図１６に示すように、積層板４３にスルーホール
４２を形成し、該スルーホール４２にめっきを施してな
り、表裏が電気的に接続されている。As shown in FIGS. 4 and 16, a substrate 41 according to a fourth embodiment of the present invention is formed by forming a through hole 42 in a laminated plate 43 and plating the through hole 42, and It is electrically connected.
【００２８】スルーホール４２は、積層板４３の裏面３
３ｂから表面３３ａに向かって内径がテーパ状に拡開す
るように形成されている。めっき処理を含む基板４１の
加工工程は、第１実施例と同様であり、スルーホール４
２には、銅箔層４３ｃ、無電解めっき層４４及び電解め
っき層４５が夫々形成されている。The through hole 42 is formed on the back surface 3 of the laminate 43.
The inner diameter is formed to expand in a tapered shape from 3b toward the surface 33a. The processing steps of the substrate 41 including the plating process are the same as those of the first embodiment.
2, a copper foil layer 43c, an electroless plating layer 44, and an electrolytic plating layer 45 are respectively formed.
【００２９】本発明の第５実施例に係る基板５１は、図
５及び図１７に示すように、積層板５３にスルーホール
５２を形成し、該スルーホール５２にめっきを施してな
り、表裏が電気的に接続されている。As shown in FIGS. 5 and 17, a substrate 51 according to a fifth embodiment of the present invention is formed by forming a through hole 52 in a laminated plate 53 and plating the through hole 52, and It is electrically connected.
【００３０】スルーホール５２は、内径が一定な同径部
５３ｄと該同径部５３ｄに連続し積層板５３の表面５３
ａ又は裏面５３ｂに向かって拡開するテーパ部５３ｅと
から形成されている。本実施例においては、裏面５３ｂ
側に同型部５３ｄが形成され、表面５３ａ側にテーパ部
５３ｅが形成されている。めっき処理を含む基板５１の
加工工程は、第１実施例と同様であり、スルーホール５
２には、銅箔層５３ｃ、無電解めっき層５４及び電解め
っき層５５が夫々形成されている。The through hole 52 has a constant diameter portion 53d having a constant inner diameter and a surface 53 of the laminated plate 53 which is continuous with the same diameter portion 53d.
a or a tapered portion 53e expanding toward the rear surface 53b. In the present embodiment, the back surface 53b
The same shaped portion 53d is formed on the side, and the tapered portion 53e is formed on the front surface 53a side. The processing steps of the substrate 51 including the plating process are the same as those of the first embodiment.
2, a copper foil layer 53c, an electroless plating layer 54, and an electrolytic plating layer 55 are respectively formed.
【００３１】本発明の第６実施例に係る基板６１は、図
６及び図１８に示すように、積層板６３にスルーホール
６２を形成し、該スルーホール６２にめっきを施してな
り、表裏が電気的に接続されている。As shown in FIGS. 6 and 18, a substrate 61 according to a sixth embodiment of the present invention is formed by forming a through hole 62 in a laminated plate 63 and plating the through hole 62, and It is electrically connected.
【００３２】スルーホール６２は、積層板６３の厚さ方
向の中程は狭く、そこから表面６３ａ及び裏面６３ｂに
向かって夫々内径がテーパ状に拡開するように形成され
ている。本実施例においては、スルーホール６２のうち
内径が狭く形成されているのは、積層板６３の厚さ方向
の表面６３ａ寄りであり、そこから表面６３ａ及び裏面
６３ｂに向かって夫々内径がテーパ状に拡開するように
形成されているため、テーパの角度は表面６３ａ側の方
が大きくなっている。めっき処理を含む基板６１の加工
工程は、第１実施例と同様であり、スルーホール６２に
は、銅箔層６３ｃ、無電解めっき層６４及び電解めっき
層６５が夫々形成されている。The through hole 62 is formed so that the middle of the laminated plate 63 in the thickness direction is narrow, and the inner diameter of the through hole 62 is tapered toward the front surface 63a and the back surface 63b. In this embodiment, the through hole 62 whose inner diameter is formed narrower is closer to the surface 63a in the thickness direction of the laminated plate 63, and the inner diameter is tapered toward the surface 63a and the back surface 63b from there. The taper angle is larger on the surface 63a side. The processing steps of the substrate 61 including the plating process are the same as those of the first embodiment, and the copper foil layer 63c, the electroless plating layer 64, and the electrolytic plating layer 65 are formed in the through holes 62, respectively.
