JPH031105B2 - - Google Patents
Info
- Publication number
- JPH031105B2 JPH031105B2 JP10162683A JP10162683A JPH031105B2 JP H031105 B2 JPH031105 B2 JP H031105B2 JP 10162683 A JP10162683 A JP 10162683A JP 10162683 A JP10162683 A JP 10162683A JP H031105 B2 JPH031105 B2 JP H031105B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- laminate
- molten solder
- soldering
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 68
- 238000005476 soldering Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000007598 dipping method Methods 0.000 claims description 2
- 230000003068 static effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は電子機器に用いる積層板のはんだ付け
方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for soldering laminates used in electronic equipment.
積層板は色々なパターンのプリント基板を重ね
合わせたもので、その厚さは10mm以上に達する厚
いものがある。積層板における各プリント基板間
の導通は貫通したスルーホールを銅メツキするこ
とによりなされているが、更に導通を確実なもの
にし、スルーホール内に挿入された電子部品との
接合を完全に行うためにははんだ付け時、該スル
ーホール内にはんだが十分に付着するようにしな
ければならないものである。 Laminated boards are made by layering printed circuit boards with various patterns, and some are as thick as 10 mm or more. Conductivity between each printed circuit board in a laminate is achieved by copper plating the through-holes, but in order to further ensure continuity and to ensure complete bonding with electronic components inserted into the through-holes. When soldering, it is necessary to ensure that the solder adheres sufficiently within the through-hole.
一般に積層板のはんだ付けは溶融はんだ中に浸
漬することにより行われるが、従来のはんだ付け
方法ではスルーホール内に完全にはんだが上昇し
ていなかつたり、或いはスルーホール下部にはん
だが付着しないというはんだ付け不良を起すこと
が往々にしてあつた。 Generally, laminated boards are soldered by dipping them into molten solder, but with conventional soldering methods, the solder does not rise completely into the through-holes, or the solder does not adhere to the bottom of the through-holes. Poor attachment often occurred.
これらの原因について本発明者らが検討してみ
た結果、スルーホール内にはんだが上昇しないの
は厚い積層板の上部が完全にはんだ付け温度にな
つていないため、スルーホール内上昇途中の溶融
はんだが冷えて固まつてしまうからであり、ま
た、スルーホールの下部にはんだが付着しないの
はスルーホールの下部に空気やフラツクスヒユー
ムが存在し、これがはんだの付着を邪魔するから
であることが判つた。これは従来の積層板のはん
だ付けが単に静止はんだ槽や噴流はんだ槽に浸漬
させたり、通過させるだけであつたため、上記の
ようなはんだ付け不良が発生していたものであ
る。つまり、噴流はんだ槽を用いる場合、積層板
は噴流している溶融はんだにはんだ付け面を接触
させながら移動させるが、積層板を余り深く溶融
はんだ中に浸漬すると積層板の上面に噴流してい
る溶融はんだが浸入して不要な箇所にはんだが付
着してしまう。それ故、積層板は溶融はんだ中に
深く浸漬できず熱伝動性のよくない積層板の上部
は溶融はんだで加熱されないため溶融はんだはス
ルーホールの上部まで上昇しないことになる。ま
た、積層板を静止槽ではんだ付けすると、静止槽
は溶融はんだが静止状態であるため積層板の下部
に溜つた空気を追い出すことができず、従つて空
気の溜つた部分にははんだが付着しないことにな
る。積層板の下部に空気が存在してしまうのは積
層板の厚さが厚くスルーホールが長いためにスル
ーホールから空気が抜けにくいからである。 The inventors investigated these causes and found that the reason why the solder does not rise inside the through hole is because the top of the thick laminate has not reached the soldering temperature completely, and the molten solder that is rising inside the through hole This is because the solder cools and hardens, and the reason why solder does not adhere to the bottom of the through hole is because there is air or flux fume at the bottom of the through hole, which interferes with solder adhesion. I found out. This is because the conventional soldering of laminates involved simply immersing or passing the laminate in a static solder tank or a jet solder tank, resulting in the above-mentioned soldering defects. In other words, when using a jet solder bath, the laminate is moved with its soldering surface in contact with the molten solder that is flowing, but if the laminate is immersed too deeply into the molten solder, the molten solder will flow onto the top surface of the laminate. Molten solder may penetrate and adhere to unwanted areas. Therefore, the laminate cannot be deeply immersed in the molten solder, and the upper part of the laminate, which has poor thermal conductivity, is not heated by the molten solder, so the molten solder does not rise to the top of the through hole. Additionally, when laminates are soldered in a static tank, the molten solder is stationary in the static tank, so the air that has accumulated at the bottom of the laminate cannot be expelled, and therefore the solder adheres to the areas where air is trapped. I'll end up not doing it. The reason why air exists at the bottom of the laminate is because the laminate is thick and the through holes are long, making it difficult for air to escape through the through holes.
