CN102035495A - Base, quartz crystal resonator and processing techniques thereof - Google Patents
Base, quartz crystal resonator and processing techniques thereof Download PDFInfo
- Publication number
- CN102035495A CN102035495A CN2010105412531A CN201010541253A CN102035495A CN 102035495 A CN102035495 A CN 102035495A CN 2010105412531 A CN2010105412531 A CN 2010105412531A CN 201010541253 A CN201010541253 A CN 201010541253A CN 102035495 A CN102035495 A CN 102035495A
- Authority
- CN
- China
- Prior art keywords
- type
- electrode
- insulator
- reed
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a base, a quartz crystal resonator and processing techniques thereof, which belong to the technical field of resonator structure and processing technique. The base comprises a U-shaped first electrode a U-shaped second electrode which are in image design, a baseplate and insulators, wherein a space between the two electrodes and a space between the outer sides of the two electrodes and the baseplate are respectively filled with the insulators, and the insulators are exposed outside the quartz crystal resonator; the quartz crystal resonator comprises the base and a shell, wherein the bottom of the shell is packaged with the base by a convex rafter arranged on the upper surface of the baseplate, the upper parts of the two electrodes of the base are respectively connected with a first spring plate and a second spring plate, and the upper surfaces of the two spring plates are connected with crystal plates by conductive adhesives. The base, the quartz crystal resonator and the processing techniques in the invention have the advantages that the structural design is reasonable, and because the insulators are exposed, the phenomenon that the two electrodes of the quartz crystal resonator are short-circuited in the process of reflow soldering can be effectively prevented.
Description
Technical field
The present invention relates to a kind of pedestal, quartz-crystal resonator and processing technology, belong to resonator structure and technology field.
Background technology
The insulator of existing quartz-crystal resonator is embedded, the tin short circuit may take place in quartz-crystal resonator two electrodes when Reflow Soldering, and quartz-crystal resonator two electrodes and base plate, the easy short circuit of shell can take place, at present, surface attaching type SMD product adopts ceramic material as insulator, can only adopt parallel soldering and sealing form.
Summary of the invention
The objective of the invention is to solve the weak point that above-mentioned prior art exists, a kind of reasonable in design is provided, can effectively prevent the tin short circuit when Reflow Soldering of quartz-crystal resonator two electrodes, prevent pedestal, quartz-crystal resonator and the processing technology of quartz-crystal resonator two electrodes and base plate, shell short circuit.
The present invention is achieved by the following technical solutions:
Pedestal, its special character is to comprise U type first electrode 2 and U type second electrode 3, base plate 9 and the insulator of designed in mirror image, fill insulator respectively between U type first electrode 2 and U type second electrode 3 and between U type first electrode 2 and U type second electrode, 3 outsides and the base plate 9, insulator exposes to outside the quartz-crystal resonator;
Described base plate 9 is connected with 2 insulation of U type first electrode by first insulator 10, U type first electrode 2 is connected with 3 insulation of U type second electrode by second insulator 1, U type second electrode 3 is connected with base plate 9 insulation by the 3rd insulator 11, and first insulator 10, second insulator 1, the 3rd insulator 11 all expose to outside the quartz-crystal resonator;
Described U type first electrode 2 and U type second electrode 3 adopt kovar alloy to make, and U type first electrode 2 and U type second electrode 3 adopt caustic solution or straight forming method to form;
The upper surface of described base plate 9 is provided with protruding rafter 12, with shell 8 encapsulation that are applicable to quartz-crystal resonator.
The processing technology of said base, its special character are to comprise following two kinds of technological processes:
1, adopt glass material to add ceramic material straight forming insulator, in insulator, insert two L type electrodes then, bended respectively in two L type electrode tops again, beaten the back and formed U type first electrode 2 and U type second electrode 3, then at the both sides of insulator difference sintering base plate 9;
2, at first make metallic cavity, in cavity, put into the glass material that is used to make insulator then, in glass material, insert two L type electrodes then, bended respectively in two L type electrode tops again, beat the back and formed U type first electrode 2 and U type second electrode 3, sinter molding;
At the periphery of base plate 9 positions, U type first electrode 2 and U type second electrode 3 of metallic cavity both sides coating protective layer; corrosion then; insulator is exposed; form exposed first insulator 10, second insulator 1, the 3rd insulator 11; metallic cavity coating protective layer place is not corroded; form the base plate 9 of both sides, exposed insulator prevents the tin short circuit with partition respectively between the base plate 9 of both sides and U type first electrode 2 and U type second electrode 3.
