CN105171270A - Brazing filler metal for brazing dissimilar component W-Cu alloy, preparation method and brazing method - Google Patents
Brazing filler metal for brazing dissimilar component W-Cu alloy, preparation method and brazing method Download PDFInfo
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- CN105171270A CN105171270A CN201510728635.8A CN201510728635A CN105171270A CN 105171270 A CN105171270 A CN 105171270A CN 201510728635 A CN201510728635 A CN 201510728635A CN 105171270 A CN105171270 A CN 105171270A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
Abstract
The invention discloses a brazing filler metal for brazing W-Cu alloy with different components, a preparation method and a brazing method, wherein the brazing filler metal comprises the following components, by mass, 10.0% -16.0% of Mn10, 0.5% -3.5% of Co0, 1.0% -5.0% of Ni0, 1.0% -4.0% of Ti0, 0.2% -0.6% of Si0.1% -0.3% of B, and the balance of Cu. The brazing temperature of the copper-based brazing filler metal is 1000-1050 ℃, the melting temperature of the brazing filler metal is moderate, the brazing filler metal is melted uniformly, the brazing filler metal has good wettability and metallurgical intermiscibility to W-Cu alloy by adding related beneficial elements, the obtained brazed joint has high strength and good corrosion resistance, can be completely applied to complex environments, and is an economical brazing filler metal with good comprehensive performance; the prepared copper-based brazing filler metal foil is beneficial to promoting diffusion and interface reaction of alloy elements in the brazing connection process, improves wetting and spreading capacity of the brazing filler metal on the surface of the W-Cu alloy, and is beneficial to forming a compact brazing joint.
Description
Technical field
The present invention relates to the solder of soldering foreign components W-Cu alloy and preparation method and method for welding, belong to dissimilar materials welding technology field.
Background technology
W-Cu alloy combines the excellent properties of tungsten and copper, has the features such as good conductive and heat-conductive and low thermal coefficient of expansion, a kind of heat sink material of Chang Zuowei in high power device.But along with microwave semiconductor device constantly miniaturized, highly integrated, high-power development and the high heat generation rate that causes, existing homogeneous W-Cu alloy is difficult to the requirement meeting electric substrate heat dispersion aspect.If the W-Cu alloy of heterogeneity needed for two kinds is coupled together, then can address this problem well.This solid liquid phase method of attachment of soldering is one of prefered method of connecting dissimilar material.The advantage of tungsten-copper composite material better can be brought into play by adjustment tungsten copper content by the connection of two kinds of heterogeneity W-Cu alloys, W-Cu Alloyapplication can be made in various complicated, make it have the combination property of a series of excellences such as electric-conductivity heat-conductivity high, the low thermal coefficient of expansion that matches, high intensity, therefore the method for attachment exploring two kinds of heterogeneity W-Cu alloys not only has positive realistic meaning, and has good application prospect.
For the W-Cu alloy of two pieces of foreign components connects, find a kind of function admirable and the high packing material of cost performance, formulating rational welding procedure is realize the key that two blocks of foreign components W-Cu alloys connect.At present, the relevant report of foreign components W-Cu alloy brazed is not yet seen.
Summary of the invention
Goal of the invention: in order to overcome the deficiencies in the prior art, the invention provides a kind of solder of soldering foreign components W-Cu alloy and preparation method and method for welding, solder combination property is good, the soldering processes advantages of simple of design, both are with the use of the soldered fitting that finally can obtain excellent in mechanical performance.
Technical scheme: for solving the problems of the technologies described above, the solder of soldering foreign components W-Cu alloy of the present invention, the mass percent of each component of described solder and component is respectively Mn10.0% ~ 16.0%, Co0.5% ~ 3.5%, Ni1.0% ~ 5.0%, Ti1.0% ~ 4.0%, Si0.2% ~ 0.6%, B0.1% ~ 0.3%, surplus is Cu.
As preferably, described solder is foil strip, and thickness is 100 ~ 200 μm.
