CN105171270B - Brazing filler metal for brazing dissimilar component W-Cu alloy, preparation method and brazing method - Google Patents
Brazing filler metal for brazing dissimilar component W-Cu alloy, preparation method and brazing method Download PDFInfo
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- CN105171270B CN105171270B CN201510728635.8A CN201510728635A CN105171270B CN 105171270 B CN105171270 B CN 105171270B CN 201510728635 A CN201510728635 A CN 201510728635A CN 105171270 B CN105171270 B CN 105171270B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
Abstract
The invention discloses a brazing filler metal for brazing W-Cu alloy with different components, a preparation method and a brazing method, wherein the brazing filler metal comprises the following components, by mass, 10.0% -16.0% of Mn10, 0.5% -3.5% of Co0, 1.0% -5.0% of Ni0, 1.0% -4.0% of Ti0, 0.2% -0.6% of Si0.1% -0.3% of B, and the balance of Cu. The brazing temperature of the copper-based brazing filler metal is 1000-1050 ℃, the melting temperature of the brazing filler metal is moderate, the brazing filler metal is melted uniformly, the brazing filler metal has good wettability and metallurgical intermiscibility to W-Cu alloy by adding related beneficial elements, the obtained brazed joint has high strength and good corrosion resistance, can be completely applied to complex environments, and is an economical brazing filler metal with good comprehensive performance; the prepared copper-based brazing filler metal foil is beneficial to promoting diffusion and interface reaction of alloy elements in the brazing connection process, improves wetting and spreading capacity of the brazing filler metal on the surface of the W-Cu alloy, and is beneficial to forming a compact brazing joint.
Description
Technical field
The present invention relates to the solder and preparation method and method for welding of soldering foreign components W-Cu alloys, belong to dissimilar materials weldering
Connection technology field.
Background technology
W-Cu alloys combine the excellent properties of tungsten and copper, with the spy such as good conductive and heat-conductive and low thermal coefficient of expansion
Point, frequently as a kind of heat sink material in high power device.But be increasingly miniaturized with microwave semiconductor device, it is highly integrated,
It is high-power development and caused high heat generation rate, in terms of existing homogenizing W-Cu alloys are difficult to meet electric substrate heat dispersion
Require.If the W-Cu alloys of heterogeneity needed for two kinds coupled together, this problem can be solved well.Soldering this
It is one of prefered method of connecting dissimilar material to plant solid liquid phase method of attachment.The connection of two kinds of heterogeneity W-Cu alloys can be led to
Cross adjustment tungsten copper content preferably to bring the advantage of tungsten-copper composite material into play, W-Cu Alloyapplications can be made in Various Complex
Environment so as to a series of excellent combination properties such as electric-conductivity heat-conductivity high, the low thermal coefficient of expansion that matches, high intensity,
Therefore the method for attachment for exploring two kinds of heterogeneity W-Cu alloys not only has positive realistic meaning, and has good answering
Use prospect.
For the W-Cu alloys connection of two pieces of foreign components, the high filling material of a kind of function admirable and cost performance is found
Material, it is to realize the key of two pieces of foreign components W-Cu alloys connections to formulate rational welding procedure.At present, not yet see foreign components W-
The relevant report of Cu alloy brazeds.
The content of the invention
Goal of the invention:In order to overcome the deficiencies in the prior art, the present invention to provide a kind of soldering foreign components W-Cu and close
The solder and preparation method and method for welding of gold, solder combination property are good, the soldering processes advantages of simple of design, and both coordinate
Using the final soldered fitting that can obtain excellent in mechanical performance.
Technical scheme:To solve above-mentioned technical problem, the solder of the soldering foreign components W-Cu alloys of the present invention, the solder
The mass percent of each component and component respectively Mn10.0%~16.0%, Co0.5%~3.5%, Ni1.0%~5.0%,
Ti1.0%~4.0%, Si0.2%~0.6%, B0.1%~0.3%, balance of Cu.
Preferably, the solder is foil strip, thickness is 100~200 μm.
Preferably, the mass percent of the solder each component and component is respectively Mn12.0%~15.0%,
Co1.0%~3.0%, Ni1.5%~4.0%, Ti1.5%~4%, Si0.3%~0.6%, B0.15%~0.3%, surplus
For Cu.
Preferably, the mass percent of the solder each component and component be respectively Mn13.0%, Co2.5%,
Ni3.0%, Ti3.0%, Si0.5%, B0.2%, remaining is Cu.