Adopt the quartz-crystal resonator of said base, its special character is to comprise pedestal and shell 8, shell 8 bottoms are by set protruding rafter 12 of base plate 9 upper surfaces and pedestal encapsulation, U type first electrode 2 of pedestal and the top of U type second electrode 3 are connected the upper surface of first reed 4, second reed, 5, the first reeds 4, second reed 5 respectively by conducting resinl 6 connecting wafers 7.
The processing technology of above-mentioned quartz-crystal resonator, special character are to comprise following technological process:
1, at the upper surface of U type first electrode 2 of the pedestal of above-mentioned making and U type second electrode 3 spot welding first reed 4, second reed 5 respectively, above first reed 4, second reed 5, place wafer 7, at the both sides point glue of wafer 7, wafer 7 and first reed 4, second reed 5 are fixed then by conducting resinl 6;
2, adopt parallel soldering and sealing or electric resistance welding that shell 8 is press-sealed on the base plate 9.
Reasonable in design of the present invention, insulator exposes and can prevent effectively that quartz-crystal resonator two electrodes from the tin short circuit taking place when Reflow Soldering, and can prevent quartz-crystal resonator two electrodes and base plate, shell short circuit, electrode adopts kovar alloy to make, the press seal form still can adopt the electric resistance welding form, can adopt parallel soldering and sealing by changing base arrangement simultaneously, effectively raise sealing.
Description of drawings
Fig. 1: the structural representation of a kind of quartz-crystal resonator of the present invention;
Fig. 2: first reed 4, second reed, 5 structural representations;
Fig. 3: first reed 4, second reed, 5 processing method schematic diagrames.
Among the figure: 1, second insulator, 2, U type first electrode, 3, U type second electrode, 4, first reed, 5, second reed, 6, conducting resinl, 7, wafer, 8, shell, 9, base plate, 10, first insulator, the 11, the 3rd insulator, 12, protruding rafter.
Embodiment
Provide the specific embodiment of the invention below with reference to accompanying drawing, be used for that the present invention is described further.
The pedestal of present embodiment, U type first electrode 2 and U type second electrode 3 that comprise designed in mirror image, base plate 9 and insulator, fill insulator respectively between U type first electrode 2 and U type second electrode 3 and between U type first electrode 2 and U type second electrode, 3 outsides and the base plate 9, by insulator 10,1,11 mutually insulateds and with base plate 9 insulation, the upper surface of base plate 9 is provided with the protruding rafter 12 that is applicable to 8 encapsulation of quartz-crystal resonator shell, base plate 9 is connected with 2 insulation of U type first electrode by first insulator 10, U type first electrode 2 is connected with 3 insulation of U type second electrode by second insulator 1, U type second electrode 3 is connected first insulator 10 by the 3rd insulator 11 with base plate 9 insulation, second insulator 1, the 3rd insulator 11 exposes to outside the quartz-crystal resonator; U type first electrode 2, U type second electrode 3 adopt kovar alloy to make, and adopt the straight forming method to form.
The processing technology of pedestal comprises following technological process:
Adopt glass material to add ceramic material straight forming insulator, in insulator, insert two L type electrodes then, bended respectively in two L type electrode tops again, beaten the back and formed U type first electrode 2 and U type second electrode 3, then at the both sides of insulator difference sintering base plate 9;
Quartz-crystal resonator, see Fig. 1, comprise pedestal and shell 8, shell 8 bottoms are by set protruding rafter 12 of base plate 9 upper surfaces and pedestal encapsulation, U type first electrode 2 of pedestal and the top of U type second electrode 3 are connected the upper surface of first reed 4, second reed, 5, the first reeds 4, second reed 5 respectively by conducting resinl 6 connecting wafers 7.
Above-mentioned first reed 4, second reed 5 are seen Fig. 2, the reed that is provided with low table 21 that comprises a pair of symmetry, upper surface one side of low table 21 is the high platform 22 of projection, the upper surface of high platform 22 is the some glue face 23 of coarse processing, and low table 21 is provided with and is used for and the bottom lead-in wire spot welding point 24 of spot welding mutually.