【００３３】そして本発明方法（請求項４）は、積層板
１３の表面１３ａ又は裏面１３ｂに向かって内径がテー
パ状に拡開するようにスルーホール１２を形成し、該ス
ルーホール１２にめっきを施し、該スルーホール１２の
小径側に溶融した鉛フリー半田４を接触させて、該スル
ーホール１２に十分な量の鉛フリー半田４を充填する方
法である。According to the method of the present invention (claim 4), the through hole 12 is formed so that the inner diameter expands in a tapered shape toward the front surface 13a or the back surface 13b of the laminated plate 13, and plating is performed on the through hole 12. In this method, a molten lead-free solder 4 is brought into contact with the small diameter side of the through-hole 12 to fill the through-hole 12 with a sufficient amount of the lead-free solder 4.
【００３４】そして本発明方法（請求項５）は、積層板
１３の厚さ方向の中程は狭くそこから表面１３ａ及び裏
面１３ｂに向かって夫々内径がテーパ状に拡開するよう
にスルーホール１２を形成し、該スルーホール１２にめ
っきを施し、該スルーホール１２の穴方向の中程まで溶
融した鉛フリー半田４を入れることにより、該鉛フリー
半田４がぬれ性により該スルーホール１２に入って行
き、内径の拡開に伴って更に容易に該スルーホール１２
に入って行くようにして、該スルーホール１２に十分な
量の鉛フリー半田４を充填する方法である。In the method of the present invention (claim 5), the thickness of the laminated plate 13 is small in the middle of the thickness direction, and the through holes 12 are tapered so that the inner diameters thereof are gradually increased toward the front surface 13a and the back surface 13b. The lead-free solder 4 enters the through-hole 12 due to wettability by plating the through-hole 12 and putting the molten lead-free solder 4 in the middle of the through-hole 12 in the hole direction. And the through hole 12 can be more easily
In this method, a sufficient amount of lead-free solder 4 is filled in the through-hole 12 so as to enter the through hole 12.
【００３５】本発明は、上記のように構成されており、
以下その作用について説明する。図１１に示すように、
ディップ式半田付けにより本発明の第１実施例に係る基
板１１を溶融した鉛フリー半田４に厚さの半分程度まで
浸漬すると、裏面１３ｂ側から鉛フリー半田４がスルー
ホール１２に入り込んで、液面Ａ、液面Ｂ、そして液面
Ｃまで矢印Ｄ方向に速やかに上がって行く。The present invention is configured as described above,
Hereinafter, the operation will be described. As shown in FIG.
When the substrate 11 according to the first embodiment of the present invention is immersed in the molten lead-free solder 4 to about half the thickness by the dip-type soldering, the lead-free solder 4 enters the through hole 12 from the back surface 13b side, and the liquid The liquid quickly rises in the direction of arrow D to surface A, liquid surface B, and liquid surface C.
【００３６】鉛フリー半田４は、鉛半田に比べて一般に
ぬれ性が相当悪いために、スルーホール１２への上がり
が悪いが、内径がテーパ状に拡開するところまで達すれ
ば、鉛フリー半田４の表面張力は斜め方向に作用するよ
うになる。たとえ鉛フリー半田４のぬれ性が悪く、表面
張力が小さいとしても、重力の斜め方向分力には表面張
力が勝るようになるため、重力の影響が小さくなり、鉛
フリー半田４は液面Ｃまで上がって行くことができる。The lead-free solder 4 generally has considerably poor wettability compared to the lead solder, and therefore does not easily go up to the through-hole 12. However, if the inner diameter reaches a point where the inner diameter expands in a tapered shape, the lead-free solder 4 is removed. The surface tension acts in an oblique direction. Even if the wettability of the lead-free solder 4 is poor and the surface tension is small, since the surface tension exceeds the diagonal component of gravity, the influence of gravity is reduced, and the lead-free solder 4 has a liquid surface C You can go up to.
