CN108906527A - A kind of glue fill method and glue curing method - Google Patents
A kind of glue fill method and glue curing method Download PDFInfo
- Publication number
- CN108906527A CN108906527A CN201810566009.7A CN201810566009A CN108906527A CN 108906527 A CN108906527 A CN 108906527A CN 201810566009 A CN201810566009 A CN 201810566009A CN 108906527 A CN108906527 A CN 108906527A
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- Prior art keywords
- glue
- component
- circuit board
- fill method
- temperature
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0218—Pretreatment, e.g. heating the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of glue fill method and glue curing methods, are related to technical field of semiconductors.Glue fill method includes point glue process and curing process, the area filling glue in glue process, between component and circuit board；In curing process, the component for filling glue and circuit board are preheated；By after preheating component and circuit board stand the first preset duration, standing process is maintained under the activation temperature of glue and carries out.Glue fill method and glue curing method can be such that glue is sufficient filling between component and circuit board, reduce the cavity inside glue, improve component and resist the ability of external impact and resist the ability of introduced contaminants.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of glue fill method and glue curing method.
Background technique
Glue filling is a very time-consuming process, although having there are a variety of glue fill process such as without flowing and wafer
Grade technique, but industry of traditional Capillary Flow glue fill process in today is still occupied an leading position.
One main problem of Capillary Flow glue fill process is the insufficient of glue filling, cavity occurs, especially
It is for lesser device and substrate gap and more solder joint device, empty problem is even more serious.The glue material of liquid
Flowing is non-uniform in the gap of device and substrate, in the region flowing velocity variation for having solder joint, while close to device
The flowing at edge is often faster than intermediate, and the in addition surface environment of the device and substrate variation such as presence of scaling powder and residue all may be used
To change the flowing velocity of glue.Flowing in glue just will appear bubble between region slow with flowing fastly, bubble is solid in glue
Just become cavity after change.The deformability that the presence in cavity makes device resist external impact is decreased obviously, the impaired failure of device
Risk it is larger；Existing glue fill method makes glue only be sealed in the surrounding of component simultaneously, and device is resisted extraneous sour
The ability of the impurity such as alkali, sweat, moisture is poor, is not able to satisfy current electronic product to the rigid requirement of " waterproof ".
Summary of the invention
The present invention provides a kind of glue fill method and glue curing method, and glue can be made between component and circuit board
Water is sufficient filling with, and reduces the cavity inside glue, improves ability and waterproof ability that component resists external impact.
The first technical solution provided by the invention：
A kind of glue fill method includes：
Point glue process：Area filling glue between component and circuit board；
Curing process, including：
Preheat glue：Component and the circuit board preheating of glue will be filled；
Stand glue：By the component and circuit board the first preset duration of standing after preheating, process is stood in the work of glue
Change and is carried out under temperature and preset pressure.
Further, the step of preheating glue includes the component and circuit board local environment pressure for promoting filling glue
Power to preset pressure, the standing glue carries out under the activation temperature and preset pressure of glue.
Further, after the standing glue, further include：
Solidified glue：Heat the solidification temperature of the component after standing and circuit board to glue.
Further, after the solidified glue, further include：
Resolidification glue：Component and circuit board are kept into third preset duration under solidification temperature.
Further, the solidified glue and the resolidification glue carry out under preset pressure.
Further, before described glue process, further include：
Prebake conditions process：Component and circuit board are placed in curing environment and carry out prebake conditions.
Further, the prebake conditions process includes：
Component and circuit board are heated to preset temperature；
Component and circuit board are kept into the second preset duration under preset temperature.
Further, the prebake conditions process carries out in an inert atmosphere.
Further, the range of the preset pressure is：6.0Kgf/cm2~7.5Kgf/cm2。
Second of technical solution provided by the invention：
A kind of glue curing method includes：
Preheat glue：Component and the circuit board preheating of glue will be filled；
Stand glue：By after preheating component and circuit board stand the first preset duration, standing process is maintained at glue
Activation temperature and preset pressure under carry out；
Solidified glue：Heat the solidification temperature of the component after standing and circuit board to glue；
Resolidification glue：Component and circuit board are kept into third preset duration under solidification temperature.