Above-mentioned first reed 4, second reed, 5 processing methods are seen Fig. 3, may further comprise the steps:
1, a side of cuboid reed is carried out punching press, form projection on one side, recessed L type step on one side, the recessed side of L type step constitutes a following table, the convex side of L type step, does not promptly carry out punching press one side and constitutes a upper table surface, the i.e. high platform 22 of reed;
2, portion C-1 is overflowed in the outside of the L type step following table that above-mentioned punching press is formed, C-2, C-3 dismiss, and promptly form the low table 21 of reed.
The processing technology of quartz-crystal resonator comprises following technological process:
1, at the upper surface of U type first electrode 2 of the pedestal of above-mentioned making and U type second electrode 3 spot welding first reed 4, second reed 5 respectively, above first reed 4, second reed 5, place wafer 7, at the both sides point glue of wafer 7, wafer 7 and first reed 4, second reed 5 are fixed then by conducting resinl 6;
2, adopt parallel soldering and sealing or electric resistance welding that shell 8 is press-sealed on the base plate 9.
Be with the difference of embodiment 1:
U type first electrode 2, U type second electrode 3 adopt caustic solution to form.
The processing technology of pedestal comprises following technological process:
At first make metallic cavity, in cavity, put into the glass material that is used to make insulator then, in glass material, insert two L type electrodes then, bended respectively in two L type electrode tops again, beat the back and formed U type first electrode 2 and U type second electrode 3, sinter molding;
Then at the periphery of base plate 9 positions, U type first electrode 2 and U type second electrode 3 of metallic cavity both sides coating protective layer; corrosion then; insulator is exposed; form exposed first insulator 10, second insulator 1, the 3rd insulator 11; metallic cavity coating protective layer forms the base plate 9 of both sides; exposed insulator prevents the tin short circuit with cutting off respectively between base plate 9, U type first electrode 2 and U type second electrode 3 of both sides.
Because SMD quartz resonator product has two types at present, a kind of is metallic packaging, this product pedestal supply is almost monopolized by Japan, cause the high and supply instability of cost, another kind is the glue encapsulating products, though be mature technology, because glue needs high temperature (390 °) to melt, poor than metallic packaging on the quality reliability, and supply is also almost monopolized by Japan; This patented product combines HC-49S rack making technology, substitutes lead-in wire with U type electrode on the profile, all raw material and process domestic equal can finishing, thus cost is reduced.
The foregoing description reasonable in design can effectively reduce the whole height of crystal, realizes the miniaturization of crystal.Insulator exposes and can effectively prevent the tin short circuit when Reflow Soldering of quartz-crystal resonator two electrodes, and can prevent quartz-crystal resonator two electrodes and base plate, shell short circuit, electrode adopts kovar alloy to make, pedestal adopts caustic solution or straight forming method to form, the press seal form still can adopt the electric resistance welding form, can adopt parallel soldering and sealing by changing base arrangement simultaneously, effectively raise sealing.
Claims (8)
1. pedestal, it is characterized in that comprising U type first electrode (2) and U type second electrode (3), base plate (9) and the insulator of designed in mirror image, fill insulator respectively between U type first electrode (2) and U type second electrode (3) and between U type first electrode (2) and U type second electrode (3) outside and the base plate (9), insulator exposes to outside the quartz-crystal resonator.
2. according to the described pedestal of claim 1, it is characterized in that
Described base plate (9) is connected with U type first electrode (2) insulation by first insulator (10), U type first electrode (2) is connected with U type second electrode (3) insulation by second insulator (1), U type second electrode (3) is connected with base plate (9) insulation by the 3rd insulator (11), and first insulator (10), second insulator (1), the 3rd insulator (11) all expose to outside the quartz-crystal resonator.
3. according to the described pedestal of claim 1, it is characterized in that
Described U type first electrode (2) and U type second electrode (3) adopt kovar alloy to make, and U type first electrode (2) and U type second electrode (3) adopt caustic solution or straight forming method to form.
4. according to the described pedestal of claim 1, it is characterized in that
The upper surface of described base plate (9) is provided with the protruding rafter (12) of shell (8) encapsulation that is applicable to quartz-crystal resonator.