【００３７】基板１１を溶融した鉛フリー半田４から取
り出すと、図１２及び図１３に示すように、スルーホー
ル１２はその上部まで鉛フリー半田４により十分に満た
された状態となり、該鉛フリー半田４は温度の低下と共
に固化する。When the substrate 11 is taken out of the molten lead-free solder 4, the through hole 12 is fully filled with the lead-free solder 4 up to its upper part, as shown in FIGS. 4 solidifies with decreasing temperature.
【００３８】第２実施例に係る基板２１のスルーホール
２２は、段付き形状となっているため、一旦表面２３ａ
側の内径が大きくなるところまで鉛フリー半田４が上が
ってしまえば、該鉛フリー半田４を保持し易くなる。こ
れによって溶融した鉛フリー半田４から基板２１を取り
出す際にも、スルーホール２２内の鉛フリー半田４が留
まり、固化するので、該スルーホール２２をその上部ま
で鉛フリー半田４で充填することが可能となる。The through hole 22 of the substrate 21 according to the second embodiment has a stepped shape, so that
If the lead-free solder 4 rises to the point where the inner diameter on the side increases, it becomes easier to hold the lead-free solder 4. As a result, even when the substrate 21 is taken out from the molten lead-free solder 4, the lead-free solder 4 in the through-hole 22 remains and solidifies, so that the through-hole 22 can be filled up to the upper portion with the lead-free solder 4. It becomes possible.
【００３９】第３実施例から第６実施例に係る基板３
１，４１，５１，６１のスルーホール３２，４２，５
２，６２については、図１５から図１８に示すように、
いずれも夫々表面３３ａ，４３ａ，５３ａ，６３ａに向
かって内径がテーパ状に拡開している点で第１実施例と
同様であり、いずれも鉛フリー半田４の上がりを向上さ
せることが可能である。The substrate 3 according to the third to sixth embodiments
1, 41, 51, 61 through holes 32, 42, 5
For 2,62, as shown in FIGS. 15 to 18,
Each of them is the same as the first embodiment in that the inner diameter is expanded in a tapered shape toward the surfaces 33a, 43a, 53a, and 63a, respectively. is there.
【００４０】[0040]
【発明の効果】本発明は、上記のように積層板にスルー
ホールを形成し該スルーホールにめっきを施してなり表
裏が電気的に接続されたプリント配線基板において、積
層板の表面又は裏面に向かって内径がテーパ状に拡開す
るようにスルーホールを形成したので、ぬれ性の悪い鉛
フリー半田でもスルーホールに上がり易くなるようにす
ることができる効果があり、該スルーホールの上部まで
鉛フリー半田を充填できるという画期的な効果が得られ
る。According to the present invention, there is provided a printed wiring board in which a through hole is formed in a laminate as described above, and the through hole is plated, and the front and back surfaces are electrically connected. Since the through-hole is formed so that the inner diameter expands in a tapered shape, there is an effect that even a lead-free solder having poor wettability can be easily raised to the through-hole, and the lead is formed up to the upper portion of the through-hole. An epoch-making effect that free solder can be filled is obtained.
【００４１】また上記構成において、積層板の厚さ方向
の中程は狭くそこから表面及び裏面に向かって夫々内径
がテーパ状に拡開するようにスルーホールを形成し、該
スルーホールに鉛フリー半田を充填し易いように構成し
たので、鉛フリー半田実装の実用化に大きく貢献するプ
リント配線基板を提供することができる効果がある。In the above structure, a through hole is formed so that the middle of the laminated plate in the thickness direction is narrow, and the inner diameter of the through hole is tapered toward the front surface and the back surface. Since the configuration is such that the solder is easily filled, there is an effect that a printed wiring board which greatly contributes to the practical use of lead-free solder mounting can be provided.
