JPS63140794A - Ge alloy brazing filler metal exhibiting joint strength at high temperature - Google Patents

Abstract

PURPOSE:To improve joint strength at a high temp. by forming the titled brazing filler metal of a compsn. contg. specific weight % of Al and Cu and consisting of the balance Ge and impurities and adding prescribed % of Si, Sb Ga and Ni thereto at need. CONSTITUTION:The compsn. components of the brazing filler metal are composed of 30-50wt% A and 0.01-10% Cu, are composed of the balance Ge and inevitable impurities and are incorporated therein with 50-70% Ge component. 1 or >=2 kinds among Si, Sb, Ga and Ni are added thereto at 0.1-3% at need. The Ge and Al components in the co-existing state have the effect to improve the joint strength and the Cu improves the wettability and flow characteristics of the brazing filler metal. The Si, Sb, Ga and Ni have the effect of increasing the joint strength by improving the wettability of the brazing filler metal. The joint strength is, therefore, improved by the improvement in the wettability of the brazing filler metal at the high temp.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a Ge alloy brazing material that exhibits high bonding strength not only at room temperature but also at high temperatures, and particularly relates to a Cu alloy material and an M alloy material. Furthermore, the present invention relates to a Ge alloy brazing material suitable for use in brazing Cu or Cu alloy materials with other metal materials, semimetal materials, ceramic materials, or glass materials.

[Conventional technology]

Conventionally, Aε was deposited on the surface of a substrate by sputtering, for example.
- When forming a thin film of Si alloy by vapor deposition, an AH-Si alloy is used as a target material, and this target material is soldered to a backing plate of CU or Cu alloy. It is well known that Sn alloy solder material is used for soldering.

[Problem that the invention seeks to solve]

However, in the target material bonded to the para-kink plate using the above-mentioned Sn alloy solder material, the bonding strength between the two members at high temperatures is insufficient, and therefore the target material may peel off during sputtering at high temperatures. There are some problems that can easily occur.

[Failure to solve the problem]

Therefore, from the above-mentioned viewpoint, the present inventors particularly
As a result of conducting research to strengthen the bond between u or Cu alloy material and M alloy material, we found that the brazing filler metal, in weight% (hereinafter, "ch" indicates weight%), has the following properties: AA: 30-50%, Cu: 0.01 ~10%, and if necessary, one or two of Sl, Sb, Ga, and Ni
It has a composition that contains 201 to 3% of the species or more, and the remainder consists of C) e (contains 50 to 70%) and inevitable impurities (if Ere alloy is used, Cu or CU alloy material and M In addition to brazing alloy materials, Cui or CU alloy materials and other metal materials,
Even when brazing with semi-metallic materials, ceramic materials, or glass materials, it was found that high bonding strength is exhibited at room temperature and high temperature, and there is no peeling phenomenon between the two liquid materials.

This invention has been made based on the above knowledge, and the reason why the component composition is limited to the above general composition will be explained below.

(a) Ge and M These components have the effect of improving the bonding strength when they coexist, but even if the M content is less than 30% or the Ge content is less than 50%, the desired high bonding strength cannot be achieved. On the other hand, if the content exceeds 0% ()e and 50%, the bonding strength tends to deteriorate. :50~70chi, Ai! = 30 to 50%.

(b) Cu The CU acid component promotes alloying through reaction with Cu, Cu alloy, and other metals in the substrate, improves the wettability and fluidity of the brazing material, and thereby provides even better bonding strength. However, if its content is less than 0.01%, the desired bonding strength cannot be secured, while if its content exceeds 10%, it forms an intermetallic compound with A2 and Ge. Since this causes a decrease in bonding strength, especially bonding strength at high temperatures, its content was determined to be 0.01 to 10%.

