CN105483486A - Low-melting-point alloy and thermal interface material made from low-melting-point alloy - Google Patents
Low-melting-point alloy and thermal interface material made from low-melting-point alloy Download PDFInfo
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- CN105483486A CN105483486A CN201510844612.3A CN201510844612A CN105483486A CN 105483486 A CN105483486 A CN 105483486A CN 201510844612 A CN201510844612 A CN 201510844612A CN 105483486 A CN105483486 A CN 105483486A
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- point alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
Abstract
The invention relates to the field of thermal interface materials and provides a low-melting-point alloy. The alloy comprises In, Bi, Sn and Ga; the mass percentage of In to Bi to Sn is 51: 32.5: 16.5; and the mass of Ga accounts for 0.5%-3% of the total mass in percentage. A thermal interface material made from the low-melting-point alloy is provided further. The thermal interface material comprises a high-thermal-conductivity metal sheet, and a low-melting-point alloy clad layer is arranged on the surface of the high-thermal-conductivity metal sheet. According to the low-melting-point alloy and the thermal interface material, the low-temperature phase-change alloy and the high-thermal-conductivity metal sheet are combined, so that the novel thermal interface material is obtained; the thermal interface material displays an excellent property of low thermal impedance which is low to 5.8x10-6m2K/W (is cladded on a copper sheet of 50 mu m); with the adoption of the gallium-contained low-melting-point alloy, a conducting strip can function fully at the working temperature of 40-60 DEG C, compared with the required temperature of an existing phase-change metal hot sheet, the working temperature is low, and the usage space of a phase-change metal material is expanded; and the thermal interface material is free from harmful elements such as lead, cadmium and the like and facilitates the green development of electronic products.
Description
Technical field
The present invention relates to thermally conductive material field, particularly metallographic phase change conducting strip.
Background technology
Along with contemporary electronic technology develops rapidly, degree of integration and the packing density of electronic devices and components improve constantly, and while providing powerful using function, also lead the sharply increase of its operating power consumption and thermal value.High temperature will produce injurious effects to the stability of electronic devices and components, reliability and life-span.Therefore, guarantee that the heat that heating electronic component produces can be discharged in time, become an importance of microelectronic product system assembles.Heat interfacial material becomes the important research object of cooling electronic component.
At present, heat interfacial material can be divided three classes: adhesive solidification heat-conducting glue, phase change material and heat-conducting elastomer material.Metal heat interface material and indium foil have the following disadvantages: re-use after (1) pure metal heat interfacial material needs to be melted in use, have the possibility that metal solidifies fusing and spilling repeatedly in use procedure, the danger such as electronic devices and components short circuit will be caused; Meanwhile, the solid liquid phase volume change in use procedure can damage Heating element.(2) indium foil fusing point is higher, is in use solid-state, causes indium foil can not fill clearance between electronic devices and components well, and cause thermal contact resistance comparatively large, heat transfer efficiency is low.
Also there is no fusing point lower than the relevant publication, technical literature, market product etc. of the alloy conducting strip material of 59 degree at present.And the fusing point newly researched and developed near 45 degree containing gallium low melting point alloy, because its intrinsic fragility causes forming difficulty, metallographic phase change sheet material can not be made separately, limit its application in thermally conductive material field.
Summary of the invention
The object of the present invention is to provide a kind of low melting point alloy, the present invention proposes following technical scheme:
A kind of low melting point alloy, this alloying constituent comprises In, Bi, Sn, Ga, and the mass percent of described In, Bi, Sn is 51: 32.5: 16.5, and the mass percent that the quality of described Ga accounts for total mass is 0.5% ~ 3%.
Another object of the present invention is to provide a kind of thermal conductive metal plate that uses as the heat interfacial material of low melting point alloy carrier, the invention provides technical scheme as follows:
Use the heat interfacial material that low melting point alloy described in claim 1 makes, this heat interfacial material comprises a high-thermal conductive metal sheet, and the surface of described high-thermal conductive metal sheet is provided with low melting point alloy coating.
As a preferred embodiment of the present invention, the thickness of described high-thermal conductive metal sheet is 10 μm ~ 50 μm.