【００４２】更には、内径が一定な同径部と該同径部に
連続し積層板の表面又は裏面に向かって拡開するテーパ
部とからなるスルーホールを積層板に形成し、該スルー
ホールに同径部側から鉛フリー半田を充填し易いように
構成したので、スルーホールに対する工数が少なく、か
つ鉛フリー半田をスルーホールの上部まで十分に充填可
能なプリント配線基板を低コストで提供できる効果があ
る。Further, a through-hole is formed in the laminated plate, comprising a constant-diameter portion having a constant inner diameter and a tapered portion continuous with the same-diameter portion and expanding toward the front or back surface of the laminated plate. Because it is configured so that lead-free solder can be easily filled from the same diameter part side, it is possible to provide a low-cost printed wiring board that requires less man-hours for through-holes and can sufficiently fill lead-free solder up to the top of through-holes. effective.
【００４３】また積層板の表面又は裏面に向かって内径
がテーパ状に拡開するようにスルーホールを形成し該ス
ルーホールにめっきを施し、該スルーホールの小径側に
溶融した鉛フリー半田を接触させて、該スルーホールの
上部まで十分な量の鉛フリー半田を充填するようにした
ので、鉛フリー半田のぬれ性の悪さを補って、鉛フリー
半田実装の実用化を可能とし得る効果がある。Further, a through hole is formed so that the inner diameter expands in a tapered shape toward the front surface or the back surface of the laminated plate, plating is applied to the through hole, and molten lead-free solder is brought into contact with the small diameter side of the through hole. Then, a sufficient amount of lead-free solder is filled up to the upper portion of the through-hole, so that the poor wettability of the lead-free solder is compensated, and there is an effect that the lead-free solder mounting can be practically used. .
【００４４】更には、積層板の厚さ方向の中程は狭くそ
こから表面及び裏面に向かって夫々内径がテーパ状に拡
開するようにスルーホールを形成し該スルーホールにめ
っきを施し、該スルーホールにめっきを施し、ディップ
式又は噴流式半田付けにより該スルーホールの穴方向の
途中まで溶融した鉛フリー半田を充填することにより、
該鉛フリー半田を表面張力に起因するぬれ性により該ス
ルーホール内を上昇させると共に、内径のテーパ状の拡
開に伴って重力の影響を減らすことで更に容易に該スル
ーホール内を上昇させ、該スルーホールの上部まで十分
な量の前記鉛フリー半田を充填できるようにしたので、
鉛フリー半田実装の実用化を可能とし得る効果があり、
またこの結果鉛半田による地球環境汚染の防止に貢献で
きるという産業上、環境衛生上極めて優れた効果が得ら
れる。Further, a through hole is formed so that the middle of the laminated plate in the thickness direction is narrow, and the inner diameter of the through hole is tapered toward the front surface and the back surface, and the through hole is plated. By plating the through hole and filling it with lead-free solder that has been melted halfway in the hole direction of the through hole by dip or jet soldering,
The lead-free solder is raised in the through hole by wettability caused by surface tension, and is further easily raised in the through hole by reducing the influence of gravity due to the tapered expansion of the inner diameter. Since a sufficient amount of the lead-free solder was filled up to the top of the through hole,
There is an effect that can make practical use of lead-free solder mounting possible,
As a result, an extremely excellent effect on industry and environment and sanitation can be obtained, which can contribute to prevention of global environmental pollution due to lead solder.
【００４５】[0045]
【実施例１】スルーホールに対し、基板の両面から頂角
６０°の先端円錐形の工具により、図１０に示すよう
な、スルーホールの両側にテーパ状に拡開した面（テー
パ面）を形成した基板と、基板の表面又は裏面から同様
に先端円錐形の工具により、図１７に示すようなスルー
ホールの片側にテーパ面を形成した基板を製作し、夫々
のスルーホールに対して、表１に示す条件で鉛フリー半
田による半田付けを行った。EXAMPLE 1 As shown in FIG. 10, a surface (tapered surface) expanded in a tapered shape on both sides of the through hole with respect to the through hole by a conical tool having a vertex angle of 60 ° from both sides of the substrate. A substrate having a tapered surface formed on one side of a through hole as shown in FIG. 17 was manufactured using the formed substrate and a front-cone-shaped tool from the front or back surface of the substrate. Under the conditions shown in No. 1, soldering with lead-free solder was performed.
