JPS59126739A - Quickly liquid-cooled alloy foil strip for brazing - Google Patents
Quickly liquid-cooled alloy foil strip for brazingInfo
- Publication number
- JPS59126739A JPS59126739A JP296283A JP296283A JPS59126739A JP S59126739 A JPS59126739 A JP S59126739A JP 296283 A JP296283 A JP 296283A JP 296283 A JP296283 A JP 296283A JP S59126739 A JPS59126739 A JP S59126739A
- Authority
- JP
- Japan
- Prior art keywords
- atomic
- ceramics
- foil strip
- brazing
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Abstract
Description
【発明の詳細な説明】
技術分野
この発明は、セラミックスとセラミックス、セラミック
スと金属、あるいは金属同士を接着するためのろう材に
係り、複雑な形状のものを接着するのに適した箔帯が容
易に得られるろう材に関する。[Detailed Description of the Invention] Technical Field The present invention relates to a brazing material for bonding ceramics to ceramics, ceramics to metals, or metals to each other, and easily creates a foil strip suitable for bonding objects with complex shapes. Regarding the brazing filler metal obtained in
背景技術
セラミックスと金属を接着する技術として活性金属法が
実用化されており、この方法は、TL、Zr等の活性金
属粉末と、これと比輯的低融点の合金を作るQL 、N
L 、Ac+粉末等との混合粉末を有機バインダーを用
いてペースト状にし、セラミックスと金属との間に挿入
し、真空中または不活性ガス中で、−回の加熱操作によ
り接着する方法である。BACKGROUND ART The active metal method has been put into practical use as a technology for bonding ceramics and metals, and this method consists of active metal powders such as TL and Zr, and QL and N, which are made into alloys with relatively low melting points.
This is a method in which a mixed powder of L, Ac+ powder, etc. is made into a paste using an organic binder, the paste is inserted between ceramic and metal, and the paste is bonded by heating operations twice in vacuum or in an inert gas.
しかし、この活性金属法は上記ペースト状のろう材を使
用するため、接着の信頼性と接着時の操作性に種々の問
題があった。However, since this active metal method uses the above-mentioned paste-like brazing material, there are various problems in the reliability of bonding and the operability during bonding.
すなわち、TL、ZY等の活性金属粉末は非常に酸化し
やすく粉末表面に酸化物が形成され、この酸化物が接着
部に残存し、接着後の信頼性を低下させる要因となり、
また、上記のペースト状ろう材はたんに有機バンイダー
で混合されるだけであり、接着後に均一な合金組成を得
ることができず、加熱時に有機バインダーが蒸発して不
要ガスが発生すると共に、その部分が気泡となりやすく
、接着強度が不均一となり、接着後の信頼性を低下させ
ていた。さらに、上記のペースト状ろう材をセラミック
スや金属に塗布する際に塗布量の不均一が生じやすく、
接着強度や加熱接着以前の塗布等の作業性が能率的でな
いなど爵問題がある。That is, active metal powders such as TL and ZY are very easily oxidized and oxides are formed on the powder surface, and these oxides remain in the bonded area, causing a decrease in reliability after bonding.
In addition, the paste-like brazing filler metal described above is simply mixed with an organic binder, making it impossible to obtain a uniform alloy composition after bonding, and the organic binder evaporates during heating, producing unnecessary gas. Bubbles tend to form in the parts, resulting in uneven adhesive strength and reduced reliability after adhesion. Furthermore, when applying the above-mentioned paste brazing filler metal to ceramics or metals, the amount of application tends to be uneven.
There are problems such as inefficient adhesive strength and workability such as application before heat bonding.
このように接着に際して、気孔や残渣を形成してしまう
ペースト状ろう材に代るろう付は用合金として、特圃招
56−4396号公報に、延性のあるホイルとして得ら
れるろう付は用コバルト基合金が開示されているが、こ
の合金は本発明の合金箔帯の組成と異なり、コバルト及
びニッケル基合金等の金属部材用のろう材であり、上記
以外の金属及びセラミックスの接着には不適である。In order to replace the paste brazing filler metal that forms pores and residues during adhesion, Japanese Patent Application Publication No. 56-4396 describes cobalt as a brazing alloy that can be obtained as a ductile foil. Although a base alloy is disclosed, this alloy is different from the composition of the alloy foil strip of the present invention and is a brazing material for metal members such as cobalt and nickel base alloys, and is not suitable for bonding metals other than those mentioned above and ceramics. It is.
また、周知の技術で、溶融体を急速冷却して薄板が得ら
れる延性をもったガラス質合金として、特公昭57−5
2947号公報にジルコニウム−チタン合金が開示され
ているが、上記公報の発明は電気抵抗用合金に係り、セ
ラミックスとセラミックス、セラミックスと金属、ある
いは金属同士の接着用ろう材に関しては全く開示されて
いない。In addition, using a well-known technique, it was developed as a ductile glassy alloy that can be made into thin plates by rapidly cooling the melt.
Although a zirconium-titanium alloy is disclosed in Publication No. 2947, the invention in the publication relates to an alloy for electrical resistance, and does not disclose anything regarding a brazing material for adhesion between ceramics and ceramics, ceramics and metals, or metals. .
