CN1127138C - Low-temp MEMS vacuum sealing technique for metals - Google Patents
Low-temp MEMS vacuum sealing technique for metals Download PDFInfo
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- CN1127138C CN1127138C CN 00124752 CN00124752A CN1127138C CN 1127138 C CN1127138 C CN 1127138C CN 00124752 CN00124752 CN 00124752 CN 00124752 A CN00124752 A CN 00124752A CN 1127138 C CN1127138 C CN 1127138C
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Abstract
The present invention relates to a design and a corresponding packaging technology for a vacuum package casing of micro electromechanical system (micro-Electronic-mechanicsystem is called MEMS for short) for low-temperature vacuum sealing weld, which combines the technical characteristics of microelectronic technology and vacuum electronic technology; the metal casings used by the traditional hybrid integrated circuits are partially improved, an MEMS vacuum packaging pipe casing with low cost is developed, and the low temperature brazing technology and the getter activate technical processes are correspondingly reformed; thereby, the convenient and practical MEMS vacuum packaging is realized; the present invention can be widely applied to the packaging of MEMS, such as micro gyroscopes.
Description
Affiliated field
The present invention relates to be used for MEMS (micro electro mechanical system) (Micro-Electronic-MechanicSystem is hereinafter to be referred as the MEMS) sealed in unit and the corresponding method for packing of cryogenic vacuum soldering and sealing.
Background technology
Vacuum Package is the key factor of some MEMS product technology performance of decision and cost price, thereby is the major issue in MEMS field.It requires the MEMS gauge outfit is carried out Vacuum Package, to guarantee that gauge outfit is in 10 for a long time
-2Steady operation in the high vacuum environment below the handkerchief, and guarantee that gauge outfit has the good signal of telecommunication to be connected with extraneous.The similar technology that addresses this problem at present mainly contains:
1. in sheet low pressure encapsulation technology: this technology is on the vacuum equipment in special use, to carry out bonding by the exocoel to glass-silicon-glass or silicon-silicon-three-deckers such as silicon, to reach the purpose that makes gauge outfit be in vacuum condition; The subject matter that it exists is the connection transmission of the signal of telecommunication, because after having made metal electrode on the silicon face, the quality of bonding and leak rate are difficult to control.
2. parallel soldering and sealing of metal or stored energy welding technology: this technology is to realize seal welding by bestowing the big electric current of high frequency between metal base that retrofit is handled and cover plate, and this obtains a large amount of application at microelectronics such as hybrid integrated circuits; But leak rate seal request higher, that do not reach condition of high vacuum degree is to limit the subject matter that it is applied in the Vacuum Package field.
3. low-temperature metal soldering encapsulation technology: this technology is to carry out sealing-in with epoxy resin or low-temperature metal scolder between metal base and pipe cap or cover plate, and this is used widely in the electric vacuum technology field.Its main technique comprises, in normal atmosphere, end face is fixed and sealed with epoxy resin or low-temperature metal scolder, be pumped to vacuum and clamp folder dead through soft metal tube with specific purpose tool, wherein in order to keep the high vacuum performance of cavity, need built-in getter for low temperature, and the activation of carrying out more than 400 ℃ is handled.This subject matter of bringing has gauge outfit need bear temperature shock more than 400 ℃, therefore may influence the machinery or the electrical property of device; Base complex structure, processing cost height; Need carry out multiple tracks processes such as getter activation, melt solder, sealing-in respectively, thereby complex process etc.
And these problems that do not solve in the above-mentioned technology have all restricted the commercialization and the application of Vacuum Package MEMS related device.
Goal of the invention
The present invention widely collects the technology speciality of microelectric technique and vacuum electronic technology, the Can used to the conventional hybrid integrated circuit carried out local improvement, thereby develop MEMS Vacuum Package shell cheaply, and correspondingly reformed low temperature brazing technology and getter activation technology flow process, thereby realized simple and practical MEMS Vacuum Package.The technical scheme of invention
The present invention mainly comprises the design of MEMS Vacuum Package shell and sealed in unit and the content of corresponding two parts of low temperature process for sealing.