5. the processing technology of claim 1 or 2 described pedestals is characterized in that comprising following technological process:
Adopt glass material to add ceramic material straight forming insulator, in insulator, insert two L type electrodes then, bended respectively in two L type electrode tops again, beaten the back and formed U type first electrode (2) and U type second electrode (3), then at the both sides of insulator difference sintering base plate (9).
6. the processing technology of claim 1 or 2 described pedestals is characterized in that comprising following technological process:
At first make metallic cavity, in cavity, put into the glass material that is used to make insulator then, in glass material, insert two L type electrodes then, bended respectively in two L type electrode tops again, beat the back and formed U type first electrode (2) and U type second electrode (3), sinter molding;
At the periphery of base plate (9) position, U type first electrode (2) and U type second electrode (3) of metallic cavity both sides coating protective layer; corrosion then; insulator is exposed; form exposed first insulator (10), second insulator (1), the 3rd insulator (11); metallic cavity coating protective layer place forms the base plate (9) of both sides, and exposed insulator will cut off respectively between base plate (9), U type first electrode (2) and U type second electrode (3) of both sides.
7. comprise the quartz-crystal resonator of claim 1 or 2 described pedestals, it is characterized in that
Comprise pedestal and shell (9), shell (9) bottom is by base plate (9) set protruding rafter of upper surface (12) and pedestal encapsulation, U type first electrode (2) of pedestal is connected first reed (4), second reed (5) respectively with the top of U type second electrode (3), and the upper surface of first reed (4), second reed (5) is by conducting resinl (6) connecting wafer (7).
8. the processing technology of the described quartz-crystal resonator of claim 7 is characterised in that to comprise following technological process:
(1), at the upper surface of U type first electrode (2) of the pedestal of above-mentioned making and U type second electrode (3) spot welding first reed (4), second reed (5) respectively, wafer (7) is placed in top at first reed (4), second reed (5), at the both sides point glue of wafer (7), wafer (7) and first reed (4), second reed (5) are fixed then by conducting resinl (6);
(2), adopt parallel soldering and sealing or electric resistance welding that shell (8) is press-sealed on the base plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105412531A CN102035495A (en) | 2010-11-03 | 2010-11-03 | Base, quartz crystal resonator and processing techniques thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105412531A CN102035495A (en) | 2010-11-03 | 2010-11-03 | Base, quartz crystal resonator and processing techniques thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102035495A true CN102035495A (en) | 2011-04-27 |
Family
ID=43887926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105412531A Pending CN102035495A (en) | 2010-11-03 | 2010-11-03 | Base, quartz crystal resonator and processing techniques thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102035495A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970001A (en) * | 2012-10-31 | 2013-03-13 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and reflow soldering method thereof |
| CN103152008A (en) * | 2013-01-31 | 2013-06-12 | 深圳市晶峰晶体科技有限公司 | Sunken type metal base electric resistance welding minitype quartz-crystal resonator |
| CN105305995A (en) * | 2015-11-05 | 2016-02-03 | 烟台大明电子科技有限公司 | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof |
| WO2018107577A1 (en) * | 2016-12-15 | 2018-06-21 | 广东大普通信技术有限公司 | Crystal oscillator packaging structure, and crystal oscillator |
| CN112087209A (en) * | 2020-09-27 | 2020-12-15 | 苏州汉天下电子有限公司 | Method for manufacturing resonator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1905364A (en) * | 2005-04-05 | 2007-01-31 | 精工电子有限公司 | Piezoelectric vibrator and manufacturing method thereof, vibrator containing vibrator, electronic unit and electric wave meter |
| CN201122937Y (en) * | 2007-12-04 | 2008-09-24 | 成都奔月科技有限公司 | Minitype quartz-crystal resonator |