As preferably, the mass percent of each component of described solder and component is respectively Mn12.0% ~ 15.0%, Co1.0% ~ 3.0%, Ni1.5% ~ 4.0%, Ti1.5% ~ 4%, Si0.3% ~ 0.6%, B0.15% ~ 0.3%, and surplus is Cu.
As preferably, the mass percent of each component of described solder and component is respectively Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, and all the other are Cu.
A preparation method for the solder of above-mentioned soldering foreign components W-Cu alloy, comprises the following steps:
1) take highly purified Mn sheet, Co particle, Ni particle, Ti particle, Si particle, B particle and Cu particle by mass percentage and obtain mixture, put into the container being added with acetone, at the temperature of 15 ~ 25, carry out ultrasonic cleaning 15 ~ 20min;
2) mixture after step 1 ultrasonic cleaning is dried at the temperature of 30 ~ 50 DEG C, obtain dry mixture;
3) by the uniform solder foundry alloy of method prepared composition of mixture M n, Co, Ni, Ti, Si, B and Cu employing vacuum induction melting, after the foundry alloy prepared is pulverized, load in the quartz glass tube of high vacuum single roller strip machine;
4) quartz glass tube is installed in gets rid of in the electrical induction circle of band machine, and its nozzle is adjusted to 150 ~ 250 μm to copper roller surface spacing;
5) close fire door, adopt mechanical pump to be evacuated to 1.5 × 10-3Pa, then adopt molecular pump pumping high vacuum, condition of high vacuum degree is not less than 6 × 10-5Pa, and then cavity is full of high-purity Ar gas to 180 ~ 200mbar;
6) open motor, make copper roller rotating speed us in the scope of 29 ~ 34m/s, then open high frequency electric source, after the foundry alloy high-frequency induction heating in quartz glass tube to complete molten homogeneous, insulation superheated melt 70s ~ 90s;
7) by Ar gas air pressure modulation P=20 ~ 50KPa, with high pressure argon gas, the superheated melt continuous spraying in quartz glass is mapped to the cooling copper roller surface of High Rotation Speed, liquid metal is subject to chilling and forms foil shape, thus obtains solder foil strip, and thickness is 100 ~ 200 μm.
As preferably, in described step 3, quartz ampoule nozzle is rectangle, and its length is 8 ~ 12mm, and width is 0.9 ~ 1.2mm.
As preferably, in described step 6, copper roller diameter is 250mm, and copper roller width is 50mm.
Use a method for welding for the solder of above-mentioned soldering foreign components W-Cu alloy, comprise the following steps:
(1) preparatory stage: the W-Cu alloy sample end face of to be brazed two pieces of foreign components is cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for solder paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, the W-Cu alloy sample of two pieces of foreign components and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between the W-Cu alloy welding surface of two pieces of foreign components, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.02 ~ 0.04MPa;
(3) the brazing stage: the fixture entirety assembled is placed in the brazing equipment that vacuum is not less than 6 × 10-4Pa, first with ramp to 300 ~ 350 DEG C of 10 ~ 15 DEG C/min, insulation 15 ~ 20min, again with ramp to 700 ~ 850 DEG C of 5 ~ 10 DEG C/min, temperature retention time 15 ~ 20min, continue to be warming up to brazing temperature 1000 ~ 1050 DEG C with the speed of 8 ~ 12 DEG C/min again, temperature retention time 20 ~ 45min, 800 ~ 850 DEG C are cooled to again with the speed of 12 ~ 16 DEG C/min, temperature retention time 10 ~ 15min, finally be cooled to 400 ~ 450 DEG C with the speed of 5 ~ 10 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
Copper base solder prepared by the present invention, making solder have good soldering processes performance, heat-and corrosion-resistant performance and processing characteristics by rationally adding multiple alloying element, meeting the performance requirement of foreign components W-Cu alloy brazed joint in complex environment.Wherein adding appropriate Mn element one is can improve the performance of soldered fitting by solid solution effect, two be Mn be added in the resistance to elevated temperatures that also can improve joint to a certain extent; Add appropriate Co element both can avoid generating cenotype in solder, the form of phase composition material can be changed again, to the refining effect of specific phase clearly; Add heat-and corrosion-resistant and elevated temperature strength that appropriate Ni element can improve joint; Add appropriate Ti to be conducive to reducing solder fusing point and to improve alloy flowability and can crystal grain thinning, improve intensity and the plasticity of brazing filler metal alloy; Si and B adding trace can improve the oxidation resistance of solder, reduces the fusion temperature of solder, improves wetability; A large amount of Cu elements is conducive to improving solder to the wetability of mother metal and solid solution ability simultaneously, improves plasticity and the intensity of solder alloy, promotes the solid solution metallurgical reaction of two blocks of different component W-Cu alloys, improve the combination property of soldered fitting.
