JPH04270094A - Brazing material - Google Patents
Brazing materialInfo
- Publication number
- JPH04270094A JPH04270094A JP4030691A JP4030691A JPH04270094A JP H04270094 A JPH04270094 A JP H04270094A JP 4030691 A JP4030691 A JP 4030691A JP 4030691 A JP4030691 A JP 4030691A JP H04270094 A JPH04270094 A JP H04270094A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- brazing material
- paste
- weight
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 46
- 238000005219 brazing Methods 0.000 title claims abstract description 44
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 5
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 5
- 239000003960 organic solvent Substances 0.000 claims description 8
- 238000004898 kneading Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 150000002484 inorganic compounds Chemical class 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 10
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 150000002739 metals Chemical class 0.000 abstract description 6
- 239000010949 copper Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- -1 B4 O7 ・5H2 O Chemical class 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910003887 H3 BO3 Inorganic materials 0.000 description 1
- 229910004039 HBF4 Inorganic materials 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】この発明は、ろう付用材料に関す
るものである。さらに詳しくは、この発明は、金属、合
金またはセラミックスの同種あるいは異種同士の材料接
合に有用な新しいろう付用材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to brazing materials. More specifically, the present invention relates to a new brazing material useful for joining similar or dissimilar metals, alloys, or ceramics.
【0002】0002
【従来の技術】従来より、金属、合金またはセラミック
スの同種あるいは異種同士の材料接合に際しては、一般
的にろう付が行われており、そのための材料がこれまで
に多種多様に開発されてきている。このようなろう付材
料の中で、たとえば銀ろうとりん銅ろうは、ろう付に広
く用いられてきており、ろう付用材料の中でも一般的な
ものとして知られているものである。これらの銀ろうお
よびりん銅ろうは、JISに規格化されており、銀ろう
はJISZ.3261に、また銅ろうはJISZ.32
64にまとめられている。[Prior Art] Brazing has been commonly used to join materials of the same or different types such as metals, alloys, or ceramics, and a wide variety of materials have been developed for this purpose. . Among such brazing materials, for example, silver solder and phosphorous solder have been widely used for brazing, and are known as common brazing materials. These silver solders and phosphor solders are standardized by JIS, and silver solders are standardized by JISZ. 3261, and copper solder is JISZ. 32
It is summarized in 64.
【0003】0003
【発明が解決しようとする課題】しかしながら、このよ
うな従来のろう付用材料については、銅、鉄、ステンレ
ス、Ni基合金等の金属または合金の接合の場合には有
効となっているものの、セラミックス材料同士の接合や
金属材料とセラミックス材料との接合などの場合には、
接合強度が充分でなく、しかも濡れ性が悪いという欠点
がある。特に、金属材料とセラミックス材料の接合の場
合には、金属とセラミックスが反応し、脆化層を形成す
るという問題があった。このため、金属−セラミックス
接合に際しては、金属材料表面を緻密な酸化膜で被覆し
た後にろう付を行わなければならなかった。しかしなが
ら、金属材料表面に緻密で、かつ密着性の良好な酸化膜
を形成することは、実質的に難しく、また、その作業は
面倒であり、効率も悪かった。[Problems to be Solved by the Invention] However, although these conventional brazing materials are effective for joining metals or alloys such as copper, iron, stainless steel, and Ni-based alloys, In the case of joining ceramic materials to each other or joining metal materials to ceramic materials,
It has the drawbacks of insufficient bonding strength and poor wettability. In particular, in the case of joining metal materials and ceramic materials, there has been a problem in that the metal and ceramics react and form a brittle layer. For this reason, when joining metal-ceramics, it is necessary to coat the surface of the metal material with a dense oxide film and then perform brazing. However, it is substantially difficult to form a dense oxide film with good adhesion on the surface of a metal material, and the work is troublesome and inefficient.
【0004】一方、セラミックスろう付用の材料として
、これまでにAg−Ti系、Ag−Ti,Cu系、Ti
,Ni系のろう付材料が提案されてきているが、実際の
使用には未だ改善すべき課題が少なくないのが実情であ
った。この発明は、以上の通りの事情に鑑みてなされた
ものであり、従来のろう付用材料の欠点を解消し、金属
、合金またはセラミックスの同種あるいは異種同士の材
料接合に有用な、真空または雰囲気下での接合に用いる
ことのできるろう付用材料を提供することを目的として
いる。On the other hand, as materials for ceramic brazing, Ag-Ti type, Ag-Ti, Cu type, Ti
, Ni-based brazing materials have been proposed, but the reality is that there are still many problems that need to be improved in actual use. This invention was made in view of the above circumstances, and it solves the drawbacks of conventional brazing materials and provides a vacuum or atmosphere brazing material useful for joining materials of the same type or different types such as metals, alloys, or ceramics. The purpose of the present invention is to provide a brazing material that can be used for bonding underneath.
【0005】[0005]
【課題を解決するための手段】この発明は、上記の課題
を解決するものとして、Zr,Mg,B,Mm(希土類
元素の混合物)の1種以上を5重量%以下含有し、残部
がAgおよびCuからなり、かつAgを0〜95重量%
含有させてなることを特徴とするろう付用材料を提供す
る。[Means for Solving the Problems] This invention solves the above problems by containing 5% by weight or less of one or more of Zr, Mg, B, and Mm (a mixture of rare earth elements), and the balance being Ag. and Cu, and contains 0 to 95% by weight of Ag.
Provided is a brazing material characterized by containing:
【0006】この発明のろう付用材料は、ベースがAg
およびCuからなる材料に、特定の活性元素、すなわち
Zr,Mg,B,Mm(希土類元素の混合物)を1種以
上含有させることによって、セラミックス材料との濡れ
性を改善するとともに、金属材料とセラミックス材料と
の反応を防止する。このZr,Mg,BおよびMm(希
土類元素の混合物)は、セラミックスと反応して化学的
結合を形成する。一般的含有量が0.05%未満では、
その結合力は充分でなく、5%を越えると生成する反応
層が脆くなり、逆に結合力を低下させてしまう。このた
め、これらの元素の含有量は、好ましくは0.05〜5
%とする。[0006] The brazing material of the present invention has a base of Ag.
By incorporating one or more specific active elements, namely Zr, Mg, B, and Mm (a mixture of rare earth elements) into a material consisting of Cu and Cu, it improves the wettability with ceramic materials, and improves the wettability between metal materials and ceramics. Prevent reactions with materials. This Zr, Mg, B and Mm (a mixture of rare earth elements) reacts with the ceramic to form a chemical bond. If the general content is less than 0.05%,
The bonding force is not sufficient, and if it exceeds 5%, the resulting reaction layer will become brittle, and the bonding force will be reduced. Therefore, the content of these elements is preferably 0.05 to 5
%.
【0007】一方、ベースをAgおよびCuとしている
ため、加工が容易となり、薄板、線材、粉末等の任意の
形状に加工することが可能となる。Ag量としては、0
〜95重量%の範囲とすることができる。またこの発明
においては、融点の調整、濡れ性および強度の向上、ま
た、耐食性の向上のために、V,Cr,Co,Ni,Z
n,Pd,Cd,In,Sn,Sb,Ti,Si,P,
Mnの1種以上を合計で1〜50重量%の範囲で添加す
ることができる。On the other hand, since the base is made of Ag and Cu, it is easy to process, and it is possible to process it into any shape such as a thin plate, wire, powder, etc. The amount of Ag is 0
95% by weight. In addition, in this invention, in order to adjust the melting point, improve wettability and strength, and improve corrosion resistance, V, Cr, Co, Ni, Z
n, Pd, Cd, In, Sn, Sb, Ti, Si, P,
One or more types of Mn can be added in a total amount of 1 to 50% by weight.
【0008】たとえば以上のような組成からなるろう付
用材料は、従来のTi−Ni系、Ag−Ti系等のろう
付用材料に比べ加工が容易であり、表1に示したように
、融点が600〜800℃程度(Ti−Ni系は900
〜1100℃)と低く、また、ろう付作業も簡便かつ容
易となり、熱歪も小さいという優れた特徴を有している
。For example, brazing materials having the compositions described above are easier to process than conventional brazing materials such as Ti--Ni and Ag--Ti, and as shown in Table 1, The melting point is about 600 to 800℃ (Ti-Ni is 900℃)
~1100°C), and also has the excellent characteristics of making brazing work simple and easy, and having small thermal distortion.
【0009】さらにまたこの発明においては、上記した
組成からなる粉末を利用し、これを樹脂および有機系溶
媒、または無機化合物フラックスおよび有機系溶媒と混
合、混練させて、ペースト状にすることも可能である。
特に、この発明においては、このペースト状ろう付用材
料として、Tiを5重量%以下含有し、残部がAgおよ
びCuからなり、かつAgが0〜95重量%の組成から
なる粒径250μm以下の粉末に、樹脂および有機系溶
媒を添加・混練し、ペースト状にしてなることを特徴と
するろう付用材料をも提供するものである。Furthermore, in the present invention, it is also possible to make a paste by using a powder having the above composition and mixing and kneading it with a resin and an organic solvent, or an inorganic compound flux and an organic solvent. It is. In particular, in the present invention, the paste-like brazing material contains 5% by weight or less of Ti, the balance consists of Ag and Cu, and has a composition of 0 to 95% by weight of Ag, and has a particle size of 250 μm or less. The present invention also provides a brazing material characterized in that it is made into a paste by adding and kneading a resin and an organic solvent to powder.
【0010】このようにペースト状とすることによって
、ディスペンサー等の容器に入れることができ、しかも
使用時に適当量を空気圧等で自動吐出供給することがで
きる。また、スクリーン印刷することも可能となり、必
要箇所に自動的に印刷することができる。さらには、複
雑形状部分や微小部分のろう付も簡便かつ容易に行うこ
とができる。[0010] By forming the paste into a paste form as described above, it can be placed in a container such as a dispenser, and moreover, an appropriate amount can be automatically dispensed using air pressure or the like when used. In addition, screen printing is also possible, and printing can be done automatically where necessary. Furthermore, it is possible to simply and easily braze parts with complex shapes or minute parts.
【0011】粉末の粒径としては、前記のTiの場合の
ように、一般的に250μm以下とするのが好ましく、
150μm程度がより好ましい。250μmより大きい
と均一な混練が困難となる。スクリーン印刷をするよう
な場合には50μm以下が好ましい。また、この場合に
使用することのできる樹脂としては、アクリル樹脂、メ
チルセルロース、エチルセルロース、ニトロセルロース
、ポリイミド、ポリメタクリレート等を例示することが
でき、有機系溶媒としては、アルコール、アセトン、ト
ルエン、キシレン、テルピネオール、ブチルカルビトー
ルやそのアセテート類などとすることができる。スクリ
ーン印刷をするような場合には50μm以下が好ましい
。The particle size of the powder is generally preferably 250 μm or less, as in the case of Ti,
More preferably, the thickness is about 150 μm. If it is larger than 250 μm, uniform kneading becomes difficult. In the case of screen printing, the thickness is preferably 50 μm or less. In addition, examples of resins that can be used in this case include acrylic resin, methyl cellulose, ethyl cellulose, nitrocellulose, polyimide, and polymethacrylate, and examples of organic solvents include alcohol, acetone, toluene, xylene, Examples include terpineol, butyl carbitol, and their acetates. In the case of screen printing, the thickness is preferably 50 μm or less.
【0012】一方、無機化合物フラックスとしては、L
iCl,MgCl2等の塩化物、H3 BO3 ,K2
B4 O7 ・5H2 O等のホウ酸塩、HBF4,
NaF等のホウフッ化物やフッ化物、KBr等の臭化物
などを主に用いることができる。このようなフラックス
は、接合表面の清浄化とともに、ろう付温度以下で軟化
・溶融し、濡れ性を確保するという作用効果がある。ま
た、ろう付雰囲気下でのろう付用材料の酸素等による劣
化を防止する作用効果も有している。On the other hand, as an inorganic compound flux, L
Chlorides such as iCl, MgCl2, H3 BO3, K2
Borates such as B4 O7 ・5H2 O, HBF4,
Borofluorides and fluorides such as NaF, bromides such as KBr, etc. can mainly be used. Such a flux has the effect of cleaning the joint surface, softening and melting at a temperature below the brazing temperature, and ensuring wettability. It also has the effect of preventing deterioration of the brazing material due to oxygen, etc. in a brazing atmosphere.
【0013】[0013]
【実施例】以下実施例を示し、この発明のろう付用材料
についてさらに詳しく説明する。
実施例1,比較例1
表1に示した試料No3の組成からなるろう付用材料(
粒径250μm以下)を用い、アクリル樹脂をトルエン
で溶かした溶媒中に、粉末8、溶媒2の割合で混合・混
練し、ペースト状にした。EXAMPLES The brazing material of the present invention will be explained in more detail with reference to Examples below. Example 1, Comparative Example 1 Brazing material consisting of the composition of sample No. 3 shown in Table 1 (
(particle size of 250 μm or less) was mixed and kneaded in a solvent prepared by dissolving acrylic resin in toluene at a ratio of 8 parts powder and 2 parts solvent to form a paste.
【0014】[0014]
【表1】[Table 1]
【0015】次いで、図1に示したように、このペース
ト(1)をアルミナ基板(2)に塗布した後に、ペース
ト(1)の上に20×40mm角で厚さ1mmの42N
i板(3)を乗せ、そのまま810℃で30分間保持し
て接合した。比較のために、同一のアルミナ板上にJI
SZ.3621のペースト状の72Ag−8Cuろう材
を塗布し、この上に同一形状の42Ni板を接合した。Next, as shown in FIG. 1, after applying this paste (1) to an alumina substrate (2), a 42N layer of 20 x 40 mm square and 1 mm thick is placed on the paste (1).
The i-plate (3) was placed on the plate and held at 810° C. for 30 minutes to bond. For comparison, JI was placed on the same alumina plate.
SZ. A paste-like 72Ag-8Cu brazing material of 3621 was applied, and a 42Ni plate of the same shape was bonded thereon.
【0016】この発明のろう付用材料を用いた場合には
、完全な接合が得られた。一方、従来のろう付用材料を
用いた場合には、接合部にクラックが生じ、弱い衝撃で
剥離した。
実施例2
表1に示した試料No1の組成からなるろう付用材料の
薄板を用い、図2に示したように、リボン状の薄板(4
)をアルミナパイプ(5)の外周に巻き付け、この上に
コバールパイプ(6)をはめ込んだ後に、Ar雰囲気中
で900℃に加熱し接合した。[0016] A complete joint was obtained using the brazing material of the present invention. On the other hand, when conventional brazing materials were used, cracks occurred in the joints and peeled off due to weak impacts. Example 2 Using a thin plate of a brazing material having the composition of sample No. 1 shown in Table 1, a ribbon-shaped thin plate (4
) was wound around the outer periphery of the alumina pipe (5), and the Kovar pipe (6) was fitted thereon, and then heated to 900° C. in an Ar atmosphere to join them.
【0017】接合部分に割れ等が発生せず、完全に密着
していた。
実施例3
Ag71%−Cu27%−Ti2%合金の100メッシ
ュ(150μm)以下の粉末94部にアクリル樹脂6部
と溶剤としてのブチルカルビトールアセテートを適量添
加し、十分に混練してペースト状とした。[0017] No cracks or the like occurred in the joint, and the joint was completely adhered. Example 3 6 parts of acrylic resin and an appropriate amount of butyl carbitol acetate as a solvent were added to 94 parts of 100 mesh (150 μm) or less powder of Ag71%-Cu27%-Ti2% alloy, and the mixture was sufficiently kneaded to form a paste. .
【0018】このペーストをアルミナの円板上に置き、
その上からアルミナパイプを乗せてAr気流中で900
℃、1000℃の各々の温度で20分加熱してろう付を
行った。いずれの温度条件の時にも、良好な濡れと接合
性が得られた。
比較例2
Ag70%−Cu28%合金を使用する以外は実施例3
と同様にして、900℃、1000℃で接合しようとし
たが、いずれの場合にも接合は不可能であった。Place this paste on an alumina disk,
Place an alumina pipe on top of it and heat it to 900°C in an Ar air flow.
Brazing was performed by heating at temperatures of 1000°C and 1000°C for 20 minutes. Good wetting and bonding properties were obtained under all temperature conditions. Comparative Example 2 Example 3 except for using 70% Ag-28% Cu alloy
Similar attempts were made to bond at 900° C. and 1000° C., but bonding was impossible in both cases.
【0019】もちろんこの発明は、以上の例によって限
定されるものではない。ろう付用材料の化学組成、混合
・混練する樹脂および有機系溶媒の種類、金属およびセ
ラミックス材料の種類、形状および大きさ等の細部につ
いては様々な態様が可能であることはいうまでもない。Of course, the invention is not limited to the above examples. It goes without saying that various embodiments are possible with respect to details such as the chemical composition of the brazing material, the types of resins and organic solvents to be mixed and kneaded, and the types, shapes and sizes of the metal and ceramic materials.
【0020】[0020]
【発明の効果】以上詳しく説明した通り、この発明によ
って、金属、合金またはセラミックスの同種あるいは異
種同士の材料接合を確実に行うことのできるろう付用材
料が提供される。接合時のろう付作業が著しく簡便かつ
容易となる。As described in detail above, the present invention provides a brazing material that can reliably join materials of the same or different types such as metals, alloys, or ceramics. Brazing work during joining becomes extremely simple and easy.
【図1】この発明のろう付用材料を用いた接合の一実施
例を示した断面図である。FIG. 1 is a sectional view showing an example of joining using the brazing material of the present invention.
【図2】この発明のろう付用材料を用いた接合の別の例
を示した断面図である。FIG. 2 is a sectional view showing another example of joining using the brazing material of the present invention.
1 ペースト状ろう付用材料 2 アルミナ基板 3 42Ni板 4 薄板状ろう付用材料 5 アルミナパイプ 6 コバールパイプ 1 Paste brazing material 2 Alumina substrate 3 42Ni plate 4 Thin plate brazing material 5 Alumina pipe 6 Kovar pipe
Claims (5)
混合物)の1種以上を5重量%以下含有し、残部がAg
およびCuからなり、かつAgを0〜95重量%含有さ
せてなることを特徴とするろう付用材料。Claim 1: Contains 5% by weight or less of one or more of Zr, Mg, B, Mm (mixture of rare earth elements), and the balance is Ag.
and Cu, and contains 0 to 95% by weight of Ag.
Cd,In,Sn,Sb,Ti,Si,P,Mnの1種
以上を合計で1〜50重量%添加してなる請求項1のろ
う付用材料。[Claim 2] V, Cr, Co, Ni, Zn, Pd,
2. The brazing material according to claim 1, wherein one or more of Cd, In, Sn, Sb, Ti, Si, P, and Mn is added in a total amount of 1 to 50% by weight.
250μm以下の粉末に、樹脂および有機系溶媒を添加
・混練し、ペースト状にしてなることを特徴とするろう
付用材料。3. A brazing material characterized in that it is made into a paste by adding and kneading a resin and an organic solvent to the powder having the composition according to claim 1 or 2 and having a particle size of 250 μm or less.
gおよびCuからなり、かつAgが0〜95重量%の組
成からなる粒径250μm以下の粉末に、樹脂および有
機系溶媒を添加・混練し、ペースト状にしてなることを
特徴とするろう付用材料。4. Contains 5% by weight or less of Ti, with the balance being A.
A brazing product characterized by being made into a paste by adding and kneading a resin and an organic solvent to a powder having a particle size of 250 μm or less and having a composition of 0 to 95% by weight of Ag and Cu. material.
粒径250μm以下の粉末に、無機化合物フラックスお
よび有機系溶媒を添加・混練し、ペースト状にしてなる
ことを特徴とするろう付用材料。5. A wax characterized in that it is made into a paste by adding and kneading an inorganic compound flux and an organic solvent to the powder having the composition of claim 1, 2, 3, or 4 and having a particle size of 250 μm or less. Material for attachment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4030691A JPH04270094A (en) | 1991-01-07 | 1991-03-06 | Brazing material |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23491 | 1991-01-07 | ||
JP3-234 | 1991-01-07 | ||
JP4030691A JPH04270094A (en) | 1991-01-07 | 1991-03-06 | Brazing material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04270094A true JPH04270094A (en) | 1992-09-25 |
Family
ID=26333163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4030691A Pending JPH04270094A (en) | 1991-01-07 | 1991-03-06 | Brazing material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04270094A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0820969A1 (en) * | 1996-07-23 | 1998-01-28 | Commissariat A L'energie Atomique | Reactive brazing composition and process for alumina-containing ceramic materials |
KR100403790B1 (en) * | 1995-12-18 | 2004-02-11 | 에스케이 주식회사 | Method for bonding ceramic with metal using magnesium |
WO2008004552A1 (en) * | 2006-07-04 | 2008-01-10 | Kabushiki Kaisha Toshiba | Ceramic-metal bonded body, method for manufacturing the bonded body and semiconductor device using the bonded body |
JP2008188670A (en) * | 2007-01-12 | 2008-08-21 | Terumo Corp | Brazing material, guide wire, and joined assembly |
WO2011142262A1 (en) * | 2010-05-13 | 2011-11-17 | 日本発條株式会社 | Brazing material for bonding in atmosphere, bonded article, and current collecting material |
WO2012077733A1 (en) * | 2010-12-09 | 2012-06-14 | 日本発條株式会社 | Brazing material for bonding in atmosphere, bonded article, and current collector material |
-
1991
- 1991-03-06 JP JP4030691A patent/JPH04270094A/en active Pending
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100403790B1 (en) * | 1995-12-18 | 2004-02-11 | 에스케이 주식회사 | Method for bonding ceramic with metal using magnesium |
EP0820969A1 (en) * | 1996-07-23 | 1998-01-28 | Commissariat A L'energie Atomique | Reactive brazing composition and process for alumina-containing ceramic materials |
FR2751640A1 (en) * | 1996-07-23 | 1998-01-30 | Commissariat Energie Atomique | COMPOSITION AND METHOD FOR REACTIVE BRAZING CERAMIC MATERIALS CONTAINING ALUMINA |
US6050478A (en) * | 1996-07-23 | 2000-04-18 | Commissariat A L'energie Atomique | Composition and process for the reactive brazing of ceramic materials containing alumina |
US6247565B1 (en) | 1996-07-23 | 2001-06-19 | Commissariat A L'energie Atomique | Composition and process for the reactive brazing of ceramic materials containing alumina |
JP5226511B2 (en) * | 2006-07-04 | 2013-07-03 | 株式会社東芝 | Ceramic-metal bonded body, manufacturing method thereof, and semiconductor device using the same |
WO2008004552A1 (en) * | 2006-07-04 | 2008-01-10 | Kabushiki Kaisha Toshiba | Ceramic-metal bonded body, method for manufacturing the bonded body and semiconductor device using the bonded body |
US8518554B2 (en) | 2006-07-04 | 2013-08-27 | Kabushiki Kaisha Toshiba | Ceramic metal composite and semiconductor device using the same |
JP2008188670A (en) * | 2007-01-12 | 2008-08-21 | Terumo Corp | Brazing material, guide wire, and joined assembly |
WO2011142262A1 (en) * | 2010-05-13 | 2011-11-17 | 日本発條株式会社 | Brazing material for bonding in atmosphere, bonded article, and current collecting material |
JP2011235345A (en) * | 2010-05-13 | 2011-11-24 | Nhk Spring Co Ltd | Brazing material for bonding in atmosphere, bonded article, and current collecting material |
CN102883853A (en) * | 2010-05-13 | 2013-01-16 | 日本发条株式会社 | Brazing material for bonding in atmosphere, bonded article, and current collecting material |
KR101454983B1 (en) * | 2010-05-13 | 2014-10-27 | 니혼 하츠쵸 가부시키가이샤 | Brazing material for bonding in atmosphere, bonded article, and current collecting material |
WO2012077733A1 (en) * | 2010-12-09 | 2012-06-14 | 日本発條株式会社 | Brazing material for bonding in atmosphere, bonded article, and current collector material |
JP2012121055A (en) * | 2010-12-09 | 2012-06-28 | Nhk Spring Co Ltd | Brazing material for bonding in atmosphere, bonded article, and current collector material |
CN103249520A (en) * | 2010-12-09 | 2013-08-14 | 日本发条株式会社 | Brazing material for bonding in atmosphere, bonded article, and current collector material |
EP2650077A4 (en) * | 2010-12-09 | 2015-10-21 | Nhk Spring Co Ltd | Brazing material for bonding in atmosphere, bonded article, and current collector material |
CN103249520B (en) * | 2010-12-09 | 2016-01-20 | 日本发条株式会社 | Air engages with solder, conjugant and current-collecting member |
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