【００４６】[0046]
【表１】 [Table 1]
【００４７】その結果、スルーホールの両側にテーパ面
を形成した基板については、すべてのスルーホールに十
分に半田が上がり、該スルーホールをその上部まで１０
０％鉛フリー半田で満たすことができた。As a result, in the case of a substrate having tapered surfaces formed on both sides of the through hole, the solder is sufficiently raised in all the through holes, and the through holes are moved up to 10
It could be filled with 0% lead-free solder.
【００４８】またスルーホールの下側、即ち半田槽側に
テーパ面を形成した基板と、スルーホールの上側に該テ
ーパ面を形成した基板については、スルーホールの両側
にテーパ面を形成した基板よりは半田の上がりが少ない
が、どちらも１００％近く、スルーホールの上部まで鉛
フリー半田で満たすことができた。なお、どちらかとい
えばスルーホールの下側にテーパ面を形成した基板の方
が、鉛フリー半田の上がりがよい結果となった。Further, the substrate having a tapered surface formed on the lower side of the through hole, that is, the solder bath side, and the substrate having the tapered surface formed on the upper side of the through hole, are different from the substrates having tapered surfaces formed on both sides of the through hole. Although the rise of the solder was small, both of them were nearly 100%, and the upper part of the through hole could be filled with the lead-free solder. It should be noted that, if anything, the substrate having the tapered surface formed below the through hole had a better lead-free solder rise.
【図１】図１から図１８は、本発明に係り、図１は本発
明の第１実施例に係る積層板のスルーホールの形状を示
す縦断面図である。FIGS. 1 to 18 relate to the present invention, and FIG. 1 is a longitudinal sectional view showing a shape of a through hole of a laminate according to a first embodiment of the present invention.
【図２】本発明の第２実施例に係る積層板のスルーホー
ルの形状を示す縦断面図である。FIG. 2 is a longitudinal sectional view showing a shape of a through hole of a laminate according to a second embodiment of the present invention.
【図３】本発明の第３実施例に係る積層板のスルーホー
ルの形状を示す縦断面図である。FIG. 3 is a longitudinal sectional view showing a shape of a through hole of a laminate according to a third embodiment of the present invention.
【図４】本発明の第４実施例に係る積層板のスルーホー
ルの形状を示す縦断面図である。FIG. 4 is a longitudinal sectional view showing a shape of a through hole of a laminated board according to a fourth embodiment of the present invention.
【図５】本発明の第５実施例に係る積層板のスルーホー
ルの形状を示す縦断面図である。FIG. 5 is a longitudinal sectional view showing a shape of a through hole of a laminate according to a fifth embodiment of the present invention.
【図６】本発明の第６実施例に係る積層板のスルーホー
ルの形状を示す縦断面図である。FIG. 6 is a longitudinal sectional view showing a shape of a through hole of a laminate according to a sixth embodiment of the present invention.
【図７】図７から図１３は、本発明の第１実施例に係
り、図７は積層板に無電解めっき層を形成した状態を示
す縦断面図である。FIGS. 7 to 13 relate to a first embodiment of the present invention, and FIG. 7 is a longitudinal sectional view showing a state in which an electroless plating layer is formed on a laminate.
【図８】積層板の無電解めっき層の上に電解めっき層を
形成して全面にドライフィルムを貼着した状態を示す縦
断面図である。FIG. 8 is a longitudinal sectional view showing a state in which an electrolytic plating layer is formed on an electroless plating layer of a laminate and a dry film is adhered to the entire surface.
【図９】図８の状態から、ポジパターンとして露光及び
現像を行った後、エッチングを行い、余分な電解めっき
層、無電解めっき層及び銅箔層を除去した状態を示す縦
断面図である。FIG. 9 is a longitudinal sectional view showing a state in which after performing exposure and development as a positive pattern from the state of FIG. 8, etching is performed, and an extra electrolytic plating layer, an electroless plating layer, and a copper foil layer are removed. .