Soldering processes provided by the invention adopt first the W-Cu alloy of two pieces of foreign components to be put into special brazing jig in the mode of docking, again sample and fixture are together put into vacuum drying oven and complete soldering, high vacuum environment coordinates rational processing parameter setting, make whole component without distortion, without microfissure, pore with the defect such as to be mingled with, contribute to the soldered fitting obtaining good mechanical properties.
Copper base solder provided by the invention shows good wetability and metallurgical intermiscibility to W-Cu alloy, and the soldering joint strength of acquisition is high, and corrosion resistance is good, is the good economical brazing material of a kind of combination property.The soldering processes of the present invention's design are simple, implement convenient and swift, coordinate rational processing parameter setting can realize the connection of two blocks of foreign components W-Cu alloys well.
Beneficial effect: compared with prior art, the present invention has the following advantages:
(1) copper base solder brazing temperature provided by the invention is at 1000 DEG C ~ 1050 DEG C, brazing filler metal melts moderate temperature, brazing filler metal melts is even, by adding associated beneficial element, make solder have good wetability and metallurgical intermiscibility to W-Cu alloy, the soldering joint strength of acquisition is high, and corrosion resistance is good, completely can be applied in complex environment, be the good economical solder of a kind of combination property; The copper base solder paillon foil of preparation is conducive to the diffusion and the interfacial reaction that promote alloying element in brazing process, improves the wetting and spreading ability of solder at W-Cu alloy surface, contributes to forming fine and close soldered fitting;
(2) the soldering processes advantages of simple of the foreign components W-Cu alloy of the present invention's design, adopt method for welding in vacuum drying oven, brazing process need not add brazing flux and other safeguard measures, high vacuum environment coordinates rational processing parameter setting, make whole component without distortion, without microfissure, pore with the defect such as to be mingled with, contribute to the soldered fitting obtaining good mechanical properties;
(3) copper base solder provided by the invention has excellent normal temperature and high-temperature behavior, solid solution metallurgical reaction can be fully there is with mother metal, the soldering processes simple and practical with the use of the present invention finally can obtain the good jointing of combination property, for W-Cu alloy provides new application prospect;
(4) the copper base solder combination property of the present invention's development is good, is highly suitable for the soldering of W-Cu alloy, and the soldering processes of design are implemented convenient and swift, and the preparation of solder and soldering processes can repetitions, are convenient to propagation and employment widely.
Accompanying drawing explanation
Fig. 1 is braze-welded structure part structural representation of the present invention.
Fig. 2 is the soldered fitting stereoscan photograph that concrete enforcement 1 obtains;
Fig. 3 is that concrete 1 soldered fitting obtained of implementing bends fracture macro pattern photo;
Fig. 4 is that concrete 1 soldered fitting obtained of implementing bends fracture micro-appearance photo.
Detailed description of the invention
Embodiment 1
W75-Cu1 alloy and W55-Cu2 alloy is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W75-Cu1 alloy and W55-Cu2 alloy sample size are 20mm × 20mm × 6mm, and to be brazed is 20mm × 6mm cross section.
Composition and the mass percent proportioning of solder are: Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, and surplus is Cu.Solder thickness is 100 μm.