| CN101783659A (en) * | 2009-01-20 | 2010-07-21 | 精工电子有限公司 | Piezoelectric vibrator |
| CN101820264A (en) * | 2010-04-06 | 2010-09-01 | 台晶(宁波)电子有限公司 | Through-hole type wafer-level package structure for vibrator device |
| CN201860300U (en) * | 2010-11-03 | 2011-06-08 | 李斌 | Substrate and quartz crystal resonator |
-
2010
- 2010-11-03 CN CN2010105412531A patent/CN102035495A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1905364A (en) * | 2005-04-05 | 2007-01-31 | 精工电子有限公司 | Piezoelectric vibrator and manufacturing method thereof, vibrator containing vibrator, electronic unit and electric wave meter |
| CN201122937Y (en) * | 2007-12-04 | 2008-09-24 | 成都奔月科技有限公司 | Minitype quartz-crystal resonator |
| CN101783659A (en) * | 2009-01-20 | 2010-07-21 | 精工电子有限公司 | Piezoelectric vibrator |
| CN101820264A (en) * | 2010-04-06 | 2010-09-01 | 台晶(宁波)电子有限公司 | Through-hole type wafer-level package structure for vibrator device |
| CN201860300U (en) * | 2010-11-03 | 2011-06-08 | 李斌 | Substrate and quartz crystal resonator |
Non-Patent Citations (1)
| Title |
|---|
| 湛菁，晏心，黎昌俊，岳建峰，蒋伟燕: "铁钴镍三元合金的制备研究进展", 《金属材料与冶金工程》 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970001A (en) * | 2012-10-31 | 2013-03-13 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and reflow soldering method thereof |
| CN102970001B (en) * | 2012-10-31 | 2016-01-20 | 成都晶宝时频技术股份有限公司 | A kind of quartz-crystal resonator and reflow soldering method thereof |
| CN103152008A (en) * | 2013-01-31 | 2013-06-12 | 深圳市晶峰晶体科技有限公司 | Sunken type metal base electric resistance welding minitype quartz-crystal resonator |
| CN103152008B (en) * | 2013-01-31 | 2016-08-10 | 深圳市晶峰晶体科技有限公司 | Umbilicate type metal base electric resistance welding Minitype quartz-crystal resonator |
| CN105305995A (en) * | 2015-11-05 | 2016-02-03 | 烟台大明电子科技有限公司 | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof |
| WO2018107577A1 (en) * | 2016-12-15 | 2018-06-21 | 广东大普通信技术有限公司 | Crystal oscillator packaging structure, and crystal oscillator |
| CN112087209A (en) * | 2020-09-27 | 2020-12-15 | 苏州汉天下电子有限公司 | Method for manufacturing resonator |
| CN112087209B (en) * | 2020-09-27 | 2024-02-23 | 苏州汉天下电子有限公司 | Resonator manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102035495A (en) | Base, quartz crystal resonator and processing techniques thereof | |
| JP6722479B2 (en) | Method for manufacturing solid electrolytic capacitor | |
| CN102629851A (en) | Oscillator | |
| CN105283935B (en) | Solid electrolytic capacitor And Manufacturing approach | |
| US9478386B2 (en) | Integrated gas discharge tube and preparation method therefor | |
| JP2007273699A (en) | Electric double layer capacitor | |
| CN104283524A (en) | Piezoelectric quartz-crystal resonator and manufacturing method thereof | |
| CN201860300U (en) | Substrate and quartz crystal resonator | |
| JP2006351807A (en) | Surface-mounting solid state electrolytic capacitor and its manufacturing method | |
| JP2005039168A (en) | Ceramic package and tantalum electrolytic capacitor using the same | |
| JP2012043927A (en) | Electronic component, and electronic device | |
| US10396002B2 (en) | Electronic component storage substrate and housing package | |
| CN203774185U (en) | Solid-state relay housing where insulating sheet is not apt to crack | |
| CN114743944B (en) | Module diode and manufacturing method thereof | |
| CN214957808U (en) | Gas discharge tube with integrated electrode | |
| CN105450197A (en) | Surface-mounted quartz crystal resonator and processing process thereof | |
| CN101662270A (en) | Quartz-crystal resonator | |
| JP2015088718A (en) | Tantalum capacitor and method of manufacturing the same | |
| KR20150125406A (en) | Tantalum capacitor and method of preparing the same | |
| CN212365947U (en) | Ceramic packaging structure for improving poor insulation | |
| JP5941080B2 (en) | Tantalum capacitor and manufacturing method thereof | |
| CN201490984U (en) | Quartz crystal resonator | |
| CN201378591Y (en) | Surface-mounted metal wall ceramic substrate shell | |
| CN211047397U (en) | Quartz resonator and circuit board integrated structure | |
| CN217240679U (en) | Ceramic substrate adds crystal resonator of welding ring encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110427 |
|
| WD01 | Invention patent application deemed withdrawn after publication |