【図１０】ドライフィルムを除去し、完成したプリント
配線基板のスルーホールの状態を示す縦断面図である。FIG. 10 is a longitudinal sectional view showing a state of a through hole of a completed printed wiring board after removing a dry film.
【図１１】プリント配線基板を溶融した鉛フリー半田に
その厚さの半分程度まで浸漬することによって、該鉛フ
リー半田がスルーホールにその上部まで上がって行く状
態を示す縦断面図である。FIG. 11 is a vertical cross-sectional view showing a state in which a printed wiring board is immersed in molten lead-free solder to about half its thickness, so that the lead-free solder rises up to the upper portion of the through hole.
【図１２】プリント配線基板に鉛フリー半田が十分に充
填された状態を示す縦断面図である。FIG. 12 is a longitudinal sectional view showing a state in which lead-free solder is sufficiently filled in a printed wiring board.
【図１３】プリント配線基板に鉛フリー半田が十分に充
填された状態を示す斜視図である。FIG. 13 is a perspective view showing a state in which the printed wiring board is sufficiently filled with lead-free solder.
【図１４】本発明の第２実施例に係るプリント配線基板
のスルーホールの状態を示す縦断面図である。FIG. 14 is a longitudinal sectional view showing a state of a through hole in a printed wiring board according to a second embodiment of the present invention.
【図１５】本発明の第３実施例に係るプリント配線基板
のスルーホールの状態を示す図である。FIG. 15 is a diagram showing a state of a through hole in a printed wiring board according to a third embodiment of the present invention.
【図１６】本発明の第４実施例に係るプリント配線基板
のスルーホールの状態を示す図である。FIG. 16 is a diagram showing a state of a through hole in a printed wiring board according to a fourth embodiment of the present invention.
【図１７】本発明の第５実施例に係るプリント配線基板
のスルーホールの状態を示す図である。FIG. 17 is a diagram showing a state of a through hole in a printed wiring board according to a fifth embodiment of the present invention.
【図１８】本発明の第６実施例に係るプリント配線基板
のスルーホールの状態を示す図である。FIG. 18 is a diagram illustrating a state of a through hole in a printed wiring board according to a sixth embodiment of the present invention.
【図１９】図１９及び図２０は、従来例に係り、図１９
はプリント配線基板を溶融した鉛フリー半田にその厚さ
の半分程度まで浸漬しても、該鉛フリー半田がスルーホ
ールの上部まで上がって行かない状態を示す縦断面図で
ある。FIG. 19 and FIG. 20 are related to the conventional example, and FIG.
FIG. 3 is a vertical cross-sectional view showing a state where the lead-free solder does not go up to the upper part of the through hole even when the printed wiring board is immersed in the molten lead-free solder to about half its thickness.
【図２０】半田付け後のプリント配線基板のスルーホー
ルに鉛フリー半田がほとんど上がっていない状態を示す
斜視図である。FIG. 20 is a perspective view showing a state in which lead-free solder hardly rises in a through hole of the printed wiring board after soldering.