The solder preparation method of above-mentioned a kind of soldering W75-Cu alloy and W55-Cu alloy, comprises the following steps:
1) take highly purified 130gMn sheet, 25gCo particle, 30gNi particle, 30gTi particle, 5gSi particle, 2gB particle and 778gCu particle by mass percentage and obtain mixture, put into the container being added with acetone, at the temperature of about 20 DEG C, carry out ultrasonic cleaning 15 ~ 20min;
2) mixture after step 1 ultrasonic cleaning is dried at the temperature of 30 ~ 50 DEG C, obtain dry mixture;
3) by the uniform solder foundry alloy of method prepared composition of mixture M n, Co, Ni, Ti, Si, B and Cu employing vacuum induction melting, after the foundry alloy prepared is pulverized, load in the quartz glass tube of high vacuum single roller strip machine;
4) quartz glass tube is installed in gets rid of in the electrical induction circle of band machine, and its nozzle is adjusted to 150 ~ 250 μm to copper roller surface spacing;
5) close fire door, adopt mechanical pump to be evacuated to 1.5 × 10
-3pa, then adopt molecular pump pumping high vacuum, condition of high vacuum degree is not less than 6 × 10
-5pa, then cavity is full of high-purity Ar gas to 180 ~ 200mbar;
6) open motor, make copper roller rotating speed u
sin the scope of 29 ~ 34m/s, then open high frequency electric source, after the foundry alloy high-frequency induction heating in quartz glass tube to complete molten homogeneous, insulation superheated melt 70s ~ 90s;
7) by Ar gas air pressure modulation P=20 ~ 50KPa, with high pressure argon gas, the superheated melt continuous spraying in quartz glass is mapped to the cooling copper roller surface of High Rotation Speed, liquid metal is subject to chilling and forms foil shape, thus obtains solder foil strip, and thickness is 100 μm.
Soldering process step is:
(1) preparatory stage: W75-Cu1 alloy to be brazed and W55-Cu2 alloy sample end face are cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for copper base solder 3 paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, W75-Cu1 alloy, W55-Cu2 alloy and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between W75-Cu1 alloy and W55-Cu2 alloy welding surface, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.04MPa, as shown in Figure 1;
(3) the brazing stage: the fixture entirety assembled is placed in vacuum and is not less than 6 × 10
-4in the brazing equipment of Pa, first with the ramp to 300 DEG C of 12 DEG C/min, insulation 20min, then with the ramp to 800 DEG C of 8 DEG C/min, temperature retention time 20min, continue to be warming up to brazing temperature 1050 DEG C, temperature retention time 30min with the speed of 10 DEG C/min again, then be cooled to 800 DEG C with the speed of 15 DEG C/min, temperature retention time 15min, finally be cooled to 450 DEG C with the speed of 8 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
Result: the W75-Cu1 alloy that soldering obtains and W55-Cu2 alloy-junction are formed well, metallographic observation finds that brazing area forms fine and close interface cohesion, alloying component is evenly distributed, room temperature four-point bending intensity is 980MPa, soldered fitting stereoscan photograph as shown in Figure 2, soldered fitting bends fracture macro pattern photo as shown in Figure 3, and soldered fitting bends fracture micro-appearance photo as shown in Figure 4.
Embodiment 2
W80-Cu alloy and W60-Cu alloy is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W80-Cu alloy and W60-Cu alloy sample size are 20mm × 20mm × 6mm, and to be brazed is 20mm × 6mm cross section.
Composition and the mass percent proportioning of solder are: Mn15.0%, Co2.0%, Ni3.0%, Ti3.0%, Si0.3%, B0.15%, and surplus is Cu.Solder thickness is 130 μm.