空気の存在ではんだ付け不良を起すのはチツプ
部品を搭載したプリント基板においても同様であ
り、このようなプリント基板のはんだ付け方法と
しては流動している溶融はんだ中にプリント基板
を浸漬し、その後流動を止めてからプリント基板
を退出させてはんだ付けする方法が提案されてい
る（特公昭58−14075号）。確かにこの方法は薄い
プリント基板には有効であるが、積層板のように
厚さの厚いものには適さないものである。なぜな
らば、積層板のようにスルーホール内に十分には
んだを上昇させるために積層板を深く浸漬させな
ければならないものでは、流動している溶融はん
だ中に浸漬すると溶融はんだが積層板の上面に侵
入してしまうからである。 The presence of air can also cause soldering defects in printed circuit boards mounted with chip components, and the soldering method for such printed circuit boards is to immerse the printed circuit board in flowing molten solder, and then A method has been proposed in which the flow is stopped and then the printed circuit board is withdrawn and soldered (Japanese Patent Publication No. 14075/1983). While this method is certainly effective for thin printed circuit boards, it is not suitable for thick boards such as laminates. This is because when laminates need to be immersed deeply in order to raise the solder sufficiently into the through-holes, molten solder may spill onto the top surface of the laminate when immersed in flowing molten solder. This is because they will invade.
本発明者らはスルーホール内にはんだを十分に
上昇させるとともに、スルーホール下部の空気を
追い出してはんだ付け不良を発生させないはんだ
付け方法について鋭意研究した結果、積層板を溶
融はんだに浸漬する時は溶融はんだを静止状態に
しておき、浸漬後、溶融はんだを流動させても溶
融はんだは容易に積層板の上面に侵入しないこと
に着目して本発明を完成させた。本発明の特徴と
するところは、はんだ液面が静止状態となつてい
るはんだ槽に積層板を浸漬し、該浸漬後はんだ液
面を一方向に流動させ、しかる後、はんだ液面の
流動を止めてはんだ液面を再度静止状態にしてか
ら積層板を退出させる積層板のはんだ付け方法で
ある。 The inventors of the present invention have conducted extensive research on a soldering method that allows the solder to rise sufficiently into the through-hole and expels the air below the through-hole to prevent soldering defects. The present invention was completed by focusing on the fact that even if the molten solder is kept stationary and the molten solder is allowed to flow after immersion, the molten solder does not easily penetrate into the upper surface of the laminate. The feature of the present invention is that the laminate is immersed in a solder bath in which the solder liquid level is in a static state, the solder liquid level is allowed to flow in one direction after the immersion, and then the solder liquid level is allowed to flow in one direction. This is a laminated board soldering method in which the solder is stopped and the solder liquid level is brought to a stationary state again, and then the laminated board is withdrawn.
以下図面に基づいて本発明を説明する。 The present invention will be explained below based on the drawings.
第１〜３図は本発明の工程を説明するもので図
中１は積層板、２は溶融はんだ、３ははんだ槽、
４は溶融はんだを流動させる流動装置である。 Figures 1 to 3 explain the steps of the present invention, in which 1 is a laminate, 2 is molten solder, 3 is a solder bath,
4 is a fluidizing device for fluidizing molten solder.
ここで各工程について説明する。 Each step will now be explained.
： 第１図に示すように積層板１を溶融はんだ
２が静止状態となつているはんだ槽３に深く浸
漬する。: As shown in FIG. 1, the laminate 1 is deeply immersed in a solder bath 3 in which molten solder 2 is in a stationary state.
この時、はんだ槽内で溶融はんだが流動して
いると積層板上に流動はんだが侵入してしまい
不必要な箇所にはんだが付着するので溶融はん
だは静止状態にしておかなければならない。 At this time, if the molten solder is flowing in the solder bath, the flowing solder will invade the laminate and adhere to unnecessary places, so the molten solder must be kept stationary.
