CN103763868B - A kind of 0201 electric capacity row's welding method - Google Patents
A kind of 0201 electric capacity row's welding method Download PDFInfo
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- CN103763868B CN103763868B CN201410031871.XA CN201410031871A CN103763868B CN 103763868 B CN103763868 B CN 103763868B CN 201410031871 A CN201410031871 A CN 201410031871A CN 103763868 B CN103763868 B CN 103763868B
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- steel mesh
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- electric capacity
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Abstract
The invention provides a kind of 0201 electric capacity row's welding method, including: on substrate, carry out scaling powder printing；Using and be formed with the steel mesh of perforate and carry out Solder-Paste Printing, wherein the position of opening of steel mesh corresponding to putting in 0201 electric capacity ranking of Printing Paste, and does not forms perforate in the corresponding region of the scaling powder with printing of steel mesh；Perform paster, on scaling powder pasting chip and mount on soldering paste 0201 electric capacity row；Perform reflow soldering, so that chip and 0201 electric capacity row are fixed to substrate.
Description
Technical field
The present invention relates to integrated antenna package field, it is more particularly related to a kind of 0201
Electric capacity row's welding method.
Background technology
Flip chip technology is to arrange I/O(input/output on the surface of integrated chip by array-like) terminal,
Chip is directly arranged on substrate in upside-down mounting mode, by the I/O terminal of above-mentioned array-like and substrate
Corresponding electrode is connected to form electrical connection.The bare chip of upside-down mounting and common SMT(surface mount
Technology) device is different, its salient point is many, diameter and pitch little, be not suitable for using the mode of Printing Paste
Weld.
But, on the other hand in high performance chip packaging, in same packaging body, except bare chip
In addition, the electric capacity or the electric capacity row that also have filtering need welding.Meanwhile, filter capacitor needs to use weldering
Cream welds, and there are print fluxing and two technological processes of soldering paste the most in process of production.
Thus, in batch production, the soldering paste needed for filtered electrical perhaps electric capacity row uses the mode of printing
There is provided, and the scaling powder needed for bare chip uses the mode dipped to provide substantially, needs special equipment.
Print encapsulated or does not possess the equipment dipping function, using the mode of twice printing, it is achieved soldering paste
With the distribution of scaling powder, in solder paste printing process, solder paste amounts need to be guaranteed, prevent few stannum, void
The defects such as weldering, the scaling powder of Bing Duiqian road printing is protected.
The shortcoming of prior art is: 1) uses the mode dipped to distribute scaling powder, needs special equipment,
Input cost is big；2) need to customize special fixture, the cycle is long, is suitable only for producing in enormous quantities.Also
That is, the method for prior art cost the highest cycle for small displacement produces is oversize.
Summary of the invention
The technical problem to be solved is for there is drawbacks described above in prior art, it is provided that one
While planting the solder paste amounts when guaranteeing 0201 electric capacity typesetting and printing brush, improve the conjunction of 0201 electric capacity row's welding
Lattice rate and the method for reliability.
According to the present invention, it is provided that a kind of 0201 electric capacity row's welding method, comprising:
First step: carry out scaling powder printing on substrate；
Second step: use the steel mesh being formed with perforate to carry out Solder-Paste Printing, wherein the perforate position of steel mesh
Put corresponding to will Printing Paste 0201 electric capacity ranking put, and steel mesh with printing scaling powder
Corresponding region does not forms perforate；
Third step: perform paster, on scaling powder pasting chip and on soldering paste mount 0201 electricity
Hold row；
4th step: perform reflow soldering, so that chip and 0201 electric capacity row are fixed to substrate.
Preferably, in the side relative with substrate of steel mesh, the scaling powder with printing of steel mesh is corresponding
Region be formed with groove；Steel mesh with will be formed at the position corresponding of Printing Paste
Perforate；And in the side deviated from substrate of steel mesh, in the regional extent of perforate, it is formed with groove.
Preferably, the perforate of steel mesh size on the length direction along soldering paste pad is than soldering paste pad
Length is big.
Preferably, the perforate of steel mesh size on the length direction along soldering paste pad is soldering paste pad
1.05 times of length.
Preferably, in the second step, will be formed with the steel mesh of perforate to be arranged in and be printed with scaling powder
On substrate so that scaling powder is contained in the groove of the side relative with substrate, and fill in perforate
Soldering paste, and remove steel mesh after filling full weld cream in perforate so that the soldering paste in perforate is retained in
On the soldering paste pad of substrate.
Preferably, paste soldering flux is used to carry out scaling powder printing on substrate in the first step.
The present invention is by improving steel mesh opening mode, it is ensured that deposition during Solder-Paste Printing, the most right
The scaling powder of printing implements protection, i.e. can prevent scolding tin bridging increasing steel mesh opening simultaneously.This
The print that invention is particularly suitable in Flip-Chip Using produces or small lot batch manufacture.