The beneficial effect of glue fill method provided by the invention and glue curing method is：
By increasing the step of standing glue in glue fill method and glue curing method, by the component after preheating
The first preset duration is stood with circuit board, and stands process and is carried out under the activation temperature and preset pressure of glue, glue can be made
The capillary percolation phenomenon of water sufficiently carries out, and glue is made to adequately fill up the region between component and circuit board, reduces cavity, improves
The leakproofness of glue reduces the risk of the impaired failure of component to improve the ability that component is resisted external impact and deformed；
The ability that component resists the impurity such as extraneous soda acid, sweat, moisture is improved, component and circuit board is made to be not easy impaired failure.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the flow diagram for the glue fill method that one embodiment of the invention provides.
Fig. 2 is the flow diagram of curing process provided in an embodiment of the present invention.
Fig. 3 be another embodiment of the present invention provides glue fill method flow diagram.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
Traditional glue filling is that glue is coated in encapsulation component edge on a machine, and glue is again in air environment
The gap between substrate and device is flowed and is filled by capillary osmosis down, last glue is in traditional air-heating furnace
Middle solidification.Conventional method major defect is the glue of component because flowing in air, and glue material is easy to appear cavity.For
This, the embodiment of the present invention gives a kind of glue fill method and glue curing method without cavity, specific as follows:
A kind of glue fill method, for the gap filling glue between circuit board and encapsulation component on circuit boards
Water in the present embodiment, by taking component is chip as an example, but equally can be used for other devices for needing glue fill process.
After glue fill method provided in this embodiment mainly applies to component package on circuit boards, when turnover stops
Between be less than the situation of the first stay time, the first stay time is preferably 12 hours.Referring to Fig. 1, glue fill method packet
It includes：
S1：Point glue process
Specifically, point glue process includes the area filling glue between component and circuit board.It, can be in the present embodiment
Using dispenser along the edge-coating glue of component, it is preferable that glue can be coated with one week around component, in order to
Glue is inwardly filled along multiple directions, certainly also only in the side of component or two sides glue coating, so as to improve dispensing work
The glue application efficiency of sequence, the point glue process in the present embodiment can carry out at normal temperature, but be not limited thereto.
S2：Curing process
Referring to Fig. 2, glue curing process specifically included for five stages in the present embodiment：
S21：Preheat glue
In this step, the component for filling glue and circuit board are preheated, specifically, are preheated to activation temperature,.It is different
The glue of type, activation temperature is different, and generally, activation temperature is between 55 DEG C~60 DEG C, and under normal circumstances, warm-up phase is held
Continuous duration is chosen as 6min, is not limited thereto certainly, and those skilled in the art can also be according to physical condition contracting appropriate
Duration that is short or extending this preheating glue.
In additional embodiment of the invention, preheat glue the step of further include the steps that pressurization, that is, promoted filling glue
Component and circuit board local environment pressure to preset pressure, that is to say, that in additional embodiment of the invention, preheat rank
Section includes being heated and pressurizeed two processes, and generally, 6.0Kgf/cm may be selected in preset pressure2~7.5Kgf/cm2, may be, for example,
6.0Kgf/cm2Or 7.5Kgf/cm2, it is not limited thereto certainly, those skilled in the art also can choose other preset pressure
Value.
Specifically, glue is before reaching activation temperature, and as the temperature rises, the increased activity of glue reaches activation
When temperature, the activity of glue reaches maximum, and the mobility of glue is most fast at this time, continues to rise with glue temperature later, glue
Qualitative change will occur for water, successively be changed into melten glass state by liquid, finally be changed into solid-state, the mobility of glue can be with qualitative change
And gradually weaken.Glue is heated to the strongest active temperature of activity by the step of the present embodiment is by preheating glue, while preferably
The environmental pressure for filling glue can also be increased to preset pressure by ground.
In the present embodiment, the preheating of glue carries out in an oven.The oven for example can be an independent reflow ovens or
Oven with three to seven heating zones and a mobile band.For being not easy to cause the small component package of bubble, using simple
Conventional oven and reflow ovens.