As another kind of preferred version of the present invention, the material of described high-thermal conductive metal sheet is copper, aluminium or indium.
As another preferred version of the present invention, the mode that described low melting point alloy coating gets rid of band by aerosolization spraying, ultrasonic aerosolization spraying family or two roller is located at high-thermal conductive metal sheet surface.
The beneficial effect that the present invention brings is:
1, present invention incorporates low temperature phase change alloy and high-thermal conductive metal sheet obtains new heat interfacial material, this heat interfacial material display thermal impedance is low to moderate 5.8 × 10
-6m
2the excellent properties of K/W (being coated on 50 μm of copper sheets);
2, the present invention is by using containing gallium low melting point alloy, and conducting strip can play a role completely under the working temperature of 40 ~ 60 DEG C, lower than the requirement temperature of current existing phase-change metal backing, has expanded the usage space of phase-change metal material;
3, the harmful element such as not leaded, cadmium of heat interfacial material of the present invention, to environment, can not be conducive to electronic product Green Development.
Embodiment
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Embodiment 1:
A kind of low melting point alloy, this alloying constituent comprises In, Bi, Sn, Ga, and wherein the mass percent of In, Bi, Sn is the mass percent that the quality of 51: 32.5: 16.5, Ga accounts for total mass is 1.32%.The fusing point of this low melting point alloy is 47.8 DEG C.
Heat interfacial material uses Copper Foil as high-thermal conductive metal sheet, and copper thickness is 18 μm, and concrete making step is as follows:
1) low melting point alloy of corresponding composition is put in vitrified pot, in process furnace, is heated to 80 degrees Celsius of melting and heat preservations;
2) 18 micron thickness Copper Foils of 400mm × 400mm size to be placed in workspace and to fix four edges;
3) debug the atomisation unit of high pressure nitrogen as source of the gas, pressure is set to 0.2MPa, pours in magazine by low melting point alloy melt;
4) operate atomizing lance, make rifle mouth be right against Copper Foil, about distance 200mm, make to be sprayed on uniform speed scanning on Copper Foil and carry out;
5) careful by the row spraying again of Copper Foil turn-over after one side completes;
6) composite sheet sprayed is cut into corresponding conducting strip shape.
Embodiment 2:
The material of high-thermal conductive metal sheet is the Copper Foil of 50 μm of thickness.The mass percent that the quality of the Ga of low melting point alloy accounts for total mass is 2.76%.The fusing point of this low melting point alloy is 40.5 DEG C.The concrete making step of heat interfacial material is with embodiment 1.
The above; be only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention; the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (5)
1. a low melting point alloy, this alloying constituent comprises In, Bi, Sn, Ga, it is characterized in that: the mass percent of described In, Bi, Sn is 51: 32.5: 16.5, and the mass percent that the quality of described Ga accounts for total mass is 0.5% ~ 3%.
2. use the heat interfacial material that low melting point alloy described in claim 1 makes, it is characterized in that: this heat interfacial material comprises a high-thermal conductive metal sheet, the surface of described high-thermal conductive metal sheet is provided with low melting point alloy coating.
3. heat interfacial material according to claim 2, is characterized in that: the thickness of described high-thermal conductive metal sheet is 10 μm ~ 50 μm.
4. heat interfacial material according to claim 2, is characterized in that: the material of described high-thermal conductive metal sheet is copper, aluminium or indium.