A kind of preparation method of the solder of above-mentioned soldering foreign components W-Cu alloys, comprises the following steps:
1) highly purified Mn pieces, Co granules, Ni granules, Ti granules, Si granules, B granules and Cu are weighed by mass percentage
Granule is obtained mixture, is put in the container added with acetone, at a temperature of 15~25 DEG C carries out 15~20min of ultrasonic cleaning;
2) mixture after be cleaned by ultrasonic step 1 is dried at a temperature of 30~50 DEG C, obtains dry mixture;
3) mixture M n, Co, Ni, Ti, Si, B and Cu are adopted the uniform pricker of method prepared composition of vacuum induction melting
Material foundry alloy, after the foundry alloy prepared is pulverized, loads in the quartz glass tube of high vacuum single roller strip machine;
4) quartz glass tube is installed in and is got rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 150~250 μm;
5) fire door is closed, 1.5 × 10-3Pa is evacuated to using mechanical pump, then using molecular pump pumping high vacuum, Gao Zhen
Reciprocal of duty cycle is not less than 6 × 10-5Pa, and then cavity is full of high-purity Ar gas to 180~200mbar;
6) motor is opened, makes copper roller rotating speed us in the range of 29~34m/s, be then turned on high frequency electric source, by quartz glass
Foundry alloy high-frequency induction heating in pipe is incubated superheated melt 70s~90s to substantially uniformity melting;
7) Ar gas air pressure is modulated into P=20~50KPa, the superheated melt in quartz glass is continuously sprayed with high pressure argon gas
To the cooling copper roller surface of high speed rotation, liquid metal formed foil shape by chilling, and so as to obtain solder foil strip, thickness is
100~200 μm.
Preferably, quartz ampoule nozzle is rectangle in the step 3, its length is 8~12mm, width is 0.9~
1.2mm。
Preferably, copper roller diameter is 250mm in the step 6, copper roller width is 50mm.
A kind of method for welding of the solder using above-mentioned soldering foreign components W-Cu alloys, comprises the following steps:
(1) preparatory stage:The W-Cu alloy sample end faces of two pieces of foreign components to be brazed are cleared up, surface is removed
Impurity, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 abrasive paper for metallograph will
Solder paillon foil is two-sided to be ground smooth, and the W-Cu alloy samples and solder paillon foil of two pieces of foreign components are placed in third together after grinding
In ketone, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:Solder paillon foil after cleaning is placed between the W-Cu alloy welding surfaces of two pieces of foreign components, and
Be close to be assemblied in special brazing jig, it is ensured that the precision of connection, on fixture place nominal-mass pressure head, produce 0.02~
The constant perpendicular pressure of 0.04MPa;
(3) the soldering connection stage:The fixture for assembling is integrally placed at into the brazing equipment that vacuum is not less than 6 × 10-4Pa
In, first with the ramp of 10~15 DEG C/min to 300~350 DEG C, 15~20min is incubated, then with the speed of 5~10 DEG C/min
Rate is warming up to 700~850 DEG C, 15~20min of temperature retention time, then is continuously heating to brazing temperature with the speed of 8~12 DEG C/min
1000~1050 DEG C, 20~45min of temperature retention time, then 800~850 DEG C, during insulation are cooled to the speed of 12~16 DEG C/min
Between 10~15min, be finally cooled to 400~450 DEG C with the speed of 5~10 DEG C/min, cool to room temperature with the furnace, quilt is taken out in blow-on
Weldering connector.
Copper base solder prepared by the present invention, makes solder have good soldering processes by rationally adding various alloying elements
Performance, heat-and corrosion-resistant performance and processing characteristics, meeting performance of the foreign components W-Cu alloy brazed joints in complex environment will
Ask.Appropriate Mn elements one are wherein added to can be by the performance that solid solution effect improves soldered fitting, two is being added in for Mn
The resistance to elevated temperatures of joint can be also improved to a certain extent;Appropriate Co elements are added both to have avoided generating newly in solder
Phase, can change the form of phase composition material again, apparent to the refining effect of specific phase;Add appropriate Ni elements improve
The heat resisting corrosion-proof corrosion of joint and elevated temperature strength;Add appropriate Ti to advantageously reduce solder fusing point and improve alloy flowability and can
With crystal grain thinning, the intensity and plasticity of brazing filler metal alloy are improved;Add micro Si and B improve the oxidation resistance of solder, drop
The fusion temperature of low solder, improves wettability;Substantial amounts of Cu elements are conducive to improving solder to the wettability of mother metal and consolidate simultaneously
Molten ability, improves the plasticity and intensity of solder alloy, promotes the solid solution metallurgical reaction of two blocks of different component W-Cu alloys, improve pricker
The combination property of plumb joint.