： 第２図に示すように積層板１が十分深く溶
融はんだに浸漬された後、流動装置４を駆動さ
せて溶融はんだ２の液面を矢印の如く一方向に
流動させる。As shown in FIG. 2, after the laminated plate 1 is immersed sufficiently deeply in the molten solder, the flow device 4 is driven to cause the surface of the molten solder 2 to flow in one direction as shown by the arrow.
積層板を溶融はんだに浸漬後、溶融はんだを
流動させるとスルーホールの下部に存在してい
る空気がこの流れによつて追い出され溶融はん
だがスルーホール下部に入つていく。 After the laminate is immersed in molten solder, when the molten solder is allowed to flow, the air present in the lower part of the through hole is driven out by this flow, and the molten solder enters the lower part of the through hole.
この時、溶融はんだの液面が粗立つていると
積層板上に溶融はんだが侵入してしまうことが
あるので溶融はんだの液面は決して粗立たせて
はならない。本発明に適したはんだ槽として
は、図に示す如くはんだ槽内両端にシロツコフ
アンのような流動装置を設置したものが良く、
これは溶融はんだ液面を粗立たせずに流れの早
い定常流を作ることができる。 At this time, if the surface of the molten solder is rough, the molten solder may penetrate onto the laminate, so the surface of the molten solder must never be rough. A suitable solder bath for the present invention is one in which a flow device such as a Sirotskov fan is installed at both ends of the solder bath, as shown in the figure.
This makes it possible to create a fast, steady flow without making the surface of the molten solder rough.
： 第３図に示すように積層板１を流動してい
る溶融はんだ２に一定時間浸漬後、流動装置４
の駆動を停止させ、溶融はんだの静止を確認し
てから積層板を傾斜させながら矢印Ａ方向へ引
き上げる。: As shown in FIG. 3, after immersing the laminated plate 1 in the flowing molten solder 2 for a certain period of time,
After stopping the drive and confirming that the molten solder is stationary, the laminate is pulled up in the direction of arrow A while tilting it.
積層板の引上げ時、溶融はんだの流動を止め
る理由にはピンフラツグの発生を防止するため
である。ピンフラツグとは、リードの先端等に
ツララが斜め方向に出て、これが密集した回路
においては短絡の原因となつてしまうもので、
流動している溶融はんだから積層板を引き上げ
ると引上げ方向と逆方向に発生するものであ
る。 The reason for stopping the flow of molten solder when pulling up the laminate is to prevent pin flags from occurring. Pin flags are icicles that appear diagonally at the tips of leads, which can cause short circuits in crowded circuits.
When a laminate is pulled up from flowing molten solder, it occurs in the opposite direction to the pulling direction.
上記のようにして積層板のはんだ付けを行う
と、スルーホールの下部には必ずはんだが付着
し、しかもスルーホール内にも上部まで完全には
はんだが上昇するため信頼性に優れたはんだ付け
が行えるものである。 When soldering a laminate as described above, the solder always adheres to the bottom of the through-hole, and the solder rises completely to the top of the through-hole, resulting in highly reliable soldering. It can be done.
第１〜３図は本発明の工程を説明するものであ
る。
１…積層板、２…溶融はんだ、３…はんだ槽、
４…流動装置。
1 to 3 illustrate the steps of the present invention. 1... Laminate board, 2... Molten solder, 3... Solder bath,
4...Flow device.
Claims (1)
に積層板を浸漬し、該浸漬後はんだ液面を一方向
に流動させ、しかる後、はんだ液面の流動を止め
てはんだ液面を再度静止状態にしてから積層板を
退出させることを特徴とする積層板のはんだ付け
方法。1. The laminate is immersed in a solder bath in which the solder liquid level is stationary, and after dipping, the solder liquid level is allowed to flow in one direction, and then the flow of the solder liquid level is stopped and the solder liquid level is made stationary again. A method for soldering a laminate board, which comprises bringing the laminate into a state and then removing the laminate board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162683A JPS59229279A (en) | 1983-06-09 | 1983-06-09 | Soldering method of laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162683A JPS59229279A (en) | 1983-06-09 | 1983-06-09 | Soldering method of laminated plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59229279A JPS59229279A (en) | 1984-12-22 |
| JPH031105B2 true JPH031105B2 (en) | 1991-01-09 |
Family
ID=14305610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10162683A Granted JPS59229279A (en) | 1983-06-09 | 1983-06-09 | Soldering method of laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59229279A (en) |
-
1983
- 1983-06-09 JP JP10162683A patent/JPS59229279A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59229279A (en) | 1984-12-22 |
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