1.MEMS Vacuum Package shell:
(1) base adopts the metal-packaged shell of conventional hybrid integrated circuit, and external form is rectangle or circle.(see accompanying drawing 1-1a, Fig. 1-1b, Fig. 1-1c, Fig. 1-1d)
(2) pipe cap adopts metal material of the same race.Simultaneously the structure of pipe cap is improved, designed structure with arrangement getter for low temperature and the seal groove that holds solder.(seeing accompanying drawing 1-2)
2. at the Vacuum Package shell after improving, be used for corresponding the becoming of MEMS vacuum and low temperature method for packing of cryogenic vacuum soldering and sealing:
(1) processing step:
Step 1: the MEMS gauge outfit of at first in base, having good positioning and carry out bonding, the good electric connecting wire of bonding (seeing accompanying drawing 2-1a) simultaneously, and in pipe cap, place getter for low temperature (seeing accompanying drawing 2-1b);
Step 2: in the seal groove of pipe cap, insert solder; (seeing accompanying drawing 2-2)
Step 3: base and pipe cap are placed on separately the locating rack (seeing accompanying drawing 2-3), and move into and have in the vacuum chamber of vacuum acquiring system;
Step 4: start vacuum acquiring system, make the vacuum degree in the vacuum chamber reach 10
-3More than the handkerchief;
Step 5: by getter for low temperature about specification requirement (being generally 400 ℃-450 ℃) the heating pipe cap number that activates minute, so that activated degasser;
Step 6: in vacuum degree 10
-3Handkerchief is above, 150 ℃-180 ℃ insulation a few hours, so that make pipe cap, base and the thorough degasification of other part, melts the low-temperature metal scolder simultaneously;
Step 7: the base end face is imported the pipe cap seal groove; (seeing accompanying drawing 2-4)
Step 8: progressively cooling under vacuum state, all packaging technology is finished.
(2) feature of processing step: among the present invention because MEMS Vacuum Package shell has been carried out design again, therefore in above-mentioned steps 5, the activation of getter and the localized heating of solder fusion are carried out simultaneously, and in step 6, realized insulation simultaneously.Beneficial effect
The present invention combines low temperature sealing by fusing technology and hybrid integrated circuit metallic packaging technology dexterously,
Not only technical maturity, and flow process is simple, greatly reduces production cost.Adopt the technology of the present invention to carry out MEMS product reliability height, the function admirable of Vacuum Package, can realize the batch process of MEMS Vacuum Package.
The Figure of description explanation:
Fig. 1 a rectangular configuration base external form schematic diagram
Fig. 1 b rectangular configuration pipe cap external form schematic diagram
Fig. 1 c circular configuration base external form schematic diagram
The 1-base
Fig. 1 d circular configuration pipe cap external form schematic diagram
The 2-pipe cap
Fig. 2 packaging technology schematic flow sheet
The 3-MEMS gauge outfit
The 4-getter
The 5-scolder
The locating rack of 6-band heater
Claims (3)
1. all-metal low temperature MEMS (micro electro mechanical system) Vacuum Package shell, base adopts the metal-packaged shell of hybrid integrated circuit, carries out sealing-in with the low-temperature metal scolder between base and pipe cap, and it is characterized in that: the base external form is rectangle or circle; Pipe cap adopts metal material of the same race, is provided with structure of settling getter for low temperature and the seal groove that holds solder.