Soldering process step is:
(1) preparatory stage: W80-Cu alloy to be brazed and W60-Cu alloy sample end face are cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for copper base solder paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, W80-Cu alloy, W60-Cu alloy and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between W80-Cu alloy and W60-Cu alloy welding surface, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.03MPa;
(3) the brazing stage: the fixture entirety assembled is placed in vacuum and is not less than 6 × 10
-4in the brazing equipment of Pa, first with the ramp to 350 DEG C of 14 DEG C/min, insulation 20min, then with the ramp to 850 DEG C of 10 DEG C/min, temperature retention time 20min, continue to be warming up to brazing temperature 1040 DEG C, temperature retention time 40min with the speed of 9 DEG C/min again, then be cooled to 850 DEG C with the speed of 13 DEG C/min, temperature retention time 15min, finally be cooled to 400 DEG C with the speed of 7 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
Result: the W80-Cu alloy that soldering obtains and W60-Cu alloy-junction are formed well, metallographic observation finds that brazing area forms fine and close interface cohesion, and alloying component is evenly distributed, and room temperature four-point bending intensity is 950MPa.
Embodiment 3
W70-Cu alloy and W50-Cu alloy is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W70-Cu alloy and W50-Cu alloy sample size are 20mm × 20mm × 6mm, and to be brazed is 20mm × 6mm cross section.
Composition and the mass percent proportioning of solder are: Mn12.0%, Co3.0%, Ni4.0%, Ti3.0%, Si0.6%, B0.3%, and surplus is Cu.Solder thickness is 150 μm.
Soldering process step is:
(1) preparatory stage: W70-Cu alloy to be brazed and W50-Cu alloy sample end face are cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for copper base solder paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, W70-Cu alloy, W50-Cu alloy and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between W70-Cu alloy and W50-Cu alloy welding surface, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.02MPa;
(3) the brazing stage: the fixture entirety assembled is placed in vacuum and is not less than 6 × 10
-4in the brazing equipment of Pa, first with the ramp to 300 DEG C of 10 DEG C/min, insulation 20min, then with the ramp to 800 DEG C of 6 DEG C/min, temperature retention time 20min, continue to be warming up to brazing temperature 1030 DEG C, temperature retention time 45min with the speed of 8 DEG C/min again, then be cooled to 800 DEG C with the speed of 12 DEG C/min, temperature retention time 15min, finally be cooled to 400 DEG C with the speed of 5 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
Result: the W70-Cu alloy that soldering obtains and W50-Cu alloy-junction are formed well, metallographic observation finds that brazing area forms fine and close interface cohesion, and alloying component is evenly distributed, and room temperature four-point bending intensity is 930MPa.
Embodiment 4
W60-Cu alloy and W50-Cu alloy is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W60-Cu alloy and W50-Cu alloy sample size are 20mm × 20mm × 6mm, and to be brazed is 20mm × 6mm cross section.
Composition and the mass percent proportioning of solder are: Mn10.0%, Co0.5%, Ni1.0%, Ti1.0%, Si0.2%, B0.1%, and surplus is Cu.Solder thickness is 200 μm.
Soldering process step is:
(1) preparatory stage: W60-Cu alloy to be brazed and W50-Cu alloy sample end face are cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for copper base solder paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, W60-Cu alloy, W50-Cu alloy and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between W60-Cu alloy and W50-Cu alloy welding surface, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.02MPa;
(3) the brazing stage: the fixture entirety assembled is placed in vacuum and is not less than 6 × 10
-4in the brazing equipment of Pa, first with the ramp to 300 DEG C of 10 DEG C/min, insulation 20min, then with the ramp to 800 DEG C of 6 DEG C/min, temperature retention time 20min, continue to be warming up to brazing temperature 1030 DEG C, temperature retention time 45min with the speed of 8 DEG C/min again, then be cooled to 800 DEG C with the speed of 12 DEG C/min, temperature retention time 15min, finally be cooled to 400 DEG C with the speed of 5 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
Result: the W60-Cu alloy that soldering obtains and W50-Cu alloy-junction are formed well, metallographic observation finds that brazing area forms fine and close interface cohesion, and alloying component is evenly distributed, and room temperature four-point bending intensity is 940MPa.