４ 鉛フリー半田 １１ プリント配線基板 １２ スルーホール １３ 積層板 １３ａ 表面 １３ｂ 裏面 ２１ プリント配線基板 ２２ スルーホール ２３ 積層板 ２３ａ 表面 ２３ｂ 裏面 ３１ プリント配線基板 ３２ スルーホール ３３ 積層板 ３３ａ 表面 ３３ｂ 裏面 ４１ プリント配線基板 ４２ スルーホール ４３ 積層板 ４３ａ 表面 ４３ｂ 裏面 ５１ プリント配線基板 ５２ スルーホール ５３ 積層板 ５３ａ 表面 ５３ｂ 裏面 ５３ｄ 同径部 ５３ｅ テーパ部 ６１ プリント配線基板 ６２ スルーホール ６３ 積層板 ６３ａ 表面 ６３ｂ 裏面 REFERENCE SIGNS LIST 4 lead-free solder 11 printed wiring board 12 through hole 13 laminated board 13a front surface 13b back surface 21 printed wiring board 22 through hole 23 laminated board 23a front surface 23b back surface 31 printed wiring board 32 through hole 33 laminated plate 33a front surface 33b back surface 41 printed wiring board 42 through hole 43 laminated board 43a front surface 43b back surface 51 printed wiring board 52 through hole 53 laminated plate 53a front surface 53b back surface 53d same diameter portion 53e taper portion 61 printed wiring board 62 through hole 63 laminated plate 63a front surface 63b back surface
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E317 AA24 CC15 CC25 CD27 CD32 GG07 GG17 5E319 AC11 AC16 BB01 CC23 CD28 GG20 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA24 CC15 CC25 CD27 CD32 GG07 GG17 5E319 AC11 AC16 BB01 CC23 CD28 GG20
Claims (5)
ホールにめっきを施してなり表裏が電気的に接続された
プリント配線基板において、前記積層板の表面又は裏面
に向かって内径がテーパ状に拡開するように前記スルー
ホールを形成したことを特徴とするプリント配線基板。1. A printed wiring board in which a through hole is formed in a laminated plate and the through hole is plated and the front and back surfaces are electrically connected, wherein the inner diameter is tapered toward the front surface or the back surface of the laminated plate. A printed wiring board, wherein the through hole is formed so as to expand.
ホールにめっきを施してなり表裏が電気的に接続された
プリント配線基板において、前記積層板の厚さ方向の中
程は狭くそこから表面及び裏面に向かって夫々内径がテ
ーパ状に拡開するように前記スルーホールを形成し、該
スルーホールの上部まで鉛フリー半田を充填し易いよう
に構成したことを特徴とするプリント配線基板。2. A printed wiring board in which a through hole is formed in a laminated plate and the through hole is plated, and the front and back surfaces are electrically connected to each other. And a through-hole formed so that the inner diameter of the through-hole expands in a tapered shape toward the rear surface, and a lead-free solder is easily filled up to the upper portion of the through-hole.
ホールにめっきを施してなり表裏が電気的に接続された
プリント配線基板において、内径が一定な同径部と該同
径部に連続し前記積層板の表面又は裏面に向かって拡開
するテーパ部とからなるスルーホールを前記積層板に形
成し、該スルーホールの上部まで前記同径部側から鉛フ
リー半田を充填し易いように構成したことを特徴とする
プリント配線基板。3. A printed wiring board in which a through hole is formed in a laminated plate, and the through hole is plated and electrically connected to the front and back sides. A through hole comprising a tapered portion expanding toward the front surface or the back surface of the laminated plate is formed in the laminated plate, and the upper portion of the through hole is configured to be easily filled with lead-free solder from the same diameter portion side. A printed wiring board, characterized in that:
テーパ状に拡開するようにスルーホールを形成し該スル
ーホールにめっきを施し、該スルーホールの小径側に溶
融した鉛フリー半田を接触させて、該スルーホールの上
部まで十分な量の前記鉛フリー半田を充填することを特
徴とするプリント配線基板のスルーホールへの半田付け
方法。4. A through-hole is formed so that the inner diameter expands in a tapered shape toward the front surface or the back surface of the laminated plate, plating is applied to the through-hole, and molten lead-free solder is applied to the small-diameter side of the through-hole. A method of soldering a printed wiring board to a through-hole, wherein the lead-free solder is filled in a sufficient amount up to the top of the through-hole.