2. all-metal low temperature MEMS (micro electro mechanical system) vacuum packaging method, between metal base and pipe cap, carry out sealing-in with the low-temperature metal scolder, comprise getter activation, melt solder, sealing-in process, keep the high vacuum performance of cavity by built-in getter for low temperature, under high vacuum state, end face is fixed and is sealed, it is characterized in that with the low-temperature metal scolder:
Step 1: the MEMS (micro electro mechanical system) gauge outfit of at first having good positioning in base and carry out bondingly, simultaneously bonding is good
Connect lead-in wire, and in pipe cap, place getter for low temperature;
Step 2: in the seal groove of pipe cap, insert solder;
Step 3: base and pipe cap are placed on separately the locating rack, and move into and have in the vacuum chamber of vacuum acquiring system;
Step 4: start vacuum acquiring system, make the vacuum degree in the vacuum chamber reach 10
-3More than the handkerchief;
Step 5: press temperature requirement heating pipe cap number that getter for low temperature activates minute, promptly at 400 ℃-450 ℃ heating pipe caps, so that activated degasser;
Step 6: keep 10 in vacuum degree
-3Handkerchief is above, 150 ℃-180 ℃ insulation a few hours, so that make pipe cap, base and the thorough degasification of other part, melts the low-temperature metal scolder simultaneously;
Step 7: the base end face is imported the pipe cap seal groove;
Step 8: progressively cooling under vacuum state, all encapsulation process is finished.
3. all-metal low temperature MEMS (micro electro mechanical system) vacuum packaging method according to claim 2 is characterized in that: carry out the localized heating of the activation and the solder fusion of getter simultaneously, and carry out insulation simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00124752 CN1127138C (en) | 2000-09-15 | 2000-09-15 | Low-temp MEMS vacuum sealing technique for metals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00124752 CN1127138C (en) | 2000-09-15 | 2000-09-15 | Low-temp MEMS vacuum sealing technique for metals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1289659A CN1289659A (en) | 2001-04-04 |
| CN1127138C true CN1127138C (en) | 2003-11-05 |
Family
ID=4590636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00124752 Expired - Fee Related CN1127138C (en) | 2000-09-15 | 2000-09-15 | Low-temp MEMS vacuum sealing technique for metals |
Country Status (1)
| Country | Link |
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| CN (1) | CN1127138C (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533188B (en) * | 2001-07-20 | 2003-05-21 | Getters Spa | Support for microelectronic, microoptoelectronic or micromechanical devices |
| CN1305726C (en) * | 2003-11-11 | 2007-03-21 | 陈建国 | Telescopic car |
| CN1319139C (en) * | 2004-12-01 | 2007-05-30 | 中国电子科技集团公司第二十四研究所 | Production of local vacuum sealing protective structure of silicon based sensor flexible piece |
| CN100337788C (en) * | 2005-05-25 | 2007-09-19 | 马军 | Processing technique of tenon and mortise joint and braze welding for case body packaged by metal |
| US7348193B2 (en) * | 2005-06-30 | 2008-03-25 | Corning Incorporated | Hermetic seals for micro-electromechanical system devices |
| CN100491232C (en) * | 2007-05-15 | 2009-05-27 | 东南大学 | Micro electromechanical packaging structure for wind direction sensor |
| CN102528199B (en) * | 2011-12-10 | 2015-02-25 | 中国振华集团永光电子有限公司 | Welding method for sealed package of electronic components |
| US9061887B2 (en) * | 2012-02-24 | 2015-06-23 | Spatial Photonics, Inc. | Moisture-resistant package |
| CN103759880B (en) * | 2014-01-27 | 2016-03-02 | 中国电子科技集团公司第四十九研究所 | A kind of SOI absolute pressure Sensitive Apparatus adopting leadless packaging structure |
| CN105643037A (en) * | 2016-03-22 | 2016-06-08 | 东莞洲亮通讯科技有限公司 | Welding process used for passive device |
| CN105731357B (en) * | 2016-04-29 | 2017-09-05 | 合肥芯福传感器技术有限公司 | Integrated attraction type ceramic package shell |
-
2000
- 2000-09-15 CN CN 00124752 patent/CN1127138C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1289659A (en) | 2001-04-04 |
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