S22：Stand glue
By the component and circuit board the first preset duration of standing after the preheating of S21 step, process is stood in glue
It is carried out under activation temperature；Under the activation temperature of glue, the activity of glue is maximum, and the mobility of glue is most strong.
Preferably, in other embodiment of the present invention, standing process also carries out under preset pressure simultaneously, that is,
It says, by the component and circuit board the first preset duration of standing after the preheating of S21 step, stands process in the activation temperature of glue
It is carried out under degree and preset pressure.
At this time due to the presence of preset pressure, the power that " capillary " process occurs for glue is further enhanced.In activation temperature
Under degree, glue is in liquid, and the activity and mobility ability of glue are preferable.Under a constant pressure state, further mention
The power of " capillary " phenomenon occurs for high glue, keeps area filling of the glue between component and circuit board more abundant,
Improve the filling effect of glue.
Specifically, the range of the first preset duration is chosen as：5min~15min, certainly not with this danger, this field skill
Art personnel can as the case may be it is appropriate extension or shortening resting step the first preset duration, can guarantee that glue exists
Area filling between component and circuit board is abundant, at the same can also glue filling efficiency.Generally, it is filled in process time
In the case where foot, standing stage lasting duration can be as close possible to 15min or longer, to can more make full use of glue
Capillary phenomenon, keep glue filling abundant.
S23：Solidified glue
Further, by after the glue that above-mentioned standing step is completed is sufficient filling with component and circuit board it is further
Heating after temperature is higher than the activation temperature of glue, continues to rise such as above-mentioned talk about with glue temperature, and glue will
Qualitative change occurs, is gradually changed into melten glass state by liquid, with increasing again for temperature, glue will be last by melten glass state
It is changed into solid-state, therefore, in this step, using the above-mentioned property of glue, continues to carry out glue the solidification for being heated to glue
Temperature.Specifically, the solidification temperature of glue is selected as 120 DEG C~140 DEG C, specifically, such as be chosen as 120 DEG C, 130 DEG C or
140℃。
Further, in this step, cure stage remains at constant pressure (being chosen as preset pressure) progress,
Last glue further is carried out using the gradually decreased mobility of glue to fill, and further promotes the effect of filling.This step
In, the duration of solidified glue is chosen as 12min, is not limited thereto certainly, and those skilled in the art can also be according to practical item
Part shortening appropriate or the duration for extending this solidified glue.
S24：Resolidification glue
By after above-mentioned S23 solidified glue step component and circuit board protected under solidification temperature and preset pressure
Hold third preset duration.The resolidification stage of this step is maintained under constant pressure and stationary temperature and carries out, specifically, should
Constant pressure can be the preset pressure in above-mentioned steps S23, which is the glue that above-mentioned steps S23 is finally reached
Solidification temperature, such as between 120 DEG C~140 DEG C.Third preset duration is chosen as 12min, is not limited thereto certainly, ability
Field technique personnel can also be according to the physical condition duration appropriate for shortening or extending this resolidification glue.
Resolidification glue process by this step, can be such that glue sufficiently solidifies, sufficiently sealed component and circuit board
Between region, so that the impurity such as extraneous soda acid, sweat, moisture is cannot be introduced into the inside of component.
S25：Cooling glue
Specifically, oven is stopped heating, simultaneously circulation-supplied cooling water takes away the heat in furnace chamber, makes the temperature in furnace chamber
Drop to default low temperature.The pressure (being chosen as preset pressure) that cooling stage is kept constant, specifically, in order to improve the effect of work
Glue is cooled to from solidification temperature pre- not being cooled to room temperature the temperature of glue from solidification temperature by rate, this step
If low temperature, default low temperature for example may be selected to be 60 DEG C~65 DEG C, further, such as be chosen as 60 DEG C or 65 DEG C, certain ability
Field technique personnel can choose other temperature as default low temperature.The lasting duration of cooling stage is chosen as 10min, certainly also simultaneously
It is not limited, those skilled in the art can shorten or extend this cooling duration according to physical condition is appropriate.