発明の目的
この発明は、上述の活性金属法に使用する従来のペース
ト状ろう材の欠点を解消し、接着作業性にすぐれ、複雑
な形状であっても、接着操作の容易なろう材を目的とす
る。また、接着強度が高くかつ均一で接着後の信頼性に
富むろう材を目的とする。Purpose of the Invention The purpose of the present invention is to eliminate the drawbacks of the conventional paste brazing filler metal used in the above-mentioned active metal method, and to provide a brazing filler metal that has excellent bonding workability and is easy to bond even with complex shapes. shall be. The aim is also to provide a brazing material that has high and uniform bonding strength and is highly reliable after bonding.
さらに、この発明は、接着操作が容易で、取り扱いが簡
単なろう材を目的とし、ホイル、リボン、ワイヤ等のm
l帯が容易に得られるろう材を目的とする。Furthermore, the present invention aims at a brazing material that is easy to bond and handle, and is intended for use in moulds, such as foils, ribbons, wires, etc.
The purpose is to create a brazing filler metal that can easily form L-bands.
また、この発明は、セラミックスとセラミックス、セラ
ミックスと金属、及び金属と金属の接着に対し、広い適
用性を有し、接着強度とその均一性、耐食性、耐酸化性
、経年変化等の信頼性、接着操作の容易性、ろう材自体
の取り扱いの容易性などの接着性にすぐれたろう材を目
的としている。In addition, the present invention has wide applicability to bonding ceramics to ceramics, ceramics to metals, and metals to metals, and has reliability such as bonding strength and uniformity, corrosion resistance, oxidation resistance, aging, etc. The aim is to create a brazing material with excellent adhesive properties, such as ease of bonding operations and ease of handling of the brazing material itself.
発明の開示
この発明は、Ti、Zr、H?のうち少なくとも1種を
25原子%〜75原子%含有し、残部 へ及び不可避的
不純物とからなるろう付は用液体急冷合金箔帯を要旨と
する。DISCLOSURE OF THE INVENTION This invention relates to Ti, Zr, H? The gist is a liquid-quenched alloy foil strip containing at least one of these in an amount of 25 to 75 at %, and the remainder including unavoidable impurities.
さらに、この発明は、TL、Zy、)tfのうち少なく
とも1種を25原子%〜75原子%、下記群のうち各群
の制限内で少なくとも1群を選択し合計で30原子%以
下、20原子%を越える伍、及び不可避的不純物との総
量で100原子%となるろう付は用液体急冷合金箔帯で
ある。Furthermore, the present invention provides at least one of TL, Zy, The liquid quenched alloy foil strip is used for brazing with a total amount of 100 atomic % and unavoidable impurities exceeding 5 atomic %.
a Co 、Fe 、NL 、Pd 、Rh 、Be
のうち少なくとも1種を20原子%以下、
b Cr 、t’b 、W 、V 、r 、Ta
、Mnのうち少なくとも1種を20原子%以下、
0〜.Auのうち少なくとも1種を30原子%以下、
dSc、Y、Li族のうち少なくとも1種を10原子%
以下、
8 B 、Si 、CA、P 、As 、Sbの
うち少なくとも1種を15原子%以下、
f M 、Ca 、ITl 、Sn 、Cd 、Zn
のうち少なくとも1種を10原子%以下。a Co , Fe , NL , Pd , Rh , Be
20 atomic % or less of at least one of the following, b Cr , t'b , W , V , r , Ta
, 20 atomic % or less of at least one of Mn, 0 to . 30 atomic % or less of at least one of Au, 10 atomic % of at least one of dSc, Y, and Li group
Hereinafter, at least one of 8B, Si, CA, P, As, and Sb is contained at 15 atomic % or less, fM, Ca, ITl, Sn, Cd, and Zn.
At least one of these in an amount of 10 atomic % or less.
この発明は、T、、 7.r、 )4Fのうち少なくと
も1種の活性金属を25原子%〜75原子%を含有し、
少なくとも20原子%の伍を含有した液体急冷合金箔帯
であり、可撓性を得るのに十分な微細結晶質もしくは非
晶質を有するホイル、リボン、ワイヤ等の箔帯のろう材
であることを特徴としている。This invention consists of T., 7. r, ) Contains 25 at % to 75 at % of at least one active metal among 4F,
A liquid-quenched alloy foil strip containing at least 20 at. It is characterized by
この発明は、・上述の活性金属法に使用する従来のペー
スト状ろう材と比較して、柔軟性、延性に富む箔帯であ
るため、取り扱いが簡単で、接着作業性にすぐれ、複雑
な形状であっても、むだなく均−に接着部に介在させる
ことができ、接着操作が容易となる。また、従来のペー
スト状のろう材と異なり活性金属の酸化物を生成し難い
ため、セラミックスとセラミックス、セラミックスと金
属、及び金属と金属の接着に対し、広い適用性を有し、
接着強度とその均一性、耐食性、耐酸化性、経年変化等
の機械的信頼性、接着操作の容易性、ろう材自体の取り
扱いの容易性などの接着性にすぐれている。This invention has the following advantages: Compared to the conventional paste brazing filler metal used in the above-mentioned active metal method, the foil strip is more flexible and ductile, so it is easy to handle, has excellent bonding workability, and can be used in complex shapes. Even if it is, it can be evenly interposed in the bonding part without waste, and the bonding operation becomes easy. In addition, unlike conventional paste brazing materials, it is difficult to generate active metal oxides, so it has wide applicability for bonding ceramics to ceramics, ceramics to metals, and metals to metals.