The soldering processes that the present invention is provided are to adopt first the W-Cu alloys of two pieces of foreign components are put into specially in the way of docking
In the brazing jig of door, then sample and fixture are together put into into vacuum drying oven complete soldering, high vacuum environment coordinates rational technique
Parameter setting so that whole component without microfissure, pore and the defect such as is mingled with without deformation, contributes to obtaining mechanical property good
Good soldered fitting.
The copper base solder that the present invention is provided shows good wettability and metallurgical intermiscibility, the pricker of acquisition to W-Cu alloys
Plumb joint intensity is high, and corrosion resistance is good, is a kind of good economical brazing material of combination property.The soldering processes of present invention design
Simply, it is easy to implement quick, coordinate rational processing parameter setting realize the company of two blocks of foreign components W-Cu alloys well
Connect.
Beneficial effect:Compared with prior art, the present invention has advantages below:
(1) the copper base solder brazing temperature that the present invention is provided is at 1000 DEG C~1050 DEG C, brazing filler metal melts moderate temperature, solder
Fusing is uniform, by adding associated beneficial element so that solder has good wettability and metallurgical intermiscibility to W-Cu alloys,
The soldering joint strength of acquisition is high, and corrosion resistance is good, is can apply in complex environment completely, is a kind of good economy of combination property
Type solder;The copper base solder paillon foil of preparation may advantageously facilitate the diffusion of alloying element and interfacial reaction during soldering connection, carry
Moistening and spreading ability of the high solder in W-Cu alloy surfaces, contribute to forming the soldered fitting of densification;
(2) the soldering processes advantages of simple of the foreign components W-Cu alloys of present invention design, using method for welding in vacuum drying oven,
Brazing process need not add brazing flux and other protective measures, and high vacuum environment coordinates rational processing parameter setting so that whole
Component without microfissure, pore and the defect such as is mingled with without deformation, contributes to obtaining the soldered fitting of good mechanical properties;
(3) copper base solder that the present invention is provided has excellent room temperature and high-temperature behavior, solid solution smelting can fully occur with mother metal
Gold reaction, can finally obtain the good jointing of combination property with the use of the simple and practical soldering processes of the present invention, be W-
Cu alloys provide new application prospect;
(4) the copper base solder combination property that the present invention is developed is good, is highly suitable for the soldering of W-Cu alloys, the pricker of design
Welding is easy to implement quick, and the preparation of solder and soldering processes are repeated and reproduced, and are easy to extensive popularization and are applied.
Description of the drawings
Fig. 1 is braze-welded structure part structural representation of the present invention.
Fig. 2 is to be embodied as the 1 soldered fitting stereoscan photograph for obtaining;
Fig. 3 is to be embodied as the 1 soldered fitting bending fracture macro pattern photo for obtaining;
Fig. 4 is to be embodied as the 1 soldered fitting bending fracture micro-appearance photo for obtaining.
Specific embodiment
Embodiment 1
W75-Cu1 alloys are selected to carry out banjo fixing butt jointing vacuum brazing with W55-Cu2 alloys.Wherein W75-Cu1 alloys with
W55-Cu2 alloy sample sizes are 20mm × 20mm × 6mm, and face to be brazed is 20mm × 6mm sections.
The composition and mass percent proportioning of solder be:Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%,
Si0.5%, B0.2%, balance of Cu.Solder thickness is 100 μm.