In other embodiments, during the entire process of curing process, positive pressure ring can also be substituted using subnormal ambient
Border, that is to say, that preset pressure is replaced using a negative pressure value, negative pressure value can choose in -7.5Kgf/cm2~-6.0Kgf/
cm2In any value.
In curing process, glue processing step is stood by increasing, makes glue in constant pressure and stationary temperature
Lower first preset duration that stands guarantees that the capillary percolation phenomenon of glue carries out sufficiently, and then fills out component bottom glue sufficiently
It fills, component and circuit board are not easy impaired failure.In addition, carrying out cure stage and resolidification stage to glue, make glue curing
Sufficiently, internal there is no bubbles, can further increase the ability that component resists external force.
For component package on circuit boards after, the turnover residence time is when being more than the situation of the first stay time, first
Stay time is preferably 12 hours, and another embodiment of the present invention can be used, referring to Fig. 3, specifically, before glue process,
It can also carry out prebake conditions process：
S01：Prebake conditions process
Specifically, component and circuit board are placed in curing environment and carry out prebake conditions, toasted shown in the present embodiment
It is primarily referred to as：Component and circuit board are placed in the hot environment of sealing, such as in pressure oven, hot environment uses electric heating
The mode of silk heating is formed, and the hot environment of sealing is additionally provided with exhaust system, with substances such as the moisture, the scaling powders that will volatilize out
Discharge.Preferably, prebake conditions process can carry out in an inert atmosphere.
The condition of prebake conditions is as shown in the table：
Table：The condition of prebake conditions
| SEG | Temperature rise period | The constant temperature stage |
| Temperature | Room temperature → preset temperature | Preset temperature |
| Pressure | Normal pressure | Normal pressure |
| Time | 30min | 30min |
Specifically, in the temperature rise period, heat component and circuit board to preset temperature, preset temperature may be selected 120 DEG C~
140 DEG C, specifically, such as 120 DEG C, 130 DEG C or 140 DEG C are chosen as, temperature rise period lasting duration is chosen as 30min, keeps
It is carried out under atmospheric pressure environment.
In the constant temperature stage, component and circuit board are kept into the second preset duration, the second preset duration under preset temperature
It is chosen as 30min, while the constant temperature stage is maintained under atmospheric pressure environment and carries out.
By carrying out prebake conditions to component and circuit board, can between printed circuit board and component moisture and
Part scaling powder volatilizees away, makes the subsequent point adhesive curing stage, the capillary percolation phenomenon of glue carry out it is abundant, glue filling
More sufficiently, specific reason is as follows：
If the region residual moisture between component and circuit board, glue is in subsequent cure stage, the glue of liquid
There is totally-enclosed property in all directions, cause the remaining vapor in the region between component and circuit board can not by glue encirclement
Release, to cause the capillary percolation phenomenon Arrested Development of glue.Part scaling powder volatilize away so that circuit board and glue it
Between isolation area accordingly reduce, to keep the filling of glue on circuit boards more abundant.In such manner, it is possible to be conducive to make glue
Leakproofness is preferable, and glue filling in component bottom is sufficient, and the ability that component is resisted external impact and deformed is stronger, and component supports
The ability of the impurity such as anti-external world's soda acid, sweat, moisture is stronger.
The beneficial effect of glue fill method provided in this embodiment：
1. prebake conditions process has been carried out before glue process, it can be the moisture between printed circuit board and component
And part scaling powder volatilizees away, makes the subsequent point adhesive curing stage, the capillary percolation phenomenon of glue occurs sufficiently, and glue is in electricity
Filling on the plate of road is more abundant., the component resistance certain adaptability to changes of external impact is stronger, and component resists extraneous soda acid, sweat
The ability of the impurity such as liquid, moisture is stronger, and component is not easy impaired failure.