Embodiment 5
W80-Cu alloy and W70-Cu alloy is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W80-Cu alloy and W70-Cu alloy sample size are 20mm × 20mm × 6mm, and to be brazed is 20mm × 6mm cross section.
Composition and the mass percent proportioning of solder are: Mn16.0%, Co3.5%, Ni5.0%, Ti4.0%, Si0.5%, B0.3%, and surplus is Cu.Solder thickness is 130 μm.
Soldering process step is:
(1) preparatory stage: W80-Cu alloy to be brazed and W70-Cu alloy sample end face are cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for copper base solder paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, W80-Cu alloy, W60-Cu alloy and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between W80-Cu alloy and W70-Cu alloy welding surface, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.03MPa;
(3) the brazing stage: the fixture entirety assembled is placed in vacuum and is not less than 6 × 10
-4in the brazing equipment of Pa, first with the ramp to 350 DEG C of 14 DEG C/min, insulation 20min, then with the ramp to 850 DEG C of 10 DEG C/min, temperature retention time 20min, continue to be warming up to brazing temperature 1040 DEG C, temperature retention time 40min with the speed of 9 DEG C/min again, then be cooled to 850 DEG C with the speed of 13 DEG C/min, temperature retention time 15min, finally be cooled to 400 DEG C with the speed of 7 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
Result: the W80-Cu alloy that soldering obtains and W70-Cu alloy-junction are formed well, metallographic observation finds that brazing area forms fine and close interface cohesion, and alloying component is evenly distributed, and room temperature four-point bending intensity is 950MPa.
The above is only the preferred embodiment of the present invention; be noted that for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (8)
1. the solder of a soldering foreign components W-Cu alloy, it is characterized in that: the mass percent of each component of described solder and component is respectively Mn10.0% ~ 16.0%, Co0.5% ~ 3.5%, Ni1.0% ~ 5.0%, Ti1.0% ~ 4.0%, Si0.2% ~ 0.6%, B0.1% ~ 0.3%, surplus is Cu.
2. the solder of the soldering foreign components W-Cu alloy according to right 1, it is characterized in that: described solder is foil strip, thickness is 100 ~ 200 μm.
3. the solder of the soldering foreign components W-Cu alloy according to right 1, it is characterized in that: the mass percent of each component of described solder and component is respectively Mn12.0% ~ 15.0%, Co1.0% ~ 3.0%, Ni1.5% ~ 4.0%, Ti1.5% ~ 4%, Si0.3% ~ 0.6%, B0.15% ~ 0.3%, surplus is Cu.
4. the solder of the soldering foreign components W-Cu alloy according to right 3, it is characterized in that: the mass percent of each component of described solder and component is respectively Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, all the other are Cu.
5. a preparation method for the solder of soldering foreign components W-Cu alloy as claimed in claim 1, is characterized in that, comprise the following steps:
1) take highly purified Mn sheet, Co particle, Ni particle, Ti particle, Si particle, B particle and Cu particle by mass percentage and obtain mixture, put into the container being added with acetone, at the temperature of 15 ~ 25, carry out ultrasonic cleaning 15 ~ 20min;
2) mixture after step 1 ultrasonic cleaning is dried at the temperature of 30 ~ 50 DEG C, obtain dry mixture;
3) by the uniform solder foundry alloy of method prepared composition of mixture M n, Co, Ni, Ti, Si, B and Cu employing vacuum induction melting, after the foundry alloy prepared is pulverized, load in the quartz glass tube of high vacuum single roller strip machine;
4) quartz glass tube is installed in gets rid of in the electrical induction circle of band machine, and its nozzle is adjusted to 150 ~ 250 μm to copper roller surface spacing;
5) close fire door, adopt mechanical pump to be evacuated to 1.5 × 10-3Pa, then adopt molecular pump pumping high vacuum, condition of high vacuum degree is not less than 6 × 10-5Pa, and then cavity is full of high-purity Ar gas to 180 ~ 200mbar;
6) open motor, make copper roller rotating speed us in the scope of 29 ~ 34m/s, then open high frequency electric source, after the foundry alloy high-frequency induction heating in quartz glass tube to complete molten homogeneous, insulation superheated melt 70s ~ 90s;
7) by Ar gas air pressure modulation P=20 ~ 50KPa, with high pressure argon gas, the superheated melt continuous spraying in quartz glass is mapped to the cooling copper roller surface of High Rotation Speed, liquid metal is subject to chilling and forms foil shape, thus obtains solder foil strip, and thickness is 100 ~ 200 μm.