A kind of above-mentioned soldering W75-Cu alloys and the solder preparation method of W55-Cu alloys, comprise the following steps:
1) weigh by mass percentage highly purified 130g Mn pieces, 25g Co granules, 30g Ni granules, 30g Ti granules,
5g Si granules, 2g B granules and 778g Cu granules are obtained mixture, are put in the container added with acetone, in 20 DEG C or so of temperature
15~20min of ultrasonic cleaning is carried out under degree;
2) mixture after be cleaned by ultrasonic step 1 is dried at a temperature of 30~50 DEG C, obtains dry mixture;
3) mixture M n, Co, Ni, Ti, Si, B and Cu are adopted the uniform pricker of method prepared composition of vacuum induction melting
Material foundry alloy, after the foundry alloy prepared is pulverized, loads in the quartz glass tube of high vacuum single roller strip machine;
4) quartz glass tube is installed in and is got rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 150~250 μm;
5) fire door is closed, 1.5 × 10 are evacuated to using mechanical pump-3Pa, then using molecular pump pumping high vacuum, fine vacuum
Degree is not less than 6 × 10-5Pa, then cavity is full of high-purity Ar gas to 180~200mbar;
6) motor is opened, makes copper roller rotating speed usIn the range of 29~34m/s, high frequency electric source is then turned on, by quartz glass
Foundry alloy high-frequency induction heating in pipe is incubated superheated melt 70s~90s to substantially uniformity melting;
7) Ar gas air pressure is modulated into P=20~50KPa, the superheated melt in quartz glass is continuously sprayed with high pressure argon gas
To the cooling copper roller surface of high speed rotation, liquid metal formed foil shape by chilling, and so as to obtain solder foil strip, thickness is
100μm。
Soldering process step is:
(1) preparatory stage:W75-Cu1 alloys to be brazed and W55-Cu2 alloy sample end faces are cleared up, table is removed
The impurity in face, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 metallographic sand
Paper by it is 3 paillon foil of copper base solder two-sided be ground it is smooth, by W75-Cu1 alloys, W55-Cu2 alloys and solder paillon foil one after grinding
Rise and be placed in acetone, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:By the solder paillon foil after cleaning be placed in W75-Cu1 alloys and W55-Cu2 alloys welding surface it
Between, and be close to be assemblied in special brazing jig, it is ensured that the precision of connection, the pressure head of nominal-mass is placed on fixture, is produced
The constant perpendicular pressure of 0.04MPa, as shown in Figure 1;
(3) the soldering connection stage:The fixture for assembling is integrally placed at into vacuum and is not less than 6 × 10-4The brazing equipment of Pa
In, first with the ramp of 12 DEG C/min to 300 DEG C, 20min is incubated, then with the ramp of 8 DEG C/min to 800 DEG C, is protected
Warm time 20min, then 1050 DEG C of brazing temperature is continuously heating to the speed of 10 DEG C/min, temperature retention time 30min, then with 15
DEG C/speed of min is cooled to 800 DEG C, temperature retention time 15min is finally cooled to 450 DEG C with the speed of 8 DEG C/min, furnace cooling
To room temperature, blow-on is taken out by weldering connector.
As a result:The W75-Cu1 alloys and W55-Cu2 alloy-junctions that soldering is obtained is formed well, and metallographic observation finds soldering
Area forms the interface cohesion of densification, and alloying component is evenly distributed, and room temperature four-point bending intensity is 980MPa, and soldered fitting scans electric
Mirror photo is as shown in Fig. 2 soldered fitting bending fracture macro pattern photo is as shown in figure 3, soldered fitting bending fracture microcosmic shape
Looks photo is as shown in Figure 4.
Embodiment 2
W80-Cu alloys are selected to carry out banjo fixing butt jointing vacuum brazing with W60-Cu alloys.Wherein W80-Cu alloys and W60-Cu
Alloy sample size is 20mm × 20mm × 6mm, and face to be brazed is 20mm × 6mm sections.
The composition and mass percent proportioning of solder be:Mn15.0%, Co2.0%, Ni3.0%, Ti3.0%,
Si0.3%, B0.15%, balance of Cu.Solder thickness is 130 μm.
Soldering process step is:
(1) preparatory stage:W80-Cu alloys to be brazed and W60-Cu alloy sample end faces are cleared up, surface is removed
Impurity, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 abrasive paper for metallograph
It is ground smooth by copper base solder paillon foil two-sided, W80-Cu alloys, W60-Cu alloys and solder paillon foil is put together after grinding
In acetone, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:Solder paillon foil after cleaning is placed between W80-Cu alloys and W60-Cu alloy welding surfaces,
And be close to be assemblied in special brazing jig, it is ensured that the precision of connection, the pressure head of nominal-mass is placed on fixture, is produced
The constant perpendicular pressure of 0.03MPa;
(3) the soldering connection stage:The fixture for assembling is integrally placed at into vacuum and is not less than 6 × 10-4The brazing equipment of Pa
In, first with the ramp of 14 DEG C/min to 350 DEG C, 20min is incubated, then with the ramp of 10 DEG C/min to 850 DEG C, is protected
Warm time 20min, then 1040 DEG C of brazing temperature is continuously heating to the speed of 9 DEG C/min, temperature retention time 40min, then with 13 DEG C/
The speed of min is cooled to 850 DEG C, and temperature retention time 15min is finally cooled to 400 DEG C with the speed of 7 DEG C/min, cools to the furnace
Room temperature, blow-on are taken out by weldering connector.