2. carrying out standing glue in curing process, glue is made to keep first under constant pressure and stationary temperature
Preset duration, in this way, it is further ensured that the capillary percolation phenomenon of glue occurs sufficiently, to make the filling of component bottom glue sufficiently,
Component and circuit board are not easy impaired failure.In addition, carrying out cure stage to glue and in cure stage, filling glue curing
Point, internal there is no bubbles, can further increase the ability that component resists external force.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of glue fill method, which is characterized in that the glue fill method includes：
Point glue process：Area filling glue between component and circuit board；
Curing process, including：
Preheat glue：Component and the circuit board preheating of glue will be filled；
Stand glue：By the component and circuit board the first preset duration of standing after preheating, process is stood in the activation temperature of glue
Degree is lower to carry out.
2. glue fill method according to claim 1, which is characterized in that the step of preheating glue further includes being promoted
The component and circuit board local environment pressure for filling glue to preset pressure, it is described stand glue in the activation temperature of glue and
It is carried out under preset pressure.
3. glue fill method according to claim 2, which is characterized in that after the standing glue, further include：
Solidified glue：Heat the solidification temperature of the component after standing and circuit board to glue.
4. glue fill method according to claim 3, which is characterized in that after the solidified glue, further include：
Resolidification glue：Component and circuit board are kept into third preset duration under solidification temperature.
5. glue fill method according to claim 4, which is characterized in that the solidified glue and the resolidification glue
Carried out under preset pressure.
6. glue fill method according to claim 2, which is characterized in that before described glue process, further include：
Prebake conditions process：Component and circuit board are placed in curing environment and carry out prebake conditions.
7. glue fill method according to claim 6, which is characterized in that the prebake conditions process includes：
Component and circuit board are heated to preset temperature；
Component and circuit board are kept into the second preset duration under preset temperature.
8. glue fill method according to claim 6, which is characterized in that the prebake conditions process is in inert gas environment
Lower progress.
9. glue fill method according to claim 1, which is characterized in that the range of the preset pressure is：6.0Kgf/
cm2~7.5Kgf/cm2。
10. a kind of glue curing method, which is characterized in that the glue curing method includes：
Preheat glue：Component and the circuit board preheating of glue will be filled；
Stand glue：By after preheating component and circuit board stand the first preset duration, standing process is maintained at the work of glue
Change and is carried out under temperature and preset pressure；
Solidified glue：Heat the solidification temperature of the component after standing and circuit board to glue；
Resolidification glue：Component and circuit board are kept into third preset duration under solidification temperature.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810566009.7A CN108906527A (en) | 2018-06-04 | 2018-06-04 | A kind of glue fill method and glue curing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810566009.7A CN108906527A (en) | 2018-06-04 | 2018-06-04 | A kind of glue fill method and glue curing method |
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| Publication Number | Publication Date |
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| CN108906527A true CN108906527A (en) | 2018-11-30 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111167681A (en) * | 2020-03-11 | 2020-05-19 | 柳州致盛汽车电子有限公司 | Curing method of heat-conducting glue |
| CN113194628A (en) * | 2021-05-19 | 2021-07-30 | 景旺电子科技(龙川)有限公司 | Dispensing process, circuit board main production process and circuit board processed by same |
| CN114916152A (en) * | 2022-04-21 | 2022-08-16 | 昆山丘钛微电子科技股份有限公司 | Method for sealing bracket by camera module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103109361B (en) * | 2011-04-06 | 2016-04-13 | 北京大学深圳研究生院 | Primer fill method in a kind of semiconductor packages and equipment |
-
2018
- 2018-06-04 CN CN201810566009.7A patent/CN108906527A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103109361B (en) * | 2011-04-06 | 2016-04-13 | 北京大学深圳研究生院 | Primer fill method in a kind of semiconductor packages and equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111167681A (en) * | 2020-03-11 | 2020-05-19 | 柳州致盛汽车电子有限公司 | Curing method of heat-conducting glue |
| CN113194628A (en) * | 2021-05-19 | 2021-07-30 | 景旺电子科技(龙川)有限公司 | Dispensing process, circuit board main production process and circuit board processed by same |
| CN114916152A (en) * | 2022-04-21 | 2022-08-16 | 昆山丘钛微电子科技股份有限公司 | Method for sealing bracket by camera module |
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Application publication date: 20181130 |