It has excellent adhesion properties such as adhesive strength and uniformity, corrosion resistance, oxidation resistance, mechanical reliability such as aging, ease of adhesion operation, and ease of handling of the brazing material itself.
以下に成分の限定理由を説明する。The reasons for limiting the ingredients will be explained below.
TL、 Zr、 1−)Pのうち少なくとも1種を25
原子%〜75原子%含有するのは、セラミックスあるい
は金属との強い接着強度を得るのに必要な活性金属の最
低量が25原子%であり、積極的に含有するが、751
i!子%を越えると融点が高くなりすぎ実用上不適とな
るためである。また、望ましくは30原子%〜70原子
%、もつとも望ましくは40原子%〜60原子%の含有
である。25 at least one of TL, Zr, 1-)P
The minimum amount of active metal required to obtain strong adhesive strength with ceramics or metals is 25 at%, and it is actively included, but 751
i! This is because if the amount exceeds 5%, the melting point becomes too high and is not suitable for practical use. Further, the content is preferably 30 atom % to 70 atom %, and most preferably 40 atom % to 60 atom %.
侮は、上記の活性金属との共晶によってろう材の融点を
さげるもので、この発明によるろう材の基体をなし、非
晶質化しやすくする働きをするため、活性金属及び侃の
働きを助ける下記の添加元素群を添加しても、少なくと
も20原子%を越える含有が必要であり、下記添加元素
群を添加しない場合は残部を占める。The brazing material lowers the melting point of the brazing filler metal through eutectic formation with the active metal, and forms the base of the brazing filler metal according to the present invention, and serves to make it easier to become amorphous, thereby aiding the function of the active metal and the brazing filler metal. Even if the following additive element groups are added, the content must exceed at least 20 atomic %, and if the following additive element groups are not added, the remaining amount will be included.
a群、Go 、Fe 、NL 、Pci 、Rh 、B
eは、活性金属の融点を下げるとともに接着時のぬれ性
を向上させるため、上記元素のうち少なくとも1種を添
加するが、多く含有するとかえって活性度を低下させる
ため、20原子%以下の含有とする。望ましくは0.1
原子%〜10原子%の含有とする。Group a, Go, Fe, NL, Pci, Rh, B
At least one of the above elements is added to e to lower the melting point of the active metal and improve wettability during adhesion, but if it is contained in a large amount, the activity will be reduced, so the content should not exceed 20 at%. do. Preferably 0.1
The content is from atomic % to 10 atomic %.
b群、Cr 、h 、W 、V 、Nb 、Ta 、l
’tnは、ろう材の活性化を促進するため、上記元素の
うち少なくとも1種を添加するが、多く含有するとかえ
って融点が高くなりすぎるため、20原子%以下の含有
とする。望ましくは0.1原子%〜10原子%の含有と
する。Group b, Cr, h, W, V, Nb, Ta, l
'tn is added with at least one of the above elements in order to promote the activation of the brazing filler metal, but if too much is included, the melting point will become too high, so the content should be 20 at % or less. The content is desirably 0.1 atomic % to 10 atomic %.
0群、〜、Auは、組の融点を下げ、接合部分の靭性を
向上させる働きがあるため、上記元素のうち少なくとも
1種を添加するが、多く含有するとかえって活性度を低
下させるため、30原子%以下の含有とする。望ましく
は0.1原子%〜20原子%の含有とする。最も望まし
くは0.1原子%〜10原子%の含有とする。Group 0, ~, Au has the function of lowering the melting point of the group and improving the toughness of the joint part, so at least one of the above elements is added. The content shall be atomic percent or less. The content is desirably 0.1 atomic % to 20 atomic %. Most preferably, the content is 0.1 atomic % to 10 atomic %.
d群、Sc 、Y 、La族は、ろう材の活性化を促進
するため、上記元素のうち少なくとも1種を添加するが
、多く含有するとろう材を脆くするため、10原子%以
上の含有とする。望ましくは0,1原子%〜5原子%の
含有とする。At least one of the above elements is added to the d group, Sc, Y, and La groups in order to promote the activation of the brazing filler metal. However, if the content is too large, the brazing filler metal becomes brittle, so the content should not exceed 10 at %. do. The content is desirably 0.1 atomic % to 5 atomic %.
8群、B 、SL、Ga 、P 、As 、Sbは、伍
の融点を゛ 下げる働きがあるため、上記元素のう
ち少なくとも1種を添加するが、多く含有するとかえっ
て活性度を低下させるため、15原子%以下の含有とす
る。望ましくは0.1原子%〜10原子%の含有とする
。Group 8, B, SL, Ga, P, As, and Sb have the function of lowering the melting point of 5, so at least one of the above elements is added; The content shall be 15 atomic % or less. The content is desirably 0.1 atomic % to 10 atomic %.
1群、# 、Ga 、In 、Sn 、Cd 、Znは
、非晶質化を促進するため、上記元素のうち少な(とも
1種を添加するが、多く含有するとかえって活性度を低
下させるため、10原子%以下の含有とする。望ましく
は0.1原子%〜5原子%の含有とする。 −また、
上記各群は、各々の含有制限内で単独あるいは2群以上
複合して含有させても有効に働くが、各群の組み合せに
よって、これらの総量が30原子%を越えると、活性度
を低下させたり、非晶質化を妨げるため、上限を30原
子%とする。Group 1, #, Ga, In, Sn, Cd, and Zn are added with a small amount (or one kind) of the above elements in order to promote amorphization, but if they are included in a large amount, the activity is reduced, so The content is 10 atom % or less, preferably 0.1 atom % to 5 atom %.