Accompanying drawing explanation
In conjunction with accompanying drawing, and by with reference to detailed description below, it will more easily the present invention is had more
Complete understands and its adjoint advantage and feature is more easily understood, wherein:
Fig. 1 schematically shows 0201 electric capacity row's welding method according to the preferred embodiment of the invention
Flow chart.
Fig. 2 schematically shows 0201 electric capacity row's welding method according to the preferred embodiment of the invention
The perforate inscribe figure of the steel mesh used.
Fig. 3 schematically shows 0201 electric capacity row's welding method according to the preferred embodiment of the invention
Schematic diagram.
Fig. 4 schematically shows 0201 electric capacity row's welding method according to the preferred embodiment of the invention
Detailed maps.
It should be noted that accompanying drawing is used for illustrating the present invention, and the unrestricted present invention.Note, represent
The accompanying drawing of structure may be not necessarily drawn to scale.Further, in accompanying drawing, same or like element mark
There is same or like label.
Detailed description of the invention
In order to make present disclosure more clear and understandable, below in conjunction with specific embodiments and the drawings pair
Present disclosure is described in detail.
Fig. 1 schematically shows 0201 electric capacity row's welding method according to the preferred embodiment of the invention
Flow chart.
Specifically, as it is shown in figure 1, according to the preferred embodiment of the invention 0201 electric capacity row welding
Method includes:
First step S1: use such as paste soldering flux to carry out scaling powder 200 on the substrate 100 and print；
Hereafter, preferably check printing quality with guarantee the scaling powder of printing uniformly, foreign, bubble-free；
Second step S2: use and be formed with the steel mesh 300 of perforate and carry out Solder-Paste Printing, wherein steel mesh
Position of opening corresponding to will Printing Paste 0201 electric capacity ranking put, and steel mesh with printing
The region that scaling powder is corresponding is not formed perforate (thus protect the scaling powder of printing unaffected)；
Hereafter, preferably check solder paste deposits amount and guarantee that soldering paste does not offset, and guaranteeing that prints before helps
Solder flux shape is intact；
Specifically, Fig. 2 schematically shows 0201 electric capacity according to the preferred embodiment of the invention
The perforate inscribe figure of the steel mesh that row's welding method uses.With reference to Fig. 2, a length of L of perforate, width
For W, the degree of depth is T；Selection for steel mesh thickness:
Surface mount device soldering paste bonding pad opening, sectional area and lateral area ratio (that is, (L × W)/[2 ×
(L+W) × T]) more than 2/3, can show that 0201 class component steel mesh thickness should be less than 0.12mm；
And the steel plate thickness >=0.15mm generally used.Thus, in encapsulation process, for preventing follow-up soldering paste
Extrude scaling powder during printing, protection need to be etched overleaf, will be detailed below.
In particular, it is preferred that ground, as it is shown on figure 3, in second step S2, steel mesh and base
The side (side i.e. contacted with substrate during Printing Paste) that plate is relative, steel mesh with printing help weldering
The corresponding region of agent 10 is formed with groove 11；Steel mesh with will the position of Printing Paste 20 relative
The position answered is formed with perforate 21；And at side (the i.e. Printing Paste deviated from substrate of steel mesh
The side of Shi Buyu substrate contact), in the regional extent 22 of perforate 21, it is formed with groove, so that
The thickness obtaining steel mesh in this region is thinning, so that the height of the soldering paste of follow-up printing is thinning.That is,
Now, in the case of can using existing steel disc, want for meeting filter capacitor (holding row) steel mesh thickness
Asking, filter capacitor (holding row) position is thinning
Further, it is assumed that the soldering paste length of bonding pad on substrate is Y, width is X；For guaranteeing soldering paste
Amount, steel mesh perforate extends out along its length, so that the perforate of steel mesh is in the length side along soldering paste pad
Size upwards is more than soldering paste pad, as shown in Figure 4；The most both can ensure that the stannum amount of reflow soldering
The company's of being possible to prevent stannum again.Specifically, as shown in Figure 4, the perforate of steel mesh is in the length along soldering paste pad
Size on degree direction is bigger than the length of soldering paste pad, it is preferable that the perforate of steel mesh is along soldering paste pad
Length direction on size be 1.05 times of length of soldering paste pad, it is possible to open increasing steel mesh
Mouth prevents scolding tin bridging simultaneously.
Thus, specifically, such as, second step S2 can include such operation, will be formed with
The steel mesh of perforate is arranged on the substrate being printed with scaling powder so that scaling powder is contained in relative with substrate
Side groove in, and in perforate, fill soldering paste, and fill in perforate after full weld cream and move
Except steel mesh so that the soldering paste in perforate is retained on the soldering paste pad of substrate.