表面及び裏面に向かって夫々内径がテーパ状に拡開する
ようにスルーホールを形成し、該スルーホールにめっき
を施し、ディップ式又は噴流式半田付けにより該スルー
ホールの穴方向の途中まで溶融した鉛フリー半田を充填
することにより、該鉛フリー半田を表面張力に起因する
ぬれ性により該スルーホール内を上昇させると共に、内
径のテーパ状の拡開に伴って重力の影響を減らすことで
更に容易に該スルーホール内を上昇させ、該スルーホー
ルの上部まで十分な量の前記鉛フリー半田を充填するこ
とを特徴とするプリント配線基板のスルーホールへの半
田付け方法。5. A through-hole is formed such that the middle of the thickness direction of the laminated plate is narrow and the inner diameter of the laminated plate expands in a tapered shape toward the front surface and the back surface, and the through-hole is plated. By filling the lead-free solder melted halfway in the hole direction of the through-hole by a soldering method or a jet type soldering, the lead-free solder is raised in the through-hole by the wettability caused by surface tension, and the inner diameter is increased. The print characterized in that the influence of gravity is reduced with the expansion of the tapered shape, the inside of the through-hole is more easily raised, and a sufficient amount of the lead-free solder is filled up to the upper part of the through-hole. A method for soldering to through holes in wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000263887A JP2002076615A (en) | 2000-08-31 | 2000-08-31 | Printed circuit board and method for soldering to its through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000263887A JP2002076615A (en) | 2000-08-31 | 2000-08-31 | Printed circuit board and method for soldering to its through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002076615A true JP2002076615A (en) | 2002-03-15 |
Family
ID=18751376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000263887A Pending JP2002076615A (en) | 2000-08-31 | 2000-08-31 | Printed circuit board and method for soldering to its through hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002076615A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269603A (en) * | 2005-03-23 | 2006-10-05 | Ngk Spark Plug Co Ltd | Wiring board and multi-patterned wiring board |
| JP2006324500A (en) * | 2005-05-19 | 2006-11-30 | Olympus Corp | Junction structure and joining method |
| JP2009060151A (en) * | 2008-12-18 | 2009-03-19 | Ibiden Co Ltd | Production process of laminated wiring board |
| CN102740614A (en) * | 2011-03-30 | 2012-10-17 | 揖斐电株式会社 | Method for manufacturing multilayer printed wiring board |
| JP2015090965A (en) * | 2013-11-07 | 2015-05-11 | 三菱電機株式会社 | Semiconductor device |
| CN110010581A (en) * | 2018-01-05 | 2019-07-12 | 意法半导体(格勒诺布尔2)公司 | Insulated contact spacer |
| CN111083884A (en) * | 2019-12-24 | 2020-04-28 | 广州兴森快捷电路科技有限公司 | Multilayer circuit board and laminating method thereof |
| CN113079645A (en) * | 2021-03-30 | 2021-07-06 | 上海大学 | Pressing method for aluminum-based sandwich printed circuit board |
-
2000
- 2000-08-31 JP JP2000263887A patent/JP2002076615A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269603A (en) * | 2005-03-23 | 2006-10-05 | Ngk Spark Plug Co Ltd | Wiring board and multi-patterned wiring board |
| JP2006324500A (en) * | 2005-05-19 | 2006-11-30 | Olympus Corp | Junction structure and joining method |
| JP2009060151A (en) * | 2008-12-18 | 2009-03-19 | Ibiden Co Ltd | Production process of laminated wiring board |
| CN102740614A (en) * | 2011-03-30 | 2012-10-17 | 揖斐电株式会社 | Method for manufacturing multilayer printed wiring board |
| JP2012212858A (en) * | 2011-03-30 | 2012-11-01 | Ibiden Co Ltd | Manufacturing method of multilayer printed wiring board |
| US8931168B2 (en) | 2011-03-30 | 2015-01-13 | Ibiden Co., Ltd. | Method for manufacturing multilayer printed wiring board |
| JP2015090965A (en) * | 2013-11-07 | 2015-05-11 | 三菱電機株式会社 | Semiconductor device |
| CN110010581A (en) * | 2018-01-05 | 2019-07-12 | 意法半导体(格勒诺布尔2)公司 | Insulated contact spacer |
| CN111083884A (en) * | 2019-12-24 | 2020-04-28 | 广州兴森快捷电路科技有限公司 | Multilayer circuit board and laminating method thereof |
| CN113079645A (en) * | 2021-03-30 | 2021-07-06 | 上海大学 | Pressing method for aluminum-based sandwich printed circuit board |
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