6. the preparation method of the solder of soldering foreign components W-Cu alloy according to claim 5, it is characterized in that: in described step 3, quartz ampoule nozzle is rectangle, its length is 8 ~ 12mm, and width is 0.9 ~ 1.2mm.
7. the preparation method of the solder of soldering foreign components W-Cu alloy according to claim 5, it is characterized in that: in described step 6, copper roller diameter is 250mm, copper roller width is 50mm.
8. use a method for welding for the solder of the soldering foreign components W-Cu alloy described in claim 1, it is characterized in that, comprise the following steps:
(1) preparatory stage: the W-Cu alloy sample end face of to be brazed two pieces of foreign components is cleared up, impurity, greasy dirt and oxide-film that removing is surperficial, W28 ~ W3.5 abrasive paper for metallograph is utilized to carry out grinding smooth, to carry out grinding smooth by two-sided for solder paillon foil to utilize W3.5 abrasive paper for metallograph, after grinding, the W-Cu alloy sample of two pieces of foreign components and solder paillon foil are placed in acetone together, adopt Ultrasonic Cleaning 15 ~ 20min, and carry out drying and processing;
(2) assembling stage: the solder paillon foil after cleaning is placed between the W-Cu alloy welding surface of two pieces of foreign components, and be close to and be assemblied in special brazing jig, guarantee the precision connected, fixture is placed the pressure head of nominal-mass, produce the constant perpendicular pressure of 0.02 ~ 0.04MPa;
(3) the brazing stage: the fixture entirety assembled is placed in the brazing equipment that vacuum is not less than 6 × 10-4Pa, first with ramp to 300 ~ 350 DEG C of 10 ~ 15 DEG C/min, insulation 15 ~ 20min, again with ramp to 700 ~ 850 DEG C of 5 ~ 10 DEG C/min, temperature retention time 15 ~ 20min, continue to be warming up to brazing temperature 1000 ~ 1050 DEG C with the speed of 8 ~ 12 DEG C/min again, temperature retention time 20 ~ 45min, 800 ~ 850 DEG C are cooled to again with the speed of 12 ~ 16 DEG C/min, temperature retention time 10 ~ 15min, finally be cooled to 400 ~ 450 DEG C with the speed of 5 ~ 10 DEG C/min, cool to room temperature with the furnace, welded connector is taken out in blow-on.
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| CN105522245A (en) * | 2016-03-01 | 2016-04-27 | 江苏科技大学 | High-strength connection process for same materials of W-Cu alloy |
| CN105855745A (en) * | 2016-05-10 | 2016-08-17 | 武汉工程大学 | Copper-based solder and preparation method and application method thereof |
| CN106216879A (en) * | 2016-08-17 | 2016-12-14 | 武汉工程大学 | A kind of Cu TiH2ni+B NEW TYPE OF COMPOSITE solder and its preparation method and application |
| CN109848608A (en) * | 2019-03-08 | 2019-06-07 | 任耀文 | A kind of solder alloy suitable for 34CrNi3Mo rotor part |
| CN114571129A (en) * | 2021-09-30 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing filler metal and preparation method and application thereof |
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| CN109848608A (en) * | 2019-03-08 | 2019-06-07 | 任耀文 | A kind of solder alloy suitable for 34CrNi3Mo rotor part |
| CN114571129A (en) * | 2021-09-30 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing filler metal and preparation method and application thereof |
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| CN105171270B (en) | 2017-04-05 |
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