Third step S3: perform paster, pasting chip attachment 0201 on soldering paste on scaling powder
Electric capacity row (such as filter capacitor)；After paster, preferably check that the polarity dots of chip is the most correct,
And guarantee that chip and electric capacity are without skew；
4th step S4: perform reflow soldering, so that chip and 0201 electric capacity row are fixed to base
Plate；Preferably, quality of welding spot (abnormal without skew, rosin joint etc.) is checked after reflow soldering.
The present invention is under the steel mesh thickness specified, by improving steel mesh opening mode, it is ensured that Solder-Paste Printing
Time deposition, protection implemented by the scaling powder to printing simultaneously, i.e. can increase steel mesh opening simultaneously
Prevent scolding tin bridging.It is especially applicable to the print in Flip-Chip Using produces or small lot is raw
Produce.
Although it is understood that the present invention discloses as above with preferred embodiment, but above-mentioned enforcement
Example is not limited to the present invention.For any those of ordinary skill in the art, without departing from
Under technical solution of the present invention ambit, all may utilize the technology contents of the disclosure above to the technology of the present invention
Scheme makes many possible variations and modification, or is revised as the Equivalent embodiments of equivalent variations.Therefore,
Every content without departing from technical solution of the present invention, the technical spirit of the foundation present invention is to above example
Any simple modification, equivalent variations and the modification done, all still falls within technical solution of the present invention protection
In the range of.
Claims (3)
1. electric capacity row's welding method, it is characterised in that including:
First step: carry out scaling powder printing on substrate；
Second step: use the steel mesh being formed with perforate to carry out Solder-Paste Printing, wherein the perforate position of steel mesh
Put corresponding to will Printing Paste 0201 electric capacity ranking put, and steel mesh with printing scaling powder
Corresponding region does not forms perforate；Wherein, in the side relative with substrate of steel mesh, steel mesh
The region corresponding with the scaling powder of printing is formed with groove；Steel mesh with will the position of Printing Paste
Corresponding position is formed with perforate；And in the side deviated from substrate of steel mesh, the district of perforate
Groove it is formed with in the range of territory；And, the perforate of steel mesh chi on the length direction along soldering paste pad
Very little bigger than the length of soldering paste pad；Further, in the second step, the steel mesh that will be formed with perforate is arranged
On the substrate being printed with scaling powder so that scaling powder is contained in the groove of the side relative with substrate
In, and in perforate, fill soldering paste, and remove steel mesh after filling full weld cream in perforate so that
Soldering paste in perforate is retained on the soldering paste pad of substrate；
Third step: perform paster, on scaling powder pasting chip and on soldering paste mount 0201 electricity
Hold row；
4th step: perform reflow soldering, so that chip and 0201 electric capacity row are fixed to substrate.
0201 electric capacity row's welding method the most according to claim 1, it is characterised in that steel mesh
Perforate size on the length direction along soldering paste pad be 1.05 times of length of soldering paste pad.
0201 electric capacity row's welding method the most according to claim 1 and 2, it is characterised in that
Paste soldering flux is used to carry out scaling powder printing on substrate in the first step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410031871.XA CN103763868B (en) | 2014-01-23 | 2014-01-23 | A kind of 0201 electric capacity row's welding method |
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|---|---|---|---|
| CN201410031871.XA CN103763868B (en) | 2014-01-23 | 2014-01-23 | A kind of 0201 electric capacity row's welding method |
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| CN103763868A CN103763868A (en) | 2014-04-30 |
| CN103763868B true CN103763868B (en) | 2016-11-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104576426A (en) * | 2015-01-15 | 2015-04-29 | 苏州市易德龙电器有限公司 | Mounting method of flip chip and wafer level chip and mounting jig set |
| CN106954353A (en) * | 2017-05-12 | 2017-07-14 | 郑州云海信息技术有限公司 | A kind of steel mesh method for designing for solving electric capacity missing solder |
| CN107731693A (en) * | 2017-10-16 | 2018-02-23 | 苏州日月新半导体有限公司 | The operational method and its tool of scaling powder |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN109411360A (en) * | 2018-08-29 | 2019-03-01 | 深圳市天毅科技有限公司 | A kind of chip generation method and chip |
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| JP2882126B2 (en) * | 1991-10-14 | 1999-04-12 | 三菱電機株式会社 | Solder supply method |
| US5984166A (en) * | 1997-07-09 | 1999-11-16 | Mask Technology, Inc. | Process for creating fine and coarse pitch solder deposits on printed ciruit boards |
| CN100382266C (en) * | 2005-05-17 | 2008-04-16 | 华为技术有限公司 | Ball mounting method and apparatus for ball grid array packaging substrate |
| CN103303012B (en) * | 2013-05-08 | 2015-05-20 | 无锡江南计算技术研究所 | Resistance-capacitance and bare-chip coplanar printing method |
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