5. heat interfacial material according to claim 3, is characterized in that: the mode that described low melting point alloy coating gets rid of band by aerosolization spraying, ultrasonic aerosolization spraying or two roller is located at high-thermal conductive metal sheet surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510844612.3A CN105483486A (en) | 2015-11-26 | 2015-11-26 | Low-melting-point alloy and thermal interface material made from low-melting-point alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510844612.3A CN105483486A (en) | 2015-11-26 | 2015-11-26 | Low-melting-point alloy and thermal interface material made from low-melting-point alloy |
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| Publication Number | Publication Date |
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| CN105483486A true CN105483486A (en) | 2016-04-13 |
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| CN201510844612.3A Pending CN105483486A (en) | 2015-11-26 | 2015-11-26 | Low-melting-point alloy and thermal interface material made from low-melting-point alloy |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105838919A (en) * | 2016-05-04 | 2016-08-10 | 无锡市嘉邦电力管道厂 | Low-melting-point metal alloy heat conduction material and preparing method thereof |
| CN107548260A (en) * | 2016-06-24 | 2018-01-05 | 苏州天脉导热科技有限公司 | A kind of mobile phone camera radiator structure |
| CN113430440A (en) * | 2020-03-20 | 2021-09-24 | 北京梦之墨科技有限公司 | Low-melting-point alloy and preparation method and application thereof |
| CN114032072A (en) * | 2021-11-05 | 2022-02-11 | 云南科威液态金属谷研发有限公司 | Copper/low-melting-point alloy composite thermal interface material and preparation method and application thereof |
| CN114276785A (en) * | 2021-11-29 | 2022-04-05 | 江阴镓力材料科技有限公司 | Metal-based phase-change interface heat conduction material, preparation method and application thereof |
| US11795529B1 (en) | 2022-06-20 | 2023-10-24 | Industrial Technology Research Institute | Low-melting-point alloy composite material and composite material structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1861824A (en) * | 2006-06-14 | 2006-11-15 | 四川省有色冶金研究院 | Non-pollution lower melting point alloy |
| US20080110609A1 (en) * | 2006-11-15 | 2008-05-15 | Industrial Technology Research Institute | Melting temperature adjustable metal thermal interface materials and application thereof |
| CN103725946A (en) * | 2013-12-04 | 2014-04-16 | 曹帅 | Five-phase liquid metal material and preparation method thereof |
-
2015
- 2015-11-26 CN CN201510844612.3A patent/CN105483486A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1861824A (en) * | 2006-06-14 | 2006-11-15 | 四川省有色冶金研究院 | Non-pollution lower melting point alloy |
| US20080110609A1 (en) * | 2006-11-15 | 2008-05-15 | Industrial Technology Research Institute | Melting temperature adjustable metal thermal interface materials and application thereof |
| CN103725946A (en) * | 2013-12-04 | 2014-04-16 | 曹帅 | Five-phase liquid metal material and preparation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105838919A (en) * | 2016-05-04 | 2016-08-10 | 无锡市嘉邦电力管道厂 | Low-melting-point metal alloy heat conduction material and preparing method thereof |
| CN107548260A (en) * | 2016-06-24 | 2018-01-05 | 苏州天脉导热科技有限公司 | A kind of mobile phone camera radiator structure |
| CN113430440A (en) * | 2020-03-20 | 2021-09-24 | 北京梦之墨科技有限公司 | Low-melting-point alloy and preparation method and application thereof |
| CN113430440B (en) * | 2020-03-20 | 2022-03-01 | 北京梦之墨科技有限公司 | Low-melting-point alloy and preparation method and application thereof |
| CN114032072A (en) * | 2021-11-05 | 2022-02-11 | 云南科威液态金属谷研发有限公司 | Copper/low-melting-point alloy composite thermal interface material and preparation method and application thereof |
| CN114032072B (en) * | 2021-11-05 | 2024-03-29 | 云南科威液态金属谷研发有限公司 | Copper/low-melting-point alloy composite thermal interface material and preparation method and application thereof |
| CN114276785A (en) * | 2021-11-29 | 2022-04-05 | 江阴镓力材料科技有限公司 | Metal-based phase-change interface heat conduction material, preparation method and application thereof |
| US11795529B1 (en) | 2022-06-20 | 2023-10-24 | Industrial Technology Research Institute | Low-melting-point alloy composite material and composite material structure |
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| CB02 | Change of applicant information |
Address after: 215000, No. 9, Sheng Lu, Luzhi Town, Wuzhong District, Jiangsu, Suzhou Applicant after: Suzhou Tianmai Thermal Technology Co., Ltd. Address before: Wuzhong District Luzhi town Suzhou city Jiangsu province 215000 Huikai Road No. 6 Applicant before: Suzhou Tianmai Thermal Technology Co., Ltd. |
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Application publication date: 20160413 |