Each of the above groups works effectively when contained alone or in combination of two or more groups within each content limit, but if the total amount exceeds 30 at% due to the combination of each group, the activity will decrease. The upper limit is set to 30 atom % in order to prevent the content from becoming amorphous.
この発明によるお帯ろう材は可撓性を得るのに十分な微
細結晶質あるいは非晶質を有することを特徴とするが、
箔帯ろう材自体の取り扱いを容易にしかつすぐれた接着
性を得るためには、望ましくは30%以上、さらに望ま
しくは50%以上、最も望ましくは80%以上の非晶質
部分を有するのがよい。The obi brazing material according to the present invention is characterized by having sufficient fine crystallinity or amorphousness to obtain flexibility,
In order to facilitate the handling of the foil strip brazing material itself and to obtain excellent adhesion, it is preferable that the amorphous portion be 30% or more, more preferably 50% or more, and most preferably 80% or more. .
この発明による箔帯ろう材を用いて接着可能な金属及び
セラミックスは、本発明のろう材の融点より高い融点を
有するものであればよく、従来のろう材では接着の困難
なチタン、ジルコニウム。Metals and ceramics that can be bonded using the foil strip brazing material of the present invention may have a melting point higher than that of the brazing material of the present invention, such as titanium and zirconium, which are difficult to bond with conventional brazing materials.
タングステン、モリブデン等、ステンレス鋼、工具鋼、
インバー、コバール等の金属を始め、酸化物系セラミッ
クス、炭化物系セラミックス、窒化物系セラミックス、
リチアセラミックス、チタン酸バリウム系セラミックス
、フェライト系セラミックス等、はとんどすべてのセラ
ミックスに適用できる。Tungsten, molybdenum, etc., stainless steel, tool steel,
In addition to metals such as Invar and Kovar, oxide ceramics, carbide ceramics, nitride ceramics,
It can be applied to almost all ceramics such as lithium ceramics, barium titanate ceramics, and ferrite ceramics.
この発明による箔帯のろう材を得る方法は、所定組成の
溶融体を約り05℃/秒の速度で冷却する周知の技術が
利用でき、例えば、高速回転する金属製ドラムの表面に
溶融体をガス圧力で噴き付(プ、104〜b
り箔帯が得られる。また一対の金属ドラムを逆回転で対
向接触させて3速回転させ、このドラムの対抗面に溶融
体を噴き付ける方法でもよく、また、金属ドラム表面へ
の噴き付けのほか、高速回転する円筒内面に噴きつける
方法も利用できる。The method for obtaining the brazing filler metal of the foil strip according to the present invention can utilize the well-known technique of cooling a molten material of a predetermined composition at a rate of about 0.5° C./sec. A foil strip can be obtained by spraying with gas pressure (104-b).Also, a method can be used in which a pair of metal drums are rotated in opposite directions and are brought into contact with each other, rotated at 3rd speed, and the molten material is sprayed onto the opposing surfaces of the drums. In addition to spraying onto the surface of a metal drum, it is also possible to spray onto the inner surface of a cylinder rotating at high speed.
ろう付は方法を説明すると、例えば、セラミックス基体
と金属部Mの接合予定面の間に、この接合面の形状に応
じて切断、プレス成型した箔帯を挾装し、両者を一体に
保持し、゛ 約IX10−3mmHQ以下の真空中、不
活性ガス中、あるいは乾燥水素中のごとき還元性雰囲気
中で、挾装した箔帯ろう材料の融点以上で被接着物の融
点以下の温度範囲で加熱し、その後冷却して接着を完了
する。To explain the brazing method, for example, a foil strip cut and press-molded according to the shape of this joint surface is inserted between the surfaces to be joined between the ceramic base and the metal part M, and the two are held together. ,゛ Heating in a reducing atmosphere such as a vacuum of about IX10-3 mmHQ or less, an inert gas, or dry hydrogen at a temperature range above the melting point of the sandwiched foil strip brazing material and below the melting point of the adherend. and then cooled to complete the bonding.
また、加熱温度は上記温度範囲で高いほうが、その保持
時間は5分〜20分程度の短時間のほうが、より高い接
着強度を得ることができる。Furthermore, higher adhesive strength can be obtained when the heating temperature is higher within the above temperature range and when the holding time is shorter, such as from about 5 minutes to 20 minutes.
実施例
実施例1
所定の組成を有する合金を、アルゴンガス雰囲気中で高
周波溶融し、高速で回転する鋼製のロールの外周面上に
、アルゴンガス圧力で噴出させて約り05℃/秒の速度
で冷却し、厚み20〜60ρ、幅約15n+mのリボン
を37種作製した。Examples Example 1 An alloy having a predetermined composition is high-frequency melted in an argon gas atmosphere, and is ejected under argon gas pressure onto the outer peripheral surface of a steel roll rotating at high speed at a rate of approximately 05°C/sec. By cooling at a high speed, 37 kinds of ribbons having a thickness of 20 to 60 ρ and a width of about 15 nm+m were produced.
各リボン状の箔帯ろう材の組成は、第1表に示すとおり
であり、その多くは実質的に非晶質合金からなり、一部
は非晶質と結晶質の混合物(5,8゜22.30,32
,33.34)及び微細結晶質(36,37>であった
。The composition of each ribbon-shaped foil brazing filler metal is as shown in Table 1, most of which consists essentially of an amorphous alloy, and some of which consists of a mixture of amorphous and crystalline materials (5.8° 22.30,32
, 33, 34) and microcrystalline (36, 37).
得られたリボン状ろう材は、づべて直径30mmの棒材
に巻き取ることが可能な可撓性のある箔帯であった。The obtained ribbon-shaped brazing material was a flexible foil strip that could be wound up into a bar with a total diameter of 30 mm.
第1表
試料階 組 成 (原子%)1
丁L 34CLL 662 TiS2
へ50
3 TL60Cu40
4 丁L67Cu33
5 Zr25Cu75
6 Zr40Cu60
7 zr55cu45
8 7、r72Cu28
9 TL 50Zr 10Cu 4010
Ti30HP5CLL6511 Zr4
0HP 5CLL5512 Zr45Ca45
F@1013 Zr 45Cu 45Co 1
014 Zr45Cw45Ni 1015
Zr45Cu45Pd 1016 TL
43Cu47Be1017 Ti 43Cu
52Cr 518 下L43cu52V
519 Ti50Cu40tln102
0 TL50CA40〜1021
Zr50伍40α1022 Ti50
cu40La 5Ce 523 Zr40
Cu60Y 1024’ Zr40Cu60
B 1025 TL55CAL40P 5
26 Ti55Cu40Si 527
丁L55CAL4ON 528
Ti55Cu40Si 529 TL40Z
r 10Cu4ONL 5Cr 530
丁L40Zr 10Cu30Be 10Ao 103
1 Tu5Zr15Cu30SL 5#
532 Zr 45Cu 3ONL 10tl
n 10Sn 533 Zr 40Cah
45Be 5Sn ssi 534 Zr
45H1’ 5Cu3ONL 10Y 5 B 5
35 TLIOCn4ONL 15SL53
6 Ti25cAL60sL 5Sn 10
37 Zr25CLL65El 5ZTl
5実施例2
接着基体に、純度99.8%1.15mmX 15mm
、厚み3mmのアルミナ板を使用し、被接着部材に6m
mX 6mm、厚み、3mmのタフピッチ銅を用い、各
々の接着面をエメリー紙にてI&1000まで研摩した
のち、両者間に第1表の141.2.3の箔帯ろう材を
各々挿入し、sx io −s mmHOの真空下で、
950℃〜1050℃の瀉度奄囲で種々の温度に5分間
保持して接着を行なった。Table 1 Sample floor Composition (atomic%) 1
Ding L 34CLL 662 TiS2
To50 3 TL60Cu40 4 L67Cu33 5 Zr25Cu75 6 Zr40Cu60 7 zr55cu45 8 7, r72Cu28 9 TL 50Zr 10Cu 4010
Ti30HP5CLL6511 Zr4
0HP 5CLL5512 Zr45Ca45
F@1013 Zr 45Cu 45Co 1
014 Zr45Cw45Ni 1015
Zr45Cu45Pd 1016 TL
43Cu47Be1017 Ti 43Cu
52Cr 518 Lower L43cu52V
519 Ti50Cu40tln102
0 TL50CA40~1021
Zr505 40α1022 Ti50
cu40La 5Ce 523 Zr40
Cu60Y 1024' Zr40Cu60
B 1025 TL55CAL40P 5
26 Ti55Cu40Si 527
Ding L55CAL4ON 528
Ti55Cu40Si 529 TL40Z
r 10Cu4ONL 5Cr 530
Ding L40Zr 10Cu30Be 10Ao 103
1 Tu5Zr15Cu30SL 5#
532 Zr 45Cu 3ONL 10tl
n 10Sn 533 Zr 40Cah
45Be 5Sn ssi 534 Zr
45H1' 5Cu3ONL 10Y 5 B 5
35 TLIOCn4ONL 15SL53
6 Ti25cAL60sL 5Sn 10
37 Zr25CLL65El 5ZTl
5 Example 2 Adhesive substrate with purity 99.8% 1.15 mm x 15 mm
, using an alumina plate with a thickness of 3 mm, and a 6 m long
Using tough pitch copper with mX 6mm and thickness of 3mm, each adhesive surface was polished to I&1000 with emery paper, and the foil strip brazing filler metal of 141.2.3 in Table 1 was inserted between the two, and sx Under vacuum of io −s mm HO,
Bonding was carried out by holding at various temperatures for 5 minutes under a temperature range of 950°C to 1050°C.
接着後の接着基体と被接着部材を逆方向に引張り、この
ときの剪断破壊応力を測定した。結果は第1図に、陽1
箔帯ろう材をx印、陽2をΔ印、lV&13を○印でそ
れぞれ示す。ちなみに、上記の加熱冷却を施した同アル
ミナ板の剪断破壊強度は約1014fJであった。After adhesion, the adhesive substrate and the adhered member were pulled in opposite directions, and the shear fracture stress at this time was measured. The results are shown in Figure 1.
The foil strip brazing material is indicated by x, positive 2 is indicated by Δ, and lV & 13 is indicated by ○. Incidentally, the shear fracture strength of the same alumina plate subjected to the heating and cooling described above was about 1014 fJ.
第1図から明らかなように、この発明による箔帯のろう
材で接着したものは基体のアルミナ板と同等の強度が得
られたことがわかる。また、上記3種のろう材は、Th
の含有鉛が多いほど接着強度が高いことがわかる。As is clear from FIG. 1, it can be seen that the foil strip according to the present invention bonded with a brazing material had the same strength as the alumina plate of the base. In addition, the above three types of brazing filler metals are Th
It can be seen that the higher the lead content, the higher the adhesive strength.
実施例3
接着基体に、純度99.8%、15mmX15mm、厚
み3配のアルミナ板を使用し、被接着部材に6mmX6
mm、厚み3mmのタフピッチ銅を用い、各々の接着面
をエメリー紙にてbioooまで研摩したのら、両者間
に第1表の陽2の箔帯ろう材を挿入し、5×10−5m
mHoの真空下で、950℃〜1050℃の温度範囲で
種々の温度に5分間保持して接着を行なった。Example 3 An alumina plate with a purity of 99.8%, 15 mm x 15 mm, and three thicknesses was used as the bonding substrate, and a 6 mm x 6 plate was used as the bonded member.
Using tough pitch copper with a thickness of 3 mm, each adhesive surface was polished to biooo with emery paper, and a foil strip brazing filler metal shown in Table 1, positive 2, was inserted between the two, and a 5 x 10-5 m
Bonding was carried out under mHo vacuum by holding various temperatures in the temperature range of 950° C. to 1050° C. for 5 minutes.
また、比較のため、この発明によるIVb、 2の箔帯
ろう材と同組成のへ粉とT、粉(ともに300メツシユ
の粉)との混合粉を有機バインダーでペースト状となし
た従来のろう材を用いて同条件で接着を行なった。For comparison, a conventional brazing material was prepared in which a mixed powder of foil brazing material IVb and 2 of the present invention and a powder having the same composition and T powder (both 300 mesh powder) was made into a paste form with an organic binder. Bonding was performed using the same materials under the same conditions.
接着後の接着基体と被接着部材を逆方向に引張り、この
ときの剪断破壊応力を測定した。結果は第2図に、本発
明箔帯ろう材の場合をΔ印、従来のペースト状の場合を
・印でそれぞれ示す。After adhesion, the adhesive substrate and the adhered member were pulled in opposite directions, and the shear fracture stress at this time was measured. The results are shown in FIG. 2, where Δ indicates the case of the foil strip brazing material of the present invention, and ・ indicates the case of the conventional paste-like brazing material.
第2図から明らかなように、この発明による箔帯のろう
材を使用して接着を施した方が接着強度が高いことがわ
かる。これは、箔帯ろ″う材が従来のペースト状ろう材
に比較して、緻密なこと、酸化物等の不純物が著しく少
ないためであると考えられる。As is clear from FIG. 2, it can be seen that the bonding strength is higher when bonding is performed using the brazing filler metal of the foil strip according to the present invention. This is thought to be because the foil strip brazing material is denser and contains significantly less impurities such as oxides than conventional paste brazing material.
実施例4
接着基体に、15mm X 15mm 、厚み3胴の第
2表に示すセラミックス板を使用し、被接着部材にsm
mX6mm、厚み3mmの第2表に示すセラミックス板
を用い、各々の接着面をエメリー紙にて1ioooまで
研摩したのち、両者間に第2表に示す箔帯ろう材を挿入
し、5X10−5mmHOの真空下で、900℃〜12
00℃の温度範囲で種々の温度に5分間保持して接着を
行なう接着試験を12組実施した。Example 4 A ceramic plate shown in Table 2, measuring 15 mm x 15 mm and having a thickness of 3 cylinders, was used as the adhesive base, and the adhered member was sm
Using the ceramic plates shown in Table 2 with a size of 6 mm x 6 mm and a thickness of 3 mm, each adhesive surface was polished to 1iooo with emery paper, and a foil strip brazing filler metal shown in Table 2 was inserted between them, and a 5 x 10-5 mm HO plate was used. Under vacuum, 900℃~12
Twelve sets of adhesion tests were conducted in which adhesives were bonded by holding them at various temperatures in the temperature range of 00°C for 5 minutes.
接着後の接着基体と被接着部材を逆方向に引張り、この
ときの剪断破壊応力を測定した。結果は各接着基体、被
接着部材のセラミックス種、箔帯陽、接着温度、ととも
に第2表に示す。After adhesion, the adhesive substrate and the adhered member were pulled in opposite directions, and the shear fracture stress at this time was measured. The results are shown in Table 2, along with the adhesive substrates, ceramic types of the members to be adhered, foil band thickness, and adhesion temperatures.
第2表により、この発明による箔帯ろう材は多種組み合
せのセラミックスの接着が可能でかつ高い接着強度を得
ていることがわかる。Table 2 shows that the foil strip brazing material according to the present invention is capable of bonding various combinations of ceramics and has high bonding strength.
第2表
[接
ア
ジ
ブ
ブ
ブ
ク
j・
以下余白
実施例5
接着基体に、15mmX15mm、厚み3mmの第3表
A。Table 2 [Contact Adhesive] Example 5 Table 3 A with 15 mm x 15 mm and 3 mm thickness on the adhesive substrate.
Bに示すセラミックス板を使用し、被接着部材にsmm
’x 6mm、厚み3mmの第3表A、Bに示す金属板
を用い、各々の接着面をエメリー紙にてrbioo。Use the ceramic plate shown in B, and attach smm to the adhered member.
Using the metal plates shown in Table 3 A and B, each measuring 6 mm x 3 mm and 3 mm thick, each adhesive surface was covered with emery paper.
まで研摩したのち、両者間に第3表A、Bに示す箔帯ろ
う材を挿入し、乾燥水素中または 5×10−5mm
H(Jの真空下で、各々900℃〜1150℃の温度範
囲で種々の温度に10分間保持して接着を行なう接着試
験を42組実施した。After polishing to the desired temperature, a foil strip brazing filler metal shown in Table 3 A and B is inserted between the two, and heated in dry hydrogen or 5 x 10-5 mm.
42 sets of adhesion tests were carried out in which bonding was carried out by holding each sample at various temperatures in the temperature range of 900° C. to 1150° C. for 10 minutes under a vacuum of H (J).
接着後の接着基体と被接着部材を逆方向に引張り、この
ときの剪断破壊応力を測定した。結果は、雰囲気が乾燥
水素中の場合を第3表Aに、真空中の場合を第3表Bに
、各接着基体、被接着部材のセラミックス及び金属種、
箔帯比、接着温度、とともに示す。After adhesion, the adhesive substrate and the adhered member were pulled in opposite directions, and the shear fracture stress at this time was measured. The results are shown in Table 3 A for the case where the atmosphere is in dry hydrogen, and Table 3 B for the case in vacuum.
It is shown together with the foil band ratio and adhesion temperature.
第3表A、Bにより、この発明による箔帯ろう材は多種
組み合せのセラミックスと金属の接着が可能でかつ高い
接着強度を得ていることがわかる。From Tables A and B, it can be seen that the foil strip brazing material according to the present invention is capable of adhering various combinations of ceramics and metals and has high adhesion strength.
なお、実施例に使用した各セラミックス板の気孔率は、
アルミナ 0%、ジルコニア 約20%、炭化珪素 0
.5%、炭化チタン(サーメット)0%、窒化珪素 約
23%、窒化チタン 0%、チタン酸バリウム 約1%
、チタン酸カルシウム約1%、グラファイト 約19%
であった。The porosity of each ceramic plate used in the examples is
Alumina 0%, Zirconia approx. 20%, Silicon Carbide 0
.. 5%, titanium carbide (cermet) 0%, silicon nitride approximately 23%, titanium nitride 0%, barium titanate approximately 1%
, Calcium titanate approx. 1%, Graphite approx. 19%
Met.
以下余白
第3表A
第3表B
注 *は接着後にセラミックス接着基体にクラックが生
じた。Margins below Table 3 A Table 3 B Note *: Cracks occurred in the ceramic bonded substrate after bonding.
第1図、第2図は温度と剪断破壊応力との関係を示すグ
ラフであり、それぞれ実施例2と実施例3の場合を示す
。
出願人 岡本郁男
同 奈賀正明
同 荒m吉明
同 川惣電材工業株式会社
同 住友特殊金属株式会社
代理人 押 1) 良 久層、″l!侶t第1図
900 950 1000 10
50第2図
吹田市南吹田2丁目19−1住友
特殊金属株式会社吹田製作所内
0出 願 人 奈賀正明
吹田市円山町30−6
■出 願 人 荒田吉明
尼崎市武庫荘3丁目13番の11
0出 願 人 川惣電材工業株式会社
大阪市西区西本町1丁目7番10
号
■出 願 人 住友特殊金属株式会社
大阪市東区北浜5丁目22番FIGS. 1 and 2 are graphs showing the relationship between temperature and shear fracture stress, and show the cases of Example 2 and Example 3, respectively. Applicants: Ikuo Okamoto, Masaaki Naga, Yoshiaki Aram, Kawaso Electric Materials Co., Ltd., Sumitomo Special Metals Co., Ltd., Agent 1) Yoshihisa, “l!
50 Figure 2 Sumitomo Special Metals Co., Ltd. Suita Works, 2-19-1 Minami Suita, Suita City 0 Applicant Masaaki Naga 30-6 Maruyama-cho, Suita City Applicant Yoshiaki Arata 3-13-11 Mukosho, Amagasaki City 0Applicant Kawaso Electric Materials Co., Ltd. 1-7-10 Nishihonmachi, Nishi-ku, Osaka ■Applicant Sumitomo Special Metals Co., Ltd. 5-22 Kitahama, Higashi-ku, Osaka
Claims (1)
〜75原子%含有し、残部 侮及び不可避的不純物から
なるろう付は用液体急冷合金箔帯。 2 Tj、 Zr、 Hrのうち少なくとも1種を2
5原子%〜75原子%、下記群のうち各群の制限内で少
なくとも1群を選択し合31で30原子%以下、20原
子%を越える伍、及び不可避的不純物との総量で、10
0原子%となるろう付Gノ用液体急冷合金箔帯。 a Co 、Fe 、Ni 、Pd 、Rh 、−の
うち少なくとも1種を20原子%以下、 b Cr 、Mo 、W 、V 、Nb 、Ta 、
Mnのうち少なくとも1種を20原子%以下、 CAg、Auのうち少なくとも1種を30原子%以下、 dsc、Y、La族のうち少なくとも1種を10原子%
以下、 8 B 、SL 、Ge 、P 、As 、Sb
のうち少なくとも1種を15原子%以下、 f M 、、Ga 、In 、Si 、Cd 、Zn
のうち少なくとも1種を10原子%以下。[Claims] 25 atomic % of at least one of ITL, Zy, and HP
A liquid quenched alloy foil strip containing up to 75 atomic percent, with the remainder consisting of oxidation and unavoidable impurities. 2 At least one of Tj, Zr, and Hr is 2
5 atomic % to 75 atomic %, selected from at least one group within the limits of each group from the following groups, 31% or less, exceeding 20 atomic %, and unavoidable impurities in a total amount of 10
Liquid quenched alloy foil strip for brazing G with 0 atomic %. a At least one of Co, Fe, Ni, Pd, Rh, - at 20 atomic % or less, b Cr, Mo, W, V, Nb, Ta,
At least one of Mn is 20 atomic % or less, at least one of CAg and Au is 30 atomic % or less, and at least one of dsc, Y, and La group is 10 atomic %
Below, 8 B, SL, Ge, P, As, Sb
At least one of the following at 15 atomic % or less, f M , Ga, In, Si, Cd, Zn
At least one of these in an amount of 10 atomic % or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58002962A JPH0717975B2 (en) | 1983-01-11 | 1983-01-11 | Amorphous alloy foil strip for brazing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58002962A JPH0717975B2 (en) | 1983-01-11 | 1983-01-11 | Amorphous alloy foil strip for brazing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59126739A true JPS59126739A (en) | 1984-07-21 |
JPH0717975B2 JPH0717975B2 (en) | 1995-03-01 |
Family
ID=11543989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58002962A Expired - Lifetime JPH0717975B2 (en) | 1983-01-11 | 1983-01-11 | Amorphous alloy foil strip for brazing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0717975B2 (en) |
Cited By (33)
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JPS61126992A (en) * | 1984-11-26 | 1986-06-14 | Nippon Kinzoku Kogyo Kk | Brazing filler metal for joining zirconia and stainless steel |
JPS6286833A (en) * | 1985-10-14 | 1987-04-21 | Hitachi Ltd | Ceramic package for placing semiconductor substrate and manufacturing thereof |
JPS6379928A (en) * | 1986-09-24 | 1988-04-09 | Mitsui Eng & Shipbuild Co Ltd | Highly corrosion-resistant amorphous alloy |
JPS63169348A (en) * | 1986-12-29 | 1988-07-13 | Teikoku Piston Ring Co Ltd | Amorphous alloy foil for jointing ceramics |
JPS63273592A (en) * | 1987-04-30 | 1988-11-10 | Daido Steel Co Ltd | Ti brazing material |
FR2616447A1 (en) * | 1987-06-15 | 1988-12-16 | Inst Sverkhtverdykh Mat | COPPER-BASED METAL BINDER FOR THE FABRICATION OF THE ACTIVE LAYER OF AN ABRASIVE TOOL |
JPS63309394A (en) * | 1987-06-09 | 1988-12-16 | Daido Steel Co Ltd | Brazing material |
EP0350735A1 (en) * | 1988-07-11 | 1990-01-17 | Lonza Ag | Cu-Zr brazing foil |
JPH0292872A (en) * | 1988-09-28 | 1990-04-03 | Kyocera Corp | Bonding between ceramic material and copper material |
JPH02155594A (en) * | 1988-12-07 | 1990-06-14 | Meidensha Corp | Alloy brazing material |
JPH02155593A (en) * | 1988-12-07 | 1990-06-14 | Meidensha Corp | Powder brazing material |
JPH04254538A (en) * | 1991-02-01 | 1992-09-09 | Masanobu Tachibana | Corrosion-resistant copper alloy |
KR20020061584A (en) * | 2002-07-09 | 2002-07-24 | 나노기술개발(주) | The brazing process on the low temperature between ceramics and metal using nano composite particles |
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US6475637B1 (en) * | 2000-12-14 | 2002-11-05 | Rohr, Inc. | Liquid interface diffusion bonded composition and method |
EP1354976A1 (en) * | 2000-12-27 | 2003-10-22 | Japan Science and Technology Corporation | Cu-base amorphous alloy |
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Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH042354B2 (en) * | 1984-11-26 | 1992-01-17 | ||
JPS61126992A (en) * | 1984-11-26 | 1986-06-14 | Nippon Kinzoku Kogyo Kk | Brazing filler metal for joining zirconia and stainless steel |
JPS6286833A (en) * | 1985-10-14 | 1987-04-21 | Hitachi Ltd | Ceramic package for placing semiconductor substrate and manufacturing thereof |
JPS6379928A (en) * | 1986-09-24 | 1988-04-09 | Mitsui Eng & Shipbuild Co Ltd | Highly corrosion-resistant amorphous alloy |
JPH0465897B2 (en) * | 1986-09-24 | 1992-10-21 | Mitsui Zosen Kk | |
JPS63169348A (en) * | 1986-12-29 | 1988-07-13 | Teikoku Piston Ring Co Ltd | Amorphous alloy foil for jointing ceramics |
JPS63273592A (en) * | 1987-04-30 | 1988-11-10 | Daido Steel Co Ltd | Ti brazing material |
JPS63309394A (en) * | 1987-06-09 | 1988-12-16 | Daido Steel Co Ltd | Brazing material |
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