As a result:The W80-Cu alloys and W60-Cu alloy-junctions that soldering is obtained is formed well, and metallographic observation finds brazing area
Fine and close interface cohesion is formed, alloying component is evenly distributed, room temperature four-point bending intensity is 950MPa.
Embodiment 3
W70-Cu alloys are selected to carry out banjo fixing butt jointing vacuum brazing with W50-Cu alloys.Wherein W70-Cu alloys and W50-Cu
Alloy sample size is 20mm × 20mm × 6mm, and face to be brazed is 20mm × 6mm sections.
The composition and mass percent proportioning of solder be:Mn12.0%, Co3.0%, Ni4.0%, Ti3.0%,
Si0.6%, B0.3%, balance of Cu.Solder thickness is 150 μm.
Soldering process step is:
(1) preparatory stage:W70-Cu alloys to be brazed and W50-Cu alloy sample end faces are cleared up, surface is removed
Impurity, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 abrasive paper for metallograph
It is ground smooth by copper base solder paillon foil two-sided, W70-Cu alloys, W50-Cu alloys and solder paillon foil is put together after grinding
In acetone, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:Solder paillon foil after cleaning is placed between W70-Cu alloys and W50-Cu alloy welding surfaces,
And be close to be assemblied in special brazing jig, it is ensured that the precision of connection, the pressure head of nominal-mass is placed on fixture, is produced
The constant perpendicular pressure of 0.02MPa;
(3) the soldering connection stage:The fixture for assembling is integrally placed at into vacuum and is not less than 6 × 10-4The brazing equipment of Pa
In, first with the ramp of 10 DEG C/min to 300 DEG C, 20min is incubated, then with the ramp of 6 DEG C/min to 800 DEG C, is protected
Warm time 20min, then 1030 DEG C of brazing temperature is continuously heating to the speed of 8 DEG C/min, temperature retention time 45min, then with 12 DEG C/
The speed of min is cooled to 800 DEG C, and temperature retention time 15min is finally cooled to 400 DEG C with the speed of 5 DEG C/min, cools to the furnace
Room temperature, blow-on are taken out by weldering connector.
As a result:The W70-Cu alloys and W50-Cu alloy-junctions that soldering is obtained is formed well, and metallographic observation finds brazing area
Fine and close interface cohesion is formed, alloying component is evenly distributed, room temperature four-point bending intensity is 930MPa.
Embodiment 4
W60-Cu alloys are selected to carry out banjo fixing butt jointing vacuum brazing with W50-Cu alloys.Wherein W60-Cu alloys and W50-Cu
Alloy sample size is 20mm × 20mm × 6mm, and face to be brazed is 20mm × 6mm sections.
The composition and mass percent proportioning of solder be:Mn10.0%, Co0.5%, Ni1.0%, Ti1.0%,
Si0.2%, B0.1%, balance of Cu.Solder thickness is 200 μm.
Soldering process step is:
(1) preparatory stage:W60-Cu alloys to be brazed and W50-Cu alloy sample end faces are cleared up, surface is removed
Impurity, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 abrasive paper for metallograph
It is ground smooth by copper base solder paillon foil two-sided, W60-Cu alloys, W50-Cu alloys and solder paillon foil is put together after grinding
In acetone, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:Solder paillon foil after cleaning is placed between W60-Cu alloys and W50-Cu alloy welding surfaces,
And be close to be assemblied in special brazing jig, it is ensured that the precision of connection, the pressure head of nominal-mass is placed on fixture, is produced
The constant perpendicular pressure of 0.02MPa;
(3) the soldering connection stage:The fixture for assembling is integrally placed at into vacuum and is not less than 6 × 10-4The brazing equipment of Pa
In, first with the ramp of 10 DEG C/min to 300 DEG C, 20min is incubated, then with the ramp of 6 DEG C/min to 800 DEG C, is protected
Warm time 20min, then 1030 DEG C of brazing temperature is continuously heating to the speed of 8 DEG C/min, temperature retention time 45min, then with 12 DEG C/
The speed of min is cooled to 800 DEG C, and temperature retention time 15min is finally cooled to 400 DEG C with the speed of 5 DEG C/min, cools to the furnace
Room temperature, blow-on are taken out by weldering connector.
As a result:The W60-Cu alloys and W50-Cu alloy-junctions that soldering is obtained is formed well, and metallographic observation finds brazing area
Fine and close interface cohesion is formed, alloying component is evenly distributed, room temperature four-point bending intensity is 940MPa.
Embodiment 5
W80-Cu alloys are selected to carry out banjo fixing butt jointing vacuum brazing with W70-Cu alloys.Wherein W80-Cu alloys and W70-Cu
Alloy sample size is 20mm × 20mm × 6mm, and face to be brazed is 20mm × 6mm sections.
The composition and mass percent proportioning of solder be:Mn16.0%, Co3.5%, Ni5.0%, Ti4.0%,
Si0.5%, B0.3%, balance of Cu.Solder thickness is 130 μm.
Soldering process step is:
(1) preparatory stage:W80-Cu alloys to be brazed and W70-Cu alloy sample end faces are cleared up, surface is removed
Impurity, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 abrasive paper for metallograph
It is ground smooth by copper base solder paillon foil two-sided, W80-Cu alloys, W60-Cu alloys and solder paillon foil is put together after grinding
In acetone, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:Solder paillon foil after cleaning is placed between W80-Cu alloys and W70-Cu alloy welding surfaces,
And be close to be assemblied in special brazing jig, it is ensured that the precision of connection, the pressure head of nominal-mass is placed on fixture, is produced
The constant perpendicular pressure of 0.03MPa;
(3) the soldering connection stage:The fixture for assembling is integrally placed at into vacuum and is not less than 6 × 10-4The brazing equipment of Pa
In, first with the ramp of 14 DEG C/min to 350 DEG C, 20min is incubated, then with the ramp of 10 DEG C/min to 850 DEG C, is protected
Warm time 20min, then 1040 DEG C of brazing temperature is continuously heating to the speed of 9 DEG C/min, temperature retention time 40min, then with 13 DEG C/
The speed of min is cooled to 850 DEG C, and temperature retention time 15min is finally cooled to 400 DEG C with the speed of 7 DEG C/min, cools to the furnace
Room temperature, blow-on are taken out by weldering connector.
As a result:The W80-Cu alloys and W70-Cu alloy-junctions that soldering is obtained is formed well, and metallographic observation finds brazing area
Fine and close interface cohesion is formed, alloying component is evenly distributed, room temperature four-point bending intensity is 950MPa.
The above is only the preferred embodiment of the present invention, it should be pointed out that:For the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (8)
1. a kind of solder of soldering foreign components W-Cu alloys, it is characterised in that:The quality percentage of the solder each component and component
Than being respectively Mn10.0%~16.0%, Co0.5%~3.5%, Ni1.0%~5.0%, Ti1.0%~4.0%, Si0.2%
~0.6%, B0.1%~0.3%, balance of Cu.
2. the solder of the soldering foreign components W-Cu alloys according to right 1, it is characterised in that:The solder is foil strip, thick
Spend for 100~200 μm.
3. the solder of the soldering foreign components W-Cu alloys according to right 1, it is characterised in that:The solder each component and component
Mass percent be respectively Mn12.0%~15.0%, Co1.0%~3.0%, Ni1.5%~4.0%, Ti1.5%~
4%, Si0.3%~0.6%, B0.15%~0.3%, balance of Cu.
4. the solder of the soldering foreign components W-Cu alloys according to right 3, it is characterised in that:The solder each component and component
Mass percent be respectively Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, remaining is Cu.
5. a kind of preparation method of the solder of soldering foreign components W-Cu alloys as claimed in claim 1, it is characterised in that include
Following steps:
1) highly purified Mn pieces, Co granules, Ni granules, Ti granules, Si granules, B granules and Cu granules are weighed by mass percentage
Prepared mixture, is put in the container added with acetone, at a temperature of 15~25 DEG C carries out 15~20min of ultrasonic cleaning;
2) mixture after be cleaned by ultrasonic step 1 is dried at a temperature of 30~50 DEG C, obtains dry mixture;
3) will be mixture M n, Co, Ni, Ti, Si, B and Cu female using the uniform solder of method prepared composition of vacuum induction melting
Alloy, after the foundry alloy prepared is pulverized, loads in the quartz glass tube of high vacuum single roller strip machine;
4) quartz glass tube is installed in and is got rid of in the electrical induction circle with machine, and its nozzle is adjusted to copper roller surface spacing
150~250 μm;
5) fire door is closed, 1.5 × 10-3Pa is evacuated to using mechanical pump, then using molecular pump pumping high vacuum, condition of high vacuum degree
6 × 10-5Pa is not less than, then cavity is full of high-purity Ar gas to 180~200mbar;
6) motor is opened, makes copper roller rotating speed us in the range of 29~34m/s, be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to substantially uniformity melting after, be incubated superheated melt 70s~90s;
7) Ar gas air pressure is modulated into P=20~50KPa, the superheated melt in quartz glass is continuously ejected into into height with high pressure argon gas
The cooling copper roller surface of speed rotation, liquid metal are formed foil shape by chilling, and so as to obtain solder foil strip, thickness is 100
~200 μm.
6. the preparation method of the solder of soldering foreign components W-Cu alloys according to claim 5, it is characterised in that:The step
In rapid 3, quartz ampoule nozzle is rectangle, and its length is 8~12mm, and width is 0.9~1.2mm.
7. the preparation method of the solder of soldering foreign components W-Cu alloys according to claim 5, it is characterised in that:The step
In rapid 6, copper roller diameter is 250mm, and copper roller width is 50mm.
8. a kind of usage right requires the method for welding of the solder of the soldering foreign components W-Cu alloys described in 1, it is characterised in that bag
Include following steps:
(1) preparatory stage:The W-Cu alloy sample end faces of two pieces of foreign components to be brazed are cleared up, the miscellaneous of surface is removed
Matter, greasy dirt and oxide-film, be ground using W28~W3.5 abrasive paper for metallograph it is smooth, using W3.5 abrasive paper for metallograph by pricker
Material paillon foil is two-sided to be ground smooth, and the W-Cu alloy samples and solder paillon foil of two pieces of foreign components are placed in acetone together after grinding
In, 15~20min is cleaned using ultrasound wave, and carries out drying and processing;
(2) assembling stage:Solder paillon foil after cleaning is placed between the W-Cu alloy welding surfaces of two pieces of foreign components, and is close to
Be assemblied in special brazing jig, it is ensured that the precision of connection, on fixture place nominal-mass pressure head, produce 0.02~
The constant perpendicular pressure of 0.04MPa;
(3) the soldering connection stage:The fixture for assembling is integrally placed at vacuum to be not less than in the brazing equipment of 6 × 10-4Pa,
First with the ramp of 10~15 DEG C/min to 300~350 DEG C, 15~20min is incubated, then with the speed of 5~10 DEG C/min
700~850 DEG C are warming up to, 15~20min of temperature retention time, then brazing temperature is continuously heating to the speed of 8~12 DEG C/min
1000~1050 DEG C, 20~45min of temperature retention time, then 800~850 DEG C, during insulation are cooled to the speed of 12~16 DEG C/min
Between 10~15min, be finally cooled to 400~450 DEG C with the speed of 5~10 DEG C/min, cool to room temperature with the furnace, quilt is taken out in blow-on
Weldering connector.
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CN105499833A (en) * | 2016-01-27 | 2016-04-20 | 江苏科技大学 | High-temperature brazing material for brazing tungsten-copper alloy and copper or copper alloy and brazing method of high-temperature brazing material |
CN105522245B (en) * | 2016-03-01 | 2017-11-14 | 江苏科技大学 | A kind of high intensity Joining Technology of W Cu alloy same materials |
CN105855745B (en) * | 2016-05-10 | 2018-07-17 | 武汉工程大学 | A kind of copper-based solder and its preparation method and application method |
CN106216879B (en) * | 2016-08-17 | 2018-07-17 | 武汉工程大学 | A kind of Cu-TiH2- Ni+B composite solders and its preparation method and application |
CN109848608B (en) * | 2019-03-08 | 2021-11-19 | 西安远航真空钎焊技术有限公司 | Alloy solder suitable for 34CrNi3Mo rotor component |
CN114571129A (en) * | 2021-09-30 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing filler metal and preparation method and application thereof |
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JPH0717975B2 (en) * | 1983-01-11 | 1995-03-01 | 郁男 岡本 | Amorphous alloy foil strip for brazing |
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