CN102528199B - Welding method for sealed package of electronic components - Google Patents
Welding method for sealed package of electronic components Download PDFInfo
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- CN102528199B CN102528199B CN201110413143.1A CN201110413143A CN102528199B CN 102528199 B CN102528199 B CN 102528199B CN 201110413143 A CN201110413143 A CN 201110413143A CN 102528199 B CN102528199 B CN 102528199B
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- cover plate
- sealed package
- base
- encapsulation cover
- solder
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Abstract
The invention discloses a welding method for sealed package of electronic components. The method comprises making a welding material sheet according to shape of a sealed package cover plate part in contact with a base; fixing the sealed package cover plate and the welding material sheet to the base, putting into a sintering furnace to heat until the welding material is molten, and cooling after the welding material is fully molten. The method of the invention accomplishes the sealed package of small components quite well. The sintering furnace is employed so that the method has the outstanding characteristics in that the accuracy of the temperature control is high; the welding material melting level is controllable; the temperature curve can be determined by programs; components profiles are not damaged; the sealing performance is excellent, etc. In particular, the method is suitable for sealed welding of metal or ceramic sealed package components with small dimensions and high quality levels.
Description
Technical field
The present invention relates to electronic devices and components encapsulation technology field, particularly relate to a kind of welding method of sealed package of electronic components.
Background technology
Along with development and the renewal of the various electronics system of China, the performance of electronic control system itself, reliability and its volume and weight also have important impact to the Performance And Reliability of armament systems.Therefore, electronic control system also proposes more and more higher requirement to the miniaturization of electronic devices and components and high reliability, in the past metallic packaging electronic devices and components because of volume and weight large, can not adapt to development and the demand of electronic control system, the volume and weight of electronic devices and components is more and more to miniaturization.
Because chip must be isolated from the outside to prevent the impurity in air from causing electric property to decline to the corrosion of chip circuit, so encapsulation must have good sealing property, the performance that the quality of encapsulation technology also directly has influence on chip self performance and the Design and manufacture of PCB be attached thereto, therefore it is vital.But miniaturized electronic devices and components are very little due to overall dimension, parallel seam welding mode conventional at present cannot be adopted to carry out hermetically sealed.
Summary of the invention
Technical problem to be solved by this invention be overcome existing parallel seam welding method cannot the defect of hermetically sealed miniature electric components and parts, a kind of welding method of sealed package of electronic components is provided, does not destroy part its own shape, good airproof performance.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
The welding method of sealed package of electronic components of the present invention, solder sheet is made by the shape of encapsulation cover plate and base contacts part, solder sheet is fixed between encapsulation cover plate and base, be placed in sintering furnace to heat, and be filled with nitrogen, when cooling again after solder fusing, after cooling encapsulation cover plate and base bond together formed hermetically sealed.
Preferably, in above-mentioned welding method, solder sheet being fixed between encapsulation cover plate and base is solder sheet adopted the mode of spot welding to be first fixed on encapsulation cover plate, then encapsulation cover plate and the superimposed rear clip of base is fixed.
Further, in previous solder methods, when encapsulation cover plate be ceramic material prepare time, solder sheet preferably adopts the golden soldering tablet of 80%Au20%Sn.
Aforementioned encapsulation is SOT-23C ceramic packaging, and solder sheet is the golden tin annular welds tablet of 80%Au20%Sn.
In previous solder methods; solder sheet is fixed on after being placed in sintering furnace between encapsulation cover plate and base; first be heated to 340 ~ 360 DEG C; constant temperature 3 ~ 5min; sintering furnace vacuumizes and fills protection gas during this period, continues to be warming up to solder melting temperature, makes solder fully melt at this temperature; cooling.Described protection gas can select nitrogen.
Compared with prior art, solder sheet is placed between encapsulation cover plate and base and then adopts the mode of sintering furnace to make solder fusing by the present invention, can well realize the hermetically sealed of Miniature component, owing to adopting sintering furnace, the present invention used has that temperature-controlled precision is high, solder fusing degree is controlled, temperature curve can program setting, do not destroy the distinguishing features such as part its own shape, good airproof performance, be particularly suitable for the seal welding of overall dimension is little and quality level is higher metal or ceramic package device.
Accompanying drawing explanation
Fig. 1 is the outline dimensional drawing of SOT-23C ceramic packaging product;
Fig. 2 is SOT-23C ceramic packaging product cover plate figure.
Embodiment
The present invention is described for SOT-23C ceramic packaging product.
The overall dimension of SOT-23C ceramic packaging product as shown in figure 1 and table 1, due to overall dimension little (3mm × 2.7mm), cannot adopt parallel seam welding mode to carry out seal welding, adopt and carry out seal welding with the following method:
1, composition is selected to be the sealing ring of golden tin annular welds tablet as SOT-23C ceramic packaging product of 80%Au20%Sn, as shown in Figure 2, adopted by annular welds tablet 1 mode of spot welding (solder joint is 2) to be fixed on the cover plate 3 of SOT-23C ceramic packaging product, then cover plate 3 and base being superimposed together and adopting molybdenum clip to clamp whole SOT-23C product is fixed on special support fixture.
2, support fixture is emitted in sintering furnace, first be warming up to 340 ~ 360 DEG C in advance, by product preheating, constant temperature 3 ~ 5min at this temperature, constantly vacuumize during constant temperature and the high pure nitrogen that fills 99.999% as protection, remove product surface moisture with the pernicious gas such as steam and oxygen got rid of in sintering furnace; Then continue to be warming up to solder melting temperature, and remain on fusion temperature and allow product fully melt, and then product is cooled, make solder solidification, can be formed hermetically sealed.
3, cooled product is carried out performance test, result shows, after using the method to seal, carrying out helium mass spectrum leak detection, leak rate can meet the instructions for use of GB completely, and leak rate is 0.5 × 10
-3pam
3/ s-1 × 10
-3pam
3/ s(standard is for being less than 5 × 10
-3pam
3/ s).
Table 1 product size (unit: mm)
。
Claims (2)
1. the welding method of a sealed package of electronic components, it is characterized in that: make solder sheet by the shape of encapsulation cover plate and base contacts part, solder sheet is fixed between encapsulation cover plate and base, be placed in sintering furnace and be heated to 340 ~ 360 DEG C, constant temperature 3 ~ 5min, sintering furnace vacuumizes during this period, and be filled with nitrogen, continue to be warming up to solder melting temperature, when cooling again after solder fusing, after cooling encapsulation cover plate and base bond together formed hermetically sealed, wherein saidly be encapsulated as SOT-23C ceramic packaging, solder sheet is the golden tin annular welds tablet of 80%Au20%Sn.
2. according to the welding method of sealed package of electronic components described in claim 1, it is characterized in that: described solder sheet being fixed between encapsulation cover plate and base solder sheet is adopted the mode of spot welding to be first fixed on encapsulation cover plate, then encapsulation cover plate and the superimposed rear clip of base are fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413143.1A CN102528199B (en) | 2011-12-10 | 2011-12-10 | Welding method for sealed package of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413143.1A CN102528199B (en) | 2011-12-10 | 2011-12-10 | Welding method for sealed package of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102528199A CN102528199A (en) | 2012-07-04 |
| CN102528199B true CN102528199B (en) | 2015-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110413143.1A Active CN102528199B (en) | 2011-12-10 | 2011-12-10 | Welding method for sealed package of electronic components |
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| CN (1) | CN102528199B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106736019A (en) * | 2016-12-13 | 2017-05-31 | 中国电子科技集团公司第四十七研究所 | A kind of method for improving Electronic Packaging housing depth |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056500B (en) * | 2012-11-30 | 2015-09-02 | 北京时代民芯科技有限公司 | The welding method of semiconductive ceramic case cap |
| CN105609904A (en) * | 2015-12-29 | 2016-05-25 | 中国电子科技集团公司第二十六研究所 | Hermetic package for chip-scale acoustic surface wave device and hermetic package method |
| CN105643037A (en) * | 2016-03-22 | 2016-06-08 | 东莞洲亮通讯科技有限公司 | Welding process used for passive device |
| CN107378166B (en) * | 2017-07-28 | 2019-12-10 | 中国振华集团永光电子有限公司（国营第八七三厂） | Fusion sealing process for reducing fusion sealing holes of electronic element cover plate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19730118B4 (en) * | 1997-07-14 | 2006-01-12 | Infineon Technologies Ag | Method and device for producing a chip-substrate connection |
| US6552264B2 (en) * | 1998-03-11 | 2003-04-22 | International Business Machines Corporation | High performance chip packaging and method |
| CN1127138C (en) * | 2000-09-15 | 2003-11-05 | 北京大学 | Low-temp MEMS vacuum sealing technique for metals |
| CN101293294B (en) * | 2008-05-30 | 2010-08-11 | 北京科技大学 | Sealing-in method for packaging outer shell with aluminum silicon carbide |
| CN102009240A (en) * | 2010-10-20 | 2011-04-13 | 北京科技大学 | Method for connecting AlN (aluminum nitride) ceramics and SiC/Al composite material respectively plated with thin-film metal layer on surface |
| CN102009241A (en) * | 2010-12-24 | 2011-04-13 | 贵州永红航空机械有限责任公司 | Vacuum brazing process of high-strength aluminum alloy plate fin radiator |
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2011
- 2011-12-10 CN CN201110413143.1A patent/CN102528199B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106736019A (en) * | 2016-12-13 | 2017-05-31 | 中国电子科技集团公司第四十七研究所 | A kind of method for improving Electronic Packaging housing depth |
| CN106736019B (en) * | 2016-12-13 | 2019-09-27 | 中国电子科技集团公司第四十七研究所 | A method of improving Electronic Packaging housing depth |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102528199A (en) | 2012-07-04 |
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