(c) Si, Sb, Ga, and Ni These components have the effect of further improving the wettability of the brazing filler metal to the members to be joined and increasing the joint strength, so they may be included as necessary. , if its content is less than 0.1%,
On the other hand, if the content exceeds 3%, extremely brittle intermetallic compounds will be formed and the bonding strength will be significantly reduced. The content was determined to be 0.01 to 3%.

The Ge alloy brazing material of the present invention may be used in the form of a powder made by melting a molten Ge alloy of a predetermined composition in a vacuum, casting it into an ingot, and then using a ball mill or the like, or it may be used in a powdered state using a ball mill or the like. A foil material or powder may be formed directly from a molten Ge alloy of a predetermined composition using a roll quenching device, or a sheet material (foil material) is produced by warm rolling an ingot, and then the ingot is heated in this state. There are no restrictions on the usage conditions, such as that it may be used in

〔Example〕

Next, the Ge alloy brazing material of the present invention will be specifically explained using examples.

A molten alloy having the composition shown in Table 1 was prepared (by a conventional melting method), and then melted into a 150 μm thick melt in an Ar atmosphere using a conventional single-roll molten metal quenching device for manufacturing metal ribbons. The alloy brazing filler metals 1 to 1 of the present invention (2) are formed into a thin ribbon, and the ribbon is ground in a ball mill in an Ar atmosphere to obtain a powder having an average particle size of 210 μm.
3 and Comparative brazing filler metals 1 to 4 were manufactured, respectively.

It should be noted that Comparative brazing fillers 1 to 4 all have component compositions in which the content of one of the constituent components (those marked with * in the first layer) is outside the scope of the present invention.

In addition, as a conventional brazing filler metal, commercially available S contains 3.5% Ag and has a composition in which the remainder consists of Sn and unavoidable impurities.
An n-Ag alloy powder was prepared.

On the other hand, as a base material, various members having dimensions of diameter: 30H x thickness: 20H and made of the materials shown in Table 1 were prepared, and the overlying brazing was performed as a member, and each member had a diameter of:
10m x thickness: 201u dimensions and each of the materials shown in Table 1 was prepared, and these base materials and brazing members, as well as the various brazing filler metal powders described above, were prepared. In the above-mentioned brazing, the joint surfaces of the members were coated with a Cu thin film with a thickness of 3 μm using the ion brazing method, and the members were laminated in the combinations shown in Table 1, and then 3 K9f / art2 was applied. Brazing is carried out in a vacuum with a load applied, and the temperature shown in the first row is held for 30 minutes. The shear strength was measured. The results of these measurements are shown in Table 1.

〔Effect of the invention〕

From the results shown in Table 1, the present invention ()e alloy brazing material 1
~13, in any case Sn-Ag
Compared to the case of using conventional alloy brazing filler metals, brazing provides superior joint strength in the parts, while as seen in the case of using Comparative Ge alloy filler metals 1 to 4, the brazing strength of the brazing filler metal It is clear that if the content of any of the constituent components is outside the scope of the present invention, the desired high bonding strength cannot be obtained.

As mentioned above, according to the Ge alloy brazing material of the present invention, it is possible to firmly join Cu or Cu alloy material, metal material such as AH-8i alloy, ceramic material, glass material, etc. Moreover, the brazed parts formed as a result exhibit high bonding strength not only at room temperature but also at high temperatures, and have industrially useful effects such as enabling strong bonding between sputtering target materials and backing plates. It is brought about.

Claims (2)

[Claims] (1) Al: 30 to 50%, Cu: 0.01 to 10%, and the remainder is Ge (containing 50 to 70%) and inevitable impurities (weight %). A Ge alloy brazing material that exhibits high bonding strength at high temperatures. (2) Contains Al: 30 to 50%, Cu: 0.01 to 10%, and further contains one or more of Si, Sb, Ga, and Ni: 0.1 to 3%, A Ge alloy brazing material exhibiting high bonding strength at high temperatures, characterized in that it has a composition (by weight %) with the remainder consisting of Ge (containing 50 to 70%